Modular FLATPAQ Modular Board-To-Board Hot Plug High Current Power Connectors TM Modular FLATPAQ connectors provide custom solutions to hot pluggable AC and DC power needs in a board-to-board format. By using off-the-shelf modular components, power and signal modules, guide pins and other available features can be combined in a configuration to meet your exact needs. Simply define which modules are required and in what sequence, using the Layout Sheet provided, and Elcon will provide samples, typically within one week. FEATURES Custom configurable modular design 35A hot pluggable contacts Blind-mating Sequenced mating for power & signal Solder or press-fit terminations Active guide pin Low insertion force Off-the-shelf modular components APPLICATIONS Board-to-board power connections Power supplies, UPS Telecommunications Computers and file servers Aerospace power applications High Current Capabilities FLATPAQ uses Elcon's highly reliable CROWN BAND technology that guarantees low insertion and extraction forces, minimal voltage drop and reduced temperature rise. Rated at 35A, FLATPAQ may handle even higher currents when mounted on boards with 5 oz. copper traces or onto a busbar (see Test Data on last page). Guide Pins FLATPAQ guide modules, both passive and active (for premate ground), are offered to provide increased gatherability for aligning connectors during blind mating. MDFP-010226LTUS (c) Copyright Elcon Products International Company 2001 Contact Termination Options FLATPAQ offers a variety of contact terminations for mounting to printed circuit boards, such as compliant press-fit, solder tail length options, and a retentive feature that holds the connector in place prior to soldering. Sequenced Mating Power blades are available in standard, postmate and premate lengths, allowing mating sequences suited to any design requirement. Signal contacts are available in standard and premate lengths.(1) Dimensions, specifications and product external appearance subject to change without Regulatory Agency Evaluations Modular FLATPAQ has been evaluated by Underwriters Laboratories Inc. to the U.S. standard UL1977 (USR); by UL (CNR) and CSA to the Canadian standard C22.2 No. 182.3-M1987 for use in data, signal, control and power applications; and by TUV to the European standard EN60950.(2) Bauart R PRODUCT SERVICE gepruft FLATPAQ Connector Layout Company Location Use this sheet to specify the desired connector layout. Please copy this sheet prior to completion to allow reuse. Contact Name Title INSTRUCTIONS Telephone Fax FAX TO ELCON AT (510) 490-3740 Indicate the connector layout by filling in the FP number of each module required in the ( ) ( ) boxes below, one per box. Use one form per mated pair. Signature EMail Address The left to right order of the modules should match the mating face views of the connector. Quantity Required Date When laying out right angle assemblies, make sure that you look at the mating face with the termination tails facing downwards. For solder terminated assemblies, indicate the tail length for each half of the connector and whether the retentive feature is required using the checkboxes to the right of the layout grid. Upon receipt of this form, Elcon will generate a Customer Use Drawing for you to check and approve prior to connector production. Write the "FP" numbers to indicate the layout of one half of the connector assembly, matching the left to right order with the mating face view of the connector (right angle assembly tails facing downwards). FP FP FP FP FP FP FP FP FP FP FP FP FP FP Solder tail options .062" thick board .093" thick board .125" thick board Retentive feature Write the "FP" numbers to indicate the layout of the mate to the above assembly, matching the left to right order with the mating face view of the connector (right angle assembly tails facing downwards). FP FP FP FP FP FP FP FP FP FP FP FP FP FP Solder tail options .062" thick board .093" thick board .125" thick board Retentive feature SOLDER TERMINATED MODULES SOLDER TAIL OPTIONS RIGHT ANGLE TAILS STRAIGHT TAILS 250V Power Modules The following options are available when specifying solder terminated assemblies. Indicate these options by marking the check-boxes to the right of the connector layout grid. 250V Power Modules Tail length FP100 Socket FP101 Standard FP102 Premate FP103 Postmate 600V Power Modules FP104 Socket FP105 Standard FP106 Premate FP107 Postmate 600V Power Modules Solder tails are available in 3 lengths. Select depending on board thickness and mounting style (straight or right angle assembly). See table below or, for more details, refer to TERMINATION OPTIONS at the bottom of next page. Board Thickness .062" .093" FP116 Socket FP118 Premate FP117 Standard FP119 Postmate Signal Modules FP120 Socket FP121 Standard FP122 Premate FP123 Postmate Signal Modules .125" Straight Tails Right Angle Tails .115" (2.92mm) Nominal .143" (3.6mm) Nominal .177" (4.5mm) Nominal .115" (2.92mm) Nominal .177" (4.5mm) Nominal .177" (4.5mm) Nominal Retentive feature Consists of precisely formed solder tails on the contacts of the outermost power modules of the assembly, as shown in the drawing below. FP300 24-pin FP301 24-pin socket FP312 6-pin PRESS-FIT TERMINATED MODULES 250V Power Modules FP200 Socket FP201 Standard FP313 6-pin socket FP302 24-pin For 0.093" or thicker boards FP203 Postmate FP412 6-pin FP314 6-pin FP400 24-pin FP315 6-pin socket Power module with retentive feature OTHER MODULES Mounts Signal Modules FP202 Premate FP303 24-pin socket FP500 Left flange mount 600V Power Modules Guides FP502 Straight passive guide socket Right angle guide sockets FP506 Passive FP516 Active Straight guide pins FP507 Right angle FP503 Passive passive FP515 Active, M3 guide pin FP517 Active, 4-40 Spacers (without contacts) FP216 Socket FP217 Standard FP218 Premate FP219 Postmate FP413 6-pin socket FP401 24-pin socket FP501 Right flange mount FP511 Straight 250V spacer FP512 Right angle 250V spacer FP513 Straight 600V spacer FP514 Right angle 600V spacer DIMENSIONS The drawings below show module dimensions for one of the countless layouts possible with Modular FLATPAQ. These drawings are for reference only. To do actual engineering design work, request a Customer User Drawing (CUD) from Elcon for your particular module configuration. Power Blade Length Blade Type Premat e St andard Post mat e .551 (14.00) Straight Assembly Dimension "A" Inches mm .492 12.50 .413 10.50 .335 8.50 .276 (7.00) .295 (7.50) .472 (12.00) .472 (12.00) .472 (12.00) .472 (12.00) .295 (7.50) 1.043 (26.50) .335 (8.50) .984 (25.00) SOCKET .366 (9.30) DIM "A" (See table above.) .551 (14.00) LEFT END CAP PASSIVE GUIDE PIN 250V POWER PIN/SOCKET 24 POS. SIGNAL PIN /SOCKET 6 POS. 600V SIGNAL POWER PIN/SOCKET PIN/SOCKET ACTIVE GUIDE PIN RIGHT END CAP 4-40 or M3 screw, user supplied. PC Board Footprint .098 (2.50) 4 PL .118 (3.00) 2 PL O .187 (4.75) Plated thru hole .098 (2.50) 8 PL .197 (5.00) .098 (2.50) 0 0 .197 (5.00) O .138 (3.50) 2 PL Non-plated holes .098 (2.50) 0 .758 (19.25) 1.142 (29.00) 1.624 (41.25) 2.087 (53.00) 3.189 (81.00) 3.622 (92.00) Dimensions, specifications and product external appearance subject to change without notice. TERMINATION OPTIONS Solder termination Solder termination is available in three lengths for straight connectors, and in two lengths for rightangle assemblies. Please refer to the table below for board thicknesses and recommended tail lengths. PC Board Surface (Ref.) DIM "B" (See table below) Solder Tail Detail Relationship between tail length and board thicknesses Board Thickness .062" .093" .125" Straight Mounting Dimension "B" .100" - .140" (2.55 - 3.57mm) [.115" (2.92mm) nominal] .130" - .170" (3.30 - 4.32 mm) [.143" (3.6mm) nominal] .160" - .200" (4.06 - 5.08mm) [1.77" (4.5mm) nominal] Right Angle Mounting .100" - .140" (2.55 - 3.57mm) [.115" (2.92mm) nominal] .160" - .200" (4.06 - 5.08mm) [1.77" (4.5mm) nominal] .160" - .200" (4.06 - 5.08mm) [1.77" (4.5mm) nominal] Compliant press-fit termination PC Board Surface (Ref.) Compliant press-fit termination is available for .160 (4.06) straight assemblies only, and it is designed for .200 (5.08) use with boards 0.093" thick and above. Tooling for compliant press-fit assemblies Compliant press-fit detail Press plates are recommended for compliant press-fit assemblies. Elcon will provide details of the recommended tooling fixture for each assembly. Insertion & extraction forces of compliant modules Forces: Tested per MIL-C-28859 (reference only) Push In: 11.2 - 22.5 lbs. per pin (50 - 100N) Push Out: 10.1 - 20.2 lbs. per pin (45 - 90N) Units: Inches (mm) DIMENSIONS The drawings below show module dimensions for one of the countless layouts possible with Modular FLATPAQ. These drawings are for reference only. To do actual engineering design work, request a Customer User Drawing (CUD) from Elcon for your particular module configuration. Power Blade Length Blade Type Premat e St andard Post mat e Dimension "A" Inches mm .492 12.50 .413 10.50 .335 8.50 .787 (20.00) .551 (14.00) Right Angle Assembly .276 (7.00) SOCKET .366 (9.30) DIM "A" (See table above.) .295 (7.50) .472 (12.00) .472 (12.00) .472 (12.00) 1.043 (26.50) .472 (12.00) .295 (7.50) .335 (8.50) .551 (14.00) LEFT END CAP 250V 6 POS. PASSIVE POWER PIN/SOCKET SIGNAL 600V GUIDE PIN/SOCKET POWER SOCKET PIN/SOCKET PC Board Footprint RIGHT END CAP 24 POS. SIGNAL PIN /SOCKET ACTIVE GUIDE SOCKET .098 (2.50) 8 PL .098 (2.50) .098 (2.50) 8 PL .118 (3.00) 2 PL .098 (2.50) 4 PL .197 (5.00) 0 0 .197 (5.00) O .138 (3.50) 2 PL Non-plated holes 0 .758 (19.25) 1.142 (29.00) 1.624 (41.25) 2.087 (53.00) 3.140 (79.75) 3.622 (92.00) Dimensions, specifications and product external appearance subject to change without notice. SUGGESTED PRINTED CIRCUIT HOLE BLIND MATING ALIGNMENT 0.025 (.63) .082 (2.08) 0.005 (.12) O 0.043 (1.09) 0.002 (.04) 0.043 (1.09) Maximum Misalignment O 0.037 (.94) Solder and compliant press-fit termination area Finished Hole: Drilled Hole: Copper Plate: Tin Plate: A O.040 .0030 (O1.02 .08) O.0453 .0005 (O1.15 .013) .0010 (.025) min. (per surface) .0003 (.008) min. (per surface) Section A-A A Without Guides 0.18 (4.57) With Guide Pin/Socket Product Specifications MATERIALS Insulators Signal Contacts Crown Bands Power Socket Contacts Power Blade Contacts Passive Guide Pin Other Modules Activated Guide Pin Activated Guide Socket Contact PPA, UL 94-V-0 flammability rated, color black Solder termination brass alloy per ASTM-B-36; compliant termination phosphor bronze alloy per ASTM-B-103, selectively plated with gold per MIL-G-45204, Type II, Grade C, Class 0 (30in minimum) and bright tin/lead per MIL-T-10727, Type 1 (100in minimum) on terminations, all over nickel per QQ-N-290, Class 2 (50in minimum) Beryllium copper alloy per ASTM-B-194, selectively plated with gold per MIL-G-45204, Type II, Grade C, Class 0 (30in minimum), over nickel per QQ-N-290, Class 2 (50in minimum) Phospor bronze alloy per ASTM-B-103, selectively plated with bright tin/lead per MIL-T-10727, Type 1 (100in minimum) on terminations, over nickel per QQ-N-290 Copper alloy per ASTM-B-152, selectively plated with gold per MIL-G-45204, Type II, Grade C, Class 0 (30in minimum), over nickel per QQ-N-290, Class 2 (50in minimum) Brass alloy per ASTM-16 plated with nickel per AMS2404 Tellurium copper alloy per ASTM-B-301, plated with silver per QQ-S-365 Phosphor bronze per ASTM-B-103, plated with silver per QQ-S-365 ELECTRICAL Regulatory Power Contact Agency Ratings Signal Contact Contact Resistance UL/TUV CUR/CSA UL/TUV CUR/CSA 35A at 250V (50 cycles, hot plug module) 20A at 250V (50 cycles, hot plug module) 3A 2.5A Power Contact 2m maximum initial, (3m maximum after 500 cycles durability), at 35A per MIL-STD 1344, Method 3004 Signal Contact 15m maximum initial, (30m maximum after 500 cycles durability), at 100mA, 20mV, per MIL-STD 1344, Method 3002 Insulation Power Contact Resistance Signal Contact Dielectric Power Contact Strength Signal Contact MECHANICAL Power Contact Insertion Force Signal Contact Extraction Power Contact Force Signal Contact Power Contact Durability Signal Contact Power Contact Contact Retention Signal Contact Tooling Marking ENVIRONMENTAL Temperature Rating Vibration Shock Humidity Temperature Life Solderability 5,000M minimum at 500VDC for 2 minutes, per MIL-STD 1344, Method 3003 1,500VDC for 1 minute, per MIL-STD 1344, Method 3001 4.0lbf maximum 5.0ozf maximum using .0305" (.775mm) diameter steel test pin 1.0lbf minimum 0.5ozf minimum using .0295" (.749mm) diameter steel test pin 500 cycles, per MIL-STD-1344, Method 2016 10.0lbf minimum 5.0lbf minimum Press fixture is recommended for compliant press fit assemblies Consult ELCON for details. Connectors are marked with manufacturer's logo, part number and lot code. -40C to +105C MIL-STD 1344, Method 2005, Test Condition II MIL-STD 1344, Method 2004, Test Condition I MIL-STD 1344, Method 1002, Type 1, Test Condition B MIL-STD 1344, Method 1005, Test Condition 4D (105 2C, 1,000 hours) MIL-STD 202, Method 208 Test Data The two graphs below show the performance of Modular FLATPAQ in terms of temperature rise and voltage drop against current. Both tests were performed on 250V power modules mounted on PC boards with 2 oz., 3 oz. and 5 oz. copper traces. VOLTAGE DROP TEMPERATURE RISE 20 100 Copper Thickness 2 oz. 3 oz. 5 oz. TEMPERATURE, C 80 70 18 60 50 40 30 14 12 10 8 6 20 4 10 2 0 0 5 10 15 20 Copper Thickness 2 oz. 3 oz. 5 oz. 16 VOLTAGE DROP, mV 90 25 30 35 40 45 50 0 55 0 5 10 15 20 25 30 35 40 CURRENT, AMPERES CURRENT, AMPERES Dedicated FLATPAQ Popular configurations are available as premolded FLATPAQ connectors. Elcon will automatically suggest the optimum solution for your application from all currently tooled insulators. For more information, request Dedicated FLATPAQ product literature from Elcon. SERVERPAK Cost-effective FLATPAQ specifically designed for high-end PC servers. SERVERPAK features 8 power and 24 signal contacts in less than 3.5" (90 mm) of length. Dedicated FLATPAQ This is one of the many dedicated FLATPAQ connectors that replicate the modular FLATPAQ, resulting in a more cost effective solution. 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