3D Magnetic Sensor 2 Go - TLE493D-A2B6
Low Power 3D Hall Sensor with I²C Interface
TLE493D-A2B6 3D-MS2GO
User Manual
About this document
Scope and purpose
This document provides an introduction to the 3D Magnetic Sensor 2 Go kit and should enable the reader to
eiciently carry out own evaluations with the 3D magnetic sensor TLE493D-A2B6.
Intended audience
This document is aimed at everyone who wants to work with the 3D Magnetic Sensor 2 Go evaluation kit.
User Manual Please read the Important Notice and Warnings at the end of this document 1.0
www.infineon.com 2018-05-16
Table of contents
User Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Hardware overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Soware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.3 Magnet heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 EvalBoard description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Optional external power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Pin header connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 EvalBoard schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3Soware installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1 Driver installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4 3D magnetic sensor evaluation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
4.1 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
4.2 Graph View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.3 Joystick view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.4 Polar coordinates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3D Magnetic Sensor 2 Go - TLE493D-A2B6
Low Power 3D Hall Sensor with I²C Interface
Table of contents
User Manual 2 1.0
2018-05-16
1 Introduction
Infineon’s 3D Magnetic Sensor 2 Go is a compact evaluation kit to familiarize the user with the 3D Hall sensor
TLE493D-A2B6. In a short time the board is set up and own 3D magnetic measurements can be executed. All
required hardware is included and the soware can be downloaded for free from the Infineon web page.
This user manual describes the dierent parts of the board, the soware installation process and clarifies how
the Graphical User Interface (GUI) can be used to do first evaluations.
1.1 Hardware overview
The 3D Magnetic Sensor 2 Go kit contains:
• The 3D evaluation board (EvalBoard) as shown in Figure 1, a ready-to-use printed circuit board (PCB) with
the 3D Hall sensor. The EvalBoard is based on the XMC2Go-Kit. More technical documents and detailed
description can be found at http://www.infineon.com/xmc2go.
• A standalone block magnet.
To use the 3D Magnetic Sensor 2 Go kit the user has to acquire a USB cable with a micro USB connection-end for
the EvalBoard side and a conventional USB connection for the PC side.
50mm
14mm
Figure 1 3D Magnetic Sensor 2 Go EvalBoard
1.2 Soware
The required soware to run the kit can be found at the Infineon web site. For further information refer to the
chapter Soware installation.
The soware package contains:
• A Graphical User Interface (GUI) for the user sensor evaluation.
• Firmware to be flashed into the XMC microcontroller for the low level communication with the sensor.
• USB driver J-Link from Segger which is necessary to establish the USB connection.
This soware was designed to be used with Windows 7 and Windows 10. It is compatible with both 32-bit and
64-bit system types. Other versions may also work, but have not been tested.
The USB protocols capabilities are defined by the Segger driver. Versions USB 2.0 and USB 3.0 should be
compatible.
The EvalBoard with the TLE493D-A2B6 3D Hall sensor can be used with the GUI version 3.0.0 and onwards.
The GUI is used to enable a communication between the sensor and the PC. The user can configure the sensor
to operate in dierent modes. In those modes the update rate of the magnetic field measured (X, Y and Z
components) and current consumption vary.
1.3 Magnet heads
As described in Chapter 1.1, a standalone magnet is provided with the 3D Magnetic Sensor 2 Go kit. This can be
manually placed to a desired position and then the magnetic field can be measured in the three dimensions.
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Low Power 3D Hall Sensor with I²C Interface
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In addition, Infineon oers magnet heads which can be mounted on the EvalBoard. Currently two magnetic
heads are available, a joystick and a rotation knob.
Table 1 Magnet heads order codes
Magnet head for the 3D Magnetic Sensor 2 Go kit SP Number
Joystick SP001491834
Rotation knob SP001504602
Figure 2 Magnet heads for the 3D Magnetic Sensor 2 Go kit
The magnet used in the joystick magnet head is an axial magnetized magnet as shown in Figure 3. The magnet
material is ferrite, of class Y35, which is equivalent to a remanence of between 400 mT and 410 mT. The magnet
disk has a size of 5 mm diameter and 5 mm thickness. For more information about the magnet, please follow
this link: https://www.supermagnete.de/eng/disc-magnets-neodymium/disc-magnet-diameter-5mm-
height-5mm-neodymium-n45-nickel-plated_S-05-05-N
5 mm
5mm
Figure 3 Magnet used in the joystick magnet head
The magnet used in the rotate knob magnet head is a diametrically magnetized magnet as shown in Figure 4.
The magnet material is Neodymium Iron Boron (NdFeB) of class N45. The magnet is protected against corrosion
with Nickel coating (Ni-Cu-Ni). The magnet size is 4 mm diameter and 10 mm thickness. For more information
about the magnet, please follow this link: https://www.supermagnete.de/eng/rod-magnets-neodymium/rod-
magnet-diameter-4mm-height-10mm-neodymium-n45-nickel-plated_S-04-10-AN
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Introduction
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4mm
10mm
Figure 4 Magnet used in the rotation knob magnet head
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2 EvalBoard description
The evaluation board (EvalBoard) is a ready-to-use printed circuit board (PCB) which contains:
• The 3D magnetic sensor TLE493D-A2B6. For the availability of 3D Magnetic Sensor 2 Go kits with dierent
sensor variants check the Infineon web page: https://www.infineon.com/cms/en/product/sensor/
magnetic-position-sensor/3d-magnetic-sensor/
• XMC1100 microcontroller based on ARM Cortex™-M0 at 48 MHz frequency connected to the 3D sensor.
• XMC4200 microcontroller based on ARM Cortex™-M4 at 144 MHz frequency used for the debugging and the
USB communication.
• Micro USB connector for power supply and communication with the Graphical User Interface (GUI).
• LED for indication of power supply and debugging.
• Two LEDs for user configuration.
• Voltage regulator, reverse current protection diode and ESD protection diode.
• Pin headers to access data lines (e.g. via oscilloscope, external microcontroller).
The dierent components and its location are shown in Figure 5. The 3D magnetic sensor can be separated
from the rest of the EvalBoard by cutting the break line.
pin header X3
user LED2
@P1.1
pin header X1
crystal for
debug IC
XMC4200 debug IC and
UART to USB bridge
voltage regulator and reverse
current protection diode
TLE493D-A2B6
mirco USB
connector
ESD protection
diode
power and
debug LED
XMC 1100
mircocontroller
pin header X2
user LED1
@P0.12
break
line
pin header
distance fits
to breadbord
Figure 5 Main components of the EvalBoard
2.1 Optional external power supply
The 3D Magnetic Sensor 2 Go EvalBoard is supplied via the USB cable. It is also possible to provide an external
power supply. If this is the case, a few considerations must be taken into account as described below.
The 3D Magnetic Sensor 2 Go EvalBoard must be supplied by external 5 Volt DC power supply connected to the
micro USB plug. The voltage regulator shis the voltage level to 3.3 V for the microcontrollers and the 3D
magnetic sensor. The Power & Debug LED indicates that the presence of the generated 3.3 V supply voltage.
Out of the box with the pre-programmed application and the on-board debugger in operation the EvalBoard
typically draws about 75 mA. This current can be delivered via the USB plug of a PC, which is specified to deliver
up to 500 mA. An on-board reverse current protection diode will ensure safe operation and protects the USB
port of the Laptop/PC in case power is provided through the pin header X1.
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It is not recommended to apply an additional power supply to the VDD pin of X1 (3.3 V) when the board is
powered via USB, because the 3.3 V supply could drive against the on-board power supply. The VDD pin can be
used to power an external circuit. But care must be taken not to draw more current than 150 mA, which is the
maximum current the on-board voltage regulator can deliver. Aer power-up the Debug LED starts blinking. In
case there is connection to a PC with correctly installed drivers, the Debug LED will turn from blinking to
constant illumination.
2.2 Pin header connector
The pin headers X1 and X2 can be used to extend the evaluation board or to perform measurements on the
XMC1100. The order of pins available at X1 and X2 corresponds to the pinning schema of the XMC1100
microcontroller in the TSSOP-16 pin package. The pinning table is also printed onto the bottom side of the PCB
(depending on the version). The pin header X3 can be used to access directly the 3D magnetic sensor pins.
X1
X2
X3
P0.5
P0.0
3.3 V
GND
P2.11
P2.10
P2.9
P2.7
P0.6
P0.7
P0.8
P0.9
P0.14
P0.15
P2.0
P2.6
VDD (P1.0)
GND
SDA (P2.10)
SCL (P2.11)
Figure 6 EvalBoard pin header connectors
The 3D Hall sensor pins can be accessed via the pin headers as shown in Table 2.
Table 2 Pin header description for the 3D magnetic sensor (X3)
TLE493D-A2B6 pin
number
Pin name
on board
XMC1100 port pin Sensor pin description
1 SCL P2.11 Interface clock and \INT pin, open drain
3 GND GND Ground pin
4 +3V3 P1.0 Supply pin
6 SDA P2.10 Interface data pin, open drain
The XMC1100 port pins P0.12 and P1.1 are connected the two user LEDs and are not available on the pin
headers.
Table 3 Pins used for the user LEDs
LED XMC1100 port pin
LED1 P0.12
LED2 P1.1
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2.3 EvalBoard schematics
The schematics of the dierent blocks from the EvalBoard of the3D Magnetic Sensor 2 Go kit are provided in
this chapter. They can be used to design customized PCBs. The user (integrator) is responsible for the correct
functioning on system level as well as for the validation and testing.
Figure 7 EvalBoard schematic: 3D magnetic sensor
Figure 8 EvalBoard schematic: the voltage regulator (for the power supply)
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Figure 9 EvalBoard schematic: the LEDs for user configuration (connected to XMC1100 pins)
Figure 10 EvalBoard schematic: the XMC1100 microcontroller and pin headers
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EvalBoard description
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Figure 11 EvalBoard schematic: the Debug connection
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Figure 12 EvalBoard schematic: the XMC4200 microcontroller and micro USB connector
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3Soware installation
The following description guides through the installation procedure of the free evaluation soware for the 3D
Magnetic Sensor 2 Go kit.
Steps
1. Download the soware.
Follow the link below to reach the Sensor 2 Go information page on the Infineon website. As shown in
Figure 13, you can find the download link for the latest version of the 3D Magnetic Sensor 2 Go GUI on
the right hand side.
https://www.infineon.com/cms/en/product/promopages/sensors-2go/
Figure 13 Download the "3D Magnetic Sensor 2 Go" soware from the Infineon web
page
2. Start the installation process.
Browse to your download folder and extract the downloaded .zip file. Aerwards, double click on
the .msi file to start the installer. The window in Figure 14 pops up. Click "Next".
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Figure 14 Start the soware installation
3. Read the license agreement carefully and tick the box to accept the terms. Click Next.
Figure 15 Accept the license agreement
4. Choose your installation path and check that the SEGGER J-Link driver will be installed. Click Next
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Figure 16 Select you installation folder
5. Confirm the installation settings by clicking on Install.
Figure 17 Confirm the installation
6. Once the installation is complete, click on Finish to close the installer.
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Figure 18 Installation finished
7. You can now start the evaluation soware. Open the start menu, browse to Infineon Technologies > 3D
Sensor 2go Kit and open the application by clicking on 3D 2Go.
Figure 19 Shortcut to the 3D Magnetic 2Go evaluation soware (GUI)
3.1 Driver installation
To enable the communication between the 3D Magnetic Sensor 2 Go kit it is necessary to install the J-Link driver
on your PC.
The driver is included in the GUI installer and will start automatically within the installation progress. In case of
issues, you can directly download the latest version from the SEGGER homepage:
https://www.segger.com/downloads/jlink
Steps
1. Start the installation. Invoke your downloaded driver executable or wait for the 3D Magnetic Sensor 2 Go
installer to open the window shown in Figure 20. Click on Next.
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Figure 20 J-Link driver setup
2. Read and accept the license agreement. Click on I Agree.
Figure 21 J-Link license agreement
3. Check that the "Install USB Driver for J-Link" option is active. Click on Next.
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Figure 22 J-Link installation options
4. Choose the installation folder. It is recommend to keep the default settings. Click on Install. Now the
installation should be executed.
Figure 23 J-Link choose install location
5. Once the installation is completed, close the installer by clicking on Finish.
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Figure 24 J-Link installation complete
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4 3D magnetic sensor evaluation
This chapter describes how the GUI can be used to make first evaluations with Infineon's 3D magnetic sensor.
4.1 Getting started
Once the soware is installed, the following steps are necessary to do the first magnetic measurements.
Steps
1. Connect the EvalBoard to the PC via the USB cable. Use the micro USB port for the EvalBoard and USB
port for the PC. The power LED on the EvalBoard will switch on, indicating the EvalBoard is supplied with
enough power.
2. Open the 3D 2Go GUI by clicking the shortcut in the start menu. On the top le side you should find the
XMC2Go board in the list. If not, check that the EvalBoard is correctly connected to the PC and the J-Link
driver is installed. Click on the Connect to selected programmer button which is marked in Figure 25 to
establish the connection with the 3D Magnetic Sensor 2 Go kit. The first time you connect the board, a
firmware will be downloaded to the XMC1100 which takes short time. This is indicated by the blinking
power LED on the EvalBoard.
Figure 25 Establish the connection to the EvalBoard
3. The GUI automatically detects the sensor type on the 3D Magnetic Sensor 2 Go kit. Now you can select
the mode configuration. The GUI supports three sensor modes for the TLE493D-A2B6. They are briefly
described in Table 4 . For details refer to the TLE493D-A2B6 data sheet and user manual. Aer you have
selected the mode, click on Start to begin with the measurements.
Table 4 Sensor modes
Sensor mode Description
Low power mode Cyclic sensor measurements with a configurable update rate. The GUI
sets the sensor to the default update rate of 770 Hz (typ.). Between the
measurements, the sensor stays in power down mode, which reduces the
power consumption.
Fast mode Sensor measurements are running continuously. Fastest update rate.
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Table 4 Sensor modes (continued)
Sensor mode Description
Master controlled
mode
Sensor measurements are triggered by the microcontroller, which
enables high flexibility.
4.2 Graph View
The graph view displays the magnetic field measurements in X, Y and Z direction.
Figure 26 shows the graph view window. On the le hand side there are three histograms which plot the
magnetic field for each measured sample. On the right a table displays all measured data, including the
temperature. With the save button it is possible to export the measurement data into a .csv file. This is
especially helpful for processing the data aerwards. .
If a new mode should to be evaluated click the Stop button on the le control panel. Save the data and Clear it.
Select a new configuration and click again on Start to begin the new evaluation.
Figure 26 Graph view
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4.3 Joystick view
The joystick view is a virtual representation of a real joystick with an attached magnet, mounted above the 3D
magnetic sensor.
It is intended to be used with the Joystick adapter available for the 3D Magnetic Sensor 2 Go kit. For order
details and information about the used magnet refer to section Magnet heads.
The soware measures the magnetic field in all three dimensions and calculates the angles necessary to
determine the joystick position. Further information is given in the application note "Infineon 3D Magnetic
Sensor - How to Make a Magnetic Design for Joystick" which can be found on the Infineon home page.
Figure 27 Joystick view
4.4 Polar coordinates
In this view the calculated spherical coordinates of the magnetic field are displayed. Additionally it includes a
graphical presentation of the 3D Magnetic Sensor 2 Go rotary knob attachment .
The polar coordinates consist of the radius r as well as the angles Phi and Theta. They are calculated out of the
measured three dimensional magnetic field with following equations:
r=Bx2+By2+Bz2
Phi = arccosBz
r
Theta = arctanBy
Bx
Below the polar coordinates a virtual rotation knob can be found. It can be used with the rotary knob
attachment described in Magnet heads. When the user turns the hardware knob, also the knob in the GUI turns.
This is achieved by measuring the magnetic field and calculating the angle between Bx and By as described
above. Also a push functionality is implemented. When the user pushes the knob, the color of the direction
stripe turns from white to green. This is based on the magnitude of the magnetic field.
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Figure 28 Polar coordinates
Revision history
Document
version
Date of
release
Description of changes
1.0 2018-05-16 Initial version.
1.1 2018-10-12 Title page updated.
3D Magnetic Sensor 2 Go - TLE493D-A2B6
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Revision history
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Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2018-05-16
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2018 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-hda1518789688364
IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaenheitsgarantie”) .
With respect to any examples, hints or any typical values
stated herein and/or any information regarding the
application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities of
any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively
intended for technically trained sta. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
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dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies oice.
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