STPS1H100UY - STMicroelectronics, Inc.

December 2010 Doc ID 17935 Rev 1 1/9

STPS1H100-Y

Automotive high voltage power Schottky rectifier

Features

■Negligible switching losses

■High junction temperature capability

■Low leakage current

■Good trade-off between leakage current and

forward voltage drop

■Avalanche capability specified

■ECOPACK®2 compliant component

■AEC-Q101 qualified

Description

Schottky rectifiers packaged in SMA or SMB, and

designed for high frequency miniature switched

mode power supplies as DC/DC converters for

automotive applications.

Table 1. Device summary

Symbol Value

IF(AV) 1 A

VRRM 100 V

Tj (max) 175 °C

VF(max) 0.62 V

SMA

(JEDEC DO-214AC)

STPS1H100AY

SMB

(JEDEC DO-214AA)

STPS1H100UY

www.st.com

Characteristics STPS1H100-Y

2/9 Doc ID 17935 Rev 1

1 Characteristics

To evaluate the conduction losses use the following equation:

P = 0.54 x IF(AV) + 0.08 IF2(RMS)

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 100 V

IF(RMS) Forward rms voltage 10 A

IF(AV) Average forward current TL = 160 °C δ = 0.5 1 A

IFSM Surge non repetitive forward current tp =10 ms sinusoidal 50 A

IRRM Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A

IRSM Non repetitive peak reverse current tp = 100 µs square 1 A

PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1500 W

Tstg Storage temperature range - 65 to + 175 °C

TjOperating junction temperature (1)

1. condition to avoid thermal runaway for a diode on its own heatsink

- 40 to + 175 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

Table 3. Thermal resistance

Symbol Parameter Value Unit

Rth(j-l) Junction to lead SMA 30 °C/W

SMB 25

Table 4. Static electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

IR(1)

1. Pulse test: tp = 5 ms, δ < 2%

Reverse leakage current Tj = 25 °C VR = VRRM

4µA

Tj = 125 °C 0.2 0.5 mA

VF(2)

2. Pulse test: tp = 380 µs, δ < 2%

Forward voltage drop

Tj = 25 °C IF = 1 A 0.77

Tj = 125 °C 0.58 0.62

Tj = 25 °C IF = 2 A 0.86

Tj = 125 °C 0.65 0.7

dPtot

dTj <1

Rth(j-a)

STPS1H100-Y Characteristics

Doc ID 17935 Rev 1 3/9

Figure 1. Average forward power dissipation

versus average forward current

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)

P (W)

F(AV)

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

δ=tp/T tp

I (A)

F(AV)

δ= 1

δ= 0.1

δ= 0.05

δ= 0.5

δ= 0.2

I (A)

F(AV)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0 25 50 75 100 125 150 175

th(j-a)

th(j-l)

δ=tp/T tp

th(j-a)

=100°C/W

th(j-a)

=120°C/W

SMA

SMB

th(j-a)

=200°C/W

T (°C)

amb

Figure 3. Normalized avalanche power

derating versus pulse duration

Figure 4. Normalized avalanche power

derating versus junction

temperature

0.001

0.01

0.10.01 1

0.1

10 100 1000

P(t

P (1µs)

ARM

t (µs)

0.2

0.4

0.6

0.8

1.2

25 50 75 100 125 150

P(T)

P (25 °C)

ARM j

ARM

T (°C)

Figure 5. Non repetitive surge peak forward

current versus overload duration

(maximum values) (SMB)

Figure 6. Non repetitive surge peak forward

current versus overload duration

(maximum values) (SMA)

I (A)

1.E-03 1.E-02 1.E-01 1.E+00

Ta=25 °C

Ta=75 °C

Ta=110 °C

δ=0.5

SMB

t(s)

I (A)

1.E-03 1.E-02 1.E-01 1.E+00

Ta=25 °C

Ta=75 °C

Ta=110 °C

δ=0.5

SMA

t(s)

Characteristics STPS1H100-Y

4/9 Doc ID 17935 Rev 1

Figure 7. Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMB)

Figure 8. Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMA)

Z/R

th(j-c) th(j-c)

0.01

0.10

1.00

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Single pulse

SMB

t (s)

Z/R

th(j-c) th(j-c)

0.01

0.10

1.00

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Single pulse

SMA

t (s)

Figure 9. Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 10. Junction capacitance versus

reverse voltage applied

(typical values)

I (µA)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

0 102030405060708090100

Tj=125 °C

Tj=25 °C

V (V)

C(pF)

100

1 10 100

F=1 MHz

VOSC=30 mVRMS

Tj=25 °C

V (V)

Figure 11. Forward voltage drop versus

forward current (maximum values)

Figure 12. Thermal resistance junction to

ambient versus copper surface

under each lead (SMB)

I (A)

0.01

0.10

1.00

10.00

100.00

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

Tj=25 °C

Tj=125 °C

V (V)

R (°C/W)

th(j-a)

100

110

120

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMB

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

STPS1H100-Y Characteristics

Doc ID 17935 Rev 1 5/9

Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMA)

R (°C/W)

th(j-a)

100

110

120

130

140

SMA

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

Package information STPS1H100-Y

6/9 Doc ID 17935 Rev 1

2 Package information

●Epoxy meets UL94, V0

●Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 14. SMA package dimensions

Figure 15. SMA footprint dimensions in millimeters (inches)

Ref

Dimensions

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

2.63

(0.103)

5.43

(0.214)

1.4

1.64

(0.064)

1.4

(0.055) (0.055)

STPS1H100-Y Package information

Doc ID 17935 Rev 1 7/9

Figure 16. SMB package dimensions

Figure 17. SMB footprint dimensions in millimeters (inches)

Ref

Dimensions

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

L 0.75 1.50 0.030 0.059

2.60

5.84

1.62

2.18

1.62

(0.064) (0.102)

(0.300)

(0.064)

(0.086)

Ordering information STPS1H100-Y

8/9 Doc ID 17935 Rev 1

3 Ordering information

4 Revision history

Table 5. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS1H100AY S11Y SMA 0.068 g 5000 Tape and reel

STPS1H100UY G11Y SMB 0.107 g 2500 Tape and reel

Table 6. Document revision history

Date Revision Changes

03-Dec-2010 1 First issue.

STPS1H100-Y

Doc ID 17935 Rev 1 9/9

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