EB52F3B15N-25.600M EB52F3 B 15 N -25.600M Series 3.3Vdc 14-Pin DIP LVCMOS TCXO Operating Temperature Range 0C to +70C Nominal Frequency 25.600MHz Control Voltage None (No Connect on Pin 1) Frequency Stability 1.5ppm Maximum ELECTRICAL SPECIFICATIONS Nominal Frequency 25.600MHz Frequency Stability 1.5ppm Maximum (Inclusive of Operating Temperature Range) Frequency Stability vs. Input Voltage 0.3ppm Maximum (5%) Aging at 25C 1ppm/Year Maximum Frequency Stability vs. Load 0.2ppm Maximum (2pF) Operating Temperature Range 0C to +70C Supply Voltage 3.3Vdc 5% Input Current 20mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum Output Voltage Logic Low (Vol) 10% of Vdd Maximum Rise/Fall Time 10nSec Maximum (Measured at 20% to 80% of waveform) Duty Cycle 50% 10% (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Control Voltage None (No Connect on Pin 1) Internal Trim 3ppm Minimum (Top of Can) Modulation Bandwidth 10kHz Minimum (Measured at -3dB with a Control Voltage of 1.65Vdc) Input Impedance 10kOhms Typical Phase Noise -70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, 145dBc at 100kHz Offset Storage Temperature Range -40C to +85C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A (Internal Crystal Only) Gross Leak Test MIL-STD-883, Method 1014 Condition C (Internal Crystal Only) Lead Integrity MIL-STD-883, Method 2004 Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 1 of 4 EB52F3B15N-25.600M MECHANICAL DIMENSIONS (all dimensions in millimeters) Internal Trim Access Hole O3.5 0.5 4.8 0.3 5.0 1.0 3 4 4.0 0.3 7.62 0.30 MARKING ORIENTATION 1.2 +0/-0.5 O0.50 0.05 (x4) 2.5 0.3 18.3 0.5 CONNECTION 1 No Connect 2 Case/Ground 3 Output 4 Supply Voltage LINE MARKING 4.0 0.3 11.7 0.5 PIN 2 15.24 0.40 1 1 ECLIPTEK 2 25.600M 3 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year CLOCK OUTPUT OUTPUT WAVEFORM VOH 80% of Waveform 50% of Waveform 20% of Waveform VOL Fall Time Rise Time TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 2 of 4 EB52F3B15N-25.600M Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 3 of 4 EB52F3B15N-25.600M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 245C Maximum 245C Maximum 1 Time / 235C Maximum 2 Times 5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. Low Temperature Solder Bath (Wave Solder) Note 1 Device is non-hermetic; Post reflow aqueous wash is not recommended Low Temperature Solder Bath (Wave Solder) Note 2 Temperatures shown are applied to back of PCB board and device leads only. www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 4 of 4