USB-KW2X Hardware Reference Manual Document Number: USB-KW2XHWRM Rev. 0.3 08/2014 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by customer's technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale, the Freescale logo, AltiVec, CodeWarrior, ColdFire, ColdFire+,Energy Efficient Solutions logo, PowerQUICC, QorIQ, StarCore, Symphony, and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. CoreNet, Layerscape, QorIQ Qonverge, QUICC Engine, Tower, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ARM and Cortex are registered trademarks of ARM Limited. ARMnnn is the trademark of ARM Limited. (c) 2014 Freescale Semiconductor, Inc. About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Chapter 1 Safety Information 1.1 1.1.1 1.1.2 1.1.3 1.1.4 1.2 1.2.1 1.3 1.4 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Antenna Restrictions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 PART 5 - Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1-1 1-1 1-1 1-1 1-2 1-2 1-2 1-2 Chapter 2 USB-KW24D512 Development Platform Overview and Description 2.1 2.2 2.2.1 2.3 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Board Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB-KW24D512 Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Software and Driver Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2-1 2-1 2-3 Chapter 3 USB-KW24D512 3.1 3.1.1 3.1.2 3.1.3 3.2 3.2.1 3.2.2 3.2.3 3.2.4 3.3 3.3.1 USB-KW24D512 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PCB Board Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB-KW24D512 Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3-1 3-1 3-2 3-3 3-4 3-5 3-5 3-6 3-7 3-9 Chapter 4 PCB Manufacturing Specifications 4.1 4.2 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor iii 4.3 4.4 4.5 4.6 4.7 4.8 4.9 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4-3 4-3 4-3 4-3 4-3 4-4 USB-KW2x Hardware Reference Manual, Rev. 0.3 iv Freescale Semiconductor About This Book This manual describes Freescale's MKW2xDxxx development platform hardware. The MKW2xDxxx is an IEEE(R) 802.15.4 compliant evaluation environment based on the Freescale MKW2xDxxx device. The MKW2xDxxx family is Freescale's latest generation ZigBeeTM platform, which incorporates a complete low power 2.4 GHz radio frequency transceiver and a Kinetis family low power, mixed-signal ARMR eCortexTM- M4 MCU into a single package. This family of products is targeted to meet the higher performance requirements of ZigBee Pro and ZigBee IP based applications, especially Smart Energy and Commercial Building Automation. This product is a cost-effective solution that matches or exceeds competitive solutions. Audience This manual is intended for system designers. Organization This document is organized into the following chapters. Chapter 1 Safety Information -- Highlights some of the FCC requirements. Chapter 2 MKW2xDxxx Development Platform Overview and Description -- Provides an overview of the boards that comprise the MKW2xDxxx development platform. USB-KW24D512 -- This chapter details the USB-KW24D512 evaluation board. PCB Manufacturing Specifications -- This chapter provides the specifications used to manufacture the various MKW2xDxxx printed circuit boards (PCBs). Chapter 3 Chapter 4 Revision History The following table summarizes revisions to this document since the previous release (Rev. 0.0). Revision History Location Revision Entire document First public release Entire document Rev. 0.1, Rename KW24512-USB to USB-KW24D512 development board. Entire document Rev. 0.2, Update Schematic Board Revision to A3. Chapter 3 Rev. 0.3, Update Schematic Board Revision to B. USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor v Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard CTS DAC I2C ISM Clear to Send Digital to Analog Converter Inter-Integrated Circuit is a multi-master serial computer bus Industrial Scientific Medical 2.4 GHz radio frequency band JTAG LGA MAC MCU Joint Test Action Group Land Grid Array Media Access Controller Microcontroller Unit PCB PiP PWM Printed circuit board Platform in Package Pulse-width modulation RCM REM RTS SMA Connector Remote Control Module Remote Extender Board Request to Send SubMiniature version "A" connector SoC SPI SSI TACT Switch System on Chip Serial Peripheral Interface Synchronous Serial Interface A switch that provides a slight "snap" or "click" to the user to indicate function. TELCO TWR USB VCP Telephone Company Tower System Universal Serial Bus Virtual Com Port USB-KW2x Hardware Reference Manual, Rev. 0.3 vi Freescale Semiconductor Chapter 1 Safety Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and Industry Canada and make operation of the product unlawful. 1.1.1 Labeling FCC labels are physically located on the back of the board. 1.1.2 Operating Conditions This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: * This device may not cause harmful interference. * This device must accept any interference received, including interference that may cause undesired operation. 1.1.3 Exposure Limits This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. 1.1.4 Antenna Restrictions An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional radiators that must be professionally USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 1-1 Safety Information installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer is responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.2 Regulatory Approval For Canada (IC RSS 210) This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: 1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device. 1.2.1 26 PART 5 - Appendix Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. 1.3 Electrostatic Discharge Considerations Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the charge device model (CDM). All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test. When operating or handling the development boards or components, Freescale strongly recommends using at least the grounding wrist straps plus any or all of the following ESD dissipation methods: * Flexible fabric, solid fixed size, or disposable ESD wrist straps * Static control workstations, static control monitors and table or floor static control systems * Static control packaging and transportation materials and environmental systems 1.4 Disposal Instructions This product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal. USB-KW2x Hardware Reference Manual, Rev. 0.3 1-2 Freescale Semiconductor Chapter 2 USB-KW24D512 Development Platform Overview and Description 2.1 Introduction The USB-KW24D512 development platform is an evaluation environment based on the Freescale MKW24D512 SIP device (MKW2x). The MKW2x device family is Freescale's latest generation ZigBeeTM platform which incorporates a complete low power IEEE(R) 802.15.4 Standard 2.4 GHz radio frequency transceiver and a Kinetis family low power, mixed-signal ARM CortexTM- M4 MCU into a single package. Freescale supplements the MKW2x with tools and software that include hardware evaluation and development boards, software development IDE and applications, drivers, custom PHY usable with Freescale's IEEE 802.15.4 compatible MAC. The USB-KW24D512 development platform contains the MKW24D512 device with 32 MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry in a USB stick hardware format. The board is a standalone and can be used for application development or as a packet sniffer. Whether the USB-KW24D512 is used in a simple standalone application or in combination with another boards, Freescale provides a complete software development environment called the Freescale BeeKit Wireless Connectivity Toolkit (BeeKit). BeeKit is a comprehensive codebase of wireless networking libraries, application templates, and sample applications. A wide range of software functionality are available to complement the USB-KW24D512 platform and these are provided as codebases within BeeKit. 2.2 2.2.1 Board Features USB-KW24D512 Board The USB-KW24D512 development platform contains the MKW24D512 device and is one of the simplest reference designs utilizing the on chip USB block for power and communication. The USB-KW24D512 is a small form factor self-contained board for evaluation of wireless applications and can be used as packet sniffer. The USB Type A connection is used with USB enabled hardware such as a computer. Figure 2-1 shows the USB-KW24D512 development platform. USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 2-1 USB-KW24D512 Development Platform Overview and Description Figure 2-1. USB-KW24D512 The USB-KW24D512 development platform includes the following Features: * Freescale's low-power MKW24D512 SIP ZigBeeTM platform * Fully compliant IEEE 802.15.4 Standard 2006 transceiver supports 250 kbps O-QPSK data in 5.0 MHz channels and full spread-spectrum encode and decode. * USB form factor for reference design and small footprint, low cost RF node -- Differential input/output port used with external balun for single port operation -- Low external component count -- Programmable output power from -32 dBm to +8 dBm feed to the Antenna -- Receiver sensitivity: -101 dBm, typical (@1% PER for 20 byte payload packet) feed to the antenna * Integrated PCB Folded F-type antenna * 32 MHz reference oscillator * 2.4 GHz frequency operation (ISM) * Programmable frequency clock output (CLK_OUT) * Full speed USB 2.0 * Cortex 10-pin (0.05") JTAG debug port for target MCU * 2 blue LED indicators * 1 push button switch * 1 Reset push button Figure 2-2 shows a simplified block diagram of the Freescale USB-KW24D512 board. USB-KW2x Hardware Reference Manual, Rev. 0.3 2-2 Freescale Semiconductor USB-KW24D512 Development Platform Overview and Description Figure 2-2. Simplified USB-KW24D512 Block Diagram 2.3 Software and Driver Considerations Install the BeeKit Wireless Connectivity Toolkit package found under Software and Tools at the following URL before proceeding to use the boards: * www.freescale.com\zigbee When users first connect a KW2x based platform to a PC, they may be prompted to install drivers. Platform drivers can be found under the installation Beekit folder as denoted below. Once BeeKit is installed, do not allow Windows to automatically search for and install the drivers. Instead, select manual installation and steer Windows to the following directory: * C:\Program Files\Freescale\Drivers Follow the instructions as they appear on the screen to complete driver installation. NOTE If the BeeKit software package is installed in another drive or directory, indicate the Drivers proper folder location where BeeKit was installed. If BeeKit is not installed, consider the following: * When prompted, download the appropriate Windows driver and follow the instructions to complete the driver installation. * The required drivers to be installed will depend on the reference design platform. -- The KW2x boards come imaged with MSD OpenSDA firmware for board to PC connectivity. The target in pre-loaded with the SMAC Connectivity Test application. -- Use the OpenSDA USB port (J15) to connect via Virtual COM Port (VCP) using P&E's OpenSDA Windows driver (See the TWR-OSDAUG.pdf guide). For additional information about our 2.4 GHz Kinetis family ZigBeeTM platforms, refer to the following: * www.freescale.com\KW2x * TWR-OSDAUG - OpenSDA User's Guide * SMACDAUG - SMAC User's Guide USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 2-3 USB-KW24D512 Development Platform Overview and Description USB-KW2x Hardware Reference Manual, Rev. 0.3 2-4 Freescale Semiconductor Chapter 3 USB-KW24D512 3.1 USB-KW24D512 Overview The USB-KW24D512 is an evaluation board based on the Freescale MKW24D512 device. The USB-KW24D512 provides a platform to evaluate the USB-KW24D512 SIP IC, develop software and applications. The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry including a printed board antenna, and supporting circuitry. This basic board is intended as the core PCB for USB-KW24D512 evaluation and application development and can be used as a simple standalone evaluation solution or use a packet sniffer. 3.1.1 PCB Board Features The USB-KW24D512 provides the following features: * USB small form factor * 4-Layer metal, 0.062 inch thick FR4 board * LGA footprint and power supply bypass * Printed metal folded F-Antenna * 32 MHz reference oscillator crystal 3.1.2 Form Factor Figure 3-1 shows the USB-KW24D512 connector and header locations. Figure 3-1. USB-KW24D512 Figure 3-2 shows a footprint of the USB-KW24D512 with the location of the header and connectors USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 3-1 USB-KW24D512 Figure 3-2. USB-KW24D512 Top Side (Component Side) Footprint 3.1.3 Board Level Specifications Table 3-1. USB-KW24D512 Specifications Parameter Min Typ Max Units 61.4 x 18.5 2.42 x 0.73 mm inches Notes/Conditions General Size (PCB: X, Y) Layer build (PCB) 1.57 0.062 mm 4-Layer inches Dielectric material (PCB) FR4 Power Current consumption mA Refer to datasheet * Operating temperature is limited to +70 C due to switches. Basic circuit is good for a maximum temperature of +85 C. Temperature Operating temperature (see note) -40 +25 +70 C Storage temperature -30 +25 +70 C 2480 MHz All 16 channels in the2450 MHz band RF 802.15.4 Frequency range 2405 RF Receiver Saturation (maximum input level) +10 dBm Datasheet Sensitivity for 1% packet error rate (PER) (+25 C) -102 dBm Datasheet RF Transmitter USB-KW2x Hardware Reference Manual, Rev. 0.3 3-2 Freescale Semiconductor USB-KW24D512 Table 3-1. USB-KW24D512 Specifications (continued) Parameter RF Power Output Min Typ -32 Max Units Notes/Conditions +8 dBm Programmable in 2dB steps. At the antenna feed with no trap. 1. 2nd harmonic <-50 <-40 dBm Datasheet 3rd harmonic <-50 <-40 dBm Datasheet Regulatory Approval FCC Product is approved accordingly to the FCC part 15 standard CE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standard CE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards Safety UL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards Environment RoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003 WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003 1 Trap will add 1 to 2 dB of loss. 3.2 Functional Description The USB-KW24D512 is built around Freescale's MKW24D512 63-pin (56-pin usable) LGA platform. This board is intended as a simple evaluation platform and as a building block for application development. The 4-layer board provides the MKW24D512 with its required RF circuitry, 32 MHz reference oscillator crystal, and power supply bypassing. The layout for this base level functionality can be used as a reference layout by the user target board. Figure 3-3 shows a simple block diagram. USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 3-3 USB-KW24D512 Figure 3-3. USB-KW24D512 Block Diagram 3.2.1 RF Performance and Considerations USB-KW24D512 transceiver includes a 1mW nominal output power, PA with internal voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation, and full spread-spectrum encoding and decoding. The USB-KW24D512 utilizes a minimum number of components while providing good RF performance. Key specifications for USB-KW24D512 are: * Nominal output power is set to 0 dBm * Programmable output power from -32 dBm to +8 dBm measured at the antenna feed * Typical sensitivity is -101 dBm (@1% PER for 25 C) measured at the antenna feed * Frequency range is 2360 to 2480 MHz * Folded "F" printed metal antenna for a small footprint, low cost design * Uses a minimum number of RF marching components and external 50:50 balun An external 50 (unbal): 50(bal) balun connects a single-ended 50-ohm port to the differential RF port of the MKW24D512 radio. The layout has provision for out-of-band signal suppression (components L5 and C19) if required. Figure 3-4 shows the typical topology for the RF circuitry. The RF switch J4 has been designed in for measurement purposes and is left as DNP. Figure 3-4. USB-KW24D512 RF Circuitry USB-KW2x Hardware Reference Manual, Rev. 0.3 3-4 Freescale Semiconductor USB-KW24D512 3.2.2 Clocks The USB-KW24D512 provides one clock: * 32 MHz Reference Oscillator -- Figure 3-5 shows the external 32 MHz external crystal Y1. This mounted crystal must meet the specifications outlined in the AN3251 application note. The IEEE 802.15.4 Standard requires that the frequency be accurate to less that +/-40 ppm. -- Capacitors C10 and C11 provide the bulk of the crystal load capacitance. Onboard trim capacitors can be programmed to center the frequency. At 25C, it is desired to have the frequency accurate to +/-10 ppm or less to allow for temperature variation. -- To measure the 32 MHz oscillator frequency, signal CLK_OUT (TP5) can optionally be programmed to provide a buffered output clock signal. Figure 3-5. USB-KW24D512 32 MHz Reference Oscillator Circuit 3.2.3 Power Management The USB-KW24D512 power management circuit is shown in Figure 3-6. USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 3-5 USB-KW24D512 Figure 3-6. USB-KW24D512 Power Management Circuit The USB-KW24D512 is powered via the USB type A connector as shown in Figure 3-6., "USB-KW24D512 Power Management Circuit"; the MKW24D512 device has an on-board USB port which is configured to provide both power and serial communication with the target MCU. 3.2.4 USB-KW24D512 Peripheral Functions The USB-KW24D512 includes two switch buttons; one for general purpose peripheral function to assist in implementing targeted applications and the other is for board hardware Reset. In the same situation the USB-KW24D512 includes two LEDs for general purpose peripheral function to assist on applications. USB-KW2x Hardware Reference Manual, Rev. 0.3 3-6 Freescale Semiconductor Freescale Semiconductor 3.3 Schematic, Board Layout, and Bill of Material Figure 3-7. USB-KW24D512 Schematic 5 4 3 2 1 V_MCU 3V3 IN CIRCUIT TEST GND PROBING V_USB C1 5pF C2 1000pF C3 0.33UF TP28 DNP VDD_RF VDD_RF V_MCU V_MCU VDD_IF D VREFH C5 1000pF C4 5pF V_MCU VDD_PA SH1 VDD_IF C8 0.1UF C24 1000pF GND C13 0.47UF D C12 33PF C7 0.1UF DNP VDD_REGD C26 5pF VDD_PA C6 0.1UF 0 C9 0.1UF TP19 V_RF VREFL SH2 GPIO1 GPIO2 26 27 VREFH VREFL 32 42 55 VBAT_MCU VBAT2_RF VBAT_RF 43 52 53 54 25 28 TAMPER0/RTC_WAKEUP 41 TP_RX_SWITCH TP_TX_SWITCH PTE0/MADC0_SE10/SPI1_PCS1/UART1_TX/MTRACE_CLKOUT/I2C1_SDA/RTC_CLKOUT PTE1/LLWU_P0/MADC0_SE11/SPI1_SOUT/UART1_RX/MTRACE_D3/I2C1_SCL/SPI1_SIN PTE2/LLWU_P1/MADC0_DP1/SPI1_SCK/UART1_CTS/MTRACE_D2 PTE3/MADC0_DM1/SPI1_SIN/UART1_RTS/MTRACE_D1/SPI1_SOUT PTE4/LLWU_P2/SPI1_PCS0/MTRACE_D0 RESET 46 47 RX_SWITCH TX_SWITCH 33 34 35 36 37 39 40 PTA0/JTAG_TCLK/SWD_CLK/EZP_CLK/UART0_CTS/UART0_COL/FTM0_CH5 PTA1/JTAG_TDI/EZP_DI/UART0_RX/FTM0_CH6 PTA2/JTAG_TDO/TRACE_SWO/EZP_DO/UART0_TX/FTM0_CH7 PTA3/JTAG_TMS/SWD_DIO/UART0_RTS/FTM0_CH0 PTA4/LLWU_P3/NMI/EZP_CS/FTM0_CH1 PTA18/EXTAL0/FTM0_FLT2/FTM_CLKIN0 PTA19/XTAL0/FTM1_FLT0/FTM_CLKIN1/LPTMR0_ALT1 4 5 6 7 C16 33PF 15 16 17 18 19 KW24_USB_DP KW24_USB_DN 49 50 RF_OUTP RF_OUTN Z_RF_P C Z1 0 C17 1PF C18 BAL_C 10PF 4 6 2 5 3 MM8030-2600B J4 RF_50 1 2400MHz 50OHM Z_RF_N NC_57 NC_58 NC_59 NC_60 NC_61 NC_62 57 58 59 60 61 62 DNP PROBE 1 2 IN OUT ANT1 2 1 C20 L3 2.2nH RF_ANT 1.8pF 0 MEANDER_ANT_HORZ C19 HARMONIC TRAP 10PF 48 51 63 64 65 MKW24D512V 21 22 R3 PTC4/LLWU_P8/SPI0_PCS0/UART1_TX/FTM0_CH3/CMP1_OUT PTC5/LLWU_P9/SPI0_SCK/LPTMR0_ALT2/I2S0_RXD0/CMP0_OUT PTC6/LLWU_P10/CMP0_IN0/SPI0_SOUT/PDB0_EXTRG/I2S0_RX_BCLK/I2S0_MCLK PTC7/CMP0_IN1/SPI0_SIN/USB_SOF_OUT/I2S0_RX_FS EP_GND1 EP_GND2 PTC4 RF_OUTP RF_OUTN GND_PA1 GND_PA2 GND_PA3 CLK_OUT TP5 C15 0.33UF PTD4 PTD5 R2 USB0_DP USB0_DM C PTA0 PTA1 PTA2 PTA3 VDD_REGD 4 RST_TGTMCU_B 8 9 10 11 12 13 14 TP2 TP_ANT_A TP_ANT_B 3 29 TAMPER0 TP3 TP4 PTD1/ADC0_SE5B/SPI0_SCK/UART2_CTS PTD2/LLWU_P13/SPI0_SOUT/UART2_RX/I2C_SCL/GPIO4_BSM_DATA PTD3/SPI0_SIN/UART2_TX/I2C_SDA/GPIO5_BSM_CLK PTD4/LLWU_P14/MADC0_SE21/SPI0_PCS1/UART0_RTS/FTM0_CH4/EWM_IN/GPIO_BSM_FRAME PTD5/ADC0_SE6B/SPI0_PCS2/UART0_CTS/UART0_COL/FTM0_CH5/EWM_OUT PTD6/LLWU_P15/ADC0_SE7B/SPI0_PCS3/UART0_RX/FTM0_CH6/FTM0_FLT0 PTD7/MADC0_SE22/CMT_IRO/UART0_TX/FTM0_CH7/FTM0_FLT1 EXTAL_32M XTAL_32M 2 3 44 45 1 1 56 VDD_REGD VDD_PA VDD_IF VDD_RF XTAL32 EXTAL32 TP1 ANT_A ANT_B 2 EXTAL_32M XTAL_32M B B A K24_USB_SHLD V RT1 2 V_USB_CONN A1 A2 A3 A4 L5 330 OHM USB_DN R7 USB_DP R8 1 2 2 L4 TP6 V_USB_CONN_IND1 C27 47PF DNP C25 47PF DNP TP9 1 C21 KW24_USB_DP 33 1 D2 BLUE PTC4 D3 BLUE Y1 EXTAL_32M 2 60OHM KW24_USB_DN 33 USB_TYPE_A SW1 V_USB MINISMDC050F-2 S1 C10 11pF 4 2 SKQYAFE010 XTAL_32M 3 1.0UF 32MHZ C11 11pF TP10 C D- PTD5_LED D+ C G PTD4_LED J5 S2 A V_LED 1 USB-KW2x Hardware Reference Manual, Rev. 0.3 30 31 VDDA VSSA 23 24 VOUT33 VREGIN R1 1.0M VDD_MCU VDD_MCU 20 38 0 U1 TP7 R9 390 TP8 R10 390 V_MCU RESET V_LED 2 V_LED A D1 GREEN 0.1UF 2.2UF V_MCU R12 0 V_RF SKQYAFE010 C30 1000pF MCU VOLTAGE R14 TP13 RF VOLTAGE 330 PIN FUNCTIONS USED J1 LED_PWR_R TP12 0 R11 V_MCU V_MCU C C29 RST_TGTMCU_B 1 TP11 LED VOLTAGE C28 PTD5 R13 10K DNP SW2 A 3V3 PTD4 32MHz XTAL POWER ON 1 3 5 7 9 NET NAMES R6 10K A 2 4 6 8 10 PTA3 JTAG_TMS/SWD_DIO JTAG_TCLK/SWD_CLK/EZP_CLK PTA0 PTA2 JTAG_TDO/TRACE_SWO/EZP_DO PTA1 JTAG_TDI/EZP_DI RST_TGTMCU_B MH1 MH_80mil HDR 2X5 MH2 MH_80mil MH3 MH_80mil MH4 MH_80mil TP14 TP15 TP16 TP17 TP18 4 3 FCP: ___ FIUO: X PUBI: ___ MAIN SCHEMATIC 1 1 1 1 1 1 2 Page Title: Size C Document Number SCH-28057 PDF: SPF-28057 Date: Thursday, July 17, 2014 Rev B Sheet 1 3 of 3 3-7 USB-KW24D512 5 ICAP Classification: Drawing Title: USB-KW24D512 1 JTAG / SWD CONNECTOR 1 POWER MANAGEMENT USB-KW24D512 Figure 3-8. USB-KW24D512 Reference Board PCB Component Location (Top View) Figure 3-9. USB-KW24D512 Reference Board PCB Test Points Figure 3-10. USB-KW24D512 Reference Board PCB Layout (Top View) USB-KW2x Hardware Reference Manual, Rev. 0.3 3-8 Freescale Semiconductor USB-KW24D512 Figure 3-11. USB-KW24D512 Reference Board PCB Layout (Bottom View) 3.3.1 Bill of Materials Table 3-2. Bill of Materials (Common parts for all frequency bands) (Sheet 1 of 3) Item Qty Reference Value Description Mfg. Name Mfg. Part Number 1 1 ANT1 MEANDER_ PCB MEANDER ANTENNA ANT_HORZ HORIZONTAL, NO PART ORDER 2 3 C1,C4,C26 5pF CAP CER 5pF 50V 5% C0G 0402 MURATA GJM1555C1H5R0CB0 1D 3 3 C2,C5,C24 1000pF CAP CER 1000PF 50V 5% C0G 0402 MURATA GRM1555C1H102JA0 1D 4 2 C3,C15 0.33UF CAP CER 0.33UF 6.3V 10% X5R 0402 MURATA GRM155R60J334KE0 1D 5 3 C6,C8,C9 0.1UF CAP CER 0.1UF 16V 10% X7R 0402 KEMET C0402C104K4RAC 6 1 C7 DNP 0.1UF CAP CER 0.1UF 16V 10% X7R 0402 KEMET C0402C104K4RAC 7 2 C10,C11 11pF CAP CER 11pF 50V 5% C0G 0402 TDK C1005C0G1H110J 8 2 C12,C16 33PF CAP CER 33PF 50V 5% C0G 0402 VENKEL COMPANY C0402C0G500-330JN E 9 1 C17 1PF CAP CER 1PF 50V 5% C0G 0402 MURATA GRM1555C1H1R0CA 01B 10 2 C18,C19 10PF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A 11 1 C20 1.8pF CAP CER 1.8PF 50V 0.25PF C0G MURATA 0402 GRM1555C1H1R8CA 01D 12 1 C21 1.0UF CAP CER 1.0UF 10V 10% X5R 0402 CC0402KRX5R6BB10 5 YAGEO AMERICA USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 3-9 USB-KW24D512 Table 3-2. Bill of Materials (Common parts for all frequency bands) (Sheet 2 of 3) Item Qty Reference Value Description Mfg. Name Mfg. Part Number 13 2 C25,C27 DNP 47PF CAP CER 47PF 16V 5% C0G 0402 AVX 0402YA470JAT2A 14 1 C29 2.2UF CAP CER 2.2UF 10V 10% X7R 0603 TAIYO YUDEN LMK107B7225KA-T 15 1 D1 GREEN LED GRN SGL 30MA SMT 0805 LITE ON LTST-C171KGKT 16 2 D2,D3 BLUE LED BLUE SGL 20MA SMT 0805 LITE ON LTST-C171TBKT 17 1 J1 HDR 2X5 CONN,HEAD,2X5,STR,50/50 CON-2RH-10-50 SAMTEC FTS-105-01-F-D 18 1 J4 DNP MM8030-26 CON COAX SMT 1.9MM SP 40H 00B AU MURATA MM8030-2610B 19 1 J5 USB_TYPE _A CON 1X4 USB_TYPE_A_MALE RA SMT -- 178H AU SAMTEC USB-AM-S-S-B-SM1 20 1 L3 2.2nH IND -- 2.2NH@500MHZ 220mA 4% 0402 MURATA LQP15MN2N2B02 21 1 L4 60OHM IND FER BEAD 60OHM@100MHZ MURATA 500MA -- 0603 BLM18PG600SN1D 22 1 L5 330 OHM IND FER BEAD 330OHM@100MHZ 2.5A -- SMT MPZ2012S331A 23 4 MH1,MH2, MH3,MH4 MH_80mil Rework Hole Non-Plated 80mil Drill size 95mil Soldermask TH, NO PART TO ORDER 24 1 RT1 MINISMDC 050F-2 FUSE PLYSW 0.5A 24V SMT TYCO ELECTRONICS MINISMDC050F-2 25 1 R1 1.0M RES MF 1.0M 1/10W 5% 0603 BOURNS CR0603-JW-105ELF 26 5 R2,R3,R11, 0 R12 RES MF ZERO OHM 1/16W 5% 0402 ROHM MCR01MZPJ000 27 1 R6 10K RES MF 10K 1/10W 5% 0603 KOA SPEER RK73B1JTTD103J 28 2 R7,R8 33 RES MF 33 OHM 1/10W 5% 0603 VISHAY CRCW060333R0JNE INTERTECHNOLOGY A 29 2 R9,R10 390 RES MF 390 OHM 1/16W 5% 0402 VISHAY CRCW0402390RJNE INTERTECHNOLOGY D 30 1 R13 DNP 10K RES MF 10K 1/10W 5% 0603 31 1 R14 330 RES MF 330 OHM 1/16W 5% 0402 VISHAY CRCW0402330RJNE INTERTECHNOLOGY D 32 3 SH1,SH2 0 ZERO OHM CUT TRACE 0402 PADS; NO PART TO ORDER 33 2 SW1, SW2 SKQYAFE0 10 SW SPST MOM PB 50MA 12V SMT TDK KOA SPEER ALPS ELECTRIC (USA) INC. RK73B1JTTD103J SKQYAFE010 USB-KW2x Hardware Reference Manual, Rev. 0.3 3-10 Freescale Semiconductor USB-KW24D512 Table 3-2. Bill of Materials (Common parts for all frequency bands) (Sheet 3 of 3) Item Qty Reference 34 18 35 Value Description Mfg. Name Mfg. Part Number TP1,TP2,TP3, TP4,TP5,TP6, TP7,TP8,TP9, TP10,TP11,TP 12,TP13,TP14 ,TP15,TP16,T P17,TP18 TPAD_040 TEST POINT PAD 40MIL DIA SMT, NO PART TO ORDER 1 TP19 TPAD_030 TEST POINT PAD 30MIL DIA SMT, NO PART TO ORDER 36 1 TP28 DNP TEST POINT WHITE TEST POINT WHITE 40 MIL DRILL 180 MIL TH 109L 37 1 U1 MKW24D51 IC MCU XCVR 2.4GHZ 64KB RAM Freescale Semiconductor 2V 512KB FLASH - USB 1.8-3.6V LGA63 MKW24D512VHA5 38 1 Y1 32MHZ XTAL 32MHZ 9PF -- SMT 3.2X2.5MM NDK EXS00A-CS02368 39 1 Z1 2400MHz 50OHM XFMR BALUN 2400 +/-100MHZ SMT MURATA LDB212G4005C-001 40 1 C28 0.1UF CAP CER 0.1UF 10V 10% X5R 0402 KEMET C0402C104K8PAC 41 1 C13 0.47UF CAP CER 0.47UF 6.3V 10% X5R 0402 MURATA GRM155R60J474KE1 9D 42 1 C30 1000pF CAP CER 1000PF 50V 5% C0G 0402 MURATA GRM1555C1H102JA0 1D COMPONENTS CORPORATION TP-105-01-09 USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 3-11 USB-KW24D512 USB-KW2x Hardware Reference Manual, Rev. 0.3 3-12 Freescale Semiconductor Chapter 4 PCB Manufacturing Specifications This chapter provides the specifications used to manufacture the KW2x Development hardware printed circuit board (PCB) described in this manual. The KW2x Development hardware PCBs must comply with the following: * The PCB must comply with Perfag1D/3C (http://www.perfag.dk/Uk/ukindex.htm) * The PCB manufacturer's logo is required * The PCB production week and year code is required -- The manufacturer's logo and week/year code must be stamped on the back of the PCB solder mask -- The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without written permission from Freescale Semiconductor, Inc. * The required Underwriter's Laboratory (UL) Flammability Rating -- The level is 94V-0 (http://www.ul.com/plastics/flame.html) -- The UL information must be stamped on the back of the PCB solder mask * * 4.1 NOTE A complete set of design files is available for the KW2x Development hardware at the Freescale web site (http:www.freescale.com/KW2x) under the "Software and Tools" tab. This design or one of a number of other reference designs should be used as a starting point for a custom application. The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual, (ZHDCRM) is also available at the same web site to provide additional design guidance. Single PCB Construction This section describes individual PCB construction details. * * * The USB-KW24D512 PCB is four-layer, multi layer design The PCBs contains no blind, buried, or micro vias PCB data: -- USB-KW24D512 Size: Approximately 61.4 x 18.5mm (2.42 x 0.73 inches) -- USB-KW24D512 Final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder mask) USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 4-1 PCB Manufacturing Specifications The following table defines some of the layers of the completed PCB. The artwork identification refers to the name of the layer in commonly used terms. Table 4-1. USB-KW24D512 Layer by Layer Overview Layer Artwork Identification File Name 1 Silkscreen Top SILK_TOP.art 2 Top Layer Metal TOP.art 3 Ground Layer GND.art 4 Power Layer PWR.art 5 Bottom Layer Metal BOTTOM.art 6 Silkscreen Bottom SILK_BOTTOM.art NOTE The USB-KW24D512 contains high frequency 2.4 GHz RF circuitry. As a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters. As a result, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing must not be changed; follow the stackup (see Figure 4-1) information is provided with the reference design. Figure 4-1. USB-KW24D512 PCB Stackup Cross-Section (Four Layer) * * 4.2 Solder mask is required Silk screen is required Panelization The panel size can be negotiated depending on production volume. 4.3 Materials The PCB composite materials must meet the following requirements: USB-KW2x Hardware Reference Manual, Rev. 0.3 4-2 Freescale Semiconductor PCB Manufacturing Specifications * * * 4.4 Laminate - The base laminate material (laminate) must be FR4. If the laminate material were changed the RF electrical characteristics may change and degrade RF performance. Copper Foil -- Top and Bottom copper layers must be 1 oz. copper -- Interior layers must be 1oz. copper Plating - All pad plating must be Hot Air Levelling (HAL) Solder Mask The solder mask must meet the following requirements: * Solder mask type: Liquid Film Electra EMP110 or equivalent * Solder mask thickness: 10 - 30 m 4.5 Silk Screen The silk screen must meet the following requirements: * Silkscreen color: White * Silkscreen must be applied after application of solder mask if solder mask is required * The silkscreen ink must not extend into any plated-thru-holes * The silk screen must be clipped back to the line of resistance 4.6 * * 4.7 Electrical PCB Testing All PCBs must be 100 percent tested for opens and shorts Impedance Measurement - An impedance measurement report is not mandatory Packaging Packaging for the PCBs must be the following requirements: * Finished PCBs must remain in panel * Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials. These materials can degrade solderability. 4.8 Hole Specification/Tool Table See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28057.pdf file. USB-KW2x Hardware Reference Manual, Rev. 0.3 Freescale Semiconductor 4-3 PCB Manufacturing Specifications 4.9 File Description Files included with the download include Design, Gerber and PDF files. Gerber files are RS-274x format. Not all files included with the Gerber files are for PCB manufacturing. PDF files included are: * FAB-28057.pdf -- USB - Board fabrication drawing * GRB-28057.zip -- USB - Metal layers, solder mask, solder paste and silk screen * SPF-28057.pdf -- USB - Schematic Design files are in Allegro format with OrCAD schematic capture. USB-KW2x Hardware Reference Manual, Rev. 0.3 4-4 Freescale Semiconductor