1999 Microchip Technology Inc. DS30609A-page 1
DEVICE MIGRATIONS
This document is intended to describe the functional differences and the electrical specification differences that are
present w h en mi gratin g fro m o ne d evic e to the next . Table 1 s hows t he c on si deration s th at must be taken in to a cc ou nt
when migrating from the PIC16C621A to the PIC16F627. Table 2 shows electrical and timing differences.
TABLE 1: PIC16C621A → PIC16F627 FUNCTIONAL DIFFERENCES
OSCILLATOR MODULE
ER Mode
The PIC16 F627 supports the new Exte rnal Resistor osc illator mod e. This mo de diff ers from the tr aditional RC oscillat or
mode i n tha t o nly a re si stor t o bia s cu rrent is requ ired. Desi gners shou ld v e rify their os cill ator de sign f o r suit abili ty in the
application before use. ER oscillator mode also supports Dual Speed mode.
EC Mode
The PIC 16F627 s upports the ne w External Cl ock- in mode . It is designe d f or usage in app lications where a system cloc k
is available. This mode provides a 1x clock directly to the PIC16F627 core. There is no gain stage in-line. Designers
should verify their oscillator design for suitability in the application before use.
IntRC Mode
The PIC16F627 IntRC oscillator mode now supports Dual Speed mode also.
Note: Even though compa tible devices are tested to the sam e ele ct rical sp ec ific ations, the device char a cte ristic s
may be different from each other (due to process differences). These process differences should have no
effect on systems that were designed well within the device spec ifications. For systems that operate close
to the device specifications, proc ess differences may cause the device to behave differently.
Note: Even though the user has made no changes to the oscillator circuit, oscillator operation should be verified
to ensure that it star ts and performs as expected. Adjusting the loading capacitor values and /or the oscil-
lator mode may be required.
No. Module Differences from PIC16C621A H/W S/W Prog.
1 Oscillator ER osc mode Yes ——
2 Oscillator Dual Speed mode Yes — —
3 Oscillator EC osc mode Yes — —
4 Oscill ato r Int RC os c mod e Yes — —
5 USART 9-bit USART Yes — —
6 Programming Low Voltage Programming mode — — Yes
7 Memory RAM — — Yes
8 Memory EEPROM Data Memory — — Yes
Legend: H/W - Issues may exist with regar d to the application circuit.
S/W - Issues may exist with regard to the user program.
Pro g. -Issues may exist with regard to programming.
PIC16C621A → PIC16F627 Migration
DS30609A-Page 2 1999 Microchip Technology Inc.
Dual Speed Mode
The PIC 16F627 supports Dual Speed mode when config ured i n eith er ER o r In tRC mode s. This sub-m ode of ope ratio n
toggles between a fixed 37 kHz frequency and the frequency set by either ER or IntRC modes.
USART MODULE
9-bit USART
The PIC16F627 USART now suppor ts 9-bit mode. This mode is useful in multi-processor communications. When bits
RX9 and ADEN in register RCSTA are set, multi-processor communication is enabled. The 9th bit is used to indicate
whether address or da ta is being transmitted by the Master.
MEMORY ORGANIZATION MODULE
RAM
The PIC16F627 has 224 bytes of data RAM, while the PIC16C621A has 80.
EEPROM Data
The PIC16F627 has 128 bytes of EEPROM data memory.
PROGRAMMING MODULE
Low Voltage Programming Mode
The PIC16F627 supports Low Voltage Prog ramming mo de. When the L VP bit of the configur ation word is asserted, plac-
ing a ‘1’ on the RB4/PGM pin will instruct the part to enter Low Voltage Programming mode.
CONFIG Reg. bits
FOSC<2:0> Description PCON Reg. bit
OSCF Result
111 ER mode w/clkout 1ER bias’ed speed
111 ER mode w/clkout 037 kHz
110 ER mode w/o clkout 1ER bias’ed speed
110 ER mode w/o clkout 037 kHz
101 IntRC w/clkout 14 MHz
101 IntRC w/clkout 037 kHz
100 IntRC w/o clkout 14 MHz
100 IntRC w/o clkout 037 kHz
Note 1: While in this mode, the RB4 pin can no longer be used as a general purpose I/O pin.
2: VDD must be 5.0V ±10% during erase/program operations while in low voltage programming mode.
DS30609A-Page 3 1999 Microchip Technology Inc.
TABLE 2: PIC16C621A → PIC16F627 ELECTRICAL SPECIFICATION DIFFERENCES
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are f or design guidance only and are not
tested.
Note 1: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in activ e oper ati on mode are:
OSC1 = ex ternal square wave, from rail to rail; all I /O pins tri-stated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
2: The power do wn current in SLEEP mode does not depend on the oscillator type . Power down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
3: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = VDD/2Rext (mA) with Rext in kΩ.
4: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base
IDD or IPD measurement.
5: Commercial temperature range only.
6: Includes EE static current. Does not include EE reads or writes.
Parm.
No. Sym. Characteristic
PIC16C621A Data
Sheet PIC16F627 Data
Sheet Units Conditions
Min Typ† Max Min Typ† Max
D010 IDD Supply Current (Note 1, 3) —
—
0.4
1.0
1.2
2.0
—
—
—
—
0.7
2.0
mA
mA
FOSC=4MHz, VDD=3.0V, WDT
Disabled, XT osc mode (Note 3)
FOSC=10MHz, VDD=3.0V, WDT
Disabled, HS osc mode (Note 5)
D023 ∆IWDT
∆ICOMP
∆IVREF
WDT Current (No te 4)
Comparator Current for
each Comparator (Note 4)
VREF Current (Note 4)
—
—
—
—
6.0
—
30
80
10
12
60
135
—
—
—
—
6.0
—
30
—
20
25
50
135
µA
µA
µA
µA
VDD=4.0V
(125°)
VDD=4.0V
VDD=4.0V
DS30609A-page 4 1999 Microchip Technology Inc.
TABLE 3: PIC16LC621A → PIC16LF627 ELECTRICAL SPECIFICATION DIFFERENCES
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are f or design guidance only and are not
tested.
Note 1: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in activ e oper ati on mode are:
OSC1 = ex ternal square wave, from rail to rail; all I /O pins tri-stated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
2: The power do wn current in SLEEP mode does not depend on the oscillator type . Power down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
3: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = VDD/2Rext (mA) with Rext in kΩ.
4: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base
IDD or IPD measurement.
5: Includes EE static current. Does not include EE reads or writes.
Parm.
No. Sym. Characteristic
PIC16LC621A Data
Sheet PIC16LF627 Data
Sheet Units Conditions
Min Typ† Max Min Typ† Max
D010 IDD Supply Current (Note 1, 3) ——1.1— —0.6mAFOSC=4MHz, VDD=2.5V, WDT
Disabled, XT osc mode (Note 3)
D023 ∆IWDT
∆ICOMP
∆IVREF
WDT Current (No te 4)
Comparator Current for
each Comparator (Note 4)
VREF Current (Note 4)
—
—
—
—
—
—
—
—
6.0
—
—
30
—
80
—
10
12
—
60
—
135
—
—
—
—
—
—
—
6.0
—
—
30
—
—
—
15
—
—
50
—
135
—
µA
µA
µA
µA
µA
µA
µA
VDD=3.0V
VDD=4.0V
(125°)
VDD=3.0V
VDD=4.0V
VDD=3.0V
VDD=4.0V
1999 Microchip Technology Inc. DS30609A-page 5
NOTES:
Information cont ai ned in this public ation regarding device applicat i ons and the like is i nte nded for suggesti on onl y and m ay be superseded by updates . No repr esentation or warranty is given and no liability is assumed
by Microchip Tec hnology Incorpora ted with respec t to the accurac y or use of such informa tion, or infringe ment of patent s or other intel lectual proper ty rights aris ing from such use or othe rwise. Use of Microchip’ s products
as critical c om ponents in life support syste m s is not authorize d exc ept with expres s written appro val by Microchip. No licenses are conve yed, implicitly or otherwise, unde r any intellectual property right s. The Mi crochip
logo and name are registered tradema rks of Mi crochip Technology Inc . in the U.S.A. and other count ries. All rights res erved. All other trademarks men tioned herein are the property of their res pective companies.
DS30609A-page 6 1999 Microchip Technology Inc.
All rights reserved. © 1999 Microchip Technology Incorporated. Printed in the USA. 12/99 Printed on recycled paper.
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