CPC1009N Single-Pole, Normally Open 4-Lead SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current On-Resistance (max) Output Leakage, Off-State Ratings 100 150 8 20 Units VP mArms / mADC nA Description CPC1009N is a miniature low voltage, low on-resistance, low off-state leakage, normally open (1-Form-A) solid state relay in a 4-lead SOP package. The MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division's patented OptoMOS(R) architecture to provide 1500 Vrms of input-to-output isolation. The optically coupled output is controlled by a highly efficient GaAIAs infrared LED. Features * Extremely Low Output Leakage: 20nA * 1500Vrms Input/Output Isolation * Small 4-Lead SOP Package * Low Drive Power Requirements (TTL/CMOS Compatible) * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Machine Insertable, Wave Solderable * Tape & Reel Version Available The CPC1009N uses IXYS Integrated Circuits Division's state of the art double-molded vertical construction to produce one of the world's smallest 4-lead relays, which offers board space savings of 20% over the competitor's larger 4-lead SOP relay. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 Applications * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security Systems * Aerospace * Industrial Controls Ordering Information Part # CPC1009N CPC1009NTR Description 4-Lead SOP (100/tube) 4-Lead SOP (2000/reel) Pin Configuration + Control - Control 1 4 3 2 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton Pb DS-CPC1009N-R05 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1009N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total PowerDissipation 1 Isolation voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 100 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Derate linearly 3.33 mW / C Electrical Characteristics @ 25C (Unless Otherwise Noted) Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input to Output 1 2 2 Conditions Symbol Min Typ Max Units t=10ms IL=150mA VL=100VP , T=115C IL ILPK RON ILEAK - 5 - 150 350 8 20 mArms / mADC mAP nA VL=50V, f=1MHz ton toff COUT - 25 2 0.5 - IL=150mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.87 0.86 1.2 - 2 1.4 10 mA mA V A - - - 1 - pF IF=5mA, VL=10V ms pF Load current derates linearly from 150mA @ 25oC to120mA @85oC. Measurement taken within 1 second of on-time. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1009N PERFORMANCE DATA* Typical Turn-On Time (N=50, IF=5mA, IL=150mA, TA=25C) 15 10 5 0.35 0.40 0.45 Turn-On (ms) 0.50 10 5 15 10 5 0.22 0.23 0.24 0.25 Turn-Off (ms) 0.26 0.85 0.90 0.95 LED Current (mA) 1.00 Typical IF for Switch Dropout (N=50, IL=100mA, TA=25C) 35 15 10 5 Turn-On (ms) 20 15 10 5 0 1.19 1.21 1.23 5.40 5.60 25 20 15 10 0 0.75 0.80 0.85 0.90 0.95 106 1.00 Typical Turn-On vs. LED Forward Current (IL=120mA, TA=25C) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 109 112 115 118 121 Blocking Voltage (VP) 124 Typical Turn-Off vs. LED Forward Current (IL=120mA, TA=25C) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1.25 5.20 Typical Blocking Voltage Distribution (N=50, TA=25C) LED Current (mA) 25 5.00 5 0.70 30 4.80 30 20 1.05 Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25C) 1.17 4.60 On-Resistance (:) 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 LED Forward Voltage Drop (V) LED Forward Current (mA) LED Forward Current (mA) Typical LED Forward Voltage Drop vs. Temperature Typical Turn-On vs. Temperature (IL=100mA) Typical Turn-Off vs. Temperature (IL=100mA) 1.8 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 Temperature (C) 80 100 120 Turn-On (ms) 1.6 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Turn-Off (ms) 35 0.80 10 4.40 Turn-On (ms) 0.75 15 0.27 0 0 20 0 0.21 25 20 25 5 0.55 Device Count (N) Device Count (N) 0.30 Typical IF for Switch Operation (N=50, IL=100mA, TA=25C) 25 Device Count (N) 15 Device Count (N) 0.25 LED Forward Voltage Drop (V) 30 20 0 0 Typical On-Resistance Distribution (N=50, IL=150mA, TA=25C) 35 Device Count (N) 20 25 Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=150mA, TA=25C) IF=5mA IF=10mA -40 -20 0 20 40 60 Temperature (C) 80 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 50 IF=10mA IF=5mA -40 -20 0 20 40 60 80 100 Temperature (C) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1009N PERFORMANCE DATA* Typical IF for Switch Operation vs. Temperature (IL=100mA) 3.0 3.0 12 1.5 1.0 2.0 1.5 1.0 0.5 0.5 0 0 -20 0 20 40 60 80 100 On-Resistance (:) LED Current (mA) 2.0 -40 IF=5mA IF=10mA 10 8 Steady State Instantaneous IF=5mA 6 4 2 -40 -20 0 20 40 60 80 0 100 -40 -20 0 20 40 60 80 Temperature (C) Temperature (C) Temperature (C) Typical Load Current vs. Load Voltage (IF=5mA, TA=25C) Typical Maximum Load Current vs. Temperature Typical Blocking Voltage vs. Temperature 100 50 0 -50 -100 -150 -1.5 190 122 180 121 170 160 150 140 IF=10mA 130 IF=5mA 120 110 100 -1.0 -0.5 0 0.5 1.0 1.5 -20 0 20 40 119 118 117 116 60 80 100 120 -40 -20 0 Load Current (A) 1.2 1.0 0.8 0.6 0.4 0.2 0 0 20 40 60 80 Temperature (C) 100 20 40 60 Temperature (C) 80 100 Energy Rating Curve (TA=25C) 1.4 Leakage (nA) 120 Temperature (C) Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=100VP) -20 100 115 -40 Load Voltage (V) 1.6 Blocking Voltage (VP) Load Current (mA) Typical On-Resistance vs. Temperature (IL=150mA) 2.5 Load Current (mA) LED Current (mA) 2.5 150 Typical IF for Switch Dropout vs. Temperature (IL=100mA) 120 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1009N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1009N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1009N 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R05 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1009N MECHANICAL DIMENSIONS CPC1009N 4.089 0.203 (0.161 0.008) Recommended PCB Land Pattern 0.200 0.025 (0.008 0.001) 0.60 (0.0217) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 5.60 (0.2205) 1.02 0.025 (0.040 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1009NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1009N-R05 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/13/2012