Reference Only Spec No.JEFK243A-0004C-01 Micro Chip Transformer P1/10 DXP2ABN7514T Reference Specification 1. Scope This reference specification applies to Micro Chip Transformer. 2. Part Numbering (ex.) DX P 2A B N (1) (2) (3) (4) (5) (1) Micro Chip Transformer (2) Structure (P: Film Type) (3) Dimension (LxW) (4) Type of Transformer (B:Balun) (5) Category 75 (6) 14 (7) T L (8) (9) (6) Port Impedance (75 : 75ohm) (7) Impedance ratio (14: one to four) (8) Main Application (:50870MHz) (9) Packing Code L:Taping / B:Bulk 3. Electrical Specification Murata Part Number Freq. Range [MHz] input-output Impedance [ohm] Insertion Loss [dB] CMRR [dB] Return Loss [dB] Rated Power [dBm] DC Resistance DXP2ABN7514TL DXP2ABN7514TB 50870 75-300 1.8max. 20 min. 6min. 20 2.0(typ.) Customer Part Number Operating Temperature : -40 to +85C Storage Temperature : -40 to +85C 4. Standard Testing Condition <Unless otherwise specified> Temperature : Ordinary Temperature 15 to 35C Humidity : Ordinary Humidity 25 to 85%(RH) 5. Style and Dimensions Dimension <In case of doubt> Temperature : 20 2C Humidity : 60 to 70%(RH) Atmospheric Pressure : 86 to106kPa Eqivalent Circuit 0.50.1 0.250.1 0.820.1 0.250.15 (1) (2) (3) (4) (6) (7) (8) 1.00.1 (5) 2.00.1 No polarity. Electrode (in mm) Unit Mass(typ.) 0.008g 6. Marking No Marking. MURATA MFG.CO.,LTD Spec No.JEFK243A-0004C-01 7. Electrical Performance No. 7.1 Item Insertion Loss (IL) Specification Meet item 3. Reference Only P2/10 Definition and Measurement Method Insertion Loss is given by Sds21 mag extracted from the below circuit. Parasitics and loss factors caused by the test board have to be removed. Port Impedance [ohm] Port1 7514T 75 Port2 150 Port3 150 IL[dB] = 20log10(Sds21) Where Sds21 is S-parameter of single mode stimulus - Differential mode response 7.2 CMRR Meet item 3. (Ref.10) CMRR is given by the following equation, S-parameters are extracted from the below circuit. Parasitics and loss factors caused by the test board have to be removed. Port Impedance [ohm] Port1 7514T 75 Port2 150 Port3 150 CMRR[dB] = 20log10(Sds21/Scs21) Where Sds21 is S-parameter of single mode stimulus - Differential mode response Scs21 is S-parameter of single mode stimulus - Common mode response (Ref.10) 7.3 Return Loss (RL) Meet item 3. Insertion Loss is given by Sss11 mag extracted from the below circuit. Parasitics and loss factors caused by the test board have to be removed. Port Impedance [ohm] Port1 7514T 75 Port2 150 Port3 150 RL[dB] = 20log10(Sss11) Where Sss11 is S-parameter of single mode stimulus - Refletcion response (Ref.10) MURATA MFG.CO.,LTD Spec No.JEFK243A-0004C-01 No. 7.4 Item DC Resistance (Rdc) Reference Only Specification Meet item 3. P3/10 Definition and Measurement Method Measuring current : 80mA max.(ref.item 10.) Rdc Rdc Rdc Rdc 8. Mechanical Performance No. 8.1 8.2 8.3 Item Appearance and Dimensions Solderability Specification Meet all dimension on item 5. Test Method Visual Inspection and measurement with microscope. The electrodes shall be at least 95% covered with new solder coating. Flux:Ethanol solution of rosin,25(wt)% Pre-Heating : 15010C 60s to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2455C Immersion Time : 31 seconds Immersion and emersion rates : 25mm/s Resistance to Soldering Heat Meet Table 1. Table 1 Appearance IL CMRR Return Loss Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : : 15010C 60s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2705C Immersion Time : 101 seconds Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 4 to 48 hours. It shall be dropped on concrete or steel board. Method : free fall Height : 1 m The Number of Times : 10 times It shall be soldered on the substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes 8.4 Drop 8.5 Vibration 8.6 Bending Strength No damaged Meet Item 3. Meet Table 2. Table 2 Appearance No damaged DC Resistance within 30% Change Total Amplitude 3.0mm or Acceleration 196m/s2 whichever is smaller Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) It shall be soldered on the Glass-epoxy substrate. Deflection : 2mm (t=1.0mm). Keeping time : 30s Speed of Applying Force : 0.5mm/s Pressure jig R230 F Deflection 45 45 Product (in mm) MURATA MFG.CO.,LTD Reference Only Spec No.JEFK243A-0004C-01 9. Environmental Performance(Products shall be soldered on the substrate.) No. 9.1 Item Heat Shock 9.2 Humidity 9.3 Heat Resistance 9.4 Cold Resistance Specification Meet Table 1. P4/10 Test Method 1 Cycle Step 1 -40C(+0C,-3C) / 30(+3,-0) min Step 2 +85(+3C,-0C) / 30(+3,-0) min Total of 200 cycles. Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 402C Humidity : 90~95%(RH) Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 852C Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : -40 2C Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. 10. Terminal to be Tested. When measuring and suppling the voltage,the following terminal is applied. No. Item 10.1 Insertion Loss (IL) CMRR Return Loss (RL) (Measurement Terminal) 10.2 DC Resistance (Measurement Terminal) Terminal to be Tested Terminal Terminal Terminal Terminal Terminal Terminal Terminal 11. P.C.B., Flux, Solder and Soldering condition Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the case of being specified special condition. MURATA MFG.CO.,LTD Terminal Spec No.JEFK243A-0004C-01 12. Frequency Characteristics (Typ.) Reference Only CMRR 0.0 50 -0.5 40 CMRR[dB] IL[dB] Insertion Loss -1.0 -1.5 -2.0 30 20 10 0 100 200 300 400 500 600 700 800 900 Freq[MHz] 0 100 200 300 400 500 600 700 800 900 Freq[MHz] Return Loss AmplitudeBalance 0 1.0 -10 0.5 AB[dB] RL[dB] P5/10 -20 -30 0.0 -0.5 -40 -50 -1.0 0 100 200 300 400 500 600 700 800 900 Freq[MHz] 0 100 200 300 400 500 600 700 800 900 Freq[MHz] Phase Balance 200 PB[Deg] 100 0 -100 -200 0 100 200 300 400 500 600 700 800 900 Freq[MHz] 13. Specification of Packaging 4.00.1 2.20.1 0.250.05 Sprocket Hole Direction of feed 8.00.2 1.5 0.1 0 1.750.1 Appearance and Dimensions ( 8mm-wide,Plastic tape) (2.75)3.50.05 13.1 1.20.1 4.00.1 2.00.05 0.980.05 MURATA MFG.CO.,LTD Reference Only Spec No.JEFK243A-0004C-01 13.2 P6/10 Specification of Taping (1)Packing quantity(Standard quantity) 3000 pcs. / reel (2)Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3)Sprocket Hole Sprockrt hole shall be located on the left hand side toward the direction of feed. (4)Spliced point The cover tape have no spliced point. (5)Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 13.3 13.4 Pull Strength of Plastic Tape Plastic Tape Cover Tape 5N min. 10N min. Peeling off force of Cover Tape 0.2 to 0.7N(Minimum value is Typical) Speed of Peeling off : 300 mm/min. 165 to 180 degree F Cover tape Plastic tape 13.5 Dimensions of Leader-tape, Trailer and Reel Leader Trailer 2.00.5 160 min. 190 min. 210 min. Empty tape Top tape Label 13.00.2 1 60 0 21.00.8 9 10 Direction of feed 131.4 0 180 3 13.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc 1) Expression of Inspection No. OOOO xxx (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D Third, Fourth digit : Day 2) Expression of RoHS Marking ROHS - Y () (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) 13.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS Marking (2), Quantity, etc 13.8 Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO.,LTD Spec No.JEFK243A-0004C-01 14. Reference Only P7/10 ! Caution 14.1 Mounting Direction Mount products in right direction. Wrong direction which is 90rotated from right direction causes not only open or short circuit but also flames or other serious trouble. 14.2 Limitation of Application Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and / or reliability to the applications listed in the above. 15. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 15.1 Flux and Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. 15.2 Assembling <Thermal Shock> Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100C MAX. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100C max. 15.3 Resin coating The electric characteristics may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 15.4 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. Products direction Products shall be location the sideways a Direction (Length : a<b) to the machanical b Stress. Poor example Good example Wraping direction a b Wraping direction 1 a b Wraping direction 2 Products(wraping direction 1, wraping direction 2) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of wraping direction 1>wraping direction 2. MURATA MFG.CO.,LTD Spec No.JEFK243A-0004C-01 Reference Only (2)Products location on P.C.B. separation Products(A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of A>C>B D. Seam b A P8/10 C B D Slit Length:a< b a Portion of Perforation 15.5 Attention Regarding P.C.B. Design < The Arrangement of Products > P.C.B. shall be designed so that products are far from the portion of perforation. x P.C.B. The portion of perforation shall be designed as narrow as possible and shall be designed so as not to be applied the stress in the case of P.C.B. separation. Portion of Perforation Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) Product x P.C.B. x Product Hole < Products Placing > Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. Pick- up nozzle < P.C.B. Separation > P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. Product P.C.B. Support pin 15.6 Attention Regarding P.C.B. Mounting In case of mounting by use of mounting machine, please choose nozzle which can pick up components of 2012 size or the equivalents. 15.7 Standard Land Dimensions MURATA MFG.CO.,LTD Spec No.JEFK243A-0004C-01 Reference Only P9/10 15.8 Standard Soldering Condition (1) Soldering Condition Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. () 260/10s 2453 220 230 Limit Profile 180 150 Standard Profile 3060s 60s max. 90s30s Pre-heating Heating Peak temperature Cycle of reflow Time Standard Profile 150180C 90s30s above 220C30s60s 2453C 2 times Limit Profile above 230C60s max. 260C10s 2 times (2) Standard printing pattern of solder paste * Standard thickness of the solder paste should be 100 to 150m. * Use the solder paste printing pattern of the right pattern. * For the resist and copper foil pattern, use standard land dimensions. * Use Sn-3.0Ag-0.5Cu solder. 0.25 0.55 0.4 0.55 (3) Reworking with Soldering iron 0.5 * The following conditions shall be strictly followed when using a soldering iron after being mounted by reflow soldering. * Pre-heating: 150C, 1 min * Soldering iron output: 30W max. * Tip temperature: 380C max. * Tip diameter:3mm max. * Soldering time : 3(+1,-0) seconds. * Times : 2times max. * Do not touch the products directly with the tip of the soldering iron. (4) Solder Volume Solder shall be used not to be exceeded the upper limits as shown below. Upper Limit Upper Limit Recommendable Recommendable t 1/3T t T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. MURATA MFG.CO.,LTD (in mm) Spec No.JEFK243A-0004C-01 Reference Only P10/10 15.9 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60C max. (40C max. for Isopropyl alcohol.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B.. Power : 20W/ l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner * Isopropyl alcohol (IPA) 2. Aqueous agent * PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 15.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 15.11 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 15.12 Storage Condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment conditions *Products should be stored in the warehouse on the following conditions. Temperature -10 ~ +40C Humidity 15 to 85% relative humidity No rapid change on temperature and humidity. * Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderability due to the oxidized electrode. * Products should be stored on the palette for the prevention of the influence from humidity,dust and so on. * Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. * Products should not be stored under the air tights packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. ! 16. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD