1658437-3 - Tyco Electronics

Product

Specification 108-2139

23Jan06 Rev A

MICTOR SB (True SMT) Connector

Harrisburg, PA

All International Rights Reserved.

* Trademark

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LOC B

1. SCOPE

1.1. Content

This specific ati on c overs performance, tests and quality r equirement s for t he Tyco Electroni c s Tr ue

Surface Mount (SMT) Style Single Beam Matc hed I mpedance (MI CT OR SB) Connector for m ezzanine

styl e boar d- to-board appli c ati ons. These two-piece connector designs accommodate a variety of

pri nted circuit boar d thic k nesses. Rec eptacl e assembli es are loaded with .006 thick M ICTO R S B

contac ts which mat e with blade c ontacts i n the pl ug assembli es. M ICTO R S B c onnec tors are available

in three contact c enterline versions and 40, 80, 120, 160 and 200 positions.

1.2. Qualification

When tests are performed on t he subj ec t product line, proc edur es specified in Figure 1 shall be used.

Al l inspecti ons shall be performed using the appl icable inspect ion plan and product dr awing.

1.3. Quali fication Test Results

Successf ul qualification testi ng on the subject pr oduc t line was compl eted on 15Oct05. The

Quali fication Test Report number for this testing is 501-616. This documentat ion i s on file at and

available from Engineering Practices and Standards (EPS).

2. APPLICABLE DOCUMENT S

The foll owing doc uments for m a part of this specification t o the ex tent speci fied herein. Unless

otherwise specified, the l atest edition of the document applies. In t he event of c onflict between the

requi r ements of thi s specificat ion and t he pr oduc t drawing, the product dr awing shal l t ak e pr ec edenc e.

In t he event of conflict between the requirements of this specification and t he r efer enc ed doc uments,

this specific ati on shal l tak e pr ec edenc e.

2.1. Tyc o E lectroni c s Document s

109-197: AMP T est Speci fications vs EIA and IEC T est Met hods

114-13116: A pplication Spec ifi c ati on( M ICTO R S B V er tic al Connectors f or S ur face Mount

Technol ogy (SMT) Printed Circuit (PC) Board Applications)

501-616: Qual ification Test Repor t

2.2. Industry S tandards

EIA - 364: El ec trical Connec tor/ S oc k et Test Pr oc edur es Inc ludi ng E nvi r onment al Classifications

EIA - 638: Surfac e M ount Sol der ability Test

3. REQUIREMENTS

3.1. Design and Constructi on

Product shall be of the desi gn, construction and phy si c al dim ensi ons specified on t he appli c able

product dr awing.

108-2139

Rev A 2 of 5

3.2. Materials

Mater ials used in t he c onstr uc tion of thi s product shall be as specified on t he appli c able produc t

drawing.

3.3. Ratings

Vol tage: 125 volts AC

Current:

• Si gnal contacts: 1.25 amperes

• Ground c ontact s:9.5 amper es

Temperature: -65 to 125

. Charact er istic Impedanc e:50 ohms

3.4. Perfor mance and Test Descri ption

Product i s designed t o meet the el ec tri c al, mec hanical and environment al performanc e r equirement s

specified i n Fi gur e 1. Unless otherwise specified, all tests shall be performed at ambient envi r onment al

condi ti ons per EIA-364.

3.5. Test Requirements and Proc edur es Summary

Test Description Requir ement Procedur e

Initial examination of product. Meets requirements of produc t

drawing. EIA-364-18.

Vi sual and dimensional (C of C)

inspect ion per pr oduc t drawing.

Final examination of product. Meets visual r equirement s. EIA - 364- 18.

Vi sual inspection.

ELECTRICAL

Low level cont ac t resistanc e.

)

R 15 milliohms m aximum for

signal c ontact s.

)

R 5 milliohm s max im um for

ground cont ac ts.

EIA-364-23.

Subj ec t specimens to 100

milliamperes maxim um and 20

millivolts m aximum open cir c uit

voltage.

See Figure 3.

Insulati on r esi stanc e. 5000 m egohms minimum init ial .

1000 m egohms minimum after

exposures.

EIA-364-21.

Test bet ween adjac ent signal

contac ts, and between all signal

contac ts and ground of m ated

specimens.

Wit hstanding volt age. 1 m inut e hold with no br eak down or

flashover. 0.5 milliampere

m aximum leak age c ur r ent.

EIA - 364- 20, Condi tion I.

675 volts AC at sea l evel . Test

between adjacent signal contac ts,

and between all signal contac ts

and ground of mated specimens.

Figure 1 (c ontinued)

108-2139

Test Description Requir ement Procedur e

Rev A 3 of 5

MECHANICAL

Solderability. Solderable area shall have a

m inim um of 95% sol der c overage. EIA-638.

Subject contacts to solderability.

Vi br ati on, random. No discont inuities of 1 microsecond

or l onger dur ati on.

See Note.

EIA - 364- 28, Test Condition V.

Subj ec t specimens to 7. 56 G's rm s

between 50 to 2000 Hz. One hour

in eac h of 3 mutual ly perpendicular

planes.

Mechanical shock. No discont inui ti es of 1 mi c r osecond

or l onger dur ati on.

See Note.

EIA - 364- 27, Met hod A .

Subj ec t specimens to 50 G ' s hal f-

sine shock pul ses of 11

milliseconds dur ati on. Three

shocks in each direction applied

along 3 mutually per pendicular

planes, 18 total shocks.

Durability. See Note. EIA-364-9.

Manual ly mat e and unmate 10

gold plat ed specim ens for 100

cycles at a maxi mum rate of 500

cycles per hour.

Mating forc e. 22.2 N [80 ozf] maxim um per

module. EIA-364-13.

Measure force nec essary to mat e

specimens at a maxi mum rat e of

12.7 mm [.5 i n] per minute.

Unm ati ng for c e. 5.6 N [ 20 oz f] mi nimum per

module. EIA-364-13.

Measure force nec essary to

unm ate specimens at a maxi mum

rate of 12.7 mm [. 5 in] per minute.

ENVIRONMENTAL

Thermal shock. See Note. E IA-364- 32, Test Condition III.

Subject speci mens to 5 cycles

between -65 and 125

Hum idity- temperatur e c y c li ng. See Note. E IA-364- 31, Method III.

Subject speci mens to 10 cycles (10

days) between 25 and 65

C at 80

to 100% RH.

Temperature l ife. See Note. E IA-364- 17, Method A , Test

Conditi on 4.

Subj ec t specimens to 105

C for

300 hours.

Shall meet v is ual r equir em ents, s how no physic al dam age, and meet r equir em ents of additional

NOTE

tests as s pec ified in the Pr oduc t Qualification and Requalificat ion Test S equenc e s hown in F igur e

2. T he us e of alter nate gold plating t hic k nes s par ts (gold flash or 30

in gold) can be expec ted to

have the s am e elec trical, mechanical and dielec tric per formance c har ac teristics. Dec is ion to use

such parts should depend on c us tomer’s need for alt er nate durability or env ir onm ental

perfor m anc e c har ac teristics.

Figure 1 (end)

108-2139

Rev A 4 of 5

3.6. Product Quali fication and Requalific ati on Test Sequence

Test or E xamination

Test G r oup ( a)

1234

Test Sequenc e ( b)

Initial examination of product 1111

Low level cont ac t resistanc e 3,7 2,4

I nsulation re sista nc e 2,6

Wit hstanding volt age 3,7

Solderability, dip test 2

Vi br ati on, random 5

Mechanical shock 6

Durability 4

Mating f orce 2

Unm ati ng for c e 8

Thermal shock 4

Hum idity- temperatur e c y c li ng 5

Temperature l ife 3(c)

Final examination of product 9583

(a) See paragraph 4.1.A .

NOTE

(b) Numbers indic ate sequence in which t es ts are per formed.

Figure 2

4. QUALITY ASSURANCE PROVISIONS

4.1. Quali fication Testing

A. Specimen Selection

Specimens shall be prepared in accordanc e with appl icable Instruc ti on S heets and shall be

select ed at random from cur r ent product ion. Test groups 1 and 2 each shall c onsi st of 3 mated

pair s (plug and receptacl e) of vert ical assemblies. T est gr oup 3 shal l consist of 5 unmounted,

m ated pai r s (plug and recept ac le) of vert ical assembli es with housi ngs fully populated with signal

contac ts and bus bars. T est gr oup 4 shal l consist of 5 unmated and unm ounted specimens.

B. Test S equenc e

Quali fication inspection shall be verified by t esting specimens as spec ified i n Figur e 2.

4.2. Requalificat ion Testing

If c hanges signifi c antly affecting form, fit or func ti on ar e made t o the product or manufact ur ing

process, product assurance shall coordinate r equalific ati on testing, consisting of al l or par t of the

ori ginal testing sequence as determined by devel opment /product , qual ity and r eliability engineering.

108-2139

Rev A 5 of 5

4.3. Acceptance

Acceptance is based on verifi c ation that t he pr oduc t meets the requirement s of Figure 1. Fail ur es

att r ibut ed to equipment, t est setup or oper ator defici enc ies shall not di squal ify the product . If pr oduc t

fai lure occ ur s, c or r ec ti ve action shall be tak en and specim ens resubm it ted for qualification. Testing to

confirm corr ec tive act ion i s required before r esubmittal.

4.4. Quali ty Conformance Inspecti on

The appli c able qual it y inspection plan shal l speci fy the sampli ng ac c eptable quality level t o be used.

Dimensi onal and functional requirements shall be in ac c or danc e with the appli c able produc t drawing

and this specific ati on.

Figure 3

Low Lev el Cont ac t Resistance Measurement P oints