DATA SHEE
T
THIN FILM CHIP RESISTORS
General purpose
RJ series (Pb Free)
1%, TC50
sizes 0201/0402/0603/0805
/
1206/1210/2010/2512
Product specification – May 30, 2005 V.1
Product specification
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May 30, 2005 V.1
Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
SCOPE
This specification describes RJ0201 to RJ2512 general purpose chip resistors with lead-free terminations made by
thin film process.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and
resistance value.
P
PH
HY
YC
CO
OM
MP
P
O
OR
RD
DE
ER
RI
IN
NG
G
C
CO
OD
DE
E
12NC CODE
2390 XXX XXXXX L
(1) (2) (3) (4)
EMBOSSED TAPE ON REEL(2) PAPER/PE TAPE ON REEL (units) (2)
RJ
SIZE
START
IN (1)
TOL.
(%)
RESISTANCE
RANGE
4,000 5,000 10,000 20,000 50,000
0201
2390 ±1% 10 Ω to 30 kΩ - - 409 8xxxx 429 8xxxx 449 8xxxx
0402
2390 ±1% 10 Ω to 121 kΩ - - 407 8xxxx 427 8xxxx 447 8xxxx
0603
2390 ±1% 3 Ω to 681 kΩ - 404 8xxxx 424 8xxxx 444 8xxxx -
0805
2390 ±1% 3 Ω to 1.5 MΩ - 401 8xxxx 421 8xxxx 441 8xxxx -
1206
2390 ±1% 3 Ω to 1.5 MΩ - 411 8xxxx 431 8xxxx 451 8xxxx -
1210
2390 ±1% 1 Ω to 1 MΩ - 412 0xxxx 432 8xxxx 412 8xxxx -
2010
2390 ±1% 10 Ω to 1 MΩ 415 8xxxx - - - -
2512
2390 ±1% 10 Ω to 1 MΩ 418 8xxxx - - - -
NOTE
a. The “L” at the end of the code is only
for ordering. On the reel label, the
standard CTC or 12NC will be
mentioned an additional stamp “LFP”=
lead free production.
b. Products with lead in terminations fulfil
t
he same requirements as mentioned in
this datasheet.
c. Products with lead in terminations will
be phased out in the coming months
(before July 1st, 2006)
(1) The resistors have a 12-digit
ordering code starting with
2390.
(2) The subsequent 4 digits
indicate the resistor
tolerance and packaging.
(3) The remaining 4 digits
represent the resistance value
with the last digit indicating
the multiplier as shown in the
table of “Last digit of 12NC”.
(4) “L” means lead-free
terminations (a).
ORDERING EXAMPLE
The ordering code of a RJ0603
resistor, TC50 value 56 X, with
±1% tolerance, supplied in tape
of 5,000 units per reel is:
239040485609L.
Resistance decade (3) Last digit
0.01 to 0.0976 X0
0.1 to 0.976 X 7
1 to 9.76 X 8
10 to 97.6 X 9
100 to 976 X 1
1 to 9.76 kX 2
10 to 97.6 kX 3
100 to 976 kX 4
1 to 9.76 MX 5
10 to 97.6 MX 6
Example: 0.02
X= 0200 or 200
0.3 X = 3007 or 307
1
X = 1008 or 108
33 kX= 3303 or 333
10 MX= 1006 or 106
Last digit of 12NC
Product specification
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May 30, 2005 V.1
Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
CTC CODE
RJ XXXX F X X XX XXXX L
(1) (2) (3) (4) (5) (6) (7)
(1) SIZE
0201
0402
0603
0805
1206
1210
2010
2512
(2) TOLERANCE
F = ±1%
(3) PACKAGING TYPE
R = Paper/PE taping reel
K = Embossed taping reel
(4) TEMPERATURE COEFFICIENT OF RESISTANCE
E = 50 ppm/°C
(5) TAPING REEL
07 = 7 inch dia. Reel
10 = 10 inch dia. Reel (not preferred)
13 = 13 inch dia. Reel
(6) RESISTANCE VALUE
5R6, 56R, 560R, 5K6, 56K, 1M.
(7) RESISTOR TERMINATIONS
L = Lead free terminations (matte tin) (a)
ORDERING EXAMPLE
The ordering code of a RJ0603 chip resistor, TC50
value 56 X with ±1% tolerance, supplied in 7-inch
tape reel is: RJ0603FRE0756RL.
NOTE
a. The “L” at the end of the code is only for ordering. On the reel
label, the standard CTC will be mentioned an additional stamp
“LFP”= lead free production.
b. Products with lead in terminations fulfil the same requirements
as mentioned in this datasheet.
c. Products with lead in terminations will be phased out in the
coming months (before July 1st, 2006)
Product specification
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May 30, 2005 V.1
Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
MARKING
RJ0805 / RJ1206 / RJ1210 / RJ2010 / RJ2512
Either resistance in E-24 or E-96: 4 digits
First three digits for significant figure and 4th digit for number of zeros
RJ0603
E-24 series: 3 digits
First two digits for significant figure and 3rd digit for number of zeros
E-96 series: 3 digits for 0603±1% EIA-96 marking method
RJ0201 / RJ0402
No marking
For marking codes, please see EIA-marking code rules in data sheet “Chip resistors marking”.
Fig. 1 Value = 10 kΩ
YNSC004
00
Fig. 2 Value = 12 kΩ
ynsc015
Fig. 3 Value = 12.4 kΩ
10C
ynsc002
Fig. 4
ynsc007
Product specification
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May 30, 2005 V.1
Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
CONSTRUCTION
The resistors are constructed out of a high-grade ceramic
body. Internal metal electrodes are added at each end and
connected by a resistive layer. The resistive layer is
adjusted to give the approximate required resistance and
laser cutting of this resistive layer that achieves tolerance
trims the value. The resistive layer is covered with a
protective coat and printed with the resistance value.
Finally, the two external terminations (matte tin) are
added. See fig. 5.
DIMENSION
ELECTRICAL CHARACTERISTICS
Table 2
TYPE L (mm) W (mm) H (mm) I1 (mm) I2 (mm)
RJ0201 0.6 ±0.10 0.30 ±0.05 0.25 ±0.05 0.15 ±0.10 0.15 ±0.10
RJ0402 1.00 ±0.10 0.50 ±0.05 0.30 ±0.05 0.20 ±0.10 0.25 ±0.10
RJ0603 1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15
RJ0805 2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20
RJ1206 3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20
RJ1210 3.10 ±0.10 2.60 ±0.15 0.55 ±0.10 0.50 ±0.20 0.50 ±0.20
RJ2010 5.00 ±0.10 2.50 ±0.15 0.55 ±0.10 0.60 ±0.20 0.50 ±0.20
RJ2512 6.35 ±0.10 3.20 ±0.15 0.55 ±0.10 0.60 ±0.20 0.50 ±0.20
Table 1 For outlines see fig. 5
protective coat
resistive layer
inner electrode
end termination
ceramic substrate
H
I2
YNSC056
protective coat
W
L
I1
Fig. 5 Chip resistor outlines
O
OU
UT
TL
LI
IN
NE
ES
S
For dimension see Table 1
TYPE
RESISTANCE
RANGE
OPERATING
TEMPERATURE RANGE
DERATED
TO
0 LOAD AT
MAXIMUM
W
ORKING
VOLTAGE
DIELECTRIC
WITHSTAND
VOLTAGE
MAXIMUM
OVERTOAD
VOLTAGE
TEMPERATURE
COEFFICIENT
OF
RESISTANCE
RJ0201 10 Ω to 22 KΩ –55 °C to +125 °C +125 °C 15 V 50 V 50 V ±50 ppm/°C
RJ0402 1 Ω to 121 KΩ –55 °C to +125 °C +125 °C 25 V 100 V 100 V ±50 ppm/°C
RJ0603 1 Ω to 681 KΩ –55 °C to +125 °C +125 °C 50 V 100 V 100 V ±50 ppm/°C
RJ0805 1 Ω to 1.5 MΩ –55 °C to +125 °C +125 °C 100 V 250 V 200 V ±50 ppm/°C
RJ1206 1 Ω to 1.5 MΩ –55 °C to +125 °C +125 °C 150 V 250 V 250 V ±50 ppm/°C
RJ1210 1 Ω to 1 MΩ –55 °C to +125 °C +125 °C 150 V 400 V 300 V ±50 ppm/°C
RJ2010 1 Ω to 1 MΩ –55 °C to +125 °C +125 °C 150 V 400 V 300 V ±50 ppm/°C
RJ2512 1 Ω to 1 MΩ –55 °C to +125 °C +125 °C 150 V 400 V 300 V ±50 ppm/°C
Product specification
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May 30, 2005 V.1
Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
handbook, halfpage
MLB206
70 10055 50
T
amb( C)
o
(%P )
rated
0
0
50
100
125
Pmax
Fig. 6 Maximum dissipation (Pmax) in percentage of rated power
as a function of the operating ambient temperature (Tamb)
FUNCTIONAL DESCRIPTION
O
OP
PE
ER
RA
AT
TI
IN
NG
GT
TE
EM
MP
PE
ER
RA
AT
TU
UR
RE
E
R
RA
AN
NG
GE
E
Range: –55°C to +125°C
P
PO
OW
WE
ER
R
R
RA
AT
TI
IN
NG
G
Each type rated power at 70°C:
RJ0201=1/20 W, RJ0402=1/16 W, RJ0603=1/16 W,
RJ0805=1/10 W, RJ1206=1/8 W, RJ1210=1/4 W,
RJ2010=1/2 W, RJ2512=3/4 W.
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V = √(P X R)
Where
V = Continuous rated DC or AC (rms) working voltage (V)
P = Rated power (W)
R = Resistance value (X)
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles,
please see the special data sheet “Chip resistors
mounting”.
ENVIRONMENTAL DAT
A
For material declaration information (IMDS-data) of
the products, please see the separated info
“Environmental data” conformed to EU RoHS.
PACKING STYLE REEL DIMENSION RJ0201 RJ0402 RJ0603 RJ0805 RJ1206 RJ1210 RJ2010 RJ2512
Paper/PE taping reel (R) 7" (178 mm) 10,000 10,000 5,000 5,000 5,000 5,000 --- ---
10" (254 mm) (2) 20,000 20,000 10,000 10,000 10,000 10,000 --- ---
13" (330 mm) 50,000 50,000 20,000 20,000 20,000 20,000 --- ---
Embossed taping reel (K) 7" (178 mm) --- --- --- --- --- --- 4,000 4,000
NOTE
1. For Paper/PE/Embossed tape and reel specification/dimensions, please see the special data sheet “Packing” document.
2. 10" reel is not preferred typing reel.
PACKING STYLE AND P
A
CKAGING QUANTITY
Table 3 Packing style and packaging quantity
Product specification
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May 30, 2005 V.1
Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENTS
At +25/–55 °C and +25/+125 °C Temperature
Coefficient o
f
Resistance
(T.C.R.)
MIL-STD-202F-method 304;
JIS C 5202-4.8
Formula:
T.C.R= ------------------------- × 106 (ppm/°C)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
±50 ppm/°C
Thermal Shoc
MIL-STD-202F-method 107G;
IEC 60115-1 4.19
At –65 (+0/–10) °C for 2 minutes and at +125
(+10/–0) °C for 2 minutes; 25 cycles
±(0.5%+0.05 Ω)
Low
Temperature
Operation
MIL-R-55342D-Para 4.7.4 At –65 (+0/–5) °C for 1 hour; RCWV applied
for 45 (+5/–0) minutes
±(0.5%+0.05 Ω)
No visible damage
Short Time
Overload
MIL-R-55342D-Para 4.7.5;
IEC 60115-1 4.13
2.5 × RCWV applied for 5 seconds at room
temperature
±(1.0%+0.05 Ω)
No visible damage
Insulation
Resistance
MIL-STD-202F-method 302;
IEC 60115-1 4.6.1.1
RCOV for 1 minute
Details see below table 5
≥10 GΩ
Dielectric
Withstand
Voltage
MIL-STD-202F-method 301;
IEC 60115-1 4.6.1.1
Maximum voltage (Vrms) applied for 1 minute
Details see below table 5
No breakdown or flashover
Resistance to
Soldering
Heat
MIL-STD-202F-method 210C;
IEC 60115-1 4.18
Unmounted chips; 260 ±5 °C for 10 ±1
seconds
±(0.5%+0.05 Ω)
No visible damage
Life MIL-STD-202F-method 108A;
IEC 60115-1 4.25.1
At 70±2 °C for 1,000 hours; RCWV applied for
1.5 hours on and 0.5 hour off
±(1%+0.05 Ω)
R2–R1
R1(t2–t1)
Table 4 Test condition, procedure and requirements
Product specification
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May 30, 2005 V.1
Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
TEST TEST METHOD PROCEDURE REQUIREMENTS
Solderabilit
y
MIL-STD-202F-method 208A;
IEC 60115-1 4.17
Solder bath at 245±3 °C
Dipping time: 2±0.5 seconds
Well tinned (≥95% covered)
No visible damage
Bending
Strength
JIS C 5202.6.14;
IEC 60115-1 4.15
Resistors mounted on a 90 mm glass epoxy resin
PCB (FR4)
Bending: see table 6 for each size
±(1.0%+0.05 Ω)
No visible damage
Resistance to
Solvent
MIL-STD-202F-method 215;
IEC 60115-1 4.29
lsopropylalcohol (C3H7OH) or dichloromethane
(CH2Cl2) followed by brushing
No smeared
Noise JIS C 5202 5.9;
IEC 60115-1 4.12
Maximum voltage (Vrms) applied. < 10 dB
Humidit
y
(steady state)
JIS C 5202 7.5;
IEC 60115-8 4.24.8
1,000 hours; 40±2 °C; 93(+2/–3)% RH
RCWV applied for 1.5 hours on and 0.5 hour off
±(0.5%+0.05 Ω)
Leaching EIA/IS 4.13B;
IEC 60115-8 4.18
Solder bath at 260±5 °C
Dipping time: 30±1 seconds
No visible damage
Intermittent
Overload
JIS C 5202 5.8
At room temperature; 2.5 × RCWV applied for 1
second on and 25 seconds off; total 10,000 cycles
±(1.0%+0.05 Ω)
Resistance to
Vibration
On request On request
Moisture
Resistance
Heat
MIL-STD-202F-method 106F;
IEC 60115-1 4.24.2
42 cycles; total 1,000 hours
Shown as figure 7
±(0.5%+0.05Ω)
No visible damage
Table 4 Test condition, procedure and requirements (continued)
TYPE RJ0201 RJ0402 RJ0603 RJ0805 RJ1206 RJ1210 RJ2010 RJ2512
Voltage (DC/unit: V); (AC/ unit: Vrms) 50 100 100 300 500 500 500 500
Table 5 Criteria of rated continued working voltage and overload voltage
TYPE RJ0201 RJ0402 RJ0603 RJ0805 RJ1206 RJ1210 RJ2010 RJ2512
Specification (mm) 2 2 3322 22
Table 6 Bending for sizes 0201 to 2512
Product specification
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Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
75
initial drying
24 hours
90 − 98% RH
80 − 98%
RH
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
initial measurements
as specified in 2.2
0
STEP1 STEP3STEP2
prior to first
cycle only
STEP4
one cycle 24 hours; repeat as specified in 2.5
voltage applied as specified in 2.4
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP6 STEP7
HBK073
STEP5
51015
end of final cycle;
measurements
as specified in 2.7
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
20
time [h]
temperature
[°C]
25
50
25
0
90 − 98% RH 90 − 98% RH
+10 °C (+18 °F)
−2 °C (−3.6 °F)
80 − 98%
RH
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
Fig. 7 Moisture resistance test requirements
Product specification
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May 30, 2005 V.1
Chip Resistor Surface Mount SERIES
RJ 0201 to 2512 (Pb Free)
REVISION HISTORY
REVISION DATE CHANGE NOTIFICATION DESCRIPTION
Version 1 May 30, 2005 - - New datasheet for thin film general purpose chip resistors sizes of
0201/0402/0603/0805/1206/1210/2010/2512 1% , TC50 with lead-free
terminations