CS45-16io1R
Single Thyristor
Thyristor
2 1
3
Part number
CS45-16io1R
Backside: isolated
TAV
T
VV1.37
RRM
45
1600
=
V= V
I= A
Features / Ad vantages: Applications: Package:
Thyristor for line frequency
Planar passivated chip
Long-term stability
Line rectifying 50/60 Hz
Softstart AC motor control
DC Motor control
Power converter
AC power control
Lighting and temperature control
ISOPLUS247
Industry standard outline
RoHS compliant
Epoxy meets UL 94V-0
Soldering pins for PCB mounting
Backside: DCB ceramic
Reduced weight
Advanced power cycling
Isolation Voltage: V~
3600
IXYS reserves the right to change limits, conditions and dimensions. 20130306cData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
CS45-16io1R
V = V
A²s
A²s
kA²s
kA²s
Symbol Definition
Ratings
typ. max.
I
V
IA
V
T
1.36
R0.8 K/W
min.
45
VV
50T = 25°C
VJ
T = °C
VJ
mA3V = V
T = 25°C
VJ
I = A
T
V
T = °C
C
80
P
tot
150 WT = 25°C
C
45
1600
forward voltage drop
total power dissipation
Conditions Unit
1.73
T = 25°C
VJ
125
V
T0
V0.88T = °C
VJ
150
r
T
11 m
V1.37T = °C
VJ
I = A
T
V
45
1.85
I = A90
I = A90
threshold voltage
slope resistance for power loss calculation only
µA
125
VV1600T = 25°C
VJ
IA71
P
GM
Wt = 30 µs 10
max. gate power dissipation
P
T = °C
C
150
Wt = 5
P
P
GAV
W0.5
average gate power dissipation
C
J
22
j
unction capacitance V = V400 T = 25°Cf = 1 MHz
RVJ
pF
I
TSM
t = 10 ms; (50 Hz), sine T = 45°C
VJ
max. forward surge current
T = °C
VJ
150
I²t T = 45°C
value for fusing
T = °C150
V = 0 V
R
V = 0 V
R
V = 0 V
V = 0 V
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
VJ
R
VJ
R
thJC
thermal resistance junction to case
T = °C
VJ
150
520
560
970
940
A
A
A
A
440
475
1.35
1.31
1600
300 µs
RMS forward current
T(RMS)
TAV
180° sine
average forward current
(di/dt)
cr
A/µs
150repetitive, I =T
VJ
= 125°C; f = 50 Hz
critical rate of rise of current
V
GT
gate trigger voltage V= 6 V T = °C25
(dv/dt) T=125°C
critical rate of rise of voltage
A/µs500
V/µs
t = µs;
IA;V = V
R = ; method 1 (linear voltage rise)
VJ
DVJ
135 A
T
P
G
=0.3
di /dt A/µs;
G
=0.3
DDRM
cr
V = V
D DRM
GK
1000
1.5 V
T= °C-40
VJ
I
GT
gate trigger current V= 6 V T = °C25
DVJ
80 mA
T= °C-40
VJ
1.6 V
200 mA
V
GD
gate non-trigger voltage T= °C
VJ
0.2 V
I
GD
gate non-trigger current 10 mA
V = V
D DRM
125
latching current T= °C
VJ
150 mAI
L
25s
p
=10
IA;
G
= 0.3 di /dt A/µs
G
=0.3
holding current T= °C
VJ
100 mAI
H
25V= 6 V
D
R =
GK
gate controlled delay tim e T= °C
VJ
st
gd
25
IA;
G
= 0.3 di /dt A/µs
G
=0.3
V = ½ V
D DRM
turn-off time T= °C
VJ
150 µst
q
di/dt = A/µs;15 dv/dt = V/µs;20
V =
R
100 V; I A;
T
=45 V = V
D DRM
tµs
p
= 200
non-repet., I = 45 A
T
150
R
thCH
thermal resistance case to heatsink K/W
Thyristor
1700
RRM/DRM
RSM/DSM
max. non-repetitive reverse/forward blocking voltage
max. re pe titive reverse/forward bl ocking volt a ge
R/D
reverse current, drain current
T
T
R/D
R/D
200
0.25
IXYS reserves the right to change limits, conditions and dimensions. 20130306cData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
CS45-16io1R
Ratings
Product Mar
k
in
g
Date Code
Part No.
Logo
UL listed
IXYS
NNNNNN
Assembly Code
Ayyww
Assembly Line
ISOPLUS®
ABCXXXXXX
®
CS45-12io1 TO-247AD (3) 1200
Package
T
VJ
°C
T
stg
°C150
storage temperature -55
Weight g6
Symbol Definition typ. max.min.Conditions
virt ua l j un ctio n temp eratu re
Unit
F
C
N120
mount ing for ce w i th cli p 20
VV
t = 1 second
V
t = 1 minute
isolation voltage
mm
mm
2.7
4.1
d
Spp/App
creepage distance on surface | striking distance through air
d
Spb/Apb
terminal to backside
I
RMS
RMS current 70 A
per terminal
150-40
terminal to terminal
CS45-16io1 TO-247AD (3) 1600
ISOPLUS247
Similar Part Package Voltage class
CS45-08io1 TO-247AD (3) 800
Delivery Mode Quantity Code No.Part Number Marking on ProductOrdering
50/60 Hz, RMS; I 1 mA
ISOL
CS45-16io1R 480312Tube 30CS45-16io1RStandard
3000
3600
ISOL
threshold voltage V0.88
m
V
0 max
R
0 max
slope resistance * 8.5
Equivalent Circuits for Simulation
T =
VJ
IV
0
R
0
Thyristor
150°C
* on die level
IXYS reserves the right to change limits, conditions and dimensions. 20130306cData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
CS45-16io1R
Die konvexe Form des Substrates ist typ. < 0.04 mm über der
Kunststoffoberfläche der Bauteilunterseite
The convex bow of substrate is typ. < 0. 04 mm over plas ti c
surface level of device bottom si de
Die Gehäuseabmessungen entsprechen dem Typ TO-247 AD
gemäß JEDEC außer Schraubloch und Lmax.
This drawing will meet all dimensions requiarement of JEDEC
outline TO-247 AD except screw hole and except Lmax.
min max min max
A 4.83 5.21 0.190 0.205
A1 2.29 2.54 0.090 0.100
A2 1.91 2.16 0.075 0.085
b 1.14 1.40 0.045 0.055
b2 1.91 2.20 0.075 0.087
b4 2.92 3.24 0.115 0.128
c 0.61 0.83 0.024 0.033
D 20.80 21.34 0.819 0.840
D1 15.75 16.26 0.620 0.640
D2 1.65 2.15 0.065 0.085
D3 20.30 20.70 0.799 0.815
E 15.75 16.13 0.620 0.635
E1 13.21 13.72 0.520 0.540
e 5.45 BSC 0.215 BSC
L 19.81 20.60 0.780 0.811
L1 3.81 4.38 0.150 0.172
Q 5.59 6.20 0.220 0.244
R 4.25 5.50 0.167 0.217
W - 0.10 - 0.004
Dim. Millimeter Inches
E
123
R
DL
L1
Q
3x b
2x b2
b4
W
A
A2
c
A1
2x e
E1
D1
D2
D3
2 1
3
Outlines ISOPLUS247
IXYS reserves the right to change limits, conditions and dimensions. 20130306cData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
CS45-16io1R
0.01 0.1 1
200
250
300
350
400
450
0.5 1.0 1.5 2.0
0
20
40
60
80
100
10
0
10
1
10
2
10
3
10
4
0.0
0.1
0.2
0.3
0.4
ITSM
[A]
IT
[A]
VT [V]
t[ms]
ZthJC
[K/W]
23456789011
100
1000
10000
I2t
[A2s]
t[ms]
IT(AV)M
[A]
TC[°C]
0 255075100125150
0
20
40
60
80
Fig. 1 Forward characteristics Fig. 3 I2t versus time (1-10 ms)
t[s]
Fig. 6 Max. forward current
at case temperature
Fig. 2 Surge overload current
Fig. 8 Transient thermal impedance
T
VJ
= 25°C
T
VJ
= 125°C
T
VJ
=45°C
50 Hz, 80% V
RRM
T
VJ
=125°C
T
VJ
= 45°C
V
R
=0 V
125°C
150°C
02040
0
20
40
60
80
IF(AV) [A]
P(AV)
[W]
Fig. 7a Power dissipation versus direct output current
Fi
g
. 7b and ambient tem
p
erature
0 50 100 150
Tamb C]
dc =
1
0.5
0.4
0.33
0.17
0.08
10 100 1000
1
10
100
1000
1 10 100 1000 10000
0.1
1
10
IG[mA]
VG
[V]
4: P
GAV
=0.5W
5: P
GM
=1W
6: P
GM
=10W
tgd
[μs]
IG[mA]
typ. Limit
T
VJ
=125°C
Fig. 4 Gate trigger characteristics Fig. 5 Gate controlled delay time
6
4
5
2
1
3
1: I
GD
,T
VJ
=150°C
2: I
GT
,T
VJ
=25°C
3: I
GT
,T
VJ
=-40°C
R
thHA
0.6
0.8
1.0
2.0
4.0
8.0
dc =
1
0.5
0.4
0.33
0.17
0.08
R
thi
[K/W] t
i
[s]
0.044 0.011
0.039 0.0001
0.047 0.02
0.09 0.4
0.18 0.12
Thyristor
IXYS reserves the right to change limits, conditions and dimensions. 20130306cData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved