TPS51100 www.ti.com SLUS600D - APRIL 2004 - REVISED MAY 2012 3-A SINK/SOURCE DDR TERMINATION REGULATOR Check for Samples: TPS51100 FEATURES 1 * * * 2 * * * * * * * * * * Input Voltage Range: 4.75 V to 5.25 V VLDOIN Voltage Range: 1.2 V to 3.6 V 3-A Sink/Source Termination Regulator Includes Droop Compensation Requires Only 20-F Ceramic Output Capacitance Supports High-Z in S3 and Soft-Off in S5 1.2-V Input (VLDOIN) Helps Reduce Total Power Dissipation Integrated Divider Tracks 0.5 VDDQSNS for VTT and VTTREF Remote Sensing (VTTSNS) 20-mV Accuracy for VTT and VTTREF 10-mA Buffered Reference (VTTREF) Built-In Soft-Start, UVLO and OCL Thermal Shutdown Supports JEDEC Specifications The TPS51100 is a 3-A sink/source tracking termination regulator. It is specifically designed for low-cost/low-external component count systems, where space is a premium. The TPS51100 maintains fast transient response, only requiring 20 F (2 x 10 F) of ceramic output capacitance. The TPS51100 supports remote sensing functions and all features required to power the DDR and DDR2 VTT bus termination according to the JEDEC specification. The part also supports DDR3 VTT termination with VDDQ at 1.5 V (typ). In addition, the TPS51100 includes integrated sleep-state controls, placing VTT in high-Z in S3 (suspend to RAM) and soft-off for VTT and VTTREF in S5 (suspend to disk). The TPS51100 is available in the thermally efficient 10-pin MSOP PowerPADTM package and is specified from -40C to 85C. ORDERING INFORMATION APPLICATIONS * * DDR, DDR2, DDR3 Memory Termination SSTL-2, SSTL-18 and HSTL Termination (1) TPS51100DGQ C1 2 x 10 F 1 VDDQSNS 2 VLDOIN 3 VTT 9 GND 8 PLASTIC MSOP PowerPADTM PACKAGE (DGQ) (1) -40C to 85C TPS51100DGQ The DGQ package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS51100DGQR). See the application section of the data sheet for the PowerPAD package drawing and layout information. 5V_IN VIN 10 S5 TA S5 C2 0.1 F 4 PGND 5 VTTSNS S3 7 VTTREF 6 Capacitor Manuf S3 VTTREF Part Number C1 TDK C2012JB0J106K C2 TDK C1608JB1H104K 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2004-2012, Texas Instruments Incorporated TPS51100 SLUS600D - APRIL 2004 - REVISED MAY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE VIN, VLDOIN, VTTSNS, VDDQSNS, S3, S5 Input voltage range (2) PGND Output voltage range (2) UNIT -0.3 to 6 V -0.3 to 0.3 -0.3 to 6 V TA Operating ambient temperature range -40 to 85 C Tstg Storage temperature -55 to 150 C (1) (2) VTT, VTTREF Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.c All voltage values are with respect to the network ground terminal unless otherwise noted. THERMAL INFORMATION TPS51100 THERMAL METRIC (1) UNITS DGQ 10 PINS JA Junction-to-ambient thermal resistance 60.3 JCtop Junction-to-case (top) thermal resistance 63.5 JB Junction-to-board thermal resistance 51.6 JT Junction-to-top characterization parameter 1.5 JB Junction-to-board characterization parameter 22.3 JCbot Junction-to-case (bottom) thermal resistance 9.5 C/W . (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) VIN MIN MAX UNIT 4.75 5.25 V -0.10 5.25 VLDOIN, VDDQSNS, VTT, VTTSNS -0.1 3.6 VTTREF -0.1 1.8 PGND -0.1 0.1 -40 85 Supply voltage S3, S5 Voltage range TA 2 Operating free-air temperature Submit Documentation Feedback V C Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 TPS51100 www.ti.com SLUS600D - APRIL 2004 - REVISED MAY 2012 ELECTRICAL CHARACTERISTICS TA = -40C to 85C, VVIN = 5 V, VLDOIN and VDDQSNS are connected to 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 0.25 0.5 1 mA 25 50 80 A 0.3 1 A 1.2 2 mA 6 10 A 0.3 1 A SUPPLY CURRENT IVIN Supply current, VIN TA = 25C, VVIN = 5 V, no load, VS3 = VS5 = 5 V IVINSTB Standby currrent, VIN TA = 25C, VVIN = 5 V, no load, VS3 = 0 V, VS5 = 5 V IVINSDN Shutdown current, VIN TA = 25C, VVIN = 5 V, no load, VS3 = VS5 = 0 V, VVLDOIN = VVDDQSNS = 0 V IVLDOIN Supply current, VLDOIN IVLDOINSTB Standby currrent, VLDOIN TA = 25C, VVIN = 5 V, no load,VS3 = 0 V, VS5 = 5 V IVLDOINSDN Shutdown current, VLDOIN TA = 25C, VVIN = 5 V, no load, VS3 = VS5 = 0 V TA = 25C, VVIN = 5 V, no load, VS3 = VS5 = 5 V 0.7 INPUT CURRENT IVDDQSNS Input current, VDDQSNS VVIN = 5 V, VS3 = VS5 = 5 V 1 3 5 A IVTTSNS Input current, VTTSNS VVIN = 5 V, VS3 = VS5 = 5 V -1 -0.25 1 A VTT OUTPUT VVLDOIN = VVDDQSNS = 2.5 V VVTTSNS Output voltage, VTT VVTTTOL25 VVTTTOL18 Output votlage tolerance to VTTREF, VTT VVTTTOL15 IVTTOCLSRC Source current limit, VTT 1.25 VVLDOIN = VVDDQSNS = 1.8 V 0.9 VVLDOIN = VVDDQSNS = 1.5 V 0.75 VVLDOIN = VVDDQSNS = 2.5 V, |IVTT| = 0 A -20 20 VVLDOIN = VVDDQSNS = 2.5 V, |IVTT| = 1.5 A -30 30 VVLDOIN = VVDDQSNS = 2.5 V, |IVTT| = 3 A -40 40 VVLDOIN = VVDDQSNS = 1.8 V, |IVTT| = 0 A -20 20 VVLDOIN = VVDDQSNS = 1.8 V, |IVTT| = 1 A -30 30 VVLDOIN = VVDDQSNS = 1.8 V, |IVTT| = 2 A -40 40 VVLDOIN = VVDDQSNS = 1.5 V, |IVTT| = 0 A -20 20 VVLDOIN = VVDDQSNS = 1.5 V, |IVTT| = 1 A -30 30 aeV VTT = cc VDDQSNS 2 e o // 0.95, o PGOOD = High Sink current limit, VTT aeV VTT = cc VDDQSNS 2 e 3.8 6 1.5 2.2 3 3 3.6 6 1.5 2.2 3 -1 0.5 10 A TA = 25C -1 0.01 1 A VS3 = VS5 = 0 V, VVTT = 0.5 V 10 17 o // 1.05, o PGOOD = High VVTT = VVDDQ IVTTLK Leakage current, VTT VTT aeV o = cc VDDQSNS // 1.25 V, 2 e o VS3 = 0 V, IVTTSNSLK Leakage current, VTTSNS aeV VTT = cc VDDQSNS 2 e IDSCHRG Discharge current, VTT TA = 25C, VVDDQSNS = 0 V, mV 3 VVTT = 0 V IVTTOCLSNK V TA = 25C A A VS5 = 5 V o // 1.25 V, o mA VTTREF OUTPUT VVTTREF VVTTREFTOL25 VVTTREFTOL18 Output voltage tolerance to VDDQSNS/2, VTTREF VVTTREFTOL15 IVTTREFOCL VVDDQSNS Output voltage, VTTREF Source current limit, VTTREF V 2 VVLDOIN = VVDDQSNS = 2.5 V, IVTTREF < 10 mA -20 20 VVLDOIN = VVDDQSNS = 1.8 V, IVTTREF < 10 mA -17 17 VVLDOIN = VVDDQSNS = 1.5 V, IVTTREF < 10 mA -15 15 VVTTREF = 0 V 10 20 30 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 mV mA 3 TPS51100 SLUS600D - APRIL 2004 - REVISED MAY 2012 www.ti.com ELECTRICAL CHARACTERISTICS (continued) TA = -40C to 85C, VVIN = 5 V, VLDOIN and VDDQSNS are connected to 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT UVLO/LOGIC THRESHOLD Wake up VVINUV UVLO threshold voltage, VIN VIH High-level input voltage S3, S5 VIL Low-level input voltage S3, S5 VIHYST Hysteresis voltage S3, S5 IILEAK Logic input leakage current S2, S5, Hysteresis 3.4 3.7 4 0.15 0.25 0.35 1.6 V 0.3 V 1 A 0.2 TA = 25C V -1 V THERMAL SHUTDOWN TSDN Shutdown temperature Thermal shutdown threshold 160 Hysteresis 10 C DEVICE INFORMATION DGQ Package (Top View) VDDQSNS 1 10 VIN VLDOIN 2 9 S5 VTT 3 8 GND PGND 4 7 S3 VTTSNS 5 6 VTTREF Actual Size 3,05 mm x 4,98 mm P0083-01 NOTE: For more information on the DGQ package, see the PowerPAD Thermally Enhanced Package application report (SLMA002). TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION GND 8 - Signal ground. Connect to negative terminal of the output capacitor PGND 4 - Power ground output for the VTT LDO S3 7 I S3 signal input S5 9 I S5 signal input VDDQSNS 1 I VDDQ sense input VIN 10 I 5-V power supply VLDOIN 2 I Power supply for the VTT LDO and VTTREF output stage VTT 3 O Power output for the VTT LDO VTTREF 6 O VTT reference output. Connect to GND through 0.1-F ceramic capacitor. VTTSNS 5 I Voltage sense input for the VTT LDO. Connect to plus terminal of the output capacitor. 4 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 TPS51100 www.ti.com SLUS600D - APRIL 2004 - REVISED MAY 2012 SIMPLIFIED BLOCK DIAGRAM VDDQSNS 1 + VLDOIN 6 VTTREF 3 VTT 4 PGND + - - GND 2 HalfDDQ 8 VIN 10 + 3.7 V/3.5 V VTTSNS 5 S3 7 VinOK ENREF - + - ENVTT ENVTT + 5 V/10% - ENREF S5 + 9 PGOOD + + - -5 V/10% TPS51100DGQ B0319-01 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 5 TPS51100 SLUS600D - APRIL 2004 - REVISED MAY 2012 www.ti.com DETAILED DESCRIPTION VTT SINK/SOURCE REGULATOR The TPS51100 is a 3-A sink/source tracking termination regulator designed specially for low-cost, low-externalcomponents systems where space is at premium, such as notebook PC applications. The TPS51100 integrates a high-performance, low-dropout linear regulator that is capable of sourcing and sinking current up to 3 A. This VTT linear regulator employs an ultimate fast-response feedback loop so that small ceramic capacitors are enough to keep tracking to the VTTREF within 40 mV under all conditions, including fast load transient. To achieve tight regulation with minimum effect of trace resistance, a remote sensing terminal, VTTSNS, should be connected to the positive node of the VTT output capacitor(s) as a separate trace from the high-current line from VTT. VTTREF Regulator The VTTREF block consists of an on-chip 1/2 divider, low-pass filter (LPF), and buffer. This regulator can source current up to 10 mA. Bypass VTTREF to GND using a 0.1-F ceramic capacitor to ensure stable operation. Soft-Start The soft-start function of the VTT is achieved via a current clamp, allowing the output capacitors to be charged with low and constant current that gives linear ramp-up of the output voltage. The current-limit threshold is changed in two stages using an internal powergood signal. When VTT is outside the powergood threshold, the current limit level is 2.2 A. When VTT rises above (VTTREF - 5%) or falls below (VTTREF + 5%), the current limit level switches to 3.8 A. The thresholds are typically VTTREF 5% (from outside regulation to inside) and 10% (when it falls outside). The soft-start function is completely symmetrical, and it works not only from GND to VTTREF voltage, but also from VDDQ to VTTREF voltage. Note that the VTT output is in a high-impedance state during the S3 state (S3 = low, S5 = high), and its voltage can be up to VDDQ voltage, depending on the external condition. Note that VTT does not start under a full-load condition. S5 Control and Soft-Off The S3 and S5 terminals should be connected to SLP_S3 and SLP_S5 signals, respectively. Both VTTREF and VTT are turned on at the S0 state (S3 = high, S5 = high). VTTREF is kept alive while VTT is turned off and left high-impedance in the S3 state (S3 = low, S5 = high). Both VTT and VTTREF outputs are turned off and discharged to ground through internal MOSFETs during S4/S5 state (both S3 and S5 are low). Table 1. S3 and S5 Control Tabl STATE S3 S5 VTTREF VTT S0 H H 1 1 L H 1 0 (high-Z) L L 0 (discharge) 0 (discharge) S3 (1) S4/S5 (1) (1) In case S3 is forced to H and S5 to L, VTTREF is discharged and VTT is at High-Z state. This condition is NOT recommended. VTT Current Protection The LDO has a constant overcurrent limit (OCL) at 3.8 A. This trip point is reduced to 2.2 A before the output voltage comes within 5% of the target voltage or goes outside of 10% of the target voltage. VIN UVLO Protection For VIN undervoltage lockout (UVLO) protection, the TPS51100 monitors VIN voltage. When the VIN voltage is lower than UVLO threshold voltage, the VTT regulator is shut off. This is a non-latch protection. Thermal Shutdown TPS51100 monitors its temperature. If the temperature exceeds the threshold value, typically 160C, the VTT and VTTREF regulators are shut off. This is also a non-latch protection. 6 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 TPS51100 www.ti.com SLUS600D - APRIL 2004 - REVISED MAY 2012 Output Capacitor For stable operation, total capacitance of the VTT output terminal can be equal to or greater than 20 F. Attach two 10-F ceramic capacitors in parallel to minimize the effect of ESR and ESL. If the ESR is greater than 2 m, insert an R-C filter between the output and the VTTSNS input to achieve loop stability. The R-C filter time constant should be almost the same or slightly lower than the time constant of the output capacitor and its ESR. Soft-start duration, tSS, is also a function of this output capacitance. Where ITTOCL = 2.2 A (typ), tSS can be calculated as, aeC VVTT o t SS = c OUT / e IVTTOCL o (1) Input Capacitor Depending on the trace impedance between the VLDOIN bulk power supply to the part, transient increase of source current is supplied mostly by the charge from the VLDOIN input capacitor. Use a 10-F (or more) ceramic capacitor to supply this transient charge. Provide more input capacitance as more output capacitance is used at VTT. In general, use 1/2 COUT for the input. VIN Capacitor Add a ceramic capacitor with a value between 1 F and 4.7 F placed close to the VIN pin, to stabilize 5 V from any parasitic impedance from the supply. Thermal Design As the TPS51100 is a linear regulator, the VTT current flow in both source and sink directions generates power dissipation from the device. In the source phase, the potential difference between VVLDOIN and VVTT times VTT current becomes the power dissipation, WDSRC. WDSRC = (VVLDOIN - VVTT ) IVTT (2) In this case, if VLDOIN is connected to an alternative power supply lower than VDDQ voltage, power loss can be decreased. For the sink phase, VTT voltage is applied across the internal LDO regulator, and the power dissipation, and WDSNK, is calculated by: WDSNK = VVTT IVTT (3) Because the device does not sink and source the current at the same time and IVTT varies rapidly with time, the actual power dissipation that must be considered for thermal design is an average over the thermal relaxation duration of the system. Another power consumption is the current used for internal control circuitry from the VIN supply and VLDOIN supply. This can be estimated as 20 mW or less at normal operational conditions. This power must be effectively dissipated from the package. Maximum power dissipation allowed to the package is calculated by, WPKG = (TJ(max) - TA(max) ) qJA (4) where TJ(max) is 125C TA(max) is the maximum ambient temperature in the system JA is the thermal resistance from the silicon junction to the ambient This thermal resistance strongly depends on the board layout. TPS51100 is assembled in a thermally enhanced PowerPAD package that has an exposed die pad underneath the body. For improved thermal performance, this die pad must be attached to the ground trace via thermal land on the PCB. This ground trace acts as a heat sink/spread. The typical thermal resistance, 57.7C/W, is achieved based on a 3 mm x 2 mm thermal land with two vias without air flow. It can be improved by using larger thermal land and/or increasing the number of vias. For example, assuming a 3 mm x 3 mm thermal land with four vias without air flow, it is 45.4C/W. Further information about the PowerPAD package and its recommended board layout is described in the PowerPAD Thermally Enhanced Package application report (SLMA002). This document is available at www.ti.com. Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 7 TPS51100 SLUS600D - APRIL 2004 - REVISED MAY 2012 www.ti.com LAYOUT CONSIDERATIONS Consider the following points before the layout of TPS51100 design begins. * The input bypass capacitor for VLDOIN should be placed to the pin as close as possible with a short and wide connection. * The output capacitor for VTT should be placed close to the pin with a short and wide connection in order to avoid additional ESR and/or ESL of the trace. * VTTSNS should be connected to the positive node of VTT output capacitor(s) as a separate trace from the high current power line and is strongly recommended to avoid additional ESR and/or ESL. If it is needed to sense the voltage of the point of the load, it is recommended to attach the output capacitor(s) at that point. Also, it is recommended to minimize any additional ESR and/or ESL of the ground trace between the GND pin and the output capacitor(s). * Consider adding an LPF at VTTSNS in case the ESR of the VTT output capacitor(s) is larger than 2 m. * VDDQSNS can be connected separately from VLDOIN. Remember that this sensing potential is the reference voltage of VTTREF. Avoid any noise generative lines. * The negative node of the VTT output capacitor(s) and the VTTREF capacitor should be tied together, avoiding common impedance to the high-current path of the VTT source/sink current. * The GND (signal GND) pin node represents the reference potential for the VTTREF and VTT outputs. Connect GND to the negative nodes of the VTT capacitor(s), VTTREF capacitor, and VDDQ capacitor(s) with care to avoid additional ESR and/or ESL. GND and PGND (Power GND) should be isolated, with a single point connection between them. * In order to remove heat from the package effectively, prepare the thermal land and solder to the package thermal pad. The wide trace of the component-side copper, connected to this thermal land, helps heat spreading. Numerous vias 0.33 mm in diameter connected from the thermal land to the internal/solder-side ground plane(s) should be used to help dissipation. NOTES: 1. The positive terminal of each output capacitor should be directly connected to VTT of the IC; do not use a VIA. 2. The negative terminal of each output capacitor should be directly connected to GND of the IC; do not use a VIA. 3. VIAs VIA between 1st and 2nd layers VIA between 1st and other layers under 2nd 4. Rs and Cs with dotted outlines are options. Figure 1. TPS51100 PCB Layout Guideline 8 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 TPS51100 www.ti.com SLUS600D - APRIL 2004 - REVISED MAY 2012 TYPICAL CHARACTERISTICS VIN SHUTDOWN CURRENT vs TEMPERATURE 1.0 2.0 0.9 1.8 IVINSDN - VINSDN Supply Current - A IVIN - VIN Supply Current - mA VIN SUPPLY CURRENT vs TEMPERATURE 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0 50 100 1.0 0.8 0.6 0.4 0 50 100 TJ - Junction Temperature - C G001 Figure 2. Figure 3. VIN SUPPLY CURRENT vs VTT LOAD CURRENT VLDOIN SUPPLY CURRENT vs TEMPERATURE 150 G002 2.0 10 1.9 DDR2 VVTT = 1.8 V IVLDOIN - VLDOIN Supply Current - mA IVIN - VIN Supply Current - mA 1.2 0.0 -50 150 TJ - Junction Temperature - C 9 1.4 0.2 0.1 0.0 -50 1.6 8 7 6 5 4 3 2 1 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 IVTT - VTT Load Current - A 1.5 2.0 0.7 -50 0 50 100 TJ - Junction Temperature - C G003 Figure 4. 150 G004 Figure 5. Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 9 TPS51100 SLUS600D - APRIL 2004 - REVISED MAY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) VLDOIN SHUTDOWN CURRENT vs TEMPERATURE DISCHARGE CURRENT vs TEMPERATURE 30 1.8 IDSCHRG - VTT Discharge Current - mA IVLDOINSDN - VLDOINSDN Supply Current - A 2.0 1.6 1.4 1.2 1.0 0.8 0.6 0.4 20 15 0.2 0.0 -50 0 50 100 10 -50 150 TJ - Junction Temperature - C 50 100 150 G005 G006 Figure 6. Figure 7. VTT VOLTAGE LOAD REGULATION vs VTT LOAD CURRENT (DDR) VTT VOLTAGE LOAD REGULATION vs VTT LOAD CURRENT (DDR2) 1.29 0.94 1.28 0.93 1.27 0.92 1.26 1.25 0 TJ - Junction Temperature - C VVTT - VTT Voltage - V VVTT - VTT Voltage - V 25 VVLDOIN = 2.5 V 1.24 0.91 0.90 VVLDOIN = 1.8 V 0.89 0.88 1.23 VVLDOIN = 1.2 V VVLDOIN = 1.8 V 1.22 0.87 VVLDOIN = 1.5 V 0.86 1.21 -4 -3 -2 -1 0 1 2 IVTT - VTT Load Current - A 3 -4 4 -2 -1 0 1 2 IVTT - VTT Load Current - A G007 Figure 8. 10 -3 3 4 G008 Figure 9. Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 TPS51100 www.ti.com SLUS600D - APRIL 2004 - REVISED MAY 2012 TYPICAL CHARACTERISTICS (continued) VTT VOLTAGE LOAD REGULATION vs VTT LOAD CURRENT (DDR3) VTTREF VOLTAGE LOAD REGULATION vs VTTREF LOAD CURRENT (DDR) 0.79 1.252 VVLDOIN = 1.5 V VVTTREF - VTTREF Voltage - V 0.78 VVTT - VTT Voltage - V 0.77 0.76 0.75 0.74 0.73 1.251 1.250 1.249 0.72 0.71 1.248 -3 -2 -1 0 1 2 IVTT - VTT Load Current - A 3 0 2 4 6 8 10 IVTTREF - VTTREF Load Current - mA G009 Figure 10. Figure 11. VTTREF VOLTAGE LOAD REGULATION vs VTTREF LOAD CURRENT (DDR2) VTTREF VOLTAGE LOAD REGULATION vs VTTREF LOAD CURRENT (DDR3) 902 G010 752 VVTTREF - VTTREF Voltage - mV VVTTREF - VTTREF Voltage - mV VVLDOIN = 1.5 V 901 900 899 898 751 750 749 748 0 2 4 6 8 IVTTREF - VTTREF Load Current - mA 10 0 G011 Figure 12. 2 4 6 8 IVTTREF - VTTREF Load Current - mA 10 G012 Figure 13. Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 11 TPS51100 SLUS600D - APRIL 2004 - REVISED MAY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) VTT VOLTAGE LOAD TRANSIENT RESPONSE STARTUP WAVEFORMS S5 LOW-TO-HIGH VS3 = 0 V IVTT = IVTTREF = 0 A VVLDOIN (50 mV/div) Offset: 1.8 V VS5 (5 V/div) VS3 (5 V/div) VVTT (20 mV/div) Offset 0.9 V VVTTREF (0.5 V/div) VVTTREF (20 mV/div) Offset 0.9 V VVTT (0.5 V/div) IVTT (2 A/div) t - Time - 20 s/div t - Time - 10 s/div G013 G014 Figure 14. Figure 15. STARTUP WAVEFORMS S3 LOW-TO-HIGH SHUTDOWN WAVEFORMS S3 HIGH-TO-LOW VS5 (5 V/div) VS3 (5 V/div) VS5 (5 V/div) VS3 (5 V/div) VTTREF VVTTREF (0.5 V/div) VVTT (0.5 V/div) VVTT (0.5 V/div) VS5 = 5 V IVTT = IVTTREF = 0 A VS5 = 5 V IVTT = IVTTREF = 0 A t - Time - 10 s/div t - Time - 1 ms/div G016 G015 Figure 16. 12 Figure 17. Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 TPS51100 www.ti.com SLUS600D - APRIL 2004 - REVISED MAY 2012 TYPICAL CHARACTERISTICS (continued) SHUTDOWN WAVEFORMS S3 AND S5 HIGH-TO-LOW BODE PLOT DDR SOURCE 180 80 Phase (-1 A) 60 Gain - dB VS3 (5 V/div) VTTREF (0.5 V/div) 135 Phase (-0.1 A) 40 90 20 45 Gain (-0.1 A) 0 0 -20 VVTT (0.5 V/div) -45 C1 = 2 x 10 F -40 10k 100k IVTT = IVTTREF = 0 A Phase - VS5 (5 V/div) Gain (-1 A) -90 10M 1M f - Frequency - Hz t - Time - 1 ms/div G018 G017 Figure 18. Figure 19. BODE PLOT DDR SINK BODE PLOT DDR2 SOURCE 180 80 60 180 80 Phase (-1 A) Phase (1 A) 135 135 60 20 45 0 Phase (0.1 A) Gain (0.1 A) -20 C1 = 2 x 10 F -40 10k 100k 40 1M 45 Gain (-0.1 A) 0 -20 -45 Gain (1 A) 20 0 0 90 Gain (-1 A) C1 = 2 x 10 F -40 10k 100k -90 10M f - Frequency - Hz Phase - 90 Gain - dB 40 Phase - Gain - dB Phase (-0.1 A) 1M -45 -90 10M f - Frequency - Hz G019 Figure 20. G020 Figure 21. Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 13 TPS51100 SLUS600D - APRIL 2004 - REVISED MAY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) BODE PLOT DDR2 SINK 180 80 60 135 40 90 20 45 0 Phase (0.1 A) Gain (0.1 A) -20 C1 = 2 x 10 F -40 10k 100k Phase - Gain - dB Phase (1 A) 0 -45 Gain (1 A) 1M -90 10M f - Frequency - Hz G021 Figure 22. 14 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 TPS51100 www.ti.com SLUS600D - APRIL 2004 - REVISED MAY 2012 Changes from Revision C (JUNE 2008) to Revision D * Page Added updated Thermal data ............................................................................................................................................... 2 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s) :TPS51100 15 PACKAGE OPTION ADDENDUM www.ti.com 9-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TPS51100DGQ ACTIVE MSOPPowerPAD DGQ 10 80 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-1-260C-UNLIM TPS51100DGQG4 ACTIVE MSOPPowerPAD DGQ 10 80 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-1-260C-UNLIM TPS51100DGQR ACTIVE MSOPPowerPAD DGQ 10 2500 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-1-260C-UNLIM TPS51100DGQRG4 ACTIVE MSOPPowerPAD DGQ 10 2500 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS51100DGQR Package Package Pins Type Drawing MSOPPower PAD DGQ 10 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 5.3 B0 (mm) K0 (mm) P1 (mm) 3.4 1.4 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS51100DGQR MSOP-PowerPAD DGQ 10 2500 364.0 364.0 27.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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