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Electrical Characteristics
Electrical Connections
Characteristic Sym Notes Min Typ Max Units
Center Frequency fC915 MHz
Insertion Loss, 902 to 928 MHz IL 2.2 3.0 dB
Amplitude Ripple, 902 to 928 MHz 0.5 1.5 dBP-P
VSWR, 902 to 928 MHz 1.6:1 2.2:1
Attenuation (Reference level from 0 dB)
dB
DC to 800 MHz 45 63
800 to 870 MHz 40 53
960 to 1080 MHz 30 40
1080 to 2000 MHz 35 53
2000 to 3000 MHz 22 28
Source impedance ZS50
Load impedance ZL50
Operating Temperature TA-40 +85 °C
Single Ended Input / Output, Impedance match No matching network required for operation at 50 ohms
Case Style SM2520-4
Lid Symbolization (2C=SF2098G Y=year, W=week) 2C, YW
Connection Terminals
Input 1
Output 3
Ground All others
SM2520-4
Low-loss SAW Filter
2.5 x 2.0 x 1.05 mm Surface-mo unt Ca se
No Matching Circuit Required
Complies with Directive 2002/95/EC (RoHS)
Absolute Maximum Ratings
Rating Value Units
Maximum Incident Power in Passband +15 dBm
Maximum DC voltage between any Two Terminals 3 VDC
Storage Temperature Range in Tape and Reel -40 to +85 °C
Maximum Reflow Soldering Profile 265 °C for 10 s
915.00 MHz
SAW Filter
SF2098G
1. US and international patents may apply.
2. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
Pb
50
RF IC
50
RF IC
12
34
BOTTOM VIEW
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
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4-Terminal Ceramic Surface-Mount Case
2.5 X 2.0 mm Nominal Footprint
TOP VIEW BOTTOM VIEW
E
F
G
G
B
A
C
1
43
2
3
2
4
1
Case Dimensions
Electrical Connections
Dimension mm
Nom
A2.0
B2.5
C1.0
E0.95
F0.70
G0.60
Connection Terminals
Port 1 Single-ended Input 1
Port 2 Single-ended Output 3
Ground All others
Single Ended Operation Only
Materials
Solder Pad
Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating 2.0 to 3.0 µm Nickel
Body Al2O3 Ceramic
Pb Free
SM2520-4 Case
PCB Foot Print
2C
YW
"
"""
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Reel Dimension
Tape Dimen sion