AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN (SEALED TYPE) ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic, vapor) and hot water. 2. The top surface of the socket is sealed by the hot melt method for high bonding strength. 3. High reliability sockets with round pin contacts and a 4-point contact construction. 4. Compliance with RoHS' Directive Environmentally friendly, the connectors' comply with Europe's RoHS' Directive. Cadmium, lead, mercury, hexavalent, chromium, PBB and PBDE are not used. Sealing tape is bonded to the top surface of the IC socket. The sealing tape is peeled off before IC chip insertion. Max. 1mm Hot melt type sealing tape (Soft stamp pressing the hot melt sealing tape increasea the bonding strength) Tape peel-off tab IC socket Construction of sealing tape Base material layer (Polyester resin with excellent heat and chemical resistance.) Adhesive layer (Polyester resin) ORDERING INFORMATION AXS 11: Round PIN type sealed IC sockets <No. of contacts (2 digits)> 08: 8 contacts 14: 14 contacts 20: 20 contacts 22: 22 contacts 32: 32 contacts 36: 36 contacts 64: 64 contacts 16: 16 contacts 24: 24 contacts 40: 40 contacts 18: 18 contacts 28: 28 contacts 48: 48 contacts <Terminal layout and shape> 1: DIL terminal layout, solder DIP terminal 7: DIL terminal layout, solder DIP terminal (24 contacts: row pitch is 7.62 mm) <Surface treatment (Internal contact/External sleeve)> 1: Au plating 0.25m/Sn plating 3: Au plating 0.76m/Sn plating 9: Sn plating/Sn plating All Rights Reserved (c) COPYRIGHT Matsushita Electric Works, Ltd. AXS1 PRODUCT TYPES Item External sleeve Internal contact Type No. of contacts 8 14 16 18 20 22 24*1 DIL 24*2 28 32 36 40 48 64 Economical type (Extremely resistant to fretting with IC) General-purpose type (Extremely resistant to fretting with IC) Sn plating Part No. AXS110819 AXS111419 AXS111619 AXS111819 AXS112019 AXS112219 AXS112419 AXS112479 AXS112819 AXS113219 AXS113619 AXS114019 AXS114819 AXS116419 Sn plating Au plating (0.25m) Part No. AXS110811 AXS111411 AXS111611 AXS111811 AXS112011 AXS112211 AXS112411 AXS112471 AXS112811 AXS113211 AXS113611 AXS114011 AXS114811 AXS116411 High-reliability type (Contact resistance is stable even if left unadhered for extended periods. Au plating (0.76m) Part No. AXS110813 AXS111413 AXS111613 AXS111813 AXS112013 AXS112213 AXS112413 AXS112473 AXS112813 AXS113213 AXS113613 AXS114013 AXS114813 AXS116413 *1 Pitch: 15.24mm *2 Pitch: 7.62mm Note) All are tray packed sockets SPECIFICATIONS AND DIMENSIONS 1. The specification of the sealed IC socket are the same as the round pin type IC socket. 2. See the DIL solder-dip type for the socket and PC board pattern dimensions. NOTES FOR SEALED TYPE 1. Storage 1) Store at an ambient temperature of 60C or lower. 2) Do not peel off the tape until after cleaning. (If the tape is peeled off before cleaning, the cleaning liquid will enter the inside of the contact.) 2. Cleaning Observe the following conditions when cleaning. 1) Cleaning time Boiling bath: within 30 seconds Vapor bath: within 30 seconds Ultrasonic bath: within 30 seconds 2) Use a cleaning liquid that will not dissolve polyester. Also, keep the temperature of the cleaning liquid at 40C or lower. 3. After cleaning, peel off the tape and insert the IC. Please see (page 237) above for other notes. Regarding general notes, please refer to page 12. For other details, please verify with the product specification sheets. All Rights Reserved (c) COPYRIGHT Matsushita Electric Works, Ltd. Quantity in box Inner carton 60 pcs. Outer carton 600 pcs. 30 pcs. 300 pcs. 20 pcs. 200 pcs.