DXP2ABN7514TL - Murata Electronics North America

Spec No.JEFK243A-0004C-01 P1/10

MURATA MFG.CO.,LTD

Reference Only

Micro Chip Transformer DXP2ABN7514T□ Reference Specification

1. Scope

This reference specification applies to Micro Chip Transformer.

2. Part Numbering

(ex.) DX P 2A B N 75 14 T L

(1) (2) (3) (4) (5) (6) (7) (8) (9)

(1) Micro Chip Transformer

(2) Structure (P: Film Type)

(3) Dimension (L×W)

(4) Type of Transformer (B:Balun)

(5) Category

3. Electrical Specification

Customer

Part Number

Murata

Part Number

Freq.

Range

[MHz]

input-output

Impedance

[ohm]

Insertion

Loss

[dB]

CMRR

[dB]

Return

Loss

[dB]

Rated

Power

[dBm]

Resistance

DXP2ABN7514TL 50～870 75-300 1.8max. 20 min. 6min. 20

2.0Ω(typ.)

DXP2ABN7514TB

Operating Temperature : -40 to +85°C Storage Temperature : -40 to +85°C

4. Standard Testing Condition

Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C

Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH)

Atmospheric Pressure : 86 to106kPa

5. Style and Dimensions

■Dimension ■Eqivalent Circuit

No polarity.

■Unit Mass(typ.)

0.008g

6. Marking

No Marking.

(6) Port Impedance (75 : 75ohm)

(7) Impedance ratio (14: one to four)

(8) Main Application (Ｔ:50～870MHz)

(9) Packing Code L:Taping / B:Bulk

1.0±0.1

0.82±0.1

□：

Electrode

(in mm)

2.0±0.1

(5) (6) (7) (8)

(1) (2) (3) (4)

0.25±0.1

0.5±0.1

0.25±0.15

Spec No.JEFK243A-0004C-01 P2/10

MURATA MFG.CO.,LTD

Reference Only

7. Electrical Performance

No. Item Specification Definition and Measurement Method

7.1 Insertion

Loss

(IL)

Meet item 3. Insertion Loss is given by Sds21 mag extracted from the below circuit.

Parasitics and loss factors caused by the test board have to be removed.

Port Impedance [ohm]

Port1 Port2 Port3

7514T 75 150 150

IL[dB] = 20log10(Sds21)

Where

Sds21 is S-parameter of single mode stimulus - Differential mode response

(Ref.10)

7.2 CMRR

Meet item 3. CMRR is given by the following equation, S-parameters are extracted from

the below circuit.

Parasitics and loss factors caused by the test board have to be removed.

Port Impedance [ohm]

Port1 Port2 Port3

7514T 75 150 150

CMRR[dB] = 20log10(Sds21/Scs21)

Where

Sds21 is S-parameter of single mode stimulus - Differential mode response

Scs21 is S-parameter of single mode stimulus - Common mode response

(Ref.10)

7.3 Return

Loss

(RL)

Meet item 3. Insertion Loss is given by Sss11 mag extracted from the below circuit.

Parasitics and loss factors caused by the test board have to be removed.

Port Impedance [ohm]

Port1 Port2 Port3

7514T 75 150 150

RL[dB] = 20log10(Sss11)

Where

Sss11 is S-parameter of single mode stimulus – Refletcion response

(Ref.10)

Spec No.JEFK243A-0004C-01 P3/10

MURATA MFG.CO.,LTD

Reference Only

No. Item Specification Definition and Measurement Method

7.4 DC Resistance

(Rdc)

Meet item 3. Measuring current : 80mA max.(ref.item 10.)

8. Mechanical Performance

No. Item Specification Test Method

8.1 Appearance

and

Dimensions

Meet all dimension on item 5. Visual Inspection and measurement with microscope.

8.2 Solderability The electrodes shall be at least

95% covered with new solder

coating.

Flux:Ethanol solution of rosin,25(wt)%

Pre-Heating : 150±10°C 60s to 90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 245±5°C

Immersion Time : 3±1 seconds

Immersion and emersion rates : 25mm/s

8.3 Resistance

to Soldering

Heat

Meet Table 1.

Table 1 Flux : Ethanol solution of rosin,25(wt)%

Pre-Heating : : 150±10°C 60s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270±5°C

Immersion Time : 10±1 seconds

Immersion and emersion rates : 25mm/s

Then measured after exposure in the room

condition for 4 to 48 hours.

8.4 Drop It shall be dropped on concrete or steel board.

Method : free fall

Height : 1 m

The Number of Times : 10 times

8.5 Vibration It shall be soldered on the substrate.

Oscillation Frequency : 10 to 2000 to 10Hz

for 20 minutes

Total Amplitude 3.0mm or Acceleration 196m/s2

whichever is smaller

Testing Time : A period of 2 hours in each of 3

mutually perpendicular directions. (Total 6 hours)

8.6 Bending

Strength

Meet Table 2.

Table 2

Appearance No damaged

DC Resistance

Change within ± 30%

It shall be soldered on the Glass-epoxy substrate.

Deflection : 2mm (t=1.0mm).

Keeping time : 30s

Speed of Applying Force : 0.5mm/s

(in mm)

Appearance No damaged

Meet Item 3.

CMRR

Return Loss

R230

Deflection

45 Product

Pressure jig

Rdc

Spec No.JEFK243A-0004C-01 P4/10

MURATA MFG.CO.,LTD

Reference Only

9. Environmental Performance(Products shall be soldered on the substrate.)

No. Item Specification Test Method

9.1 Heat Shock Meet Table 1. 1 Cycle

Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min

Step 2 +85(+3°C,-0°C) / 30(+3,-0) min

Total of 200 cycles.

Then measured after exposure in the room condition for

4 to 48 hours.

9.2

Humidity Temperature : 40±2°C

Humidity : 90~95%(RH)

Time : 1000(+48 hours,-0 hours)

Then measured after exposure in the

room condition for 4 to 48 hours.

9.3 Heat

Resistance

Temperature : 85±2°C

Time : 1000(+48 hours,-0 hours)

Then measured after exposure in the

room condition for 4 to 48 hours.

9.4 Cold

Resistance

Temperature : -40± 2°C

Time : 1000(+48 hours,-0 hours)

Then measured after exposure in the

room condition for 4 to 48 hours.

10. Terminal to be Tested.

When measuring and suppling the voltage,the following terminal is applied.

No. Item Terminal to be Tested

10.1 Insertion Loss

(IL)

CMRR

Return Loss

(RL)

(Measurement Terminal)

10.2 DC Resistance

(Measurement Terminal)

11. P.C.B., Flux, Solder and Soldering condition

Test shall be done using P.C.B., Flux, Solder and Soldering condition which are

specified in item 16 except the case of being specified special condition.

Terminal Terminal

Spec No.JEFK243A-0004C-01 P5/10

MURATA MFG.CO.,LTD

Reference Only

12. Frequency Characteristics (Typ.)

Insertion Loss

-2.0

-1.5

-1.0

-0.5

0.0

0 100 200 300 400 500 600 700 800 900

Freq[MHz]

IL[dB]

CMRR

0 100 200 300 400 500 600 700 800 900

Freq[MHz]

CMRR[dB]

Return Loss

-50

-40

-30

-20

-10

0 100 200 300 400 500 600 700 800 900

Freq[MHz]

RL[dB]

AmplitudeBalance

-1.0

-0.5

0.0

0.5

1.0

0 100 200 300 400 500 600 700 800 900

Freq[MHz]

AB[dB]

Phase Balance

-200

-100

100

200

0 100 200 300 400 500 600 700 800 900

Freq[MHz]

PB[Deg]

13. Specification of Packaging

13.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)

1.2±0.1

4.0±0.1

2.0±0.05

1.75±0.1

(2.75)3.5±0.05

0.1

φ1.5±

4.0±0.1

0.98±0.05

0.25±0.05

8.0±0.2

2.2±0.1

送り穴

引出し方向

Sprocket Hole

Direction of feed

Sprocket Hole

Spec No.JEFK243A-0004C-01 P6/10

MURATA MFG.CO.,LTD

Reference Only

13.2 Specification of Taping

(1)Packing quantity(Standard quantity) 3000 pcs. / reel

(2)Packing Method

Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.

(3)Sprocket Hole

Sprockrt hole shall be located on the left hand side toward the direction of feed.

(4)Spliced point

The cover tape have no spliced point.

(5)Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not

continuous. The specified quantity per reel is kept.

13.3 Pull Strength of Plastic Tape

Plastic Tape 5N min.

Cover Tape 10N min.

13.4 Peeling off force of Cover Tape

0.2 to 0.7N(Minimum value is Typical)

Speed of Peeling off : 300 mm/min.

13.5 Dimensions of Leader-tape, Trailer and Reel

13.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc

∗1) « Expression of Inspection No. » □□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS Marking » ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

13.7 Marking for Outside package

Customer name Purchasing Order Number, Customer Part Number, MURATA part number,

RoHS Marking (∗2), Quantity, etc

13.8 Specification of Outer Case

Outer Case Dimensions

(mm) Standard Reel Quantity in Outer Case

(Reel)

W D H

186 186 93 5

∗ Above Outer Case size is typical. It depends on a quantity of an

order.

165 to 180 degree FCover tape

Plastic tape

Empty tape

190 min.

Leader

Trailer

Top tape

2.0±0.5

13.0±0.2

21.0±0.8

180±

60±

9±

13±1.4

Direction of feed

210 min.

160 min.

Label

Spec No.JEFK243A-0004C-01 P7/10

MURATA MFG.CO.,LTD

Reference Only

14. △

!Caution

14.1 Mounting Direction

Mount products in right direction.

Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also

flames or other serious trouble.

14.2 Limitation of Application

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life, body

or property.

(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)

(2) Aerospace equipment (7) Traffic signal equipment

(3) Undersea equipment (8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment (10) Applications of similar complexity and / or reliability to the

applications listed in the above.

15. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

15.1 Flux and Solder

Flux

Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )

Do not use water-soluble flux.

Solder Use Sn-3.0Ag-0.5Cu solder

Use of Sn-Zn based solder will deteriorate performance of products.

In case of using Sn-Zn based solder, please contact Murata in advance.

15.2 Assembling

Pre-heating should be in such a way that the temperature difference between solder and

ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering

should be in such a way that the temperature difference is limited to 100°C max.

15.3 Resin coating

The electric characteristics may change and/or it may affect on the product's performance due to high

cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you

select resin. In prior to use, please make the reliability evaluation with the product mounted in your application

set.

15.4 Attentio n regardin g P.C. B. bendin g

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

Products shall be location the sideways

Direction (Length : a<b) to the machanical

Stress.

［Wraping direction］

Products(wraping direction 1, wraping direction

2) shall be located carefully so that products are

not subject to the mechanical stress due to

warping the board. Because they may be

subjected the mechanical stress in order of

wraping direction 1>wraping direction 2.

〈

Poor example

〉〈

Good example

〉

〈

Wraping direction 1

〉〈

Wraping direction 2

〉

Spec No.JEFK243A-0004C-01 P8/10

MURATA MFG.CO.,LTD

Reference Only

Pick- up nozzle

Support pin

P.C.B.

Product

(2)Products location on P.C.B. separation

Products(A,B,C,D) shall be located carefully

so that products are not subject to the

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A>C>B ≅ D.

15.5 Attention Regarding P.C.B. Design

< The Arrangement of Products >

P.C.B. shall be designed so that products are far from the portion

of perforation.

The portion of perforation shall be designed as narrow as possible

and shall be designed so as not to be applied the stress in the case

of P.C.B. separation.

Products shall not be arranged on the line of a series of holes when

there are big holes in P.C.B. (Because the stress concentrate on the

line of holes.)

< Products Placing >

Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.

during placing the products on the other side of P.C.B.

< P.C.B. Separation >

P.C.B. shall not be separated with hand.

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.

15.6 Attention Regarding P.C. B. Mounting

In case of mounting by use of mounting machine, please choose nozzle which can pick up

components of 2012 size or the equivalents.

15.7 Standard Land Dimensions

○

P.C.B.

Portion of

Perforation

Portion of

Perforation

Product

P.C.B.

Hole

○

Seam

Slit

Length:a

Spec No.JEFK243A-0004C-01 P9/10

MURATA MFG.CO.,LTD

Reference Only

15.8 Standard Soldering Condition

(1) Soldering Condition

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

Standard Profile Limit Profile

Pre-heating 150～180°C 、90s±30s

Heating above 220°C、30s～60s above 230°C、60s max.

Peak temperature 245±3°C 260°C、10s

Cycle of reflow 2 times 2 times

(2) Standard printing pattern of solder paste

• Standard thickness of the solder paste should be 100 to 150µm.

• Use the solder paste printing pattern of the right pattern.

• For the resist and copper foil pattern, use standard land dimensions.

• Use Sn-3.0Ag-0.5Cu solder.

(3) Reworking with Soldering iron

• The following conditions shall be strictly followed when using a soldering iron after

being mounted by reflow soldering.

· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.

· Tip temperature: 380°C max. · Tip diameter:φ3mm max.

· Soldering time : 3(+1,-0) seconds. · Times : 2times max.

• Do not touch the products directly with the tip of the soldering iron.

(4) Solder Volume

Solder shall be used not to be exceeded the upper limits as shown below.

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Excessive solder volume may cause the failure of mechanical or electrical performance.

150

90s±30s Time（ｓ）

245±3℃

Tem

(℃)

220℃

30～60s

180

260℃/10s

230℃

60s max.

Limit Profile

Standard Profile

0.25

0.55

0.4

0.5

(in mm)

Upper Limit

Recommendable Recommendable

Upper Limit

1/3T

≤

T (T:Chip thickness)

Spec No.JEFK243A-0004C-01 P10/10

MURATA MFG.CO.,LTD

Reference Only

15.9 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)

(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon

at the mounted products and P.C.B..

・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 minutes max.

(3) Cleaner

1. Alternative cleaner • Isopropyl alcohol (IPA)

2. Aqueous agent • PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized

water in order to remove the cleaner.

(5) Other cleaning

Please contact us.

15.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening

screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

15.11 Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the performance, such

as insulation resistance may result from the use.

(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

15.12 Storage Condition

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage environment conditions

·Products should be stored in the warehouse on the following conditions.

Temperature ： -10 ~ +40°C

Humidity ： 15 to 85% relative humidity No rapid change on temperature and humidity.

· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,

to prevent the following deterioration. Poor solderability due to the oxidized electrode.

· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.

· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

· Products should not be stored under the air tights packaged condition.

(3) Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

16.△

!Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering.