EC1089 The Communications Edge TM Product Information InGaP HBT Gain Block Product Features x 10 - 2500 MHz x +24 dBm P1dB x +41 dBm OIP3 x 15.5 dB Gain at 900 MHz x 12.2 dB Gain at 1900 MHz x Available in Lead-free / green SOT-89 Package Style Applications x Mobile Infrastructure x Final stage amplifiers for Repeaters x Defense / Homeland Security Product Description GND The EC1089 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a broad range with +41 dBm OIP3 and +24 dBm of compressed 1dB power. It is housed in an industry standard lead-free/green/RoHScompliant SOT-89 package. All devices are 100% RF and DC tested. 4 The EC1089 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the EC1089 to maintain high linearity over temperature and operate directly off a single +5 V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generation multi-carrier 3G base stations. 1 2 3 RF IN GND RF OUT Function Input Output/Bias Ground Pin No. 1 3 2, 4 Typical Performance (3) Specifications (1) Parameters Functional Diagram Units Min Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) IS-95A Channel Power MHz MHz dB dB dB dBm dBm 10 dBm +17 Noise Figure Test Frequency Gain Output P1dB Output IP3 (2) Operating Current Range Device Voltage dB MHz dB dBm dBm mA V 5.9 2140 11.5 +23.5 +40 160 +5 @ -45 dBc ACPR 10.5 +40 140 Typ Max Parameters Units Typical 2500 Frequency S21 - Gain S11 - Input R.L. S22 - Output R.L. Output P1dB Output IP3 Noise Figure Supply Bias MHz dB dB dB dBm dBm dB 900 1900 2140 15.5 12.2 11.5 -14 -15 -15 -10 -10 -10 +24 +23.5 +23.5 +40 +41 +40 5.1 5.9 5.4 +5 V @ 160 mA 1900 12.2 15 10 +23.5 +41 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +5 V, I = 160 mA, +25 C 175 1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +5 V, , in tuned application circuit. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Junction Temperature Ordering Information Part No. Rating -40 to +85 qC -65 to +150 qC +18 dBm +6 V 220 mA +250 qC Operation of this device above any of these parameters may cause permanent damage. * Description EC1089B* InGaP HBT Gain Block EC1089B-G InGaP HBT Gain Block EC1089B-PCB900 EC1089B-PCB1900 EC1089B-PCB2140 900 MHz Evaluation Board 1900 MHz Evaluation Board 2140 MHz Evaluation Board (lead-tin SOT-89 Pkg) (lead-free/green/RoHS-compliant SOT-89 Pkg) This package is being phased out in favor of the green package type which is backwards compatible for existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 6 June 2005 EC1089 The Communications Edge TM Product Information 1/4 Watt, High Linearity InGaP HBT Amplifier Typical Device Data S-Parameters (Vcc = +5 V, Icc = 160 mA, T = 25 C, unmatched 50 ohm system) S11 S22 0. 3. 0 4 2. 0 0 3. 0 4. 5.0 0 5.0 0.2 0.2 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 10.0 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0 DB(|S(2,1)|) DB(GMax()) 10 0.2 10.0 -10. 0 0 .0 .0 .0 -2 Swp Min 50MHz -1.0 -0.8 Swp Min 50MHz -0 .6 - -1.0 -0 .8 -0 .4 -0 0 2. .4 .6 Frequency (MHz) -0 -3 3000 -3 .0 2000 -4 1000 -5. 0 2 0 0 -0. 0 2 -4 . -0. -10.0 5 -5. Gain (dB) 4. 15 1.0 0. 4 20 Swp Max 3000MHz 6 0. 2. 0 0. 0.8 1.0 Swp Max 3000MHz 6 0.8 Gain / Maximum Stable Gain 25 Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 50 - 3000 MHz, with markers placed at 0.5 - 3.0 GHz in 0.5 GHz increments. S-Parameters (Vcc = +5 V, IDS = 160 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) 50 -5.84 -157.07 20.78 151.09 -25.69 17.37 -8.29 250 -3.36 -177.43 15.15 141.44 -23.57 6.90 -5.83 500 -3.07 173.83 13.70 131.20 -23.27 4.16 -5.74 750 -2.91 166.79 12.61 117.86 -22.95 2.86 -5.65 1000 -2.76 159.81 11.62 104.53 -22.54 1.07 -5.50 1250 -2.63 153.18 10.65 92.06 -22.35 -1.30 -5.41 1500 -2.55 146.03 9.64 80.38 -21.73 -2.45 -5.40 1750 -2.46 138.90 8.72 69.61 -21.47 -5.13 -5.32 2000 -2.44 132.69 7.92 59.90 -21.06 -7.78 -5.22 2250 -2.39 126.08 7.11 50.30 -20.91 -10.80 -5.19 2500 -2.33 119.55 6.30 41.62 -20.54 -17.68 -5.18 2750 -2.30 112.75 5.66 32.78 -19.62 -19.18 -5.19 3000 -2.27 105.55 5.02 23.64 -19.51 -24.29 -5.11 S22 (ang) -111.19 -168.30 177.63 169.68 161.89 155.53 148.42 141.74 135.43 128.63 122.48 115.64 108.85 Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014" Getek, 4 layers (other layers added for rigidity), .062" total thickness, 1 oz copper Microstrip line details: width = .026", spacing = .026" Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 6 June 2005 EC1089 The Communications Edge TM Product Information 1/4 Watt, High Linearity InGaP HBT Amplifier 900 MHz Application Circuit (EC1089B-PCB900) Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. Output P1dB Noise Figure Supply Voltage Supply Current PORT P=1 Z=50 Ohm +24 dBm 5.1 dB +5 V 160 mA CAP ID=C4 C=56 pF RES ID=L2 R=0 Ohm RES ID=L3 R=0 Ohm CAP ID=C9 C=1 pF ACPR (dBc) 42 41 40 -40C C9 should be placed between silk screen markers '8'and ' 9' on the WJ evaluation board. Average CDMA ACPR 43 25C PORT P=2 Z=50 Ohm The capacitor should be placed 19 @ 0.9GHz from pin 3 of the EC1089. The capacitor should be placed 13.7@ 0.9GHz from pin 1 of the EC1089 OIP3 vs. Frequency OIP3 (dBm) CAP ID=C5 C=56 pF size 0603 C7 should be placed at the silk screen marker 'F' on the WJ evaluation board. 44 37 600 size 0805 IND ID=L1 L=33 nH SUBCKT ID=U1 NET="EC1089" 38 CAP ID=C3 C=1000 pF 5.6 V RES ID=R1 R=2.7K Ohm CAP ID=C7 C=5.6 pF Measured parameters were taken at 25 C. 39 DIODE1 ID=D1 L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. +40 dBm (+11 dBm / tone, 1 MHz spacing) CAP ID=C1 C=100000 pF size 1206 CAP ID=C2 C=56 pF Vcc = +5 V 900 MHz 15.5 dB -15 dB -10 dB +85C 700 800 900 1000 Frequency (.9 GHz Matching) 1100 40 45 Note: (IS95) ACPR1 measured at 750KHz, Forward 9 Channel 50 55 60 65 70 75 80 85 10 12 14 16 Average output power (dBm) 18 1900 MHz Application Circuit (EC1089B-PCB1900) Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 (+11 dBm / tone, 1 MHz spacing) Output P1dB Noise Figure Supply Voltage Supply Current 1900 MHz 12.2 dB -15 dB -10 dB CAP ID=C1 C=100000 pF size 1206 Vcc = +5 V All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. +41 dBm PORT P=1 Z=50 Ohm +23.5 dBm 5.9 dB +5 V 160 mA CAP ID=C4 C=56 pF RES ID=L2 R=0 Ohm CAP ID=C3 C=1000 pF 5.6 V IND ID=L1 L=18 nH RES ID=L3 R=0 Ohm RES ID=R1 R=2.7K Ohm CAP ID=C7 C=2.4 pF CAP ID=C2 C=56 pF DIODE1 ID=D1 SUBCKT ID=U1 NET="EC1089" CAP ID=C9 C=1.2 pF C7 should be placed at the silk screen marker 'A' on the WJ evaluation board. Measured parameters were taken at 25 C. 45 ACPR (dBc) 43 dBm 41 39 25C 1700 -40C 1800 1900 PORT P=2 Z=50 Ohm C9 should be placed at silk screen marker ' 7' on the WJ evaluation board. Average CDMA ACPR OIP3 vs. Temperature vs. Frequency 35 1600 CAP ID=C5 C=56 pF The capacitor should be placed 34 @ 1.9GHz from pin 3 of the EC1089. The capacitor should be placed 4.6@ 1.9GHz from pin 1 of the EC1089 37 size 0805 85C 2000 2100 Frequency (MHz) 40 45 Note: (IS95) ACPR1 measured at 750KHz, Forward 9 Channel 50 55 60 65 70 75 80 85 10 12 14 16 Average output power (dBm) 18 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 6 June 2005 EC1089 The Communications Edge TM Product Information 1/4 Watt, High Linearity InGaP HBT Amplifier 2140 MHz Application Circuit (EC1089B-PCB2140) Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 (+10 dBm / tone, 1 MHz spacing) Output P1dB Noise Figure Supply Voltage Supply Current 2140 MHz 11.5 dB -15 dB -10 dB CAP ID=C1 C=100000 pF size 1206 Vcc = +5 V All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. Component R1 is shown in the silkscreen but is not used for this configuration. +40 dBm +23.5 dBm 5.4 dB +5 V 160 mA IND ID=L1 L=18 nH RES CAP ID=L2 ID=R1 C=1.5 pF R=2.7K Ohm CAP ID=C4 C=56 pF SUBCKT ID=U1 NET="EC1089" CAP ID=C6 C=1.5 pF C6 should be placed at the silk screen marker 'F' on the WJ evaluation board. The capacitor should be placed 32.6 @ 2.14GHz from pin 1 of the EC1089 Measured parameters were taken at 25 C. CAP ID=C3 C=1000 pF 5.6 V L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. PORT P=1 Z=50 Ohm CAP ID=C2 C=56 pF DIODE1 ID=D1 RES ID=L3 R=0 Ohm CAP ID=C9 C=.8 pF size 0805 CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm C9 should be placed at silk screen marker ' 6' on the WJ evaluation board. The capacitor should be placed 39 @ 2.14GHz from pin 3 of the EC1089. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 6 June 2005 EC1089 The Communications Edge TM Product Information 1/4 Watt, High Linearity InGaP HBT Amplifier EC1089B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The component will be marked with an "1089" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance (1) Junction Temperature (2) -40 to +85q C 149q C / W 204q C MTTF vs. GND Tab Temperature 1000.0 100.0 Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. 10.0 1.0 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 5 of 6 June 2005 EC1089 The Communications Edge TM Product Information 1/4 Watt, High Linearity InGaP HBT Amplifier EC1089B-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Product Marking Outline Drawing The component will be marked with an " 1089G" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the " Application Notes" section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Land Pattern Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance (1) Junction Temperature (2) -40 to +85q C 149q C / W 204q C 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 1000.0 100.0 Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. 10.0 1.0 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 6 of 6 June 2005