Innovative PowerTM - 1 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
Rev 9, 15-Nov-12
ACT8810
SYSTEM BLOCK DIAGRAM
Eight Channel ActivePathTM Power Management IC
FEATURES
ActivePathTM Li+ Charger with System Power
Selection
Six Integrated Regulators
1.3A High Efficiency Step-Do wn DC/DC
1.0A High Efficiency Step-Do wn DC/DC
0.55A High Efficiency Step-Down DC/DC
2×360mA Low Noise, High PSRR LDOs
30mA RTC LDO / Backup Battery Charger
I2CTM Serial Interface
Minimal External Components
Compatible with USB or AC-A dapter
Charging
5mm × 5mm, Thin-QFN (TQFN55-40) Packag e
Only 0.75mm Height
RoHS Compliant
APPLICATIONS
Personal Navigation Devices
Portable Media Players
Smart Phones
GENERAL DESCRIPTION
The patent-pending ACT8810 is a complete, cost
effective, highly-efficient ActivePMUTM power
management solution that is ideal for a wide range of
high performance portable handheld applications such
as personal navigation devices (PNDs). This device
integrates the ActivePathTM complete battery charging
and management system with six power supply
channels.
The ActivePath architecture automatically selects the
best available input supply for the system. If the
external input source is not present or the system load
current is more than the input source can provide, the
ActivePath supplies additional current from the battery
to the system. The charger is a complete, thermally-
regulated, stand-alone single-cell linear Li+ charger
that incorporates an internal power MOSFET.
REG1, REG2, and REG3 are three independent,
fixed-frequency, current-mode step-down DC/DC
converters that output 1.3A, 1.0A, and 0.55A,
respectively. REG4 and REG5 are high performance,
low-noise, low-dropout linear regulators that output
up to 360mA each. REG6 is a RTC LDO that
outputs up to 30mA for a real time clock. Finally, an
I2C serial interface provides programmability for the
DC/DC converters and LDOs.
The ACT8810 is available in a tiny 5mm x 5mm 40-
pin Thin-QFN package that is just 0.75mm thin.
OUT4
0.9V to 3.3V
Up to 360mA
OUT3
Adjustable, or
0.8V to 4.4V
Up to 0.55A
System
Control
OUT1
Adjustable, or
0.8V to 4.4V
Up to 1.3A
OUT5
0.9V to 3.3V
Up to 360mA
nIRQ
ON1
ON3
nPBIN
ActivePathTM
&
Single-Cell Li+
Battery Charger
Battery
Programmable
Up to 1A
VSYS
CHG_IN
CHGLEV
DCCC
OUT2
Adjustable, or
0.8V to 4.4V
Up to 1.0A
nSTAT1
ACIN
nRSTO
SCL
SDA
VSEL
ISET
OUT6
0.9V to 3.3V
Up to 30mA
REG6
RTC_LDO
ACT8810
REG1
Step-Down
DC/DC
REG2
Step-Down
DC/DC
REG3
Step-Down
DC/DC
REG4
LDO
REG5
LDO
ON2
TH
BTR
nSTAT0
PMU
PMU
PMU
TM
A
ctive
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 2 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
TABLE OF CONTENTS
GENERAL INFORMATION .......................................................................................... P. 01
Functional Block Diagram ...................................................................................................... p. 03
Ordering Information .............................................................................................................. p. 04
Pin Configuration .................................................................................................................... p. 04
Pin Descriptions ..................................................................................................................... p. 05
Absolute Maximum Ratings .................................................................................................... p. 07
SYSTEM MANAGEMENT ........................................................................................... P. 08
Register Descriptions ............................................................................................................. p. 08
I2C Interface Electrical Characteristics ................................................................................... p. 09
Electrical Characteristics ........................................................................................................ p. 10
Register Descriptions ............................................................................................................. p. 11
Typical Performance Characteristics ...................................................................................... p. 12
Functional Description ............................................................................................................ p. 13
STEP-DOWN DC/DC CONVERTERS .......................................................................... P. 17
Electrical Characteristics ........................................................................................................ p. 17
Typical Performance Characteristics ...................................................................................... p. 20
Register Descriptions ............................................................................................................. p. 22
Functional Description ............................................................................................................ p. 28
LOW-DROPOUT LINEAR REGULATORS .................................................................. P. 31
Electrical Characteristics ........................................................................................................ p. 31
Typical Performance Characteristics ...................................................................................... p. 33
Register Descriptions ............................................................................................................. p. 34
Functional Description ............................................................................................................ p. 36
RTC LOW-DROPOUT LINEAR REGULATOR ............................................................ P. 37
Electrical Characteristics ........................................................................................................ p. 37
Register Descriptions ............................................................................................................. p. 38
Functional Description ............................................................................................................ p. 39
ActivePathTM CHARGER ............................................................................................. P. 40
Electrical Characteristics ........................................................................................................ p. 40
Typical Performance Characteristics ...................................................................................... p. 42
Functional Description ............................................................................................................ p. 44
PACKAGE INFORMATION .......................................................................................... P. 53
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 3 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
REG2 REG1
REG3
FUNCTIONAL BLOCK DIAGRAM
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 4 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
PIN CONFIGURATION
ORDERING INFORMATION
TOP VIEW
Thin - QFN (TQFN55-40)
: All Active-Semi components are RoHS Compliant and with Pb-free plating unless specified differently. The term Pb-free means
semiconductor products that are in compliance with current RoHS (Restriction of Hazardous Substances) standards.
: To select VSTBYx as a output regulation voltage of REGx, tie VSEL to VSYS or a logic high.
: Refer to the Control Sequence section for more information.
PART
NUMBER VOUT1/VSTBY1 VOUT2/VSTBY2 V
OUT3/VSTBY3 V
OUT4 V
OUT5 V
OUT6 CONTROL SEQUENCE
ACT8810QJ1C1-T 3.3V/3.3V 1.1V/1.2V 1.2V/1.2V 1.2V 2.8V 3.3V Sequence A
ACT8810QJ213-T 1.2V/1.2V 1.8V/1.8V 1.0V/1.0V 3.3V 1.2V 3.0V Sequence B
ACT8810QJ3EB-T 3.3V/3.3V 1.2V/1.2V 1.8V/1.8V 1.5V 2.8V 3.3V Sequence C
ACT8810QJ420-T 3.3V/3.3V 1.8V/1.8V 1.1V/1.2V 1.2V 3.3V 2.5V Sequence D
ACT8810QJ50F-T 1.2V/1.2V 3.3V/3.3V 1.8V/1.8V 3.3V 1.8V 3.0V Sequence E
TH
DCCC
CHGLEV
ACIN
BAT
BAT
VSYS
VSYS
CHG_IN
ISET
ACT8810
BTR
OUT5
VP3
SW3
GP3
OUT3
nPBIN
SDA
SCL
ON3
OUT6
OUT1
VP1
GP1
GP2
SW2
VP2
OUT2
ON1
VSEL
SW1
nIRQ
nRSTO
REFBP
GA
ON2
nSTAT0
OUT4
INL
nSTAT1
EP
PACKAGING DETAILS PACKAGE PINS TEMPERATURE
RANGE PACKING
ACT8810QJ###-T TQFN55-40 40 -40°C to +85°C TAPE & REEL
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 5 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
1 TH
Temperature Sensing Input. Connect to battery thermistor. TH is pulled up with a 100µA current internally.
See the Battery Temperature Monitoring section for more information.
2 DCCC
Dynamic Charging Current Control. Connect a resistor to set the dynamic charging current control point.
A internal 100µA current source sets up a voltage that is used to compare with VSYS and dynamically
scale the charging current to maintain VSYS regulation. See the Dynamic Charge Current Control
section for more information.
3 BTR
Safety Timer Program Pin. The resistance between this pin and GA determines the timers timeout
values. See the Charging Safety Timers section for more information.
4 ACIN
AC Adaptor Detect. Detects presence of a wall adaptor and automatically adjusts the charge current
to the maximum charge current level. Do not leave ACIN floating.
5, 6 BAT Battery Charger Output. Connect this pin directly to the battery anode (+ terminal)
7, 8 VSYS System Output Pin. Bypass to GA with a 10µF or larger ceramic capacitor.
9 CHG_IN
Power Input for the Battery Charger. Bypass CHG_IN to GA with a capacitor placed as close to the
IC as possible. The battery charger are automatically enabled when a valid voltage is present on
CHG_IN. See the CHG_IN Bypass Capacitor Selection section for more information.
10 ISET
Charge Current Set. Program the maximum charge current by connecting a resistor (RISET) between
ISET and GA. See the Charger Current Programming section for more information.
11 VSEL
Step-Down DC/DCs Output Voltage Selection. Drive to logic low to select default output voltage.
Drive to logic high to select secondary output voltage. See the Output Voltage Selection Pin section
for more information.
12 ON1
Independent Enable Control Input for REG1. Drive ON1 to VSYS or to a logic high for normal
operation, drive to GA or a logic low to disable REG1. Do not leave ON1 floating.
13 OUT2
Output Feedback Sense for REG2. Connect this pin directly to the output node to connect the
internal feedback network to the output voltage.
14 VP2
Power Input for REG2. Bypass to GP2 with a high quality ceramic capacitor placed as close as
possible to the IC.
15 SW2 Switching Node Output for REG2. Connect this pin to the switching end of the inductor.
16 GP2
Power Ground for REG2. Connect GA, GP1, GP2 and GP3 together at a single point as close to the
IC as possible.
17 GP1
Power Ground for REG1. Connect GA, GP1, GP2 and GP3 together at a single point as close to the
IC as possible.
18 SW1 Switching Node Output for REG1. Connect this pin to the switching end of the inductor.
19 VP1
Power Input for REG1. Bypass to GP1 with a high quality ceramic capacitor placed as close as
possible to the IC.
20 OUT1
Output Feedback Sense for REG1. Connect this pin directly to the output node to connect the
internal feedback network to the output voltage.
21 ON3
Enable Control Input for REG3. Drive ON3 to a logic high for normal operation, drive to GA or a logic
low to disable REG3. Do not leave ON3 floating.
22 SCL Clock Input for I2C Serial Interface.
23 SDA Data Input for I2C Serial Interface. Data is read on the rising edge of SCL.
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 6 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
PIN DESCRIPTIONS CONT’D
PIN NAME DESCRIPTION
25 OUT3
Output Feedback Sense for REG3. Connect this pin directly to the output node to connect the
internal feedback network to the output voltage.
26 GP3
Power Ground for REG3. Connect GA, GP1, GP2, and GP3 together at a single point as close to
the IC as possible.
27 SW3 Switching Node Output for REG3. Connect this pin to the switching end of the inductor.
28 VP3
Power Input for REG3. Bypass to GP3 with a high quality ceramic capacitor placed as close as
possible to the IC.
29 OUT6 RTC LDO Output Voltage. Capable of delivering up to 30mA of output current.
30 OUT5
Output Voltage for REG5. Capable of delivering up to 360mA of output current. The output is
discharged to GA with 1k when disabled.
31 INL
Power Input for REG4, REG5, and REG6. Bypass to GA with a high quality ceramic capacitor
placed as close as possible to the IC.
32 OUT4
Output Voltage for REG4. Capable of delivering up to 360mA of output current. The output is
discharged to GA with 1k when disabled.
33 nSTAT0
Active-Low Open-Drain Charger Status Output. nSTAT0 has a 5mA (typ) current limit, allowing it to
directly drive an indicator LED without additional external components. To generate a logic-level
output, connect nSTAT0 to an appropriate supply voltage (typically VSYS) through a 10k or
greater pull-up resistor. See the Char ge Status Indication section for more information.
34 ON2
Independent Enable Control Input for REG2. Drive ON2 to a logic high for normal operation, drive to
GA or a logic low to disable REG2. Do not leave ON2 floating.
35 GA
Analog Ground. Connect GA directly to a quiet ground node. Connect GA, GP1, GP2, and GP3
together at a single point as close to the IC as possible.
36 REFBP
Reference Noise Bypass. Connect a 0.01F ceramic capacitor from REFBP to GA. This pin is
discharged to GA in shutdown.
38 nRSTO
Open-Drain Reset Output. nRSTO asserts low whenever REG1 is out of regulation, and remains low
for 260ms (typ) after REG1 reaches regulation.
39 nIRQ
Open-Drain Interrupt Output. nIRQ asserts any time nPBIN is asserted or an unmasked fault
condition exists. See the nIRQ Output section for more information.
40 CHGLEV
Charging State Select Input.
When ACIN = 0 charge current is internally set; Drive CHGLEV to a logic-high for high-current USB
charging mode (maximum charge current is 500mA), drive CHGLEV to a logic-low for low-current
USB charging mode (maximum charge current is 100mA).
When ACIN = 1 charge current is externally set by RISET; Drive CHGLEV to a logic-high to for high-
current charging mode (ISET (mA) = KISET × 1V/(RISET (k) +0.031) where KISET = 628), drive
CHGLEV to a logic-low for low-current charging mode (ISET (mA) = KISET × 1V/(RISET (k) + 0.031)
where KISET = 314). Do not leave CHGLEV floating.
EP EP Exposed Pad. Must be soldered to ground on the PCB.
24 nPBIN
Master Enable Input. Drive nPBIN to GA through a 100k resistor to enable the IC, drive nPBIN
directly to GA to assert a Hard-Reset condition. Refer to the System Startup & Shutdown and
Control Sequence sections for more information. nPBIN is internally pulled up to VSYS through a
50k resistor.
37 nSTAT1
Active-Low Open-Drain Charger Status Output. nSTAT1 has a 5mA (typ) current limit, allowing it to
directly drive an indicator LED without additional external components. To generate a logic-level
output, connect nSTAT1 to an appropriate supply voltage (typically VSYS) through a 10k or
greater pull-up resistor. See the Char ge Status Indication section for more information.
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 7 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
ABSOLUTE MAXIMUM RATINGS
PARAMETER VALUE UNIT
CHG_IN to GA
t < 1ms and duty cycle <1%
Steady State
-0.3 to +18
-0.3 to +14
V
V
VP1 to GP1, VP2 to GP2, VP3 to GP3 -0.3 to +6 V
BAT, VSYS, INL to GA -0.3 to +6 V
SW1, OUT1 to GP1 -0.3 to (VVP1 +0.3) V
SW2, OUT2 to GP2 -0.3 to (VVP2 +0.3) V
SW3, OUT3 to GP3 -0.3 to (VVP3 +0.3) V
Operating Ambient Temperature -40 to 85 °C
Maximum Junction Temperature 125 °C
Maximum Power Dissipation
TQFN55-40 (Thermal Resistance JA = 30oC/W) 2.7 W
Storage Temperature -65 to 150 °C
Lead Temperature (Soldering, 10 sec) 300 °C
ON1, ON2, ON3, ISET, ACIN, VSEL, DCCC, CHGLEV, TH, SCL, SDA, REFBP, nIRQ,
nRSTO, nSTAT0, nSTAT1, BTR, nPBIN to GA -0.3 to +6 V
OUT4, OUT5, OUT6 to GA -0.3 to (VINL +0.3) V
: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may
affect device reliability.
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 8 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
KEY:
R: Read-Only bits. No Default Assigned.
V: Default Values Depend on Voltage Option. Default Values May Vary.
Note: Addresses other than those specified in Table 1 may be used for factory settings. Do not access any registers other than those
specified in Table 1.
REGISTER DESCRIPTIONS
Table 1:
Global Register Map
OUTPUT ADDRESS DATA (DEFAULT VALUE)
HEX A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
SYS 06h 0 0 0 0 0 1 1 0 R R R 0 R R 1 R
REG1 10h 0 0 0 1 0 0 0 0 R R V V V V V V
REG1 11h 0 0 0 1 0 0 0 1 R R R R R R R R
REG1 12h 0 0 0 1 0 0 1 0 R R R R R 0 R 1
REG1 13h 0 0 0 1 0 0 1 1 R V V V V V V V
REG2 20h 0 0 1 0 0 0 0 0 R R V V V V V V
REG2 21h 0 0 1 0 0 0 0 1 R R R R R R R R
REG2 22h 0 0 1 0 0 0 1 0 R R R R R 0 R 1
REG2 23h 0 0 1 0 0 0 1 1 R V V V V V V V
REG3 30h 0 0 1 1 0 0 0 0 R R V V V V V V
REG3 31h 0 0 1 1 0 0 0 1 R R R R R R R R
REG3 32h 0 0 1 1 0 0 1 0 R R R R R 0 R 1
REG3 33h 0 0 1 1 0 0 1 1 R V V V V V V V
REG4 40h 0 1 0 0 0 0 0 0 1 R 1 V V V V V
REG4 43h 0 1 0 0 0 0 1 1 R R R R R R 0 R
REG5 41h 0 1 0 0 0 0 0 1 1 R 1 V V V V V
REG6 42h 0 1 0 0 0 0 1 0 R R R V V V V V
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 9 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
I2C INTERFACE ELECTRICAL CHARACTERISTICS
Figure 1:
I2C Serial Bus Timing
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
SCL
SDA IN
SDA OUT
tSP
tHD
tST tSU
tSCL
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SCL, SDA Low Input Voltage VVSYS = 2.6V to 5.5V, TA = -40ºC to 85ºC 0.35 V
SCL, SDA High Input Voltage VVSYS = 2.6V to 5.5V, TA = -40ºC to 85ºC 1.55 V
SCL, SDA Leakage Current 1 µA
SDA Low Output Voltage IOL = 5mA 0.3 V
SCL Clock Period, tSCL 2.5 µs
SDA Data In Setup Time to SCL High, tSU 100 ns
SDA Data Out Hold Time after SCL Low, tHD 300 ns
SDA Data Low Setup Time to SCL Low, tST Start Condition 100 ns
SDA Data High Hold Time after Clock High, tSP Stop Condition 100 ns
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 10 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
ELECTRICAL CHARACTERISTICS
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input Voltage Range 2.6 5.5 V
UVLO Threshold Voltage VSYS Rising 2.35 2.5 2.6 V
UVLO Hysteresis VSYS Falling 100 mV
VSYS Supply Current ONx = VSYS 70 µA
VSYS Shutdown Current ONx = GA, Not Charging 30 µA
Voltage Reference 1.24 1.25 1.26 V
Oscillator Frequency 1.35 1.6 1.85 MHz
Logic High Input Voltage ON1, ON2, ON3, VSEL 1.4 V
Logic Low Input Voltage ON1, ON2, ON3, VSEL 0.4 V
Leakage Current VON1 = VON2 = VON3 = VVSEL = VnIRQ = VnRSTO = 4V 1 µA
nPBIN Internal Pull-up Resistance 50 k
Low Level Output Voltage nIRQ, nRSTO. Sinking 10mA 0.3 V
Thermal Shutdown Temperature Temperature Rising 160 °C
Thermal Shutdown Hysteresis Temperature Decreasing 20 °C
nRSTO Delay 260 ms
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 11 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS
Note: See Table 1 for default register settings.
Table 2:
Control Register Map
ADDRESS DATA
D7 D6 D5 D4 D3 D2 D1 D0
06h R R R W/E R R nPBMASK PBSTAT
ADDRESS NAME BIT ACCESS FUNCTION DESCRIPTION
06h PBSTAT [0] R/W Push Button Status
0 De-assert
1 Asserted
06h nPBMASK [1] R/W Push Button Interrupt Mask Option
0 Masked
1 Not Mask
06h [3:2] R READ ONLY
06h [4] W/E
06h [7:5] R READ ONLY
WRITE-EXACT
Table 3:
Control Register Bit De scriptions
R: Read-Only bits. Default Values May Vary.
W/E: Write-Exact bits. Read/Write bits which must be written exactly as specified in Table 1.
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 12 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
TYPICAL PERFORMANCE CHARACTERISTICS
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
Shutdown Current (µA)
Temperature (°C)
26
85
20
Shutdown Current vs. Temperature
ACT8810-002
-20 0 20 40 60
24
22
Oscillator Frequency vs. Temperature
Oscillator Frequency (MHz)
Temperature (°C)
1.71
1.50
ACT8810-001
1.68
1.65
1.62
1.59
1.56
1.53
85 -20 0 20 40 60
ON1 = ON2 = ON3 = GA
VVSYS = 4.2V
VVSYS = 3.6V
VVSYS = 3.2V
-40
-40
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 13 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
FUNCTIONAL DESCRIPTION
General Description
The ACT8810 offers a wide array of system
management functions that allow it to be configured
for optimal performance in a wide range of
applications.
I2C Serial Interface
At the core of the ACT8810’s flexible architecture is
an I2C interface that permits optional programming
capability to enhance overall system performance.
To ensure compatibility with a wide range of system
processors, the ACT8810 uses standard I2C
commands; I2C write-byte commands are used to
program the ACT8810, and I2C read-byte
commands are used to read the ACT8810’s internal
registers. The ACT8810 always operates as a slave
device, and is addressed using a 7-bit slave
address followed by an eighth bit, which indicates
whether the transaction is a read-operation or a
write-operation, [1011010x].
SDA is a bi-directional data line and SCL is a clock
input. The master initiates a transaction by issuing a
START condition, defined by SDA transitioning from
high to low while SCL is high. Data is transferred in
8-bit packets, beginning with the MSB, and is
clocked-in on the rising edge of SCL. Each packet
of data is followed by an “Acknowledge” (ACK) bit,
used to confirm that the data was transmitted
successfully.
For more information regarding the I2C 2-wire serial
interface, go to the NXP website: http://www.nxp.com
System Startup and Shutdown
Startup Sequence
The ACT8810 features a flexible enable
architecture that allows it to support a variety of
push-button enable/disable schemes. Although
other startup routines are possible, ACT8810
provides three typical startup and shutdown
processes proceed as shown in Control Sequence
section.
Shutdown Sequence
Once a successful power-up routine is completed, a
shutdown process may be initiated by asserting
nPBIN a second time, typically as the result of
pressing the push-button. Although the shutdown
process is completely software-controlled, a typical
shutdown sequence proceeds as follows: The
second assertion of nPBIN asserts nPBIN and
interrupts the microprocessor, which then initiates
an interrupt service routine to reveal that nPBIN has
been asserted. If there is no input to the charger,
then the microprocessor disables each regulator
according to the sequencing requirements of the
system, then the system will finally be disabled
when each of ON1, ON2, and ON3 have been de-
asserted.
nPBIN Input
ACT8810's nPBIN pin is a dual-function pin,
combining system enable/disable control with a
hardware reset function. Refering to Figure 2, the
two pin functions are obtained by asserting this pin
low, either through a direct connection or through a
100k resistor, as described below.
In most applications, nPBIN will be driven through a
100k resistor. When driven in this way, nPBIN
initiates system startup or shutdown, as described
in the System Startup and Shutdown section.
When a hardware-reset function is desired, nPBIN
may also be driven directly to GA. In this case,
nRSTO is immediately asserted low and remains
low until nPBIN is de-asserted and the reset timeout
period expires. This provides a hardware-reset
function, allowing the system to be manually reset if
the system processor locks up.
Although a typical application will use momentary
switches to drive nPBIN, as shown in Figure 2,
nPBIN may also be driven by other sources, such
as a GPIO or other logic output.
Figure 2:
nPBIN Input
Enable /Disable Inpu ts (ON1, ON2 and ON3)
The ACT8810 provides three manual
enable/disable inputs, ON1, ON2 and ON3, which
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 14 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
enable and disable REG1, REG2, and REG3,
respectively. Once the system is enabled, the
system will remain enabled until all of ON1, ON2,
and ON3 have been de-asserted. See the Control
Sequence section for more information.
Power-On Reset Output
nRSTO is an open-drain output which asserts low
upon startup or when nPBIN is driven directly to
GA, and remains asserted low until the 260ms
(default) power-on reset timer has expired. Connect
a 10k or greater pull-up resistor from nRSTO to an
appropriate voltage supply.
nIRQ Output
nIRQ is an open-drain output that asserts low any
time startup or an unmasked fault condition exists.
When asserted, nIRQ remains low until the
microprocessor polls the ACT8810's I2C interface.
The ACT8810 supports a variety of other fault
conditions, which may each be optionally unmasked
via the I2C interface. For more information about the
available fault conditions, refer to the appropriate
sections of this datasheet.
Connect a pull-up resistor from nIRQ to an
appropriate voltage supply. nIRQ is typically used to
drive the interrupt input of the system processor,
and is useful in a variety of software-controlled
enable/disable control routines.
Thermal Shutdown
The ACT8810 integrates thermal shutdown
protection circuitry to prevent damage resulting
from excessive thermal stress, as may be
encountered under fault conditions. This circuitry
disables all regulators if the ACT8810 die
temperature exceeds 160°C, and prevents the
regulators from being enabled until the IC
temperature drops by 20°C (typ).
Control Sequence
Sequence A
The ACT8810QJ1## which is set with “sequence
A“, has a system startup is initiated whenever the
following conditions occurs:
1) nPBIN is pushed low via 100k resistance,
When ever this condition exists, the
ACT8810QJ1## begins its system startup
procedure by enabling REG1. When REG1 reaches
94% of its final regulation voltage, ACT8810QJ1##
automatically turns on REG4 and REG5 and
nRSTO is asserted low, holding the microprocessor
in reset for a user-selectable reset period of 260ms.
If VOUT1 is within 6% of its regulation voltage when
the reset timer expires, the nRSTO is de-asserted,
and the microprocessor can begin its power-up
sequence. Once the power-up routine is
successfully completed, the system remains
enabled after the push-button is released as long as
the microprocessor asserts any one of ON1, ON2
or ON3, and REG4, REG5 may be enabled or
disabled via the I2C interface.
This start-up procedure requires that the
pushbutton be held until the microprocessor
assumes control (by asserting any one of ON1,
ON2, and ON3), providing protection against
inadvertent momentary assertions of the
pushbutton. If desired, longer “push-and-hold” times
can be easily implemented by simply adding an
additional time delay before asserting ON1, ON2, or
ON3. If the microprocessor is unable to complete its
power-up routine successfully before the user lets
go of the push-button, the ACT8810QJ1##
automatically shuts itself down.
Figure 3:
Sequence A
FUNCTIONAL DESCRIPTION CONT’D
260ms
94% of VOUT1
nPBIN
System Enable
OUT1
OUT2, OUT3
Reset time Enable
nRSTO
First Push
Button
Assert
Power-Hold
Second Push
Button
Release
Button
System
Shutdown
ON1, ON2, ON3
OUT4, OUT5
nIRQ
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 15 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
System
Shutdown
260ms
94% of VOUT1
nPBIN
System Enable
OUT1
Enable Qualification
OUT2, OUT3
Reset time Enable
nRSTO
~100ms
First Push
Button
Assert
Power-Hold
Second Push
Button
Release
Button
ON1, ON2, ON3
OUT4, OUT5
REG4.ON[ ],
REG5.ON[ ]
nIRQ
260ms
94% of VOUT1
nPBIN
System Enable
OUT1
Enable Qualification
OUT2, OUT3
Reset time Enable
nRSTO
~100ms
First Push
Button
Assert
Power-Hold
Second Push
Button
Release
Button
System
Shutdown
ON1, ON2, ON3
OUT4, OUT5
nIRQ
Sequence B
The ACT8810QJ2## which is set with “sequence
B“, has a system startup is initiated whenever the
following conditions occurs:
1) nPBIN is pushed low via 100k resistance,
When ever this condition exists, the
ACT8810QJ2## begins its system startup
procedure by enabling REG1. When REG1 reaches
94% of its final regulation voltage, ACT8810QJ2##
automatically turns on REG2 and REG3 and
nRSTO is asserted low, holding the microprocessor
in reset for a user-selectable reset period of 260ms.
If VOUT1 is within 6% of its regulation voltage when
the reset timer expires, the nRSTO is de-asserted,
and the microprocessor can begin its power-up
sequence. Once the power-up routine is
successfully completed, the system remains
enabled after the push-button is released as long as
the microprocessor asserts any one of ON1, ON2
or ON3. REG4 and REG5 may be enabled if the
microprocessor sets REG4.ON[ ] and REG5.ON[ ]
to 1 via the I2C interface. In other case, REG4 and
REG5 are disable.
This start-up procedure requires that the
pushbutton be held until the microprocessor
assumes control (by asserting any one of ON1,
ON2, and ON3), providing protection against
inadvertent momentary assertions of the
pushbutton. If desired, longer “push-and-hold” times
can be easily implemented by simply adding an
additional time delay before asserting ON1, ON2, or
ON3. If the microprocessor is unable to complete its
power-up routine successfully before the user lets
go of the push-button, the ACT8810QJ2##
automatically shuts itself down.
Figure 4:
Sequence B
Sequence C
The ACT8810QJ3## which is set with “sequence
C“, has a system startup is initiated whenever the
following conditions occurs:
1) nPBIN is pushed low via 100k resistance,
When ever this condition exists, the
ACT8810QJ3## begins its system startup
procedure by enabling REG1. When REG1 reaches
94% of its final regulation voltage, ACT8810QJ3##
automatically turns on REG2, REG3, REG4, REG5
and nRSTO is asserted low, holding the
microprocessor in reset for a user-selectable reset
period of 260ms. If VOUT1 is within 6% of its
regulation voltage when the reset timer expires, the
nRSTO is de-asserted, and the microprocessor can
begin its power-up sequence. Once the power-up
routine is successfully completed, the system
remains enabled after the push-button is released
as long as the microprocessor asserts any one of
ON1, ON2 or ON3, and REG4, REG5 may be
enabled or disabled via the I2C interface.
This start-up procedure requires that the
pushbutton be held until the microprocessor
assumes control (by asserting any one of ON1,
ON2, and ON3), providing protection against
inadvertent momentary assertions of the
pushbutton. If desired, longer “push-and-hold” times
can be easily implemented by simply adding an
additional time delay before asserting ON1, ON2, or
ON3. If the microprocessor is unable to complete its
power-up routine successfully before the user lets
go of the push-button, the ACT8810QJ3##
automatically shuts itself down.
Figure 5:
Sequence C
SYSTEM MANAGEMENT
ACT8810
Rev 9, 15-Nov-12
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ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
Sequence D
The ACT8810QJ4## which is set with “sequence
D“, has a system startup is initiated whenever the
following condition occurs:
1) nPBIN is pushed low via 100k resistance,
When ever this condition exists, the
ACT8810QJ4## begins its system startup
procedure by enabling REG1, When REG1 reaches
94% of its final regulation voltage, ACT8810QJ4##
automatically turns on REG2, REG4, REG5 and
nRSTO is asserted low, holding the microprocessor
in reset for a user-selectable reset period of 260ms.
when the reset timer expires, the nRSTO is de-
asserted and the microprocessor can begin its
power-up sequence. Once the power-up routine is
successfully completed, the system remains
enabled after the push-button is released as long as
the microprocessor asserts any one of ON1, ON2
or ON3, holding REG1, REG2, REG4, REG5, and
enabling REG3. And any regulators could be
enabled or disabled via the I2C interface.
This start-up procedure requires that the
pushbutton be held until the microprocessor
assumes control (by asserting any one of ON1,
ON2, and ON3), providing protection against
inadvertent momentary assertions of the
pushbutton. If desired, longer “push-and-hold” times
can be easily implemented by simply adding an
additional time delay before asserting ON1, ON2, or
ON3. If the microprocessor is unable to complete its
power-up routine successfully before the user lets
go of the push-button, the ACT8810QJ4##
automatically shuts itself down.
Figure 6:
Sequence D
Sequence E
The ACT8810QJ5## which is set with “sequence
E“, has a system startup is initiated whenever the
following conditions occurs:
1) A valid input voltage is present at VIN, or
2) nPBIN is pushed low via 100k resistance,
When ever this condition exists, the
ACT8810QJ5## begins its system startup
procedure by enabling REG1. When REG1 reaches
94% of its final regulation voltage, ACT8810QJ5##
automatically turns on REG2, REG3, REG4, REG5
and nRSTO is asserted low, holding the
microprocessor in reset for a user-selectable reset
period of 260ms. If VOUT1 is within 6% of its
regulation voltage when the reset timer expires, the
nRSTO is de-asserted, and the microprocessor can
begin its power-up sequence. Once the power-up
routine is successfully completed, the system
remains enabled after the push-button is released
as long as the microprocessor asserts any one of
ON1, ON2 or ON3, and REG4, REG5 may be
enabled or disabled via the I2C interface.
This start-up procedure requires that the
pushbutton be held until the microprocessor
assumes control (by asserting any one of ON1,
ON2, and ON3), providing protection against
inadvertent momentary assertions of the
pushbutton. If desired, longer “push-and-hold” times
can be easily implemented by simply adding an
additional time delay before asserting ON1, ON2, or
ON3. If the microprocessor is unable to complete its
power-up routine successfully before the user lets
go of the push-button or un-plug charger input, the
ACT8810QJ5## automatically shuts itself down.
Figure 7:
Sequence E
260ms
nPBIN
System Enable
OUT1
OUT3
Reset time Enable
nRSTO
First Push
Button
Assert
Power-Hold
Second Push
Button
Release
Button
System
Shutdown
ON1, ON2, ON3
nIRQ
OUT2, OUT4,
OUT5
94% of VOUT1
260ms
94% of VOUT1
nPBIN
System Enable
OUT1
Enable Qualification
Reset time Enable
nRSTO
~100ms
First Push
Button
Assert
Power-Hold
Second Push
Button
Release
Button
System
Shutdown
ON1, ON2, ON3
OUT2, OUT3
nIRQ
CHG_IN
OR
OUT4, OUT5
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 17 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
: VNOM1 refers to the nominal output voltage level for VOUT1 as defined by the Ordering Information section.
ELECTRICAL CHARACTERISTICS (REG1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VP1 Operating Voltage Range 2.9 5.5 V
VP1 UVLO Threshold Input Voltage Rising 2.7 2.8 2.9 V
VP1 UVLO Hysteresis Input Voltage Falling 85 mV
Quiescent Supply Current 130 200 µA
Shutdown Supply Current REG1 is disabled, VVP1 = 4.2V 0.1 1 µA
Output Voltage Accuracy
VNOM1 < 1.5V, IOUT1 = 10mA -2.1% VNOM1
+2.1%
VNOM1 1.5V, IOUT1 = 10mA -1.5% VNOM1
+1.5%
Line Regulation VVP1 = Max(VNOM1 + 1V, 3.2V) to 5.5V 0.15 %/V
Load Regulation IOUT1 = 10mA to 1.3A 0.0017 %/mA
Current Limit 1.4 1.8 A
Oscillator Frequency
VOUT1 20% of VNOM1 1.35 1.6 1.85 MHz
VOUT1 = 0V 540 kHz
PMOS On-Resistance ISW1 = -100mA 0.16 0.24
NMOS On-Resistance ISW1 = 100mA 0.16 0.24
SW1 Leakage Current VVP1 = 5.5V, VSW1 = 5.5V or 0V 1 µA
Power Good Threshold
94 %VNOM1
Minimum On-Time 60 ns
V
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 18 - www.active-semi.com
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I2CTM is a trademark of NXP.
: VNOM2 refers to the nominal output voltage level for VOUT2 as defined by the Ordering Information section.
ELECTRICAL CHARACTERISTICS (REG2)
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VP2 Operating Voltage Range 2.9 5.5 V
VP2 UVLO Threshold Input Voltage Rising 2.7 2.8 2.9 V
VP2 UVLO Hysteresis Input Voltage Falling 85 mV
Quiescent Supply Current 130 200 µA
Shutdown Supply Current REG2 Disabled, VVP2 = 4.2V 0.1 1 µA
Output Voltage Regulation Accuracy
VNOM2 < 1.5V, IOUT2 = 10mA -2.1% VNOM2
+2.1%
VNOM2 1.5V, IOUT2 = 10mA -1.5% VNOM2
+1.5%
Line Regulation VVP2 = Max(VNOM2 + 1V, 3.2V) to 5.5V 0.15 %/V
Load Regulation IOUT2 = 10mA to 1.0A 0.0017 %/mA
Current Limit 1.15 1.45 A
Oscillator Frequency
VOUT2 20% of VNOM2 1.35 1.6 1.85 MHz
VOUT2 = 0V 540 kHz
PMOS On-Resistance ISW2 = -100mA 0.25 0.38
NMOS On-Resistance ISW2 = 100mA 0.17 0.26
SW2 Leakage Current VVP2 = 5.5V, VSW2 = 5.5V or 0V 1 µA
Power Good Threshold
94 %VNOM2
Minimum On-Time 60 ns
V
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
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ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
: VNOM3 refers to the nominal output voltage level for VOUT3 as defined by the Ordering Information section.
ELECTRICAL CHARACTERISTICS (REG3)
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VP3 Operating Voltage Range 2.9 5.5 V
VP3 UVLO Threshold Input Voltage Rising 2.7 2.8 2.9 V
VP3 UVLO Hysteresis Input Voltage Falling 85 mV
Quiescent Supply Current 130 200 µA
Shutdown Supply Current REG3 Disabled, VVP3 = 4.2V 0.1 1 µA
Output Voltage Regulation Accuracy
VNOM3 < 1.5V, IOUT3 = 10mA -2.1% VNOM3
+2.1%
VNOM3 1.5V, IOUT3 = 10mA -1.5% VNOM3
+1.5%
Line Regulation VVP3 = Max(VNOM3 + 1V, 3.2V) to 5.5V 0.15 %/V
Load Regulation IOUT3 = 10mA to 550mA 0.0017 %/mA
Current Limit 0.55 0.7 A
Oscillator Frequency
VOUT3 20% of VNOM3 1.35 1.6 1.85 MHz
VOUT3 = 0V 540 kHz
PMOS On-Resistance ISW3 = -100mA 0.46 0.69
NMOS On-Resistance ISW3 = 100mA 0.3 0.55
SW3 Leakage Current VVP3 = 5.5V, VSW3 = 5.5V or 0V 1 µA
Power Good Threshold
94 %VNOM3
Minimum On-Time 60 ns
V
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
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I2CTM is a trademark of NXP.
VP2 Input Voltage (V)
(ACT8810QJ3EB, VVP1 = VVP2 = 3.6V, L = 3.3µH, CVP1 = CVP2 = 4.7F, COUT1 = 22µF, COUT2 = 10F, TA = 25°C, unless otherwise specified.)
TYPICAL PERFORMANCE CHARACTERISTICS
REG1 RDSON vs. VP1 Input Voltage
REG1 RDSON (m)
VP1 Input Voltage (V)
0
ACT8810-007
6.5 6.0 5.5 5.0 4.5 4.0 3.5
0.18
0.16
0.12
0.08
0.04
PMOS
NMOS
REG2 RDSON vs. VP2 Input Voltage
ACT8810-008
REG2 RDSON (m)
0
0.5
0.3
0.4
0.2
0.1
4.5
4.0
3.5
3.0
PMOS
NMOS
REG2 Efficiency vs. Load Current
REG2 Efficiency (%)
100
1000
Load Current (mA)
ACT8810-004
80
60
40
20
10 100
VOUT2 = 1.2V
0
1
REG1 Efficiency vs. Load Current
REG1 Efficiency (%)
100
0
2 2000
Load Current (mA)
ACT8810-003
80
60
40
20
20 200
VOUT1 = 3.3V
VVSYS = 4.2V
VVSYS = 3.6V
0.14
0.10
0.06
0.02
VVSYS = 4.6V
VVSYS = 5.2V VVSYS = 3.6V
VVSYS = 4.2V
VVSYS = 4.6V
VVSYS = 5.2V
5.0 5.5 6.0
OUT1 Regulation Voltage vs. Temperature
OUT2 Regulation Voltage (V)
3.318
3.282
Temperature (°C)
-20 -40 0 20 40 60
3.315
3.312
3.309
3.306
3.303
3.300
3.297
3.294
3.291
3.288
3.285
85
IOUT1 = 35mA
ACT8810-005
OUT2 Regulation Voltage vs. Temperature
OUT3 Regulation Voltage (V)
1.212
1.188
Temperature (°C)
ACT8810-006
-20 -40 0 20 40 60
1.208
1.204
1.200
1.196
1.192
IOUT2 = 35mA
85
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
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Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
(ACT8810QJ3EB, VVP3 = 3.6V, L = 3.3µH, CVP3 = 4.7F, COUT3 = 10F, TA = 25°C, unless otherwise specified.)
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D
OUT3 Regulation Voltage vs. Tempera-
OUT1 Regulation Voltage (V)
1.812
1.788
Temperature (°C)
ACT8810-010
-20 -40 0 20 40 60
1.808
1.804
1.800
1.796
1.792
IOUT3 = 35mA
85
REG3 RDSON (m)
VP3 Input Voltage (V)
6.0
0.1
REG3 RDSON vs. VP3 Input Voltage
ACT8810-011
0.45
0.35
0.25
0.50
0.40
0.30
0.20
0.15
5.0 4.5 4.0
3.5 3.0
PMOS
NMOS
REG3 Efficiency vs. Load Current
REG3 Efficiency (%)
1000
Load Current (mA)
ACT8810-009
80
10 100
VVSYS = 4.2V
VOUT3 = 1.2V
60
40
20
1
0
100
VVSYS = 3.6V
VVSYS = 4.6V
5.5
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
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ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS
ADDRESS DATA
D7 D6 D5 D4 D3 D2 D1 D0
10h R R
11h R R R R R R R R
12h R R R R R nFLTMSK OK ON
13h R VRANGE VSET0
VSET1
Note: See Table 1 for default register settings.
Table 4:
REG1 Control Register Map
Table 5:
REG1 Control Register Bit De scriptions
R: Read-Only bits. Default Values May Vary.
ADDRESS NAME BIT ACCESS FUNCTION DESCRIPTION
10h VSET1 [5:0] R/W REG1 Standby Output Voltage Selection See Table 4
10h [7:6] R READ ONLY
11h [7:0] R READ ONLY
12h ON [0] R/W REG1 Enable
0 REG1 Disable
1 REG1 Enable
12h OK [1] R REG1 Power-OK
0 Output is not OK
1 Output is OK
nFLTMSK [2] R/W REG1 Output Voltage Fault Mask Option
0 Masked
1 Not Mask
12h [7:3] R READ ONLY
13h VSET0 [5:0] R/W REG1 Output Voltage Selection See Table 4
13h VRANGE [6] R/W REG1 Voltage Range
0 Min VOUT = 0.8V
1 Min VOUT = 1.25V
13h [7] R READ ONLY
12h
STEP-DOWN DC/DC CONVERTERS
ACT8810
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I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS CONT’D
Table 6:
REG1/VSETx[ ] Output Voltage Setting
REG1/VSETx[3:0]
REG1/VSETx[5:4]
REG1/VRANGE[ ] = [0] REG1/VRANGE[ ] = [1]
00 01 10 11 00 01 10 11
0000 Adjustable 1.025 1.425 1.825 Adjustable 2.050 2.850 3.650
0001 0.800 1.050 1.450 1.850 1.300 2.100 2.900 3.700
0010 0.800 1.075 1.480 1.875 1.350 2.150 2.950 3.750
0011 0.800 1.100 1.500 1.900 1.400 2.200 3.000 3.800
0100 0.800 1.125 1.525 1.925 1.450 2.250 3.050 3.850
0101 0.800 1.150 1.550 1.950 1.500 2.300 3.100 3.900
0110 0.800 1.175 1.575 1.975 1.550 2.350 3.150 3.950
0111 0.800 1.200 1.600 2.000 1.600 2.400 3.200 4.000
1000 0.825 1.225 1.625 2.025 1.650 2.450 3.250 4.050
1001 0.850 1.250 1.650 2.050 1.700 2.500 3.300 4.100
1010 0.875 1.275 1.675 2.075 1.750 2.550 3.350 4.150
1011 0.900 1.300 1.700 2.100 1.800 2.600 3.400 4.200
1100 0.925 1.325 1.725 2.125 1.850 2.650 3.450 4.250
1101 0.950 1.350 1.750 2.150 1.900 2.700 3.500 4.300
1110 0.975 1.375 1.775 2.175 1.950 2.750 3.550 4.350
1111 1.000 1.400 1.800 2.200 2.000 2.800 3.600 4.400
: Care must be taken when adjusting the VRANGE[ ] selection at address 13h bit-6 to avoid undesired output voltage selections. The
VRANGE bit allows selection of the two output voltage ranges available for REG1, REG2 and REG3 (VRANGE = 0 – VOUT range 0.8V
to 2.2V, VRANGE = 1 – VOUT range 1.3V to 4.4V). It is recommended that the user first establishes if the new VOUT voltage is within the
current selected voltage range (selected by VRANGE) prior to changing the value of the VRANGE bit.
: Refer to the Output Voltage Programming section for more information.
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 24 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS
ADDRESS DATA
D7 D6 D5 D4 D3 D2 D1 D0
20h R R
21h R R R R R R R R
22h R R R R R nFLTMSK OK ON
23h R VRANGE VSET0
VSET1
Note: See Table 1 for default register settings.
Table 7:
REG2 Control Register Map
Table 8:
REG2 Control Register Bit De scriptions
R: Read-Only bits. Default Values May Vary.
ADDRESS NAME BIT ACCESS FUNCTION DESCRIPTION
20h VSET1 [5:0] R/W REG2 Standby Output Voltage Selection See Table 7
20h [7:6] R READ ONLY
21h [7:0] R READ ONLY
22h ON [0] R/W REG2 Enable
0 REG2 Disable
1 REG2 Enable
22h OK [1] R REG2 Power-OK
0 Output is not OK
1 Output is OK
nFLTMSK [2] R/W REG2 Output Voltage Fault Mask Option
0 Masked
1 Not Mask
22h [7:3] R READ ONLY
23h VSET0 [5:0] R/W REG2 Output Voltage Selection See Table 7
23h VRANGE [6] R/W REG2 Voltage Range
0 Min VOUT = 0.8V
1 Min VOUT = 1.25V
23h [7] R READ ONLY
22h
STEP-DOWN DC/DC CONVERTERS
ACT8810
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I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS CONT’D
Table 9:
REG2/VSETx[ ] Output Voltage Setting
REG2/VSETx[3:0]
REG2/VSETx[5:4]
REG2/VRANGE[ ] = [0] REG2/VRANGE[ ] = [1]
00 01 10 11 00 01 10 11
0000 Adjustable 1.025 1.425 1.825 Adjustable 2.050 2.850 3.650
0001 0.800 1.050 1.450 1.850 1.300 2.100 2.900 3.700
0010 0.800 1.075 1.480 1.875 1.350 2.150 2.950 3.750
0011 0.800 1.100 1.500 1.900 1.400 2.200 3.000 3.800
0100 0.800 1.125 1.525 1.925 1.450 2.250 3.050 3.850
0101 0.800 1.150 1.550 1.950 1.500 2.300 3.100 3.900
0110 0.800 1.175 1.575 1.975 1.550 2.350 3.150 3.950
0111 0.800 1.200 1.600 2.000 1.600 2.400 3.200 4.000
1000 0.825 1.225 1.625 2.025 1.650 2.450 3.250 4.050
1001 0.850 1.250 1.650 2.050 1.700 2.500 3.300 4.100
1010 0.875 1.275 1.675 2.075 1.750 2.550 3.350 4.150
1011 0.900 1.300 1.700 2.100 1.800 2.600 3.400 4.200
1100 0.925 1.325 1.725 2.125 1.850 2.650 3.450 4.250
1101 0.950 1.350 1.750 2.150 1.900 2.700 3.500 4.300
1110 0.975 1.375 1.775 2.175 1.950 2.750 3.550 4.350
1111 1.000 1.400 1.800 2.200 2.000 2.800 3.600 4.400
: Care must be taken when adjusting the VRANGE[ ] selection at address 23h bit-6 to avoid undesired output voltage selections. The
VRANGE bit allows selection of the two output voltage ranges available for REG1, REG2 and REG3 (VRANGE = 0 – VOUT range 0.8V
to 2.2V, VRANGE = 1 – VOUT range 1.3V to 4.4V). It is recommended that the user first establishes if the new VOUT voltage is within the
current selected voltage range (selected by VRANGE) prior to changing the value of the VRANGE bit.
: Refer to the Output Voltage Programming section for more information.
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
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Copyright © 2012 Active-Semi, Inc.
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I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS
ADDRESS DATA
D7 D6 D5 D4 D3 D2 D1 D0
30h R R
31h R R R R R R R R
32h R R R R R nFLTMSK OK ON
33h R VRANGE VSET0
VSET1
ADDRESS NAME BIT ACCESS FUNCTION DESCRIPTION
30h VSET1 [5:0] R/W REG3 Standby Output Voltage Selection See Table 10
30h [7:6] R READ ONLY
31h [7:0] R READ ONLY
32h ON [0] R/W REG3 Enable
0 REG3 Disable
1 REG3 Enable
32h OK [1] R REG3 Power-OK
0 Output is not OK
1 Output is OK
nFLTMSK [2] R/W REG3 Output Voltage Fault Mask Option
0 Masked
1 Not Mask
32h [7:3] R READ ONLY
33h VSET0 [5:0] R/W REG3 Output Voltage Selection See Table 10
33h VRANGE [6] R/W REG3 Voltage Range
0 Min VOUT = 0.8V
1 Min VOUT = 1.25V
33h [7] R READ ONLY
32h
Note: See Table 1 for default register settings.
Table 10:
REG3 Control Register Map
Table 11:
REG3 Control Register Bit De scriptions
R: Read-Only bits. Default Values May Vary.
W/E: Write-Exact bits. Read/Write bits which must be written exactly as specified in Table 1
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
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Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS CONT’D
Table 12:
REG3/VSETx[ ] Output Voltage Setting
REG3/VSETx[3:0]
REG3/VSETx[5:4]
REG3/VRANGE[ ] = [0] REG3/VRANGE[ ] = [1]
00 01 10 11 00 01 10 11
0000 Adjustable 1.025 1.425 1.825 Adjustable 2.050 2.850 3.650
0001 0.800 1.050 1.450 1.850 1.300 2.100 2.900 3.700
0010 0.800 1.075 1.480 1.875 1.350 2.150 2.950 3.750
0011 0.800 1.100 1.500 1.900 1.400 2.200 3.000 3.800
0100 0.800 1.125 1.525 1.925 1.450 2.250 3.050 3.850
0101 0.800 1.150 1.550 1.950 1.500 2.300 3.100 3.900
0110 0.800 1.175 1.575 1.975 1.550 2.350 3.150 3.950
0111 0.800 1.200 1.600 2.000 1.600 2.400 3.200 4.000
1000 0.825 1.225 1.625 2.025 1.650 2.450 3.250 4.050
1001 0.850 1.250 1.650 2.050 1.700 2.500 3.300 4.100
1010 0.875 1.275 1.675 2.075 1.750 2.550 3.350 4.150
1011 0.900 1.300 1.700 2.100 1.800 2.600 3.400 4.200
1100 0.925 1.325 1.725 2.125 1.850 2.650 3.450 4.250
1101 0.950 1.350 1.750 2.150 1.900 2.700 3.500 4.300
1110 0.975 1.375 1.775 2.175 1.950 2.750 3.550 4.350
1111 1.000 1.400 1.800 2.200 2.000 2.800 3.600 4.400
: Care must be taken when adjusting the VRANGE[ ] selection at address 33h bit-6 to avoid undesired output voltage selections. The
VRANGE bit allows selection of the two output voltage ranges available for REG1, REG2 and REG3 (VRANGE = 0 – VOUT range 0.8V
to 2.2V, VRANGE = 1 – VOUT range 1.3V to 4.4V). It is recommended that the user first establishes if the new VOUT voltage is within the
current selected voltage range (selected by VRANGE) prior to changing the value of the VRANGE bit.
: Refer to the Output Voltage Programming section for more information.
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 28 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
FUNCTIONAL DESCRIPTION
General Description
REG1, REG2, and REG3 are fixed-frequency,
current-mode, synchronous PWM step-down
converters that are capable of supplying up to 1.3A,
1.0A, and 0.55A of output current, respectively.
These regulators operate with a fixed frequency of
1.6MHz, minimizing noise in sensitive applications
and allowing the use of small external components,
and achieve peak efficiencies of up to 97%.
Each step-down DC/DC is available with a variety of
standard and custom output voltages, which may be
software-controlled by systems requiring advanced
power management functions, via the I2C interface.
Buck Regulator PFM/PWM Operating
Modes
The buck converters offer PFM/PWM operating
modes to maximize efficiency under both light and
full load conditions. The device will automatically
transition from fixed frequency PWM mode to PFM
mode when the output current is approximately
100mA. In PFM mode, the device maintains output
voltage regulation by adjusting the switching
frequency. The device transitions into fixed
frequency PWM mode when the output current
reaches approximately 100mA.
100% Duty Cycle Operation
REG1, REG2 and REG3 are each capable of
operating at up to 100% duty cycle. During 100%
duty-cycle operation, the high-side power MOSFET
is held on continuously, providing a direct
connection from the input to the output (through the
inductor), ensuring the lowest possible dropout
voltage in battery powered applications.
Synchronous Rectification
REG1, REG2 and REG3 each feature integrated
channel synchronous rectifiers, maximizing
efficiency and minimizing the total solution size and
cost by eliminating the need for external rectifiers.
Enabling and Disabling REG1, REG2
and REG3
REG1, REG2, and REG3 are typically enabled and
disabled using the ACT8810's closed-loop
enable/disable control scheme, including the nPBIN
input. Refer to the System Startup and Shutdown
section for more information about this function.
Each regulator is enabled when the following
conditions are met:
1) ONx is asserted high to enable REGx,
2) REGx/ONx[ ] is set to 1 when ONx is high
In addition REG1, REG2, or REG3 may be enabled
when nPBIN is pushed low via 100k resistance. It
depends on sequence is set. See the Control
Sequence section for more information.
When none of these conditions are true, REG1,
REG2 and REG3 are disabled, and each regulator’s
quiescent supply current drops to less than 1A.
Power-OK
REG1, REG2 and REG3 each feature a variety of
status bits that can be read by the system
microprocessor. If any output falls below its power-
OK threshold, typically 6% below the programmed
regulation voltage, REGx/OK[ ] is cleared to 0.
Soft-Start
REG1, REG2 and REG3 each include matched
soft-start circuitry. When enabled, the output
voltages track the internal 80s soft-start ramp and
both power up in a monotonic manner that is
independent of loading on either output. This
circuitry ensures that each output powers up in a
controlled manner, greatly simplifying power
sequencing design considerations.
Compensation
REG1, REG2 and REG3 utilize current-mode control
and a proprietary internal compensation scheme to
simultaneously simplify external component selection
and optimize transient performance over their full
operating range. No compensation design is required;
simply follow a few simple guide lines described
below when choosing external components.
Input Capacitor Selection
The input capacitor reduces peak currents and
noise induced upon the voltage source. A 4.7F
ceramic capacitor for each of REG1, REG2 and
REG3 is recommended for most applications.
Output Capacitor Selection
For most applications, 22F ceramic output
capacitors are recommended for REG1 and 10F
ceramic output capacitors are recommended for
REG2, REG3. Although the these regulators were
designed to take advantage of the benefits of
ceramic capacitors, namely small size and very-low
ESR, low-ESR tantalum capacitors can provide
acceptable results as well.
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 29 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
(2)
1FB
6
FF R102.2
C
×
=
Inductor Selection
REG1, REG2 and REG3 utilize current-mode control
and a proprietary internal compensation scheme to
simultaneously simplify external component
selection and optimize transient performance over
their full operating range.
REG1, REG2 and REG3 of the device were optimized for
operation with and 3.3H inductor, although inductors in
the 2.2H to 4.7H range can be used.
Choose an inductor with a low DC-resistance, and
avoid inductor saturation by choosing inductors with
DC ratings that exceed the maximum output current
of the application by at least 30%.
Output Voltage Programming
By default, REG1, REG2 and REG3 each power up
and regulate to their default output voltage, as
defined in the Ordering Information section. Once
the system is enabled, each regulator’s output
voltage may be modified through either the I2C
interface or the Voltage Selection (VSEL) pin.
Programming via the I2C Interface
Following startup, REG1, REG2, and REG3 may be
independently programmed to different values by
writing to the REGx/VSETx[_] and REGx/VRANGE[_]
registers via the I2C interface. To program each
regulator, first select the desired output voltage range
via the REGx/VRANGE[ ] bit. Each regulator
supports two overlapping ranges; set
REGx/VRANGE[_] to 0 for voltages below 2.245V,
set REGx/VRANGE[_] to 1 for voltages above 1.25V.
Once the desired range has been selected, program
the output to a voltage within that range by setting the
REGx/VSETx bits. For more information about the
output voltage setting options, refer to Tables 4, 7,
and 10, for REG1, REG2, and REG3, respectively.
Programming with Adjustable Option
Figure 8 shows the feedback network necessary to
set the output voltage when using the adjustable
output voltage option. Select components as
follows: Set RFB2 = 51k, then calculate RFB1 using
the following equation:
Where VFBx is 0.625V when REGx × VRANGE[ ] = 0
and 1.25V when REGx × VRANGE[ ] = 1
Figure 8:
Output Voltage Programming
Finally choose CFF using the following equation:
Where RFB1 = 47k, use 47pF.
When using Adjustable Option, OUTx pins works as
FBx function.
Output Voltage Selection Pin (VSEL)
ACT8810's VSEL pin provides a simple means of
alternating between two preset output voltage
settings, such as may be needed for dynamic
voltage selection (DVS). The operation of this pin is
as follows: when VSEL is driven to GA or a logic
low, the output voltages of REG1, REG2, and
REG3 are each defined by their VSET0[ ] register.
when VSEL is driven to VSYS or a logic high, the
output voltages of REG1, REG2, and REG3 are
each defined by their VSET1[ ] register.
By default, each regulator's VSET0[ ] and VSET1[ ]
registers are both programmed to the same voltage,
as defined in the Ordering Information section. As a
result, toggling VSET under default conditions has
no affect. However, by re-programming one or more
regulator's VSET0[ ] and/or VSET1[ ] registers, one
can easily toggle these regulators' output voltages
between two sets of voltages, such as to implement
'normal' and 'standby' modes in a system utilizing
the ACT8810 to implement an advanced power
management architecture.
PCB Layout Considerations
High switching frequencies and large peak currents
make PC board layout an important part of step-
down DC/DC converter design. A good design
minimizes excessive EMI on the feedback paths
and voltage gradients in the ground plane, both of
which can result in instability or regulation errors.
Step-down DC/DCs exhibit discontinuous input
current, so the input capacitors should be placed as
FUNCTIONAL DESCRIPTION CONT’D
= 1
V
V
RR FBx
OUTx
2FB1FB (1)
RFB1
RFB2
OUTx
ACT8810
FBx
CFF
STEP-DOWN DC/DC CONVERTERS
ACT8810
Rev 9, 15-Nov-12
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I2CTM is a trademark of NXP.
close as possible to the IC, and avoiding the use of
vias if possible. The inductor, input filter capacitor, and
output filter capacitor should be connected as close
together as possible, with short, direct, and wide
traces. The ground nodes for each regulator’s power
loop should be connected at a single point in a star-
ground configuration, and this point should be
connected to the backside ground plane with multiple
vias. The output node for each regulator should be
connected to its corresponding OUTx pin through the
shortest possible route, while keeping sufficient
distance from switching nodes to prevent noise
injection. Finally, the exposed pad should be directly
connected to the backside ground plane using multiple
vias to achieve low electrical and thermal resistance.
FUNCTIONAL DESCRIPTION CONT’D
LOW-DROPOUT LINEAR REGULATORS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 31 - www.active-semi.com
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I2CTM is a trademark of NXP.
(VINL = 3.6V, COUT4 = 1µF, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INL Operating Voltage Range 2.6 5.5 V
INL UVLO Threshold VINL Input Rising 2.4 2.5 2.6 V
UVLO Hysteresis VINL Input Falling 0.1 V
Output Voltage Accuracy
TA = 25°C -2% VNOM4
+2%
V
TA = -40°C to 85°C -3% VNOM4 +3%
Line Regulation Error VINL = Max(VOUT5 + 0.5V, 3.6V) to 5.5V 0 %/V
Load Regulation Error IOUT5 = 1mA to 360mA -0.07 mV/mA
Power Supply Rejection Ratio
f = 1kHz, IOUT4 = 360mA, COUT4 = 1µF 70
dB
f = 10kHz, IOUT4 = 360mA, COUT4 = 1µF 60
Supply Current per Output
Regulator Enabled 35
µA
Regulator Disabled 0
Dropout Voltage3 IOUT4 = 160mA, VOUT4 > 3.1V 100 200 mV
Output Current 360
mA
Current Limit VOUT4 = 95% of regulation voltage 400
Internal Soft-Start 100 µs
Power Good Flag High Threshold VOUT4, hysteresis = -2% 88 %
Output Noise COUT4 = 10µF, f = 10Hz to 100kHz 40 µVRMS
Stable COUT4 Range 1 20 µF
Discharge Resistor in Shutdown LDO Disabled, DIS4[ ] = [1] 1000
: VNOM4 refers to the nominal output voltage level for VOUT4 as defined by the Ordering Information section.
: PSRR is lower with VSET < 1.25V
3: Dropout Voltage is defined as the differential voltage between input and output when the output voltage drops 100mV below the
regulation voltage at 1V differential voltage (for 2.8V output voltage or higher)
: LDO current limit is defined as the output current at which the output voltage drops to 95% of the respective regulation voltage. Un-
der heavy overload conditions the output current limit folds back by 40% (typ)
ELECTRICAL CHARACTERISTICS (REG4)
LOW-DROPOUT LINEAR REGULATORS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 32 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
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I2CTM is a trademark of NXP.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INL Operating Voltage Range 2.6 5.5 V
INL UVLO Threshold VINL Input Rising 2.4 2.5 2.6 V
UVLO Hysteresis VINL Input Falling 0.1 V
Output Voltage Accuracy
TA = 25°C -2% VNOM5
+2%
V
TA = -40°C to 85°C -3% VNOM5 +3%
Line Regulation Error VINL = Max(VOUT5 + 0.5V, 3.6V) to 5.5V 0 %/V
Load Regulation Error IOUT5 = 1mA to 360mA -0.07 mV/mA
Power Supply Rejection Ratio
f = 1kHz, IOUT5 = 360mA, COUT5 = 1µF 70
dB
f = 10kHz, IOUT5 = 360mA, COUT5 = 1µF 60
Supply Current per Output
Regulator Enabled 35
µA
Regulator Disabled 0
Dropout Voltage3 IOUT5 = 160mA, VOUT5 > 3.1V 100 200 mV
Output Current 360 mA
Current Limit VOUT5 = 95% of regulation voltage 400 mA
Internal Soft-Start 100 µs
Output Noise COUT5 = 10µF, f = 10Hz to 100kHz 40 µVRMS
Stable COUT5 Range 1 20 µF
Discharge Resistor in Shutdown LDO Disabled, DIS5[ ] = [1] 1000
ELECTRICAL CHARACTERISTICS (REG5)
(VINL = 3.6V, COUT5 = 1µF, TA = 25°C, unless otherwise specified.)
: VNOM5 refers to the nominal output voltage level for VOUT5 as defined by the Ordering Information section.
: PSRR is lower with VSET < 1.25V
3: Dropout Voltage is defined as the differential voltage between input and output when the output voltage drops 100mV below the
regulation voltage at 1V differential voltage (for 2.8V output voltage or higher)
: LDO current limit is defined as the output current at which the output voltage drops to 95% of the respective regulation voltage. Un-
der heavy overload conditions the output current limit folds back by 40% (typ)
LOW-DROPOUT LINEAR REGULATORS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 33 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
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I2CTM is a trademark of NXP.
0
TYPICAL PERFORMANCE CHARACTERISTICS
(ACT8810QJ3EB, VVSYS = 5V, TA = 25°C, unless otherwise specified.)
Output Regulation Voltage vs. Load Current
Output Regulation Voltage (%)
Load Current (mA)
1.5
ACT8810-012
1.0
0.5
0.0
-0.5
-1.0
Output Voltage Deviation vs. Temperature
Output Voltage Deviation (%)
Temperature (°C)
-40 85
ACT8810-014
10 35 60
LDO Output Voltage Noise
CH1
CH1: VOUTx, 200µV/div (AC COUPLED)
TIME: 200ms/div
CREF = 10nF
40 80 120 160 200 240 280 320 360
-0.5
2.00
1.50
1.00
0.50
ACT8810-015
-15
ILOAD = 0mA
0.00
-1.5
ACT8810-016
Region of Stable COUT ESR vs. Output Current
1
0.1
0.01
0 50 100 150 200 250
ESR ()
300 360
Output Current (mA)
Stable ESR
Dropout Voltage (mV)
Output Current (mA)
Dropout Voltage vs. Output Current
ACT8810-013
200
50 0 150 100 200
175
225
150
125
100
75
50
25
0
250 300 360
REG4, REG5
3.1V
3.3V
3.6V
LOW-DROPOUT LINEAR REGULATORS
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 34 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS
Note: See Table 1 for default register settings.
Table 13:
REG45 Control Register Map
ADDRESS DATA
D7 D6 D5 D4 D3 D2 D1 D0
40h DIS4 R ON4 VSET4
41h DIS5 R ON5 VSET5
43h R R R R R R nFLTMSK OK
ADDRESS NAME BIT ACCESS FUNCTION DESCRIPTION
40h VSET4 [4:0] R/W REG4 Output Voltage
Selection See Table 15
40h ON4 [5] R/W REG4 Enable
0 REG4 Disable
1 REG4 Enable
40h [6] R READ ONLY
40h DIS4 [7] R/W REG4 Discharge Enable
0 Discharge Disable
1 Discharge Enable
41h VSET5 [4:0] R/W REG5 Output Voltage
Selection See Table 15
41h ON5 [5] R/W REG5 Enable
0 REG5 Disable
1 REG5 Enable
41h [6] R READ ONLY
41h DIS5 [7] R/W REG5 Discharge Enable
0 Discharge Disable
1 Discharge Enable
43h OK [0] R REG4 Power-OK
0 Output is not OK
1 Output is OK
nFLTMSK [1] R/W REG4 Output Voltage Fault
Mask Option
0 Masked
1 Not Mask
43h [7:2] R READ ONLY
43h
Table 14:
REG45 Control Register Bit Descriptions
R: Read-Only bits. Default Values May Vary.
LOW-DROPOUT LINEAR REGULATORS
ACT8810
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I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS CONT’D
Table 15:
REG45/VSETx[ ] Output Voltage Setting
REG45CFG/VSETx[2:0] REG45CFG/VSETx[4:3]
00 01 10 11
000 0.90 1.45 1.90 2.75
001 1.00 1.50 2.00 2.80
010 1.10 1.55 2.10 2.85
011 1.20 1.60 2.20 2.90
100 1.25 1.70 2.40 3.00
101 1.30 1.75 2.50 3.10
110 1.35 1.80 2.60 3.20
111 1.40 1.85 2.70 3.30
LOW-DROPOUT LINEAR REGULATORS
ACT8810
Rev 9, 15-Nov-12
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I2CTM is a trademark of NXP.
FUNCTIONAL DESCRIPTION
General Description
REG4 and REG5 are low-noise, low-dropout linear
regulators (LDOs) that are optimized for low noise
and high-PSRR operation, achieving more than
60dB PSRR at frequencies up to 10kHz.
LDO Output Voltage Programming
All LDOs feature independently-programmable
output voltages that are set via the I2C serial
interface, increasing the ACT8810’s flexibility while
reducing total solution size and cost. Set the output
voltage by writing to the REG45CFG/VSETx[ ]
registers.
Output Current Capability
REG4 and REG5 each supply an output current of
360mA. Excellent performance is achieved over this
load current range.
Output Current Limit
In order to ensure safe operation under over-load
conditions, each LDO features current-limit circuitry
with current fold-back. The current-limit circuitry
limits the current that can be drawn from the output,
providing protection in over-load conditions. For
additional protection under extreme over current
conditions, current-fold-back protection reduces the
current-limit by approximately 40% under extreme
overload conditions.
Enabling and Disabling the LDOs
All LDOs feature independent enable/disable
control via the I2C serial interface. Independently
enable or disable each output by writing to the
appropriate REG45CFG/ONx[ ] bit.
In addition REG4 or REG5 may be enable when
nPBIN is pushed low via 100k resistance. It
depends on sequence is set. See the Control
Sequence section for more information.
Power-OK
REG4 features power-OK status bit that can be
read by the system microprocessor via the I2C
interface. If an output voltage is lower than the
power-OK threshold, typically 12% below the
programmed regulation voltage, the corresponding
REG45CFG/OK[ ] will clear to 0.
Reference Bypass Pin
The ACT8810 contains a reference bypass pin
which filters noise from the reference, providing a
low noise voltage reference to the LDOs. Bypass
REFBP to GA with a 0.01F ceramic capacitor.
Optional LDO Output Discharge
Each of the ACT8810’s LDOs features an optional,
independent output voltage discharge feature.
When this feature is enabled, the LDO output is
discharged to ground through a 1k resistance
when the LDO is shutdown. This feature may be
enabled or disabled via the I2C interface by writing
to the REG45CFG/DISx[ ] bits.
Output Capacitor Selection
REG4 and REG5 each require only a small ceramic
capacitor for stability. For best performance, each
output capacitor should be connected directly
between the OUTx and GA pins as possible, with a
short and direct connection. To ensure best
performance for the device, the output capacitor
should have a minimum capacitance of 1F, and
ESR value between 10m and 200m. High quality
ceramic capacitors such as X7R and X5R dielectric
types are strongly recommended.
PCB Layout Considerations
The ACT8810’s LDOs provide good DC, AC, and
noise performance over a wide range of operating
conditions, and are relatively insensitive to layout
considerations. When designing a PCB, however,
careful layout is necessary to prevent other circuitry
from degrading LDO performance. A good design
places input and output capacitors as close to the
LDO inputs and output as possible, and utilizes a
star-ground configuration for all regulators to
prevent noise-coupling through ground. Output
traces should be routed to avoid close proximity to
noisy nodes, particularly the SW nodes of the
DC/DCs. REFBP is a filtered reference noise, and
internally has a direct connection to the linear
regulator controller. Any noise injected onto REFBP
will directly affect the outputs of the linear
regulators, and therefore special care should be
taken to ensure that no noise is injected to the
outputs via REFBP. As with the LDO output
capacitors, the REFBP bypass capacitor should be
placed as close to the IC as possible, with short,
direct connections to the star-ground. Avoid the use
of vias whenever possible. Noisy nodes, such as
from the DC/DCs, should be routed as far away
from REFBP as possible.
RTC LOW-DROPOUT LINEAR REGULATOR
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 37 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
ELECTRICAL CHARACTERISTICS (REG6)
(TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input Supply Range 2.6 5.5 V
Output Voltage Accuracy
TA = 25°C -2% VNOM6
+2%
V
TA = -40°C to 85°C -3% VNOM6 +3%
Line Regulation Error VINL = VOUT6 + 0.5V to VINL = 5.5V 0.1 %/V
Load Regulation Error IOUT6 = 0mA to 30mA -0.01 %/mA
Input Supply Current ON1 = ON2 = ON3 = GA 6 12 µA
Dropout Voltage IOUT6 = 10mA 35 70 mV
Output Current 30 mA
Current Limit3 VOUT6 = 95% of regulation voltage 45 mA
Stable COUT6 Range 1 20 µF
: VNOM6 refers to the nominal output voltage level for VOUT6 as defined by the Ordering Information section.
: Dropout Voltage is defined as the differential voltage between input and output when the output voltage drops 100mV below the
regulation voltage at 1V differential voltage (for 2.8V output voltage or higher)
3: LDO current limit is defined as the output current at which the output voltage drops to 95% of the respective regulation voltage.
RTC LOW-DROPOUT LINEAR REGULATOR
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 38 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
REGISTER DESCRIPTIONS
Note: See Table 1 for default register settings.
Table 16:
REG6 Control Register Map
ADDRESS DATA
D7 D6 D5 D4 D3 D2 D1 D0
42h R R R VSET6
ADDRESS NAME BIT ACCESS FUNCTION DESCRIPTION
42h VSET6 [4:0] R/W REG6 Output Voltage
Selection See Table 18
42h [7:5] R READ ONLY
Table 17:
REG6 Control Register Bit De scriptions
R: Read-Only bits. Default Values May Vary.
Table 18:
REG6/VSETx[ ] Output Voltage Setting
REG6CFG/VSETx[2:0] REG6CFG/VSETx[4:3]
00 01 10 11
000 0.90 1.45 1.90 2.75
001 1.00 1.50 2.00 2.80
010 1.10 1.55 2.10 2.85
011 1.20 1.60 2.20 2.90
100 1.25 1.70 2.40 3.00
101 1.30 1.75 2.50 3.10
110 1.35 1.80 2.60 3.20
111 1.40 1.85 2.70 3.30
RTC LOW-DROPOUT LINEAR REGULATOR
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 39 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
General Description
REG6 is an always-on, low-dropout linear regulator
(LDO) that is optimized for RTC and backup-battery
applications. REG6 features low-quiescent supply
current, current-limit protection, and reverse-current
protection, and is ideally suited for always-on power
supply applications, such as for a real-time clock, or
as a backup-battery or super-cap charger.
Output Voltage
By default, REG6's output voltage is as defined in
the Ordering Information section. However, this
voltage may be programmed by writing to the
REG6CFG/VSETx[ ] register via the I2C interface.
Reverse-Current Protection
REG6 features internal circuitry that limits the
reverse supply current to less than 1µA when the
input voltage falls below the output voltage, as can
be encountered in backup-battery charging
applications. REG6's internal circuitry monitors the
input and the output, and disconnects internal
circuitry and parasitic diodes when the input voltage
falls below the output voltage, greatly minimizing
backup battery discharge.
Typical Application
Voltage Regulators
REG6 is ideally suited for always-on voltage-
regulation applications, such as for real-time clock
and memory keep-alive applications. This regulator
requires only a small ceramic capacitor with a
minimum capacitance of 1F for stability. For best
performance, the output capacitor should be
connected directly between the output and GA, with
a short and direct connection.
Figure 9:
Typical Application of RTC LDO
Backup Battery Charging
REG6 features a constant current-limit, which
protects the IC under output short-circuit conditions
as well as provides a constant charge current, when
operating as a backup battery charger.
As shown in Figure 10, REG6 features a CC/CV
output characteristic, regulating its output voltage
for load currents up to 30mA, and regulating output
current when the load exceeds (typically) 60mA.
Figure 10:
REG6 Output Voltage
FUNCTIONAL DESCRIPTION
Output Voltage (V)
ACT8810-017
4
3
2
1
0
REG6 Output Voltage vs. Load Current
Constant Voltage Region
Constant Current Region
Load Current (mA)
20 0 40 60
80 100
ACT8810
RTC
Supper cap or
Back-up battery
OUT6
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 40 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
ELECTRICAL CHARACTERISTICS
(VCHG_IN = 5V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ActivePath
CHG_IN Operating Voltage Range 4.35 6.0 V
CHG_IN UVLO Threshold CHG_IN Voltage Rising 3.6 3.8 4.0 V
CHG_IN UVLO Hysteresis CHG_IN Voltage Falling 0.8 V
CHG_IN OVP Threshold CHG_IN Voltage Falling 6.0 6.5 7.0 V
CHG_IN OVP Hysteresis CHG_IN Voltage Rising 350 mV
CHG_IN Supply Current
VCHG_IN < VUVLO 20 µA
VCHG_IN < VBAT + 120mV, VCHG_IN > VUVLO 50 120 200 µA
VCHG_IN > VBAT + 120mV, VCHG_IN > VUVLO
Charger disabled, ISYS = 0mA 1.8 mA
CHG_IN to VSYS On-Resistance IVSYS = 100mA 0.4 0.6
CHG_IN to VSYS Current Limit
ACIN = VSYS 1.5 2 3 A
ACIN = GA, CHGLEV = GA 85 95 105 mA
ACIN = GA, CHGLEV = VSYS 400 450 500
VSYS AND DCCC REGULATION
VSYS Regulated Voltage IVSYS = 10mA 4.4 4.6 4.8 V
DCCC Pull-Up Current VCHG_IN > VBAT + 120mV, Hysteresis = 50mV 92 100 108 µA
nSTATx OUTPUT
nSTATx Sink Current VnSTATx = 2V 3 5 7 mA
nSTATx Output Low Voltage InSTATx = 1mA 0.4 V
nSTATx Leakage Current VnSTATx = 4.2V 1 µA
ACIN AND CHGLEV INPUTS
CHGLEV Logic High Input Voltage 1.4 V
CHGLEV Logic Low Input Voltage 0.4 V
CHGLEV Leakage Current VCHGLEV = 4.2V 1
µA
ACIN Logic High Input Voltage 1.4 V
ACIN Logic Low Input Voltage 0.4 V
ACIN Leakage Current VACIN = 4.2V 1
µA
TEMPERATURE SENSE COMPARATOR
TH Pull-Up Current VCHG_IN > VBAT + 120mV, Hysteresis = 50mV 92 100 108 µA
VTH Upper Temperature Voltage
Threshold (VTHH) Hot Detect NTC Thermistor 0.485 0.500 0.525 V
VTH Lower Temperature Voltage
Threshold (VTHL) Cold Detect NTC Thermistor 2.47 2.52 2.57 V
VTH Hysteresis Upper and Lower 30 mV
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 41 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
ELECTRICAL CHARACTERISTICS CONT’D
(VCHG_IN = 5V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CHARGER
BAT Reverse Leakage Current VCHG_IN = 0V, VBAT = 4.2V, IVSYS = 0mA 5 µA
BAT to VSYS On-Resistance 80 m
ISET Pin Voltage Fast Charge 1.02 V
Precondition 0.12
Charge Termination Voltage TA = -20°C to 70°C 4.179 4.2 4.221 V
TA = -40°C to 85°C 4.170 4.230
Charge Current VBAT = 3.5V,
RISET = 1.2k
ACIN = VSYS, CHGLEV = VSYS -10% ISET1 +10%
mA
ACIN = VSYS, CHGLEV = GA -16% 50%ISET +16%
ACIN = GA, CHGLEV = VSYS -10%
Smallest
(450mA
or ISET)
+10%
ACIN = GA, CHGLEV = GA -10%
Smallest
(90mA or
ISET)
+10%
Precondition Charge Current VBAT = 2.5V,
RISET = 1.2k
ACIN = VSYS, CHGLEV = VSYS 12%ISET
mA
ACIN = VSYS, CHGLEV = GA 12%ISET
ACIN = GA, CHGLEV = VSYS 12%ISET
ACIN = GA, CHGLEV = GA
Smallest
(90mA or
12%ISET)
Precondition Threshold Voltage VBAT Voltage Rising 2.75 2.85 2.95 V
Precondition Threshold Hysteresis VBAT Voltage Falling 100 mV
End-of-Charge Current Threshold VBAT = 4.2V,
RISET = 1.2k
ACIN = VSYS, CHGLEV = VSYS 10%ISET
mA
ACIN = VSYS, CHGLEV = GA 10%ISET
ACIN = GA, CHGLEV = VSYS 5%ISET
ACIN = GA, CHGLEV = GA 5%ISET
Charge Restart Threshold VSET - VBAT, VBAT Falling 150 170 190 mV
Fast Charge Safety Timer TNORMAL R
BTR = 62 k 3 hr
Precondition Safety Timer TPRECONDITION R
BTR = 62 k 1
2 hr
THERMAL REGULATION
Thermal Regulation Threshold 100 145 °C
: ISET (mA) = KISET × 1V/(RISET (k) +0.031) where KISET = 628
2: TPRECONDITION = TNORMAL / 3 (typ)
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 42 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
TYPICAL PERFORMANCE CHARACTERISTICS
(VCHG_IN = 5V, RDCCC = 20k, RISET = 680, TA = 25°C, unless otherwise specified.)
ACT8810-018
SYS Current (mA)
0 1000 2000 3000
ACT8810-019
4.25
4.15
4.05
3.95
3.85
3.75
SYS Voltage (V)
ISYS = 10mA VBAT = 4.2V
SYS Output Voltage vs. CHG_IN Voltage SYS Voltage vs. SYS Current
4.8
4.6
4.5
4.4
4.3
4.2
4.1
4.0
4.7
SYS Voltage (V)
CHG_IN Voltage (V)
0 2 4 6 8 10 12 14
Battery Voltage (V)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
ACT8810-020
Charger Current vs. Battery Voltage (USB Mode)
Charger Current (mA)
CHG_IN = 5V
ISYS = 0mA
100mA USB
100
80
60
40
20
0
VBAT Falling
VBAT Rising
Battery Voltage (V)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
ACT8810-021
Charger Current vs. Battery Voltage (USB Mode)
450
400
350
300
250
200
150
100
50
0
500
Charger Current (mA)
ACT8810-022
Charger Current vs. Battery Voltage (AC Mode)
Charger Current (mA)
900
800
700
600
500
400
300
200
100
0
Battery Voltage (V)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Battery Voltage Falling
Battery Voltage Rising
Ambient Temperature (°C)
-40 -20 0 20 40 60 80 100 120 140
ACT8810-023
Fast Charge Current vs. Ambient Temperature
Fast Charger Current (mA)
ACIN, CHGLEV = 11
ACIN, CHGLEV = 10
ACIN, CHGLEV = 01
ACIN, CHGLEV = 00
1200
1000
800
600
400
200
0
CHG_IN = 5V
ISYS = 0mA
500mA USB
Battery Voltage Falling
Battery Voltage Rising
ISYS = 0mA
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 43 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D
VAC Applied, CHGLEV = LOW VAC Applied, CHGLEV = HIGH
VAC Removed, CHGLEV = LOW VAC Removed, CHGLEV = HIGH
ACT8810-024
ACT8810-025
ACT8810-026
ACT8810-027
CH1
CH2
CH3
CH4
CH1
CH2
CH3
CH4
CH1
CH2
CH3
CH4
CH1
CH2
CH3
CH4
CH1: VUSB, 2.00V/div
CH2: VCHG_IN, 2.00V/div
CH3: IBAT, 500mA/div
CH4: VVAC, 2.00V/div
TIME: 400µs/div
CH1: VUSB, 2.00V/div
CH2: VCHG_IN, 2.00V/div
CH3: IBAT, 500mA/div
CH4: VVAC, 2.00V/div
TIME: 400µs/div
CH1: VUSB, 2.00V/div
CH2: VCHG_IN, 2.00V/div
CH3: IBAT, 500mA/div
CH4: VVAC, 2.00V/div
TIME: 400µs/div
CH1: VUSB, 2.00V/div
CH2: VCHG_IN, 2.00V/div
CH3: IBAT, 500mA/div
CH4: VVAC, 2.00V/div
TIME: 400µs/div
100mA 450mA
100mA 450mA
Battery Voltage (V)
0 1 2 4 3 5
ACT8810-028
10
8
6
4
2
0
Battery Leakage Current (µA)
Battery Leakage Current vs. Battery Voltage
No CHG_IN
CHGLEV = 0
(VCHG_IN = 5V, RDCCC = 20k, RISET = 680, TA = 25°C, unless otherwise specified.)
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 44 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
FUNCTIONAL DESCRIPTION
General Description
The ACT8810 incorporates Active-Semi's patent-
pending ActivePath architecture. ActivePath is a
complete battery-charging and system power-
management solution for portable hand-held
equipment. This circuitry performs a variety of
advanced battery-management functions, including
automatic selection of the best available input
supply, current-management to ensure system
power availability, and a complete, high-accuracy
(±0.5%), thermally regulated, full-featured single-
cell linear Li+ charger with an integrated 12V power
MOSFET.
ActivePath Architecture
Active-semi's patent-pending ActivePath
architecture performs three important functions:
1) Input Protection,
2) System Configuration Optimization, and
3) Battery-Management
Input Protection
At the input of the ACT8810's ActivePath circuit is
an internal, low-dropout linear regulator (LDO) that
regulates the system voltage (VSYS). This LDO
features a 12V power MOSFET, allowing the
ActivePath system to withstand input voltages of up
to 12V, and additionally includes a variety of other
protection features, including current limit protection
and input over-voltage protection.
The ActivePath circuitry provides a very simple
means of implementing a solution that safely
operates within the current-capability limitations of a
USB port while taking advantage of the high output-
current capability of an AC adapter, when available.
ActivePath limits the total current drawn from the
input supply to a value set by the ACIN input; when
ACIN is driven to a logic-low ActivePath operates in
“USB Mode” and limits the current to either 500mA
(when CHGLEV is driven to a logic-high) or to
100mA (when CHGLEV is driven to a logic-low),
and when ACIN is driven to a logic-high ActivePath
operates in “AC-Mode” and limits the input current
to 2A. In either case, ActivePath's DCCC circuitry,
described below, allows the input overload
protection to be adjusted to accommodate a wide
range of input supplies.
System Configuration Optimization
ActivePath circuitry automatically detects the state
of the input supply, the battery, and the system, and
automatically reconfigures itself to optimize the
power system. If the input supply is present,
ActivePath powers the system in parallel with
charging the battery, so that system power and
charge current can be independently managed to
satisfy all system power requirements. This allows
the battery to charge as quickly as possible, while
ensuring that the total system current does not
exceed the capability of the input supply. If the input
supply is not present, however, then ActivePath
automatically configures the system to draw power
from the battery. Finally, if the input is present and
the system current requirement exceeds the
capability of the input supply, such as under
momentary peak-power consumption conditions,
ActivePath automatically configures itself for
maximum power capability by drawing system
power from both the battery and the input supply.
Battery Management
ActivePath includes a full-featured battery charger
for single-cell Li-based batteries. This charger is a
full-featured, intelligent, linear-mode, single-cell
charger for Lithium-based cells, and was designed
specifically to provide a complete charging solution
with minimum system design effort.
The core of the ActivePath's charger is a CC/CV
(Constant-Current/Constant-Voltage), linear-mode
charge controller. This controller incorporates
current and voltage sense circuitry, an internal
80m power MOSFET, a full-featured state-
machine that implements charge control and safety
features, and circuitry that eliminates the reverse-
blocking diode required by conventional charger
designs.
This charger also features thermal-regulation
circuitry that protects it against excessive junction
temperature, allowing the fastest possible charging
times, as well as proprietary input protection
circuitry that makes the charger robust against input
voltage transients that can damage other chargers.
The charge termination voltage is highly accurate
(±0.5%), and features a selection of charge safety
timeout periods that protect the system from
operation with damaged cells. Other features
include pin-programmable fast-charge current and
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 45 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
ACIN CHGLEV CHARGE
CURRENT
ICHG (mA)
PRECONDITION
CHARGE CURRENT
ICHG (mA)
0 0
90mA or ISET
(Smallest one)
90mA or 12%ISET
(Smallest one)
0 1
450mA or ISET
(Smallest one) 12% × ISET
1 0 50% × ISET 12% × ISET
1 1 ISET 12% × ISET
FUNCTIONAL DESCRIPTION CONT’D
two current-limited nSTAT0 and nSTAT1 outputs
that can directly drive LED indicators or provide a
logic-level status signal to the host microprocessor.
Dynamic Charge Current Control (DCCC)
The ACT8810's ActivePath Charger features
Dynamic Charge Current Control (DCCC) circuitry,
which continuously monitors the input supply to
prevent input overload conditions. DCCC reduces
the charge current when the VSYS voltage
decreases to VDCCC and stops charging when VSYS
drops below VDCCC by 1.5% (typical).
The DCCC voltage threshold is programmed by
connecting a resistor from DCCC to GA according
to the following equation:
VDCCC = 2 × (IDCCC × RDCCC) (2)
Where RDCCC is the value of the external resistor,
and IDCCC (100µA typical) is the value of the current
sourced from DCCC.
Given the tolerances of the RDCCC and IDCCC ,the
DCCC voltage threshold should be programmed to
be no less than 3.3V to prevent triggering the
UVLO, and to be no larger than 4.4V to prevent
engaging DCCC prematurely. A 19.1k (1%), or
18.7k (1%) resistor for RDCCC is recommended.
Charger Current Programming
The ACT8810's ActivePath charger features a
flexible charge current-programming scheme that
combines the convenience of internal charge
current programming with the flexibility of resistor
based charge current programming. Current limits
and charge current programming are managed as a
function of the ACIN and CHGLEV pins, in
combination with RISET, the resistance connected to
the ISET pin.
ACIN and CHGLEV Inputs
ACIN is a logic input that configures the current-limit
of ActivePath's linear regulator as well as that of the
battery charger. ACIN features a precise 1.25V
logic threshold, so that the input voltage detection
threshold may be adjusted with a simple resistive
voltage divider. This input also allows a simple, low-
cost dual-input charger switch to be implemented
with just a few, low-cost components.
When ACIN is driven to a logic high, the ActivePath
operates in “AC-Mode” and the charger charges at
the current programmed by RISET,
ISET (mA) = KISET × 1V/(RISET (k) +0.031) (3)
where KISET = 628 when CHGLEV is driven to a
logic high, and KISET = 314 when CHGLEV is driven
to a logic low.
When ACIN is driven to a logic-low, the ActivePath
circuitry operates in “USB-Mode”, which enforces a
maximum charge current setting of 500mA, if
CHGLEV is driven to a logic-high, or 100mA, if
CHGLEV is driven to a logic-low.
The ACT8810's charge current settings are
summarized in the table below:
Table 19:
ACIN and CHGLEV Inputs Table
Note that the actual charging current may be limited
to a current that is lower than the programmed fast
charge current due to the ACT8810’s internal
thermal regulation loop. See the Thermal
Regulation and Protection section for more
information.
Battery Temperature Monitoring
The ACT8810 continuously monitors the
temperature of the battery pack by sensing the
resistance of its thermistor, and suspends charging
if the temperature of the battery pack exceeds the
safety limits.
In a typical application, shown in Figure 11, the TH
pin is connected to the battery pack's thermistor
input. The ACT8810 injects a 100µA current out of the
TH pin into the thermistor, so that the thermistor
resistance is monitored by comparing the voltage at
TH to the internal VTHH and VTHL thresholds of 0.5V
and 2.5V, respectively. When VTH > VTHL or VTH < VTHH
charging and the charge timers are suspended. When
VTH returns to the normal range, charging and the
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 46 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
FUNCTIONAL DESCRIPTION CONT’D
charge timers resume.
The net resistance from TH to GA required to cross
the threshold is given by:
100µA × RNOM × kHOT = 0.5V RNOM × kHOT = 5k
100µA × RNOM × kCOLD = 2.5V RNOM × kCOLD = 25k
where RNOM is the nominal thermistor resistance at
room temperature, and kHOT and kCOLD are the ratios
of the thermistor's resistance at the desired hot and
cold thresholds, respectively.
Figure 11:
Simple Configuration
Design Procedure
When designing with thermistors it is important to
keep in mind that their nonlinear behavior typically
allows one to directly control no more than one
threshold at a time. As a result, the design
procedure can change depending on which
threshold is most critical for a given application.
Most application requirements can be solved using
one of three cases,
1) Simple solution
2) Fix VTHH, accept the resulting VTHL
3) Fix VTHL, accept the resulting VTHH
The ACT8810 was designed to achieve an
operating temperature range that is suitable for
most applications with very little design effort. The
simple solution is often found to provide reasonable
results and should always be used first, then the
design procedure may proceed to one of the other
solutions if necessary.
In each design example, we refer to the Vishay
NTHS series of NTCs, and more specifically those
which follow a "curve 2" characteristic. For more
information on these NTCs, as well as access to the
resistance/temperature characteristic tables referred
to in the example, please refer to the Vishay
website at http://www.vishay.com/thermistors.
Simple Solution
The ACT8810 was designed to accommodate most
requirements with very little design effort, but also
provides flexibility when additional control over a
design is required. Initial thermistor selection is
accomplished by choosing one that best meets the
following requirements:
RNOM = 5k/kHOT, and
RNOM = 25k/kCOLD
where kHOT and kCOLD for a given thermistor can be
found on its characteristic tables.
Taking a 0°C to 40°C application using a "curve 2"
NTC for this example, from the characteristic tables
one finds that kHOT and kCOLD are 0.5758 and 2.816,
respectively, and the RNOM that most closely
satisfies these requirements is therefore around
8.8k. Selecting 10k as the nearest standard
value, calculate kCOLD and kHOT as:
kCOLD = VTHL/(ITH × RNOM) = 2.5V/(100µA × 10k) = 2.5
kHOT = VTHH/(ITH × RNOM) = 0.5V/(100µA × 10k) = 0.5
Identifying these values on the curve 2
characteristic tables indicates that the resulting
operating temperature range is 2°C to 44°C, vs. the
design goal of 0°C to 40°C. This example
demonstrates that one can satisfy common
operating temperature ranges with very little design
effort.
Fix VTHH
For demonstration purposes, supposing that we
had selected the next closest standard thermistor
value of 6.8k in the example above, we would
have obtained the following results:
kCOLD = VTHL/(ITH × RNOM) = 2.5V/(100µA × 6.8k) = 3.67
kHOT = VTHH/(ITH × RNOM) = 0.5V/(100µA × 6.8k) = 0.74
which, according to the characteristic tables would
have resulted in an operating temperature range of
-6°C to 33°C vs. the design goal of 0°C to 40°C.
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 47 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
FUNCTIONAL DESCRIPTION CONT’D
In this case, one can add resistance in series with
the thermistor to shift the range upwards, using the
following equation:
(VTHH/ITH) = kHOT(@40°C) × RNOM + R
R = (VTHH/ITH) - kHOT(@40°C) × RNOM
R = (2.5V/100µA) - 0.5758 × 6.8k
Finally,
R = 5k - 3.9k = 1.1k
This result shows that adding 1.1k in series with
the thermistor sets the net resistance from TH to G
to be 0.5V at 40°C, satisfying VTHH at the correct
temperature. Adding this resistance, however, also
impacts the lower temperature limit as follows:
VTHL/ITH = kCOLD(@TC) × RNOM + R
kCOLD(@TC) = (VTHL/ITH) - R)/RNOM
Finally,
kCOLD(@TC) = (25k - 1.1k)/6.8k = 3.51
Reviewing the characteristic curves, the lower
threshold is found to move to -5°C, a change of only
1°C. As a result, the system satisfies the upper
threshold of 40°C with an operating temperature
range of -5°C to 40°C, vs. our design target of 0°C
to 40°C. It is informative to highlight that due to the
NTC behavior of the thermistor, the relative impact
on the lower threshold is significantly smaller than
the impact on the upper threshold.
Fix VTHL
Following the same example as above, the
"unadjusted" results yield an operating temperature
range of -6°C to 33°C vs. the design goal of 0°C to
40°C. In applications that favor VTHL over VTHH,
however, one can control the voltage present at TH
at low temperatures by connecting a resistor in
parallel with ITH. The desired resistance can be
found using the following equation:
(ITH + (VCHG_IN - VTHL)/R) × kCOLD(@0°C) × RNOM = VTHL
Rearranging yields
R = (VCHG_IN - VTHL)/(VTHL/(kCOLD(@0°C) × RNOM) - ITH)
R = (5V - 2.5V)/(2.5V/(2.816 × 6.8k) - 100µA)
R = 82k
Adding 82k in parallel with the current source
increases the net current flowing into the thermistor,
thus increasing the voltage at TH. Adding this
resistance, however, also impacts the upper
temperature limit:
VTHH = (ITH + (VCHG_IN - VTHH)/R) × kHOT(@40°C) × RNOM
Rearranging yields,
kHOT(@TC) = VTHH/(RNOM × (ITH + (VCHG_IN - VTHH)/R))
kHOT(@TC) = 0.5V/(6.8k × (100µA + (5V - 0.5V)/82k))
= 0.4748
Reviewing the characteristic curves, the upper
threshold is found to move to 45°C, a change of
Figure 12:
Fix VTHH Configuration Figure 13:
Fix VTHL Configuration
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 48 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
STATE nSTAT0 nSTAT1
PRECONDITION ON ON
FAST-CHARGE,
TOP-OFF ON OFF
END-OF-CHARGE OFF ON
FAULT, SUSPEND OFF OFF
FUNCTIONAL DESCRIPTION CONT’D
about 14°C. Adding the parallel resistance has
allowed us to achieve our desired lower threshold of
0°C with an operating temperature range of 0°C to
45°C, vs. our design target of 0°C to 40°C.
Thermal Regulation
The ACT8810's ActivePath charger features an
internal thermal regulation loop that reduces the
charging current as necessary to ensure that the
die temperature does not rise beyond the thermal
regulation threshold of 110°C. This feature protects
the against excessive junction temperature and
makes the device more accommodating to
aggressive thermal designs. Note, however, that
attention to good thermal designs is required to
achieve the fastest possible charge time by
maximizing charge current.
In order to account for the reduced charge current
resulting from operation in thermal regulation mode,
the charge timeout periods are extended
proportionally to the reduction in charge current.
Charging Safety Timers
The ACT8810 features a safety timer that is
programmable via an external resistor (RBTR)
connected from BTR to GA. The timeout period is
calculated as show in Figure 14.
If the ACT8810 detects that the charger remains in
precondition for longer than the precondition time
out period (which determined as tCHG/3), the
ACT8810 turns off the charger and generate a
FAULT to ensure prevent charging a bad cell.
Charging Status Indication
The ACT8810 provides two charge-status outputs,
nSTAT0 and nSTAT1, which indicate charge status
as defined in Table 20. nSTAT0 and nSTAT1 are
open-drain outputs with internal 5mA current limits,
which sink current when asserted and are high-Z
otherwise, and are capable of directly driving LEDs
without the need of current-limiting resistors or
other external circuitry. To drive an LED, simply
connect the LED between each pin and an
appropriate supply (typically VSYS). For a logic
level indication, simply connect a resistor from each
output to a appropriate voltage supply.
Table 20:
Charging Status Indication Table
Input Supply Detection
The ACT8810's ActivePath charger is capable of
withstanding voltages of up to 12V, protecting the
system from fault conditions such as input voltage
transients or application of an incorrect input
supply. Although the ACT8810 can withstand a
wide range of input voltages, valid input voltages for
charging must be greater than the under-voltage
lockout voltage (UVLO) and the over-voltage
protection (OVP) thresholds, as described below.
Under Voltage Lock Output (UVLO)
Whenever the input voltage applied to CHG_IN falls
below 3.0V (typ), an input under-voltage condition is
detected and the charger is disabled. Once an input
under-voltage condition is detected, the input must
exceed the under-voltage threshold by at least
800mV for charging to resume.
Over Voltage Protection (OVP)
If the charger detects that the voltage applied to
CHG_IN exceeds 6.5V (typ), an over-voltage
condition is detected and the charger is disabled.
Once an input over-voltage condition is detected,
the input must fall below the OVP threshold by at
least 350mV for charging to resume.
Reverse Leakage Current
The ACT8810's ActivePath charger includes
internal circuitry that eliminates the need for
blocking diodes, reducing solution size and cost as
well as dropout voltage relative to conventional
battery chargers. When the voltage at CHG_IN falls
below VBAT, the charger automatically reconfigures
its power switch to minimize current drain from the
battery.
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 49 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
Figure 15:
Typical Li+ Charge Profil e and ACT8810 Charge States
Figure 14:
RBTR (k)
20 30 40 50 60 70 80 90 100 110
TNORMAL vs. RBTR
TNORMAL (Min)
275
225
175
125
75
A: PRECONDITION State
B: FAST-CHARGE State
C: TOP-OFF State
D: END-OF-CHARGE State
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 50 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
Figure 16:
Charger State Diagram
SUSPEND
PRECONDITION
FAST-CHARGE
END-OF-CHARGE
BATTERY REMOVED OR
(VCHGIN < VBAT) OR (VCHGIN <V
CHGIN UVLO)
OR (VCHGIN > VOVP)
BATTERY REPLACED AND
(VCHGIN > VBAT) AND (VCHGIN >V
CHGIN UVLO)
AND (VCHGIN < VOVP)
VBAT > 2.85V
VBAT = VTERM
TEMP-FAULT
TOP-OFF
IBAT < IEOC OR
T > TNORMAL
TEMP OK
ANY STATE
TEMP NOT OK
TIMEOUT-FAULT
T > TPRECONDITION
T > TNORMAL
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 51 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
FUNCTIONAL DESCRIPTION CONT’D
Charger State-Machine
PRECONDITION State
A new charging cycle begins with the
PRECONDITION state, and operation continues in
this state until VBAT exceeds the Precondition
Threshold Voltage of 2.85V (typ). When operating
in PRECONDITION state, the cell is charged at a
reduced current, 12% of the programmed maximum
fast-charge constant current, ISET. Once VBAT
reaches the Precondition Threshold Voltage the
state machine jumps to the FAST-CHARGE state. If
VBAT does not reach the Precondition Threshold
Voltage before the Precondition Timeout period
tPRECONDITION expires, then a damaged cell is
detected and the state machine jumps to the
TIMEOUT-FAULT State. For the Precondition
Timeout period, see the Charging Safety Timers
section for more information.
FAST-CHARGE State
In FAST-CHARGE state, the ACT8810 charges at
the current programmed by RISET (see the Current
Limits and Charge Current Programming section for
more information). During a normal charge cycle
fast-charge continues in CC mode until VBAT
reaches the charge termination voltage (VTERM), at
which point the ACT8810 jumps to the TOP-OFF
state. If VBAT does not reach VTERM before the total
time out period expires then state-machine will jump
to the END-OF-CHARGE (EOC) state and will re-
initiate a new charge cycle after 2-4ms “relax”.
TOP-OFF State
In the TOP-OFF state, the cell charges in constant
voltage (CV) mode. In CV mode operation, the
charger regulates its output voltage to the 4.20V
(typ) charge termination voltage, and the charge
current is naturally reduced as the cell approaches
full charge. Charging continues until the charge
current drops to END-OF-CHARGE current
threshold, at which point the state machine jumps to
the END-OF-CHARGE (EOC) state. If the state-
machine does not jump out of the TOP-OFF state
before the Total-Charge Timeout period expires, the
state machine jumps to the EOC state and will re-
initiate a new charge cycle if VBAT falls below
termination voltage 170mv (typ). For more
information about the charge safety timers, see the
Charging Safety Times section.
END-OF-CHARGE State
In the End-of-Charge (EOC) state, the ACT8810
presents a high-impedance to the battery, allowing
the cell to “relax” and minimizes battery leakage
current. The ACT8810 continues to monitor the cell
voltage, so that it can re-initiate charging cycles
when VBAT drops to 170mV (typ) below the Charge
Termination Voltage.
SUSPEND State
In the SUSPEND state, ACT8810 disables the
charger but keeps other circuiting functional. Upon
exiting the SUSPEND State, the charge timer is
reset and the state machine jumps to
PRECONDITION state.
CHG_IN Bypass Capacitor Selection
CHG_IN is the power input for the ACT8810 battery
charger. The battery charger is automatically
enabled whenever a valid voltage is present on
CHG_IN. In most applications, CHG_IN is
connected to either a wall adapter or USB port.
Under normal operation, the input of the charger will
often be “hot-plugged” directly to a powered USB or
wall adapter cable, and supply voltage ringing and
overshoot may appear at the CHG_IN pin.
In most applications a high quality capacitor
connected from CHG_IN to GA, placed as close as
possible to the IC, is sufficient to absorb the energy.
Wall-adapter powered applications provide flexibility
in input capacitor selection, but the USB
specification presents limitations to input
capacitance selection. In order to meet both the
USB 2.0 and USB OTG (On The Go) specifications
while avoiding USB supply under-voltage conditions
resulting from the current limit slew rate
(100mA/µS) limitations of the USB bus, the
CHG_IN bypass capacitance value must to be
between 4.7µF and 10µF for the ACT8810.
Ceramic capacitors are often preferred for
bypassing applications due to their small size and
good surge current ratings, but care must be taken
in applications that can encounter hot plug
conditions as their very low ESR, in combination
with the inductance of the cable, can create a high-
Q filter that induces excessive ringing at the
CHG_IN pin. This ringing can couple to the output
and be mistaken as loop instability, or the ringing
may be large enough to damage the input itself.
ActivePathTM CHARGER
ACT8810
Rev 9, 15-Nov-12
Innovative PowerTM - 52 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
FUNCTIONAL DESCRIPTION CONT’D
Although the CHG_IN pin is designed for maximum
robustness and an absolute maximum voltage
rating of 14V for transients, attention must be given
to bypass techniques to ensure safe operation.
As a result, design of the CHG_IN bypass must
take care to “de-Q” the filter. This can be
accomplished by connecting a 1 resistor in series
with a ceramic capacitor (as shown in Figure 17), or
by using a tantalum or electrolytic capacitor to
utilize it’s higher ESR to dampen the ringing. For
additional protection in extreme situations, Zener
diodes with 12V clamp voltages may also be used.
In any case, it is always critical to evaluate voltage
transients at the ACT8810 CHG_IN pin with an
oscilloscope to ensure safe operation.
Figure 17:
CHG_IN Bypass Options for USB or Wall Adaptor Supplies
ACT8810
Rev 9, 15-Nov-12
PACKAGE OUTLINE AND DIMENSI ONS
Innovative PowerTM - 53 - www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
PACKAGE OUTLINE
TQFN55-40 PACKAGE OUTLINE AND DIMENSIONS
SYMBOL DIMENSION IN
MILLIMETERS DIMENSION IN
INCHES
MIN MAX MIN MAX
A 0.700 0.800 0.028 0.031
A1 0.200 REF 0.008 REF
A2 0.000 0.050 0.000 0.002
b 0.150 0.250 0.006 0.010
D 4.900 5.100 0.193 0.201
E 4.900 5.100 0.193 0.201
D2 3.450 3.750 0.136 0.148
E2 3.450 3.750 0.136 0.148
e 0.400 BSC 0.016 BSC
L 0.300 0.500 0.012 0.020
R 0.300 0.012
Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each
product to make sure that it is suitable for th eir applicatio ns. Active-Se mi products are not inten ded or aut horized for use
as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of
the use of any product or circuit described in this datasheet, nor does it convey any patent license.
Active-Semi and its logo are trademarks of Active-Semi, Inc. F or more info rmation on this and other products, contact
sales@active-semi.com or visit http://www.active-semi.com.
is a registered trademark of Active-Semi.
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