TEA1733CT/N1,118 - NXP Semiconductors

1. General description

The TEA1733CT is a low cost Switched Mode Power Supply (SMPS) controller IC

intended for flyback topologies. It operates in fixed frequency mode. To reduce

ElectroMagnetic Interference (EMI), frequency jitter has been implemented. Slope

compensation is integrated for Continuous Conduction Mode (CCM) operation.

The TEA1733CT includes OverPower Protection (OPP). This enables the controller to

operate under overpower situations for a limited amount of time.

Two pins, VINSENSE an d PRO TE C T, are reserved for pr ot ec tio n pu rp o ses . Inp ut

UnderVoltage Protection (UVP) and OverVoltage Protection (OVP), output OVP and

OverTemperature Protection (OTP) can be implemented using a minimal number of

external components.

At low power levels the primary peak current is set to 25 % of the maximum peak current

and the switching frequency is r educe d to limit switching losses. The co mbination of fixed

frequency operation at high output power and frequency reduction at low output power

provides high-efficiency over the total load range.

The TEA1733CT enables low cost, highly efficient and reliable supplies for power

requirements up to 75 W to be designed easily and with a minimum number of external

components.

2. Features and benefits

2.1 Features

SMPS controller IC enabling low-cost applications

Large input voltage range (12 V to 30 V)

Very low supply current during start-up and restart (typically 10 A)

Low supply current during normal operation (typically 0.5 mA without load)

Overpower or high/low line compensation

Adjustable overpowe r time- ou t

Adjustable overpowe r re start timer

Fixed switching frequency with frequency jitter to reduce EMI

Frequency reduction with fixed minimum peak current to main tain high-efficiency at

low output power levels

Slope compensation for CCM operation

Low and adjustable OverCurrent Protection (OCP) trip level

TEA1733CT

GreenChip SMPS control IC

Rev. 2 — 16 July 2013 Product data sheet

Product data sheet Rev. 2 — 16 July 2013 2 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

Adjustable soft start operation

Two protection inputs (for example: for input UVP and OVP, OTP and output OVP)

IC overtemperature protection

3. Applications

All applications requiring efficient and cost-effective power supply solutions up to

75 W.

4. Ordering information

Table 1. Ordering information

Type number Package

Name Description Version

TEA1733CT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

Product data sheet Rev. 2 — 16 July 2013 3 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

5. Block diagram

Fig 1. Block diagram

aaa-001529

OVERPOWER

CORRECTION

BLANK

OCP

LEB

VINSENSE

latch

stop

soft start

restart

OSCILLATOR

frequency reduction

set

δmax MODULATION

SLOPE

COMPENSATION

ANALOG

CONTROL

restart VCCstop

overpower

highvin

lowvin

latch

latch reset

DIGITAL CONTROL

soft start

μA

11 μA

2.5 V

1.2 V / 4.5 V

restart

VCCstart DQ

VCCstop

latch reset

RESTART

CONTROL

OPP switch

OTP

OPTIMER

5.4 V

7 kΩ

δmax

stop

set

power down

clamp

DRV

DRIVER

GND

VCC

ISENSE 4

driver

overpower OPTIMER

CTRL

PROTECT

VINSENSE

OPP switch

clamp latch

21 V

6 V22 V 12 V

5 V

400 mV

0.50 V/0.80 V

107

μA

107 μA

prothigh

protlow

highvin

lowvin

3.52 V

0.72 V/0.94 V

VCCstart

power down

lowvin

protlow

OTP

prothigh

protlow

Vctrl(Ipeak)

TEMPERATURE

PROTECTION

Product data sheet Rev. 2 — 16 July 2013 4 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 2. Pinning diagram SOT96-1 (SO8)

TEA1733CT

VCC OPTIMER

GND CTRL

DRIVER PROTECT

ISENSE VINSENSE

aaa-001530

Ta ble 2. Pin description

Symbol Pin Description

VCC 1 supply voltage

GND 2 ground

DRIVER 3 gate driver output

ISENSE 4 current sense input

VINSENSE 5 input voltage protection input

PROTECT 6 general-purpose protection input

CTRL 7 control input

OPTIMER 8 overpower and restart timer

Product data sheet Rev. 2 — 16 July 2013 5 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

7. Functional description

7.1 General control

The TEA1733CT contains a flyback circuit controller, a typical configuration of which is

shown in Figure 3.

7.2 Start-up and UnderVoltage LockOut (UVLO)

Initially, the capacitor on the VCC pin is charged from the hi gh-voltage mains via resistor

R3.

If VCC is lower than Vstartup, the IC current consumption is low (typically 10 A). When VCC

reaches Vstartup, the IC first waits for the VINSENSE pin to re ach the Vstart(VINSENSE)

voltage and PROTECT pin to reach the Vdet(L)(PROTECT) voltag e. When both levels are

reached, the IC charges the ISENSE pin to the Vstart(soft) level and starts switching. In a

typical application, the auxiliary winding of th e transformer takes over the supply voltage.

If a protection is triggered the controller stops switching. Depending on the protection

triggered, the protection causes a restart or latches the converter to an off-state.

A restart caused by a protection rapidly charges the OPTIMER pin to 4.5 V (typical). The

TEA1733CT enters Power-down mode until the OPTIMER pin discharges down to 1.2 V

(typical). In Power-down mode, the IC consumes a very low supply curren t (10 Atypical)

and the VCC pin is clamped at 22 V (typical) by an internal clamp circuit. When the

voltage on pin OPTIMER drop s below 1.2 V (typical) and the VCC pin volta ge is above the

VCC start-up voltage (See Figure 4), the IC restarts.

When a latched protection is triggered, the TEA1733CT immediately enters Powe r-down

mode. The VCC pin is clamped to a voltage just above the latch protection reset voltage

(Vrst(latch) +1V).

Fig 3. Typical configuration

aaa-001531

TEA1733CT

R3 R4

C4 R8 C5

R10

DRIVER

GND

VCC

ISENSE

VINSENSE

PROTECT

CTRL

OPTIMER

Product data sheet Rev. 2 — 16 July 2013 6 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

When the voltage on pin VCC drop s below the Vth(UVLO) level during normal operation, the

controller stops switching and enters Restart mode. In Restart mode, the driver output is

disabled and the VCC pin voltage is recharged via resistor R3 to the rectified mains.

7.3 Supply management

All internal reference vo ltage s are derived from a temperature comp ensated on-chi p band

gap circuit. Internal reference currents are derived from a trimmed and temperature

compensated current reference circuit.

7.4 Input voltage detection (VINSENSE pin)

In a typical application pin VINSENSE detect s the mains input voltage. Switching does not

take place until the voltage on VINSENSE has reached the Vstart(VINSENSE) voltage

(typically 0.94 V).

When the VINSENSE voltage drops below Vdet(L)(VINSENSE) (typically 0.72 V) or exceeds

Vdet(H)(VINSENSE) (typically 3.52 V), the converter stops switching and performs a restart.

If pin VINSENSE is left open or disconnected, the pin is pulled up by the internal 20 nA

(typical) current source to reach the Vdet(H)(VINSENSE) level. This triggers restart protection.

An internal clamp of 5.2 V (typical) protects this pin from overvoltages.

7.5 Protection input (PROTECT PIN)

Pin PROTECT is a general-purpose input pin, which can be used to trigger the restart

protection. The converter is stopped when the volt age on this pin is pulled above

Vdet(H)(PROTECT) (typically 0.8 V) or below Vdet(L)(PROTECT) (typically 0.5 V). A current of

32 A (typical) flows out of the chip when the pin voltage is at the Vdet(L)(PROTECT) level. A

current of 107 A (typical) flows into the chip when the pin voltage is at the

Vdet(H)(PROTECT) level.

Fig 4. Start-up sequence, normal operation and restart sequence

014aaa929

starting

converter

charging VCC

capacitor normal

operation protection

(power down)

soft start

VCC

ISENSE

VINSENSE

PROTECT

OPTIMER

restart

soft start

Vstartup

Vth(UVLO)

Vdet(H)(VINSENSE)

Vdet(H)(PROTECT)

Vdet(L)(PROTECT)

4.5 V

1.2 V

Product data sheet Rev. 2 — 16 July 2013 7 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

The PROTECT input can be used to create overvoltage detection and OTP functions.

A small capacitor can be connected to the pin if the protections on this pin are not used.

An internal clamp of 4.1 V (typical) protects this pin from overvoltages.

7.6 Duty cycle control (CTRL pin)

Pin CTRL regulates the output power of the conv erter. This pin is connected to an internal

5.4 V supply using an internal 7 k resistor.

The CTRL pin voltage sets the peak current which is measured using the ISENSE pin

(see Section 7.10). At a low output power the switching frequency is also reduced (see

Section 7.12). The maximum duty cycle is limited to 72 % (typical).

7.7 Slope compensation (CTRL pin)

A slope compensation circuit is integrated in the IC for CCM. Slope compensation

guarantees stable operation for duty cycles greater than 50 %.

7.8 Overpower timer (OPTIMER pin)

If the OPTIMER pin is connected to capacitor C4 (see Figure 3), a temporary overload

situation is allowed. Pin CTRL sets Vctrl(Ipeak) (see Figure 1). When Vctrl(Ipeak) is above

400 mV, the IIO(OPTIMER) current (11 A typical) is sourced from the OPTIMER pin. If the

voltage on the OPTIMER pin reaches the Vprot(OPTIMER) voltage (2.5 V typical) the

OverPower Protection (OPP) is triggered (see Figure 5).

When the Vprot(OPTIMER) voltage is reached the device restarts. If the overload is removed

before the Vprot(OPTIMER) voltage is reached, the converter continues switching.

Fig 5. Overpower delay

014aaa930

VOPTIMER

VISENSE

400 mV

protectionhigh loadhigh load normal

load

Vprot(OPTIMER)

Product data sheet Rev. 2 — 16 July 2013 8 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

7.9 Current mode control (ISENSE pin)

Current mode control is used for its good line regulation.

The primary current is sensed by the ISENSE pin across an external resistor R9 (see

Figure 3) and comp ared with an internal referen ce volt age. The inte rnal reference volt age

is proportional to the CTRL pin voltage (see Figure 6).

Leading edge blanking prevents false tr iggering due to capacitive discharge when

switching on the external power switch (see Figure 7).

7.10 Overpower or high/low line compensation

(VINSENSE and ISENSE pins)

The overpower compensation function can be used to realize a maximum output power

which is nearly constant over the full inpu t mains.

The overpower compensation circuit measures the input voltage on the VINSENSE pin

and outputs a proportionally dependent current on the ISENSE pin. The DC voltage

across the soft start resistor limits the maximum peak current on the current sense

resistor.

At low output power levels the overpower compensation circuit is switched off

(See Figure 8).

Fig 6. Peak current control using pin ISENSE

Fig 7. Le ading edge blanki ng using pin ISENSE

frequency

reduction

0.2

0.4

0.6

004312

014aaa931

CTRL

(V)

sense(max)

(V)

tleb

Vsense(max)

VISENSE t

014aaa932

Product data sheet Rev. 2 — 16 July 2013 9 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

7.11 Soft start-up (ISENSE pin)

To prevent audible noise during st a rt-up or a restart condition, a soft start is made. Before

the converte r starts, the soft start capacitor C6 (see Figure 3) on the ISENSE pin is

charged. When the converter starts switching, the primary peak current slowly increases

as the soft start capacitor discharges through the soft start resistor (R6, see Figure 3).

The soft start time constant is set by the soft st art capacitor value chosen. The soft start

resistor value must also be taken into account, but this value is typically defined by the

overpower co mp e ns at ion (s ee Section 7.10).

7.12 Low-power operation

In low-power operation switching losses are reduced by lowering the switch ing freque ncy.

The converter switching frequency is reduced and the peak current is set to 25 % of the

maximum peak current (see Figure 6 and Figure 9).

7.13 Driver (DRIVER pin)

The driver circuit to the gate of the power MOSFET has a current sourcing capability of

typically 300 mA and a current sink capability of typically 750 mA. This allows for a fast

turn-on and turn-off of the power MOSFET for efficient operation.

Fig 8. Overpower compensation using pins VINSENSE and ISENSE

1.7

0.68 1234

014aaa933

ISENSE

(μA)

VINSENSE

(V)

Fig 9. Frequency control

switching

frequency

014aaa934

VCTRL (V)

fsw

(kHz)

Product data sheet Rev. 2 — 16 July 2013 10 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

7.14 OverTemperature Protection (OTP)

Integrated overtemperature protection ensures the IC stops switching if the junction

temperature exceeds the thermal temperature shutdown limit.

OTP is a latched protection and it can be reset by removing the voltage on pin VCC.

8. Limiting values

[1] Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.

Table 3. Limitin g values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Voltages

VCC supply voltage continuous 0.4 +30 V

t < 100 ms - 35 V

VVINSENSE voltage on pin VINSENSE current limited 0.4 +5.5 V

VPROTECT voltage on pin PROTECT current limited 0.4 +5 V

VCTRL voltage on pin CTRL 0.4 +5.5 V

VIO(OPTIMER) input/output voltage on pin

OPTIMER 0.4 +5 V

VISENSE voltage on pin ISENSE current limited 0.4 +5 V

Currents

Icc current on pin VCC <10% - +0.4 A

II(VINSENSE) input current on pin

VINSENSE 1+1mA

II(PROTECT) input current on pin

PROTECT 1+1mA

ICTRL current on pin CTRL 30 mA

IISENSE current on pin ISENSE 10 +1 mA

IDRIVER current on pin DRIVER <10% 0.4 +1 A

General

Ptot total power dissipation Tamb <75C-0.5W

Tstg storage temperature 55 +150 C

Tjjunction temperature 40 +150 C

ESD

VESD electrostatic discharge

voltage class 1

human body

model [1] -4000V

charged device

model -750V

Product data sheet Rev. 2 — 16 July 2013 11 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

9. Thermal characteristics

10. Characteristics

Ta ble 4. Th ermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from

junction to ambient in free air; JEDEC test

board 150 K/W

Rth(j-c) thermal resistance from

junction to case in free air; JEDEC test

board 79 K/W

Table 5. Characteristics

Tamb =25



C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Supply voltage management (pin VCC)

Vstartup start-up voltage 18.6 20.6 22.6 V

Vth(UVLO) undervoltage lockout

threshold voltage 11.2 12.2 13.2 V

Vclamp(VCC) cl amp voltage on pin

VCC activated during restart - Vstartup +1 - V

activated during latched

protection -V

rst(latch) +1 - V

Vhys hysteres is voltage Vstartup Vth(UVLO) 89 10V

ICC(startup) start-up supply current VCC <V

startup 510 15A

ICC(oper) operating supply current no load on pin DRIVER;

excluding opto current 0.4 0.5 0.6 mA

Vrst(latch) latched reset voltage 4 5 6 V

Input voltage sensing (pin VINSENSE)

Vstart(VINSENSE) start voltage on pin

VINSENSE detection level 0.89 0.94 0.99 V

Vdet(L)(VINSENSE) LOW-level detection

voltage on pin

VINSENSE

0.68 0.72 0.76 V

Vdet(H)(VINSENSE) HIGH-level detection

voltage on pin

VINSENSE

3.39 3.52 3.65 V

IO(VINSENSE) output current on pin

VINSENSE -20 - nA

Vclamp(VINSENSE) clamp voltage on pin

VINSENSE II(VINSENSE) =50A-5.2-V

Protection input (pin PROTECT)

Vdet(L)(PROTECT) LOW-level detection

voltage on pin

PROTECT

0.47 0.50 0.53 V

Vdet(H)(PROTECT) HIGH-level detection

voltage on pin

PROTECT

0.75 0.8 0.85 V

Product data sheet Rev. 2 — 16 July 2013 12 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

IO(PROTECT) output curren t on pin

PROTECT VPROTECT =V

low(PROTECT) 34 32 30 A

VPROTECT =V

high(PROTECT) 87 107 127 A

Vclamp(PROTECT) clamp voltage on pin

PROTECT II(PROTECT) =200A[1] 3.5 4.1 4.7 V

Peak current control (pin CTRL)

VCTRL voltage on pin CTRL for minimum flyback peak

current 1.5 1.8 2.1 V

for maximum flyback peak

current 3.4 3.9 4.3 V

Rint(CTRL) internal resistance on

pin CTRL 57 9k

IO(CTRL) output curren t on pin

CTRL VCTRL =1.4V 0.7 0.5 0.3 mA

VCTRL =3.7V 0.28 0.2 0.12 mA

Pulse width modulator

fosc oscillator frequency 62 66.5 71 kHz

fmod modulation frequency 210 280 350 Hz

fmod modulation frequency

variation 345kHz

max maximum duty cycle 68.5 72 79 

Vstart(red)f frequency reduction start

voltage pin CTRL 1.5 1.8 2.1 V

V(zero) zero duty cycle voltage pin CTRL 1.25 1.55 1.85 V

Overpower protection (pin OPTIMER)

Vprot(OPTIMER) protection voltage on pin

OPTIMER 2.4 2.5 2.6 V

Iprot(OPTIMER) protection cu rrent on p in

OPTIMER no overpower situation 100 150 200 A

overpower situation 12.2 10.7 9.2 A

Restart timer (pin OPTIMER)

Vrestart(OPTIMER) restart voltage on pin

OPTIMER low level 0.8 1.2 1.6 V

high level 4.1 4.5 4.9 V

Irestart(OPTIMER) restart current on pi n

OPTIMER charging OPTIMER

capacitor 127 107 87 A

discharging OPTIMER

capacitor 0.1 0 0.1 A

Current sense (pin ISENSE)

Vsense(max) maximum sense voltage V/t=50mV/s;

VVINSENSE =0.78V 0.48 0.51 0.54 V

V/t = 200 mV/s;

VVINSENSE =0.78V 0.50 0.53 0.56 V

Vth(sense)opp overpow er protection

sense threshold voltage 370 400 430 mV

VISENSE/t slope compensation

voltage on pin ISENSE V/t=50mV/s 1725 33mV/s

Table 5. Characteristics …continued

Tamb =25



C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 2 — 16 July 2013 13 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

[1] The clamp voltage on the PROTECT pin is lowered when the IC is in power-down (latched or restart protection).

11. Application information

A power supply with the TEA1733CT is a flyback converter operating in Continuous

conduction mode (See Figure 10).

Capacitor C5 buffers the IC supply voltage, which is powered via resistor R3 at start-up

and via the auxiliary winding during normal operation. Sense resistor R9 converts the

current throug h th e MOSF ET S1 into a voltage on pin ISENSE. The value of R9 defines

the maximum primary peak current on MOSFET S1. Resistor R7 reduces the peak

current to capacitor C5.

In the example shown in Figure 10, the PROTECT pin is used for OVP and OTP. Diode Z1

sets the OVP level to VCC = 25.8 V. The Negative Temperature Coefficient (NTC) resistor

R4 sets the OTP level. The VINSENSE pin is used for mains voltage detection and

resistors R1 and R2 set the start voltage to about 80 V (AC). Capacitor C4 defines the

overpower pr otection time at 60 ms.

Capacitor C4 and resistor R8 define the restart time at 0.5 s.

tleb leading edge bla nking

time 250 300 350 ns

Overpower compensation (pin VINSENSE and pin ISENSE)

Iopc(ISENSE) overpower

compensation current on

pin ISENSE

VVINSENSE =1V;

Vsense(max) >400mV -0.28-A

VVINSENSE=3 V;

Vsense(max) >400mV -1.7-A

Soft start (pin ISENSE)

Istart(soft) soft st art current 63 55 47 A

Vstart(soft) soft start voltage VCTRL = 4 V; enable

voltage -V

sense(max) -V

Rstart(soft) sof t start resistance 12 - - k

Driver (pin DRIVER)

Isource(DRIVER) source current on pin

DRIVER VDRIVER =2V - 0.3 0.25 A

Isink(DRIVER) sink current on pin

DRIVER VDRIVER =2V 0.25 0.3 - A

VDRIVER =10V 0.6 0.75 - A

VO(DRIVER)max maximum output voltage

on pin DRIVER 9 10.5 12 V

Temperature protection

Tpl(IC) IC protection level

temperature 130 140 150 C

Table 5. Characteristics …continued

Tamb =25



C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 2 — 16 July 2013 14 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

Resistor R6 and cap acitor C6 define th e sof t st art time. Resistor R5 prevent s the soft st art

capacitor C6 from being charged during normal operation caused by negative voltage

spikes across the current sense resistor R9.

Capacitor C3 reduces noise on the CTRL pin.

See the application note for more information (Ref. 1).

Fig 10. Typical application

aaa-001532

TEA1733CT

10 MΩ

82 kΩ

1 MΩ R4

200 kΩ

25 V C4

220 nF

2.2 MΩ

4.7 μF

0.25 Ω

1 nF

68 μF

100 nF

10 Ω

220 nF

22 kΩ

10 Ω

R10

DRIVER

GND

VCC

ISENSE

VINSENSE

PROTECT

CTRL

OPTIMER

470 Ω

Product data sheet Rev. 2 — 16 July 2013 15 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

12. Package outline

Fig 11. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-27

03-02-18

Product data sheet Rev. 2 — 16 July 2013 16 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

13. References

[1] AN10868 — GreenChip TEA1733 series fixed frequency flyback controller

Product data sheet Rev. 2 — 16 July 2013 17 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

14. Revision history

Table 6. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TEA1733CT v.2 20130716 Product data sheet - TEA1733CT v.1

Modifications: •Section 11 “Application information” has been updated.

•Section 13 “References” has been added.

TEA1733CT v.1 2012 0119 Product data sheet - -

Product data sheet Rev. 2 — 16 July 2013 18 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

15. Legal information

15.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict wit h the short data sheet, th e

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

15.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data fro m the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 16 July 2013 19 of 20

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims result ing from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specificat ions.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

15.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

GreenChip — is a trademark of NXP B.V.

16. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors TEA1733CT

GreenChip SMPS control IC

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 16 July 2013

Document identifier: TEA1733CT

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

17. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 5

7.1 General control. . . . . . . . . . . . . . . . . . . . . . . . . 5

7.2 Sta rt-up and UnderVoltage LockOut (UVLO) . . 5

7.3 Supply management. . . . . . . . . . . . . . . . . . . . . 6

7.4 Input voltage detecti on (VINSENSE pin) . . . . . 6

7.5 Protection input (PROTECT PIN). . . . . . . . . . . 6

7.6 Duty cycle control (CTRL pin). . . . . . . . . . . . . . 7

7.7 Slope compensation (CTRL pin). . . . . . . . . . . . 7

7.8 Overpower timer (OPTIMER pin) . . . . . . . . . . . 7

7.9 Current mode control (ISENSE pin) . . . . . . . . . 8

7.10 Overpower or high/low line compensation

(VINSENSE and ISENSE pins) . . . . . . . . . . . . 8

7.11 Soft start-up (ISENSE pin) . . . . . . . . . . . . . . . . 9

7.12 Low-power operation . . . . . . . . . . . . . . . . . . . . 9

7.13 Driver (DRIVER pin). . . . . . . . . . . . . . . . . . . . . 9

7.14 OverTemperature Protection (OTP) . . . . . . . . 10

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10

9 Thermal characteristics . . . . . . . . . . . . . . . . . 11

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11

11 Application information. . . . . . . . . . . . . . . . . . 13

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15

13 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17

15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18

15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18

15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

16 Contact information. . . . . . . . . . . . . . . . . . . . . 19

17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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