DATA SHEE
T
WIRELESS COMPONENTS
Ceramic Chip Antenna
ANT3216LL05R5000A
5
GH
z
3216 Serie
s
Product Specification –March 27, 2013 V.0
www.yageo.
com
Mar. 27, 2013 V0
WIRELESS COMPONENTS
2
6
Product spe
cification
Ceramic Chip Antenna
FEATURES
z
Compact size
z
Omni-directi
onal radiati
on
z
Tape & reel autom
atic
mounting
z
Reflow p
rocess comp
atible
z
RoHS compliant
APPLICATIONS
z
ISM band equipment
ORDERING INFORMATION
All part numbers are identified by th
e series, packing type,
material, size,
antenna type, working frequ
ency and packing quantity.
PART
NUMBER
ANT
3216
L
L05
R
5000A
(1) (2) (3) (4) (5) (6)
(
1
)
PRODUCT
ANT = Antenna
(
2
)
SIZE
3216 = 3.2 × 1.6 mm
(
3
)
ANTENNA
TYPE
L,F,A = Chip Antenna
(
4
)
SERIAL NO.
L05
(
5
)
PACKING TYPE
R = Tape and Reel
(
6
)
WORKING FREQUENCY
5000 = 5 GHz
PHYCOMP CTC
CAN4311712055003K
12NC
431171205500
www.yageo.
com
Mar. 27, 2013 V0
WIRELESS COMPONENTS
3
6
Product spe
cification
Ceramic Chip Antenna
SPECIFICATION
DESCRIPTION
V
ALUE
Working Frequency
5.5 GH
z
Bandwidth
> 1000M Hz ( Typ. )
Return Loss
10 dB min
Polarization
Linea
r
Azimuth Beamwidth
Omni-directional
Peak Gain
5.71 dBi ( Typ. )
Impedance
50
Ω
Operating Temperature
-40~105
℃
Maximum Power
1
W
Termination
Ni / Sn (Environmentally-Friendly Leadless)
Resistance to Soldering Heats
260
℃
, 10sec.
NOTE
1. The specification is defined on Yageo evaluation board
Ta
b
l
e
1
O
O
U
U
T
T
L
L
I
I
N
N
E
E
S
S
YNH00116
Si
d
e
V
i
e
w
To
p
V
i
e
w
Bo
t
t
o
m
V
i
e
w
S1
S2
L
W
T
A
A
Fig.
1
Antenna outlines
DIME
NSIONS
DIMENSION
L (mm)
3.20 ±0.15
W (mm)
1.60 ±0.15
T (mm)
1.20 ±0.1
0
C (mm)
0.30 ±0.2
0
T
able 2 Machinical Dimension
TERMINAL NA
ME
FUNCTION
S1
Feeding Point
S2
Soldering Point
T
able 3
T
ermination configuration
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com
Mar. 27, 2013 V0
WIRELESS COMPONENTS
4
6
Product spe
cification
Ceramic Chip Antenna
YNH00117
Unit : mm
7
18
5
10
Bottom Layer / GND
T
op Layer
Unit : mm
Matching Circuit
0.75
1.3
0.5
2.6
1.85
3.0
2.0
Fig.
2
Outlook and dimension of evaluation board
REFERENCE DESIGN OF E
VALUATION BOARD
Fig.
3
Details of soldering Pad
www.yageo.
com
Mar. 27, 2013 V0
WIRELESS COMPONENTS
5
6
Product spe
cification
Ceramic Chip Antenna
YNH00118
4.0
4.3
7.0
f (GHz)
Return loss
(dB)
−
50
−
30
−
10
10
30
50
4.6
4.9
5.5
6.1
5.2
5.8
6.4
6.7
2
3
1
Fig.
4
Return loss
ELECTRICAL PERFORMANCES
Gain (dBi)
5.00
−
0.00
−
−
5.00
−
−
10.00
−
−
15.00
−
−
20.00
−
−
25.00
−
−
30.00
−
−
35.00
−
Z
Y
X
Z axle
X axle
Y axle
YNH00119
Fig.
5
Radiation pattern
Frequency= 5.47 GHz
Max gain = 5.71
dBi, at (150,
300)
MEG (mean effective gain)= -1.39dBi
Directivity (dB)
= 6.83
Efficiency = -1.12dB, 77.
33%
Evaluation board and XYZ direction
Marker data
1.
4.99GHz, -10dB
2.
5.5GHz, -22.3dB
3.
6.02GHz, -10dB
www.yageo.
com
Mar. 27, 2013 V0
WIRELESS COMPONENTS
6
6
Product spe
cification
Ceramic Chip Antenna
REVISION HISTORY
REVISION D
ATE
CHANGE
NOTIFICATIO
N
DESCRIPTIO
N
Version 0
Mar. 27, 2013
-
- New datasheet for Ceramic C
hip Antenna, 5 GHz
application,
3216 series
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