1N6642U Aerospace 0.3 A - 100 V switching diode Features K A Surface mount hermetic package High thermal conductivity materials Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop Target radiation qualification: - 150 krad (Si) low dose rate - 3 Mrad high dose rate Package weight: 0.12 g K A LCC-2D Description This power ultrafast recovery rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. It is housed in a surface mount hermetically sealed LCC-2D package whose footprint is 100% compatible with industry standard solutions in D5A. The 1N6642U is suitable for switching mode power supplies and high frequency DC to DC converters such as low voltage high frequency inverter, free wheeling or polarity protection. Table 1. Device summary(1) Order code ESCC detailed specification Quality level EPPL 1N6642UD1 - Engineering model - Flight part Target 1N6642U02D 5101/026/xx IF(AV) VRRM Tj(max) VF (max) 0.3 A 100 V 175 C 1.2 V 1. Contact ST sales office for information about the specific conditions for products in die form and gold plated version. September 2011 Doc ID 16972 Rev 2 1/7 www.st.com 7 Characteristics 1N6642U 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Value Unit 100 V 0.5 A 300 mA 2 A (1) IF(AV) Average forward rectified current IFSM Forward surge current Tstg Storage temperature range -65 to +175 C Operating junction temperature range -65 to +175 C 245 C Value Unit Tj Tsol tp = 8.3 ms sinusoidal, tamb 25 C Maximum soldering temperature (2) 1. For all variants at Tc +155 C per diode, derate linearly to 0 A at +175 C. 2. Maximum duration 5 s. The same package must not be re-soldered until 3 minutes have elapsed. Table 3. Thermal resistance Symbol Parameter Rth (j-c) Junction to case (1) 60 Rth (j-a) Junction to ambient 280 C/W 1. Package mounted on infinite heatsink Table 4. Symbol VBR (1) IR (1) VF (2) Static electrical characteristics Parameter Breakdown voltage Reverse current Forward voltage Tests conditions Tj = 25 C IR = 100 A Min. Typ. Max. Unit 100 - - V Tj = 25 C VR = 20 V - - 25 nA Tj = 25 C VR = 75 V - - 50 nA Tj = 150 C VR = 20 V - - 30 A Tj = 150 C VR = 75 V - - 40 A Tj = 25 C IF = 10 mA - - 800 Tj = 25 C IF = 100 mA - - 1200 Tj = 150 C IF = 10 mA - - 800 Tj = -55 C IF = 100 mA - - 1200 1. Pulse test: tp = 10 ms, < 2% 2. Pulse test: tp = 680 s, < 2% To evaluate the conduction losses use the following equation: P = 0.74 x IF(AV) + 1.00 x IF2(RMS ) 2/7 Doc ID 16972 Rev 2 mV 1N6642U Table 5. Characteristics Dynamic characteristics Symbol trr Test conditions Parameter Min. Typ. Max. Unit IF = IR = 10 mA(1) Reverse recovery time - - 9 ns IF = 1 A, Vr = 30 V, dI/dt = -15 A/s 20 VFP Forward recovery voltage IFM = 200 mA - - 5 V tFR Forward recovery time IFM = 200 mA - - 20 ns - 5 pF Diode capacitance VR = 0 V, V = 50 mV, F = 1 MHz - Cj VR = 1.5 V, V = 50 mV, F = 1 MHz - - 2.8 pF 1. Guaranteed but not tested Figure 1. 1.2 Forward voltage drop versus forward current (typical values) Figure 2. IFM (A) Forward voltage drop versus forward current (maximum values) IFM (A) 1.2 1.0 1.0 0.8 0.8 0.6 0.6 Tj=150 C Tj=150 C 0.4 0.4 Tj=25 C Tj=25 C Tj=-55 C Tj=-55 C 0.2 0.2 VFM (V) VFM (V) 0.0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 0.2 Doc ID 16972 Rev 2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 3/7 Characteristics Figure 3. 1.E+03 1N6642U Reverse leakage current versus reverse voltage applied (typical values) Figure 4. IR(nA) 1.0 Relative variation of thermal impedance, junction to case, versus pulse duration Zth(j-c)/Rth(j-c) 0.9 Tj=150 C 0.8 1.E+02 0.7 0.6 Tj=75 C 1.E+01 0.5 0.4 Single pulse 0.3 1.E+00 Tj=25 C 0.2 0.1 VR (V) 1.E-01 0 Figure 5. 10 20 30 40 50 60 70 80 90 100 tP(s) 0.0 1.E-06 110 1.E-05 1.E-04 1.E-02 Junction capacitance versus reverse voltage applied (typical values) 10.0 C(pF) F=1 MHz VOSC=30 mVRMS Tj=25 C 1.0 VR(V) 0.1 1 4/7 1.E-03 10 Doc ID 16972 Rev 2 100 1.E-01 1.E+00 1N6642U 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 6. Leadless chip carrier 2 (LCC-2D) package dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A(1) 1.86 2.03 2.20 0.073 0.080 0.087 B 4.44 4.57 4.77 0.175 0.180 0.188 C 1.84 1.97 2.10 0.072 0.078 0.083 D 1.53 1.70 1.87 0.060 0.067 0.074 E 0.48 - 0.71 0.019 - 0.028 F - 1.3 - - 0.051 - G - 1.67 - - 0.066 - H - 0.37 - - 0.015 - I - 0.15 - - 0.006 - r1 - 0.15 - - 0.006 - r2 - 0.20 - - 0.008 - A D B 2 Note 1 1 C F Pin 2 Cathode Note 1 Pin 1 Anode E 1 H I Note 1 E 2 r1 G r2 Note 1: The anode is identified by metallization in two top internal angles and the index mark. 1. Measurement prior to solder coating the mounting pads on bottom of package Doc ID 16972 Rev 2 5/7 Ordering information 3 1N6642U Ordering information Table 7. Ordering information(1) Order code ESCC detailed specification 1N6642UD1 - Package Lead finish Gold Marking EPPL Weight 42UD1 - LCC-2D 1N6642U02D 5101/026/xx 0.12 g Solder dip 42U02D Target Packing Waffle pack 1. Contact ST sales office for information about the specific conditions for products in die form and gold plated version. 4 Revision history Table 8. 6/7 Document revision history Date Revision Changes 26-Mar-2010 1 First issue. 23-Sep-2011 2 Updated order codes in Table 1 and Table 7. Doc ID 16972 Rev 2 1N6642U Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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