AW33201/AW33205/AW33209
Jan 2018 V1.3
www.awinic.com.cn 1 Copyright © 2016 SHANGHAI AWINIC TECHNOLOGY CO., LTD
Over-Voltage Protection Load Switch
FEATURES
Integrated low Rdson nFET switch: typical 30m
4.5A continuous current capability
Over-Voltage Protection (OVP) threshold
AW33201: 6.2V
AW33205: 6.8V
AW33209: 10.5V
Input maximum voltage rating: 32VDC
Fast turn-off response: typical 100ns
Over-Temperature Protection (OTP)
Under-Voltage Lockout (UVLO)
1.245mm × 1.245mm WLCSP-9 package
APPLICATIONS
Smartphones
Tablets
Charging Ports
GENERAL DESCRIPTION
The AW332XX features an ultra-low 30m (typ.)
Rdson nFET load switch. When input voltage
exceeds the OVP threshold, the switch is turned off
very fast to prevent damage to the protected
downstream devices. The IN pin is capable of
withstanding fault voltages up to 32VDC.
The OVP threshold is 6.2V(AW33201),
6.8V(AW33205), 10.5V(AW33209).
This device features over-temperature protection
that prevents itself from thermal damaging.
The AW332XX is available in a RoHS compliant 9-
bump 1.245mm × 1.245mm WLCSP.
TYPICAL APPLICATION CIRCUIT
OUT
IN
GND
CIN
0.1µF
50V
COUT
1µF PMIC Battery
USB
Port AW33201
AW33205
AW33209
Charger
TVS
Figure 1 AW332XX typical application circuit
All the trademarks mentioned in the document are the property of their owners.
AW33201/AW33205/AW33209
Jan 2018 V1.3
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DEVICE COMPARISON TABLE
Device
VIN_OVLO(V)
VIN_OVLO
Hysteresis(mV)
Condition
Min.
Typ.
Max.
AW33201
VIN rising
6.0
6.2
6.4
110
AW33205
VIN rising
6.66
6.80
6.94
150
AW33209
VIN rising
10.2
10.5
10.8
220
PIN CONFIGURATION AND TOP MARK
C
B
A
12 3
OUT OUT GND
OUT IN GND
IN IN GND
Pin Configuration
(Top View)
32XX – AW33201/AW33205/AW33209
YYYY – Production tracking code
32XX
YYYY
MARKING
(Top View)
Figure 2 Pin Configuration and Top Mark
PIN DEFINITION
Pin
Name
Description
B2,C1,C2
IN
Switch input and device power supply
A3,B3,C3
GND
Device ground
A1,A2,B1
OUT
Switch output
AW33201/AW33205/AW33209
Jan 2018 V1.3
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FUNCTIONAL BLOCK DIAGRAM
Gate Driver &
Charge pump
Logic Control
OV comp
Bandgap
& Ibias UV&OT comp
Oscillator
IN
GND
OUT
Figure 3 Functional Block Diagram
TYPICAL APPLICATION CIRCUITS
OUT
IN
GND
CIN
0.1µF
50V
COUT
1µF PMIC Battery
USB
Port AW33201
AW33205
AW33209
Charger
TVS
Figure 4 AW332XX typical application circuit
Notice for Typical Application Circuits:
1. CIN = 0.1μF is recommended for typical application, larger CIN is also acceptable. The rated voltage of CIN
should be larger than the TVS maximum clamping voltage, if no TVS is applied and only AW332XX is used,
the rated voltage of CIN should be 50V.
2. COUT = 1μF is recommended for typical application, larger COUT is also acceptable. The rated voltage of
COUT should be larger than the OVP threshold. For example, if the OVP threshold is 6.8V, the rated voltage
of COUT should be 10V or higher.
AW33201/AW33205/AW33209
Jan 2018 V1.3
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ORDERING INFORMATION
Part Number
Temperature
Package
Marking
Moisture
Sensitivity
Level
Environmental
Information
Delivery
Form
AW33201CSR
-40°C – 85°C
1.245mm ×
1.245mm ×
0.597mm
WLCSP-9
3201
MSL1
ROHS+HF
Tape and
Reel
3000pcs/Reel
AW33205CSR
-40°C – 85°C
1.245mm ×
1.245mm ×
0.597mm
WLCSP-9
3205
MSL1
ROHS+HF
Tape and
Reel
3000pcs/Reel
AW33209CSR
-40°C – 85°C
1.245mm ×
1.245mm ×
0.597mm
WLCSP-9
3209
MSL1
ROHS+HF
Tape and
Reel
3000pcs/Reel
AW332XX
Shipping
R: Tape & Reel
Package Type
CS: CSP
AW33201/AW33205/AW33209
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ABSOLUTE MAXIMUM RATINGS (NOTE 1)
Symbol
Parameter
Condition
Min.
Max.
Unit
VIN
Input DC voltage
-0.3
32
V
VIN_PUL
Input peak pulse voltage
20μs pulse width, repeat 100
times
45
V
VOUT
Output voltage
-0.3
See(NOTE 2)
V
IIN
Switch current(NOTE 3)
Continuous current
4.5
A
TA
Ambient temperature
-40
85
°C
TJ
Junction temperature
-40
150
°C
TSTG
Storage temperature
-55
150
°C
TLEAD
Soldering temperature
At leads, 10 seconds
260
°C
NOTE1: Conditions out of those ranges listed in “absolute maximum ratings” may cause permanent damages to the
device. In spite of the limits above, functional operation conditions of the device should within the ranges listed in
“recommended operating conditions”. Exposure to absolute-maximum-rated conditions for prolonged periods may affect
device reliability.
NOTE2: 29V or VIN+0.3V, whichever is smaller.
NOTE3: Limited by thermal design.
THERMAL INFORMATION
Symbol
Parameter
Condition
Value
Unit
RJA
Thermal resistance from
junction to ambient (NOTE 1)
In free air
85
°C/W
NOTE1: Thermal resistance from junction to ambient is highly dependent on PCB layout.
ESD AND LATCP-UP RATINGS
Symbol
Parameter
Condition
Value
Unit
VESD
Human Body Model
All pins, per MIL-STD-883J Method 3015.9
±3
kV
Charged Device Model
All pins, per JEDEC EIA/JESD22-C101F
±2
kV
Machine Model
All pins, per JEDEC EIA/JESD22-A115
±200
V
ILatch-up
Latch-up
All pins, per JEDEC STANDARD NO.78E
SEPTEMBER 2016, I Trigger
±800
mA
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min.
Typ.
Max.
Unit
VIN
Input DC voltage
2.5
30
V
CIN
Input capacitance
0.1
F
COUT
Output load capacitance
1
100
F
AW33201/AW33205/AW33209
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ELECTRICAL CHARACTERISTICS
TA = -40°C to 85°C unless otherwise noted. Typical values are guaranteed for VIN = 5V, CIN = 0.1F, IIN≤ 4.5A
and TA = 25°C .
Symbol
Description
Test Conditions
Min.
Typ.
Max.
Units
Rdson
Switch on resistance
VIN = 5V, IOUT = 1A, TA = 25°C
30
40
m
IQ
Input quiescent current
VIN = 5V, IOUT = 0A
78
120
A
Protection
VIN_OVLO
OVP trip level
AW33201
VIN rising
6.0
6.2
6.4
V
Hysteresis
0.11
AW33205
VIN rising
6.66
6.80
6.94
Hysteresis
0.15
AW33209
VIN rising
10.2
10.5
10.8
Hysteresis
0.22
VIN_UVLO
UVLO trip level
AW33201/
AW33209
VIN rising
2.3
2.5
V
Hysteresis
0.14
AW33205
VIN rising
2.2
2.4
Hysteresis
0.08
TSDN
Shutdown temperature
AW33201/AW33209
140
°C
AW33205
150
TSDN_HYS
Shutdown temperature
hysteresis
20
°C
Timing Characteristics (Figure 5)
tDEB
Debounce time
From VIN > VIN_UVLO to 10%
VOUT
15
ms
tON
Switch turn-on time
RL = 100, CL = 22F, VOUT
from 10% VIN to 90% VIN
2
ms
tOFF
Switch turn-off time
RL = 100CL = 0F, VIN >
VIN_OVLO to VOUT stop rising,
VIN rise at 10V/s
100
ns
TIMING DIAGRAM
VIN
VOUT
OVP trip level
tDEB
tON tOFF
tDEB
tON
Figure 5 Timing diagram
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TYPICAL CHARACTERISTICS
Table 1 Table of Figures
INDEX
Figure No
Normalized Rdson vs. Output Current
FIGURE 6
Normalized Rdson vs. Temp. (IOUT = 1A)
FIGURE 7
Normalized Rdson vs. Input Voltage (IOUT = 1A)
FIGURE 8
Input Supply Current vs. Supply Voltage
FIGURE 9
Normalized OVP Threshold
FIGURE 10
Normalized Debounce Time vs. Temp
FIGURE 11
Power-up (COUT = 1F, 100mA load)
FIGURE 12
Power-up (COUT = 100F, 100mA load)
FIGURE 13
OVP Response (AW33201)
FIGURE 14
Recovery from OVP(AW33201)
FIGURE 15
VIN = 5V, CIN = 0.1F, COUT = 1F, and TA = 25°C unless otherwise specified.
Figure 6 Normalized Rdson vs. Output Current Figure 7 Normalized Rdson vs. Temp. (IOUT = 1A)
0.0
0.5
1.0
1.5
2.0
2.5
0 1 2 3 4 5
Normalized Rdson
Output Current(A)
Normalized to Iout=1A
0.0
0.5
1.0
1.5
2.0
-40 -15 10 35 60 85
Normalized Rdson
Temperature (°C)
Normalized to TA= 25
°
C
AW33201/AW33205/AW33209
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TYPICAL CHARACTERISTICS (CONTINUED)
VIN = 5V, CIN = 0.1F, COUT = 1F, and TA = 25°C unless otherwise specified.
Figure 8 Normalized Rdson vs. Input Voltage (IOUT = 1A) Figure 9 Input Supply Current vs. Supply Voltage
Figure 10 Normalized OVP Threshold vs. Temp. Figure 11 Normalized Debounce Time vs. Temp.
VIN
5V / div
VOUT
5V / div
5ms / div
IOUT
100mA / div
VIN
5V / div
VOUT
5V / div
IOUT
200mA / div
5ms / div
Figure 12 Power-up (COUT = 1F, 100mA load) Figure 13 Power-up (COUT = 100F, 100mA load)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 2 4 6 8 10 12
Normalized Rdson
Input Voltage(V)
Normalized to VIN=5V
0
50
100
150
200
250
300
0 5 10 15 20 25 30 35
Input Supply Current (A)
Input Voltage (V)
–40°C
25°C
85°C
0.90
0.95
1.00
1.05
1.10
-40 -15 10 35 60 85
Normalized Threshold Voltage
Temperature (°C)
Normalized to T
A
= 25°C
0.00
0.50
1.00
1.50
2.00
-40 -15 10 35 60 85
Normalized Debounce Time
Temperature (°C)
Normalized to T
A
= 25°C
AW33201/AW33205/AW33209
Jan 2018 V1.3
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TYPICAL CHARACTERISTICS (CONTINUED)
VIN = 5V, CIN = 0.1F, COUT = 1F, and TA = 25°C unless otherwise specified.
VIN
5V / div
VOUT
5V / div
IOUT
100mA / div
5V 8V
10µs / div
V
IN
5V / div
VOUT
5V / div
10ms / div
5V 8V
Figure 14 OVP Response (AW33201) Figure 15 Recovery from OVP(AW33201)
AW33201/AW33205/AW33209
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FUNCTIONAL DESCRIPTION
Device Operation
If the input voltage is between UVLO and OVP threshold, the internal charge pump begins to work after
debounce time, the gate of the nFET switch will be slowly charged high till the switch is fully on. If the input
voltage exceeds the OVP trip level, the switch will be turned off in about 100ns. If input voltage falls below UVLO
threshold, or over-temperature happens, the switch will also be turned off.
Over-Voltage Protection
If the input voltage exceeds the OVP rising trip level, the switch will be turned off in about 100ns. The switch will
remain off until VIN falls below the OVP falling trip level.
USB On-The-Go (OTG) Operation
If VIN = 0V and OUT is supplied by OTG voltage, the body diode of the load switch conducts current from OUT
to IN and the voltage drop from OUT to IN is approximately 0.7V. When VIN > VIN_UVLO, internal charge pump
begins to open the load switch after debounce time. After switch is fully on, current is supplied through switch
channel and the voltage drop from OUT to IN is minimum.
PCB LAYOUT CONSIDERATION
To make fully use of the performance of AW332XX, the guidelines below should be followed.
1. All the peripherals should be placed as close to the device as possible. Place the input capacitor CIN on the
top layer (same layer as the AW332XX) and close to IN pin, and place the output capacitor COUT on the top layer
(same layer as the AW332XX) and close to OUT pin.
2. IN pin routing passes through the external TVS firstly, and then connect AW332XX.
3. Red bold paths on figure 4 and 5 are power lines that will flow large current, please route them on PCB as
straight, wide and short as possible.
4. The power trace from USB connector to AW332XX may suffer from ESD event, keep other traces away from
it to minimize possible EMI and ESD coupling.
5. Use rounded corners on the power trace from USB connector to AW332XX to decrease EMI coupling.
AW33201/AW33205/AW33209
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TAPE AND REEL INFORMATION
CARRIER TAPE
PIN1
Unit: mm
Pin 1 direction
Pin 1
User Direction of Feed
AW33201/AW33205/AW33209
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REEL
NOTE:
1. Unit: mm;
2. Surface resistivity: 105 to 1011 ohms/sq;
3. Restriction criterion of hazardous substance for packing material follow GP-M001.
AW33201/AW33205/AW33209
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PACKAGE DESCRIPTION
Ball
A1
D
E
e1
0.239±0.020
TOP VIEW BOTTOM VIEW
A1
A2
A3
A
SIDE VIEW
Symbol NOM Tolerance
A
A1
A2
A3
D
E
e1
e2
e3
0.597 ±0.055
0.177
0.380
0.040
1.245
1.245
0
0
0.400
±0.020
±0.025
±0.010
±0.025
±0.025
NA
NA
NA
Unit: mm
e2 e3
e3
AW33201/AW33205/AW33209
Jan 2018 V1.3
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LAND PATTERN DATA
Ø0.210
Copper Pad
Diameter
0.400
0.800
0.800
0.400
Ø0.310
Solder Mask
Opening
Unit: mm
AW33201/AW33205/AW33209
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REFLOW
Figure 16 Package Reflow Oven Thermal Profile
Reflow Note
Spec
Average ramp-up rate (217°C to Peak)
Max. 3°C /sec
Time of Preheat temp.(from 150°C to 200°C )
60-120sec
Time to be maintained above 217°C
60-150sec
Peak Temperature
>260°C
Time within 5°C of actual peak temp
20-40 sec
Ramp-down rate
Max. 6°C /sec
Time from 25°C to peak temp
Max. 8min
NOTE 1: All data are compared with the package-top temperature, measured on the package surface;
NOTE 2: AW332XX adopted the Pb-Free assembly.
AW33201/AW33205/AW33209
Jan 2018 V1.3
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REVISION HISTORY
Vision
Date
Change Record
V0.9
January 2017
Datasheet V0.9 Released
V1.0
March 2017
Added Typical Characteristics
V1.1
April 2017
1. Added PCB layout consideration.
2. Added ROHS and MSL statements.
3. Added Reflow Information.
V1.2
June 2017
Added AW33205 part number
V1.3
January 2018
Added Land Pattern Data
AW33201/AW33205/AW33209
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DISCLAIMER
Information in this document is believed to be accurate and reliable. However, Shanghai AWINIC Technology
Co., Ltd (AWINIC Technology) does not give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability for the consequences of use of such
information.
AWINIC Technology reserves the right to make changes to information published in this document, including
without limitation specifications and product descriptions, at any time and without notice. Customers shall
obtain the latest relevant information before placing orders and shall verify that such information is current and
complete. This document supersedes and replaces all information supplied prior to the publication hereof.
AWINIC Technology products are not designed, authorized or warranted to be suitable for use in medical,
military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an AWINIC
Technology product can reasonably be expected to result in personal injury, death or severe property or
environmental damage. AWINIC Technology accepts no liability for inclusion and/or use of AWINIC Technology
products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications that are described herein for any of these products are for illustrative purposes only. AWINIC
Technology makes no representation or warranty that such applications will be suitable for the specified use
without further testing or modification.
All products are sold subject to the general terms and conditions of commercial sale supplied at the time of
order acknowledgement.
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