User's Manual IE-703102-MC-EM1, IE-703102-MC-EM1-A In-circuit Emulator Optional Board Target device V850E/MS1TM Document No. U13876EJ1V0UM00 (1st edition) Date Published December 1998 N CP(K) (c) Printed in Japan 1998 1991 [MEMO] 2 V850E/MS1 is a trademark of NEC Corporation. Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/or other countries. PC/AT is a trademark of International Business Machines Corporation. Ethernet is a trademark of Xerox Corporation. UNIX is a registered trademark in the United States and other countries, licensed exclusively through X/Open Company Limited. The information in this document is subject to change without notice. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or of others. M7A 96. 10 3 Regional Information Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify: * Device availability * Ordering information * Product release schedule * Availability of related technical literature * Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) * Network requirements In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. NEC Electronics Inc. (U.S.) NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd. Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580 Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 NEC Electronics (France) S.A. Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411 NEC Electronics (France) S.A. NEC Electronics Singapore Pte. Ltd. Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 Spain Office Madrid, Spain Tel: 01-504-2787 Fax: 01-504-2860 United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583 NEC Electronics Italiana s.r.l. NEC Electronics (Germany) GmbH Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99 Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388 NEC Electronics (Germany) GmbH Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490 NEC Electronics (UK) Ltd. NEC Electronics Hong Kong Ltd. NEC Electronics Taiwan Ltd. Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951 NEC do Brasil S.A. Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829 J98. 11 4 INTRODUCTION Readers This manual is intended for users who design and develop application systems TM using the V850E/MS1 . Purpose The purpose of this manual is to describe the proper operation of the IE-703102-MCEM1 and IE-703102-MC-EM1-A, and their basic specifications. Organization This manual is broadly divided into the following parts. * Overview * Name and function of components * Cautions How to Read This Manual It is assumed that the reader of this manual has general knowledge of electrical engineering, logic circuits, and microcontrollers. The IE-703102-MC-EM1 and IE-703102-MC-EM1-A are used connected to the IE-703102-MC in-circuit emulator. This manual explains the basic setup procedure and switch settings of the IE-703102-MC-EM1 and IE-703102-MCEM1-A. For the names and functions, and the connection of parts, refer to the IE-703102-MC User's Manual, which is a separate volume. To understand the basic specifications and operation methods broadly Read this manual in the order listed in CONTENTS. To know the operation methods and command functions of the IE-703102-MC, IE703102-MC-EM1, and IE-703102-MC-EM1-A Read the user's manual of the debugger (separate volume) that is used. Conventions Note: Footnote for item marked with Note in the text Caution: Information requiring particular attention Remark: Supplementary information Binary ... xxxx or xxxxB Numeral representations: Decimal ... xxxx Hexadecimal ... xxxxH Prefixes representing the powers of 2 (address space, memory capacity): 10 K (kilo): 2 = 1024 20 M (mega): 2 = 1024 Terminology 2 The meanings of terms used in this manual are listed below. Target device Device that is emulated. Target system The system (user-built system) to be debugged. This includes the target program and user-configured hardware. 5 Product Names Unless otherwise specified, the IE-703102-MC-EM1 is treated as the representative model in this manual. When using the IE-703102-MC-EM1-A, read IE-703102-MC-EM1 as IE703102-MC-EM1-A. For functional differences between IE-703102-MC-EM1 and IE- 703102-MC-EM1-A, refer to CHAPTER 1 OVERVIEW. Related Documents The related documents indicated in this publication may include preliminary versions. However, preliminary versions are not marked as such. { Documents related to V850E/MS1 Document Name Document Number V850E/MS1 User's Manual-Hardware U12688E V850E/xxx User's Manual-Architecture U12197E PD703100-40, 703101-33, 703102-33 Data Sheet To be prepared PD703100-A40, 703101-A33, 703102-A33 Data Sheet To be prepared PD70F3102-33 Data Sheet U13844E PD70F3102-A33 Data Sheet U13845E { Documents related to development tools (User's Manual) Product Name Document Number IE-703102-MC (In-circuit emulator) U13875E IE-703102-MC-EM1, IE-703102-MC-EM1-A (In-circuit emulator optional board) CA850 (C Compiler package) TM Operation UNIX based TM U12839E Operation Windows based U12827E C language U12840E Assembly Language U10543E ID850 (Integrated debugger) Operation Windows based U13716E RX850 (Real-time OS) Basics U13430E Technical U13431E Installation U13410E Fundamental Under preparation Technical U13772E Installation U13774E RX850 Pro (Real-time OS) Note RD850 (Task debugger) U11158E RD850 (Ver. 3.0) (Task debugger) U13737E AZ850 (System performance analyzer) Operation U11181E Note 6 This manual Supports ID850 (Ver. 1.31 only) CONTENTS CHAPTER 1 1.1 1.2 1.3 1.4 1.5 1.6 Hardware Configuration .............................................................................................................12 Features (When Connected to IE-703102-MC)..........................................................................13 Function Specifications (When Connected to IE-703102-MC) ................................................14 System Configuration .................................................................................................................15 Contents in Carton ......................................................................................................................16 Connection between IE-703102-MC and IE-703102-MC-EM1 ..................................................17 CHAPTER 2 2.1 2.2 2.3 2.4 OVERVIEW .........................................................................................................................11 NAME AND FUNCTION OF COMPONENTS.................................................................19 Component Name and Function of IE-703102-MC-EM1 ..........................................................19 Clock Settings..............................................................................................................................21 MODE Pin Setting ........................................................................................................................22 2.3.1 MODE pin setting when emulator is used as stand-alone unit ...................................................... 22 2.3.2 MODE pin setting when emulator is used connected to target system ......................................... 22 Power Supply Settings ...............................................................................................................23 2.4.1 JP2 setting when the emulator operates as a stand-alone unit and target system power is off.... 23 2.4.2 JP2 setting when power of the target system is on ....................................................................... 23 CHAPTER 3 FACTORY SETTINGS .........................................................................................................25 CHAPTER 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 CAUTIONS..........................................................................................................................27 VDD and HVDD of Target System ..................................................................................................27 X1 Signal ......................................................................................................................................27 Pin Termination ...........................................................................................................................28 Internal RAM and ROM ...............................................................................................................29 Port 4 to 6, A, and B ....................................................................................................................30 Bus Interface Pin .........................................................................................................................31 Emulation Memory Operation Timing Difference.....................................................................33 APPENDIX A DIMENSIONS ....................................................................................................................35 APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION ....................41 APPENDIX C CONNECTORS FOR TARGET CONNECTION.............................................................43 C.1 C.2 Use ................................................................................................................................................43 Cautions on Handling Connectors ............................................................................................45 APPENDIX D MOUNTING OF PLASTIC SPACER..............................................................................47 7 LIST OF FIGURES Figure No. Title Page 1-1. System Configuration ....................................................................................................................................... 15 1-2. Contents in Carton............................................................................................................................................ 16 1-3. Connection between IE-703102-MC and IE-703102-MC-EM1......................................................................... 17 2-1. IE-703102-MC-EM1.......................................................................................................................................... 19 2-2. Power Supply Settings (When the Emulator Operates as a Stand-Alone Unit and Target System Power is Off) .......................................................................................................................................................................... 23 2-3. Power Supply Setting (When Power of the Target System is On).................................................................... 23 4-1. Schematic Diagram of Power Supply Flow....................................................................................................... 27 4-2. Diagram of X1 Signal Flow ............................................................................................................................... 28 4-3. Circuit Diagram of CKSEL Pin .......................................................................................................................... 28 4-4. Circuit Diagram of Port 4 to 6, A, and B ........................................................................................................... 30 C-1. Mounting of NQPACK144SD............................................................................................................................ 43 C-2. Mounting Device............................................................................................................................................... 44 C-3. NQPACK100SD and Device Pin ...................................................................................................................... 44 D-1. Mounting Method of Plastic Spacer.................................................................................................................. 47 8 LIST OF TABLES Table No. 2-1. Title Page Clock Setting (When the Emulator is Used as a Stand-Alone Unit) ................................................................. 21 2-2. Clock Setting (When the Emulator is Used in Target System Connection)...................................................... 21 2-3. MODE Pin Setting when Emulator is Used as Stand-Alone Unit ..................................................................... 22 2-4. MODE Pin Setting when Emulator is Used Connected to Target System........................................................ 22 4-1. Memory Capacity Limitation List ...................................................................................................................... 29 4-2. Bus Interface Pin Operation List....................................................................................................................... 31 9 [MEMO] 10 CHAPTER 1 OVERVIEW The IE-703102-MC-EM1 is an optional board for the in-circuit emulator IE-703102-MC. By connecting the IE703102-MC-EM1 to IE-703102-MC, hardware and software can be debugged efficiently in system development using the V850E/MS1. IE-703102-MC-EM1 is an optional board when HVDD = 5 V IE-703102-MC-EM1-A is an optional board when HVDD = 3.3 V In this manual, the basic setup sequences and switch settings of the IE-703102-MC-EM1 when connecting it to the IE-703102-MC are described. For the names and functions of the parts of the IE-703102-MC, and for the connection of elements, refer to the IE-703102-MC User's Manual (U13875E) which is a separate volume. 11 CHAPTER 1 OVERVIEW 1.1 Hardware Configuration Optionalsold hardware Separately hardware In-circuit emulator (IE-703102-MC) Optional board IE-703102-MC-EM1 IE-703102-MC-EM1-A IE-703102-MC can be used as in-circuit emulator for V850E/MS1 by adding these boards. Separately sold hardware Extension probe Note 1 (SC-xxxSDA ) General-purpose extension probe made by TOKYO ELETECH CORPORATION. PC interface board IE-70000-xx-IF-B IE-70000-xx-IF-C IE-70000-PCI-IF IE-70000-CD-IF-A These boards are used to connect the IE-703102-MC to a personal computer. These boards are inserted in the expansion slot of the personal computer. Note 2 xx: 98 (for PC-9800 series C bus) Note 2 TM PC (for IBM PC/AT compatible ISA bus) IE-70000-PCI-IF : for PCI bus IE-70000-CD-IF-A : for PCMCIA socket Network module (IE-70000-MC-SV3) The module is used when a workstation controls the IE-703102-MC via ethernetTM. Power adapter (IE-70000-MC-PS-B) AC adapter dedicated to the NEC's in-circuit emulator Notes 1. For further information, contact Daimaru Kogyo Co., Ltd. Tokyo Electronic Components Division (TEL +81-3-3820-7112) Osaka Electronic Components Division (TEL +81-6-244-6672) 2. These interface boards cannot be used for the PC98-NX series. 12 CHAPTER 1 OVERVIEW 1.2 Features (When Connected to IE-703102-MC) { Maximum operation frequency: 40 MHz (HVDD = 3.3 V or 5.0 V operation) { Extremely lightweight and compact { Higher equivalence with target device can be achieved by omitting buffer between signal cables. { Following pins can be masked. RESET, NMI, WAIT, HLDRQ { Two methods of connection to target system: * Direct connection of the IE-703102-MC-EM1 * Attach an extension probe (sold separetely) to the connection tab of the IE-703102-MC-EM1. { Dimensions of the IE-703102-MC-EM1 are as follows. Parameter Value Note 0.4 W (at 40-MHz operation frequency) Power dissipation External dimensions (Refer to APPENDIX A DIMENSIONS) Weight Height 15 mm Length 207 mm Width 96 mm 170 g Note The power dissipation is 11.4 W when IE-703102-MC + IE-703102-MC-EM1. 13 CHAPTER 1 OVERVIEW 1.3 Function Specifications (When Connected to IE-703102-MC) Parameter Emulation memory capacity Execution/pass detection Coverage memory capacity Memory access detection Coverage memory capacity Specification Internal ROM 128 Kbytes External memory 2 Mbytes Internal ROM 128 Kbytes External memory In ROM-less mode 2 Mbytes When using iROM 1 Mbyte External memory 1 Mbyte Trace memory capacity 168 bits x 32 Kframes Time measurement function Can be measured with time tag and timers (3 lines) External logic probe 8-bit external trace is possible Event setting for trace/break is possible Break function Event break Step execution break Forced break Fail safe break * Illegal access to peripheral I/O * Access to guard space * Write to the ROM space Caution 14 Some of the functions may not be supported depending on the debugger used. CHAPTER 1 OVERVIEW 1.4 System Configuration The system configuration when connecting the IE-703102-MC-EM1 to the IE-703102-MC, which is then connected to a personal computer (PC-9800 series or PC/AT compatible) is shown below. Figure 1-1. System Configuration <12> <5> <13> <6> <7> [Magnified drawing: example of use of connector for target connection] <11> <4> <2> <9> Target system <10> For PC-9800 series <8> <3> <9> <10> For PC/AT <1> Target system Remark <1> Personal computer (PC-9800 series or PC/AT compatible) <2> Debugger (sold separately) <3> PC interface board (IE-70000-98-IF-B/IE-70000-98-IF-C, IE-70000-PC-IF-B/IE-70000-PC-IF-C : sold separately ) <4> PC interface cable (included with IE-703102-MC) <5> In-circuit emulator (IE-703102-MC: sold separately) <6> In-circuit emulator option board (IE-703102-MC-EM1) <7> External logic probe (included with IE-703102-MC) <8> Extension probe (SC-144SD, SC-144SD PR: sold separately) <9> Connector for emulator connection (YQPACK144SD: included) <10> Connector for target connection (NQPACK144SD: included) <11> Power adapter (IE-70000-MC-PS-B: sold separately) <12> AC100-V power cable (sold separately: included with IE-70000-MC-PS-B) <13> AC220-V power cable (sold separately: included with IE-70000-MC-PS-B) 15 CHAPTER 1 OVERVIEW 1.5 Contents in Carton The carton of the IE-703102-MC-EM1 contains a main unit, guarantee card, packing list, and accessory bag. Make sure that the accessory bag contains this manual and connector accessories. In case of missing or damaged contents, contact an NEC sales representative or an NEC distributor. Figure 1-2. Contents in Carton <1> IE-703102-MC-EM1 <4> Packing list <3> Guarantee card <2> Accessory bag <1> IE-703102-MC-EM1 x 1 <2> Accessory bag x 1 <3> Guarantee card x 1 <4> Packing list x 1 Make sure that the accessory bag contains this manual and an accessory list (1 sheet). 16 CHAPTER 1 OVERVIEW 1.6 Connection between IE-703102-MC and IE-703102-MC-EM1 The procedure for connecting the IE-703102-MC and IE-703102-MC-EM1 is described below. Caution Connect carefully so as not to break or bend connector pins. <1> Remove the pod cover (upper and lower) of the IE-703102-MC. <2> Set the PGA socket lever of the IE-703102-MC-EM1 to the OPEN position as shown in Figure 1-3 (b). <3> Connect the IE-703102-MC-EM1 to the PGA socket at the back of the pod (refer to Figure 1-3 (c)). When connecting, position the IE-703102-MC and IE-703102-MC-EM1 so that they are horizontal. Spacers can be connected to fix the pod. (refer to APPENDIX D MOUNTING OF PLASTIC SPACER) <4> Set the PGA socket lever of the IE-703102-MC-EM1 to the CLOSE position as shown in Figure 1-3 (b). <5> Fix the IE-703102-MC-EM1 between the pod covers (upper and lower) with nylon rivets. <6> Secure the pod cover (upper) end with nylon rivets. Figure 1-3. Connection between IE-703102-MC and IE-703102-MC-EM1 (1/2) (a) Overview Nylon rivets Upper cover IE-703102-MC-EM1 Nylon rivets IE-703102-MC Lower cover Nylon rivets 17 CHAPTER 1 OVERVIEW Figure 1-3. Connection between IE-703102-MC and IE-703102-MC-EM1 (2/2) (b) PGA Socket Lever of IE-703102-MC-EM1 CLOSE OPEN (c) Connecting part (IE-703102-MC-EM1) Pin A1 location : Insertion guide : IE-703102-MC insertion area 18 CHAPTER 2 NAME AND FUNCTION OF COMPONENTS This chapter describes the names, functions, and switch settings of components comprising the IE-703102-MCEM1. For the details of the pod, jumper, and switch positions, etc., refer to the IE-703102-MC User's Manual. 2.1 Component Name and Function of IE-703102-MC-EM1 Figure 2-1. IE-703102-MC-EM1 (a) Top View (b) Bottom View Direction of pin 1 of the connector for target connection Direction of pin 1 of the connector for target connection Connector for target connection 2 1 JP1 OSC 8 2 7 1 TP1 TP2 JP2 TP3 4 3 TP4 TP5 TP6 V850E/MS1 I/O chip CKSEL (Green) LED PLL SW1 DIRECT Connector for connection to IE-703102-MC 19 CHAPTER 2 NAME AND FUNCTION OF COMPONENTS (1) Test pin (TP1 to TP6) To leave the DMA cycle or refresh cycle in the tracer, or break these cycles, connect these pins to the external logic probe. * TP1: GND * TP2: REFRQ * TP3: DMAAK0 * TP4: DMAAK1 * TP5: DMAAK2 * TP6: DMAAK3 (2) SW1 This is a switch for clock mode switching (for details, refer to 2.2 Clock Settings). (3) JP1 This is a switch jumper for the clock supply source (for details, refer to 2.2 Clock Settings). (4) JP2 This is a switch jumper for the power supply (for details, refer to 2.4 Power Supply Settings). (5) LED (CKSEL: Green) LED Status When Used as a Stand-Alone Unit When Used in Target System Connection ON SW1 = DIRECT The CKSEL signal from the target system is high OFF SW1 = PLL The CKSEL signal from the target system is low (6) Connector for IE-703102-MC connection This is a connector for connecting the IE-703102-MC. (7) Connector for target connection This is a connector for connecting the target system or the extension probe. 20 CHAPTER 2 2.2 NAME AND FUNCTION OF COMPONENTS Clock Settings This section describes the clock settings. For JP1 and SW1, refer to Figure 2-1. Table 2-1. Clock Setting (When the Emulator is Used as a Stand-Alone Unit) Clock Supply Source Setting JP1 Setting Clock Supply Method Internal clock Clock Mode Setting Note SW1 Setting (CKSEL Setting) PLL mode 2 8 1 7 PLL DIRECT Direct mode PLL DIRECT Note Setting any other state is prohibited. Table 2-2. Clock Setting (When the Emulator is Used in Target System Connection) Clock Supply Source Setting JP1 Setting Clock Supply Method Internal clock/target Note 2 clock Clock Mode Setting Note 1 SW1 Setting (CKSEL Setting) PLL mode CKSEL Setting of Target System Low level 2 8 1 7 PLL DIRECT Direct mode High level PLL DIRECT Notes 1. Setting any other state is prohibited. 2. Switching the internal clock and target clock is done with the debugger. 21 CHAPTER 2 2.3 NAME AND FUNCTION OF COMPONENTS MODE Pin Setting The emulator operation mode can be changed with the MODE pin setting. 2.3.1 MODE pin setting when emulator is used as stand-alone unit When the emulator is used as a stand-alone unit, MODE0 and MODE1 in the emulator are set as follows. The setting cannot be changed. Table 2-3. MODE Pin Setting when Emulator is Used as Stand-Alone Unit Emulator Operation Settings Inside Emulator MODE0 Single-chip mode 0 Low-level input MODE1 High-level input 2.3.2 MODE pin setting when emulator is used connected to target system When the emulator is connected to a target system, set the MODE pins of the target system as follows based on the emulator operations. The MODE2 and MODE3 signals in the target system are not used in the emulator. Table 2-4. MODE Pin Setting when Emulator is Used Connected to Target System Emulator Operation Target System Setting MODE0 MODE1 ROM-less mode 0 Low-level input Low-level input ROM-less mode 1 High-level input Low-level input Single-chip mode 0 Low-level input High-level input Single-chip mode 1 High-level input High-level input 22 CHAPTER 2 2.4 NAME AND FUNCTION OF COMPONENTS Power Supply Settings Using the JP2 setting, the IE-703102-MC-EM1 can switch between operation using the emulator as a stand-alone unit (using the power of the emulator) and operation using the emulator connected to the target system (using the power of the target system). 2.4.1 JP2 setting when the emulator operates as a stand-alone unit and target system power is off The IE-703102-MS-EM1 operates using the emulator's power supply when the emulator operates as a standalone unit and target system power is off. Depending on the product, the condition of the power is as follows. * IE-703102-MC-EM1 : VDD = 3.3 V, HVDD = 5.0 V * IE-703102-MC-EM1-A : VDD = 3.3 V, HVDD = 3.3V Figure 2-2 shows the JP2 setting. Caution If the JP2 setting is incorrect, the emulator may be damaged. Figure 2-2. Power Supply Settings (When the Emulator Operates as a Stand-Alone Unit and Target System Power is Off) JP2 2 4 1 3 Set both 1-2 and 3-4 as open 2.4.2 JP2 setting when power of the target system is on The IE-703102-MC-EM1 operates using the target system's power supply when the power of the target system is on. Figure 2-3 shows the JP2 setting. Caution If the JP2 setting is incorrect, the emulator may be damaged. Figure 2-3. Power Supply Setting (When Power of the Target System is On) JP2 2 4 1 3 Set 1-2 as open and 3-4 as short 23 [MEMO] 24 CHAPTER 3 FACTORY SETTINGS Item Setting Remark JP1 2 8 1 7 JP2 2 4 1 3 SW1 All settings other than those set in the factory are prohibited. Setting that supplies the IE-703102-MC-EM1 with the power of the emulator (when the emulator operates as a stand-alone unit and target system power is off). Set to PLL mode. PLL DIRECT Crystal oscillator 8.000-MHz crystal oscillator is mounted. If SW1 is set to the factory setting, the CPU operates at 40 MHz. 25 [MEMO] 26 CHAPTER 4 4.1 CAUTIONS VDD and HVDD of Target System (1) VDD and HVDD in the target system are used to operate the circuit in the emulator. (2) When JP2 is set as 1-2 : open and 3-4 : short, the evaluation chip in the emulator operates on VDD and HVDD from the target system. (3) When JP2 is set as 1-2 : open and 3-4 : open, the emulator recognizes the target system power is off and operates with the 3.3 V power supply. Figure 4-1. Schematic Diagram of Power Supply Flow Target system IE-703102-MC-EM1 IE-703102-MC I/O chip Evaluation chip CVDD VDD Power supply circuit Relay HVDD JP2 JP2 4.2 2 4 2 4 1 3 1 3 X1 Signal The input signal (X1 signal) from the target system is delayed (for tpLH = tpHL = 13.2 ns (MAX.)) because it passes through VHC157 before it is input to the I/O chip of the emulator. In addition, the DC characteristics change. The input voltage becomes VIH = 2.31 V (MIN.) and VIL = 0.99 V (MAX.). The input current becomes I IN = 1.0 A (MAX.). 27 CHAPTER 4 CAUTIONS Figure 4-2. Diagram of X1 Signal Flow IE-703102-MC-EM1 Target System X1 signal X1 pin 4.3 VHC157 I/O chip Pin Termination (1) MODE0 to MODE3 pins When the emulator operates as a stand-alone unit, the operation mode of the emulator is single-chip mode 0. The MODE0 to MODE3 pins are connected as follows. * MODE0: Connected to VSS via a resistor (33 k). (Pull-down) * MODE1: Connected to VDD via a resistor (5.1 k). (Pull-up) * MODE2: Unconnected * MODE3: Unconnected (2) RESET pin This pin is connected to VDD via a resistor (5.1 k). (Pull-up) (3) CKSEL pin Pull-up/pull-down switching is possible with SW1. Figure 4-3. Circuit Diagram of CKSEL Pin CKSEL pin HVDD I/O chip 100 SW1 CKSEL 33 k VHCT541 28 CHAPTER 4 4.4 CAUTIONS Internal RAM and ROM Because the internal RAM (iRAM) and internal ROM (iROM) capacities of the emulator are set in steps, the memory capacity is different from that of the target device. If access is performed to addresses that exceed the target device capacity, the memory of the emulator is accessed. Memory capacities are as follows. Table 4-1. Memory Capacity Limitation List (a) iRAM capacity (Unit: byte) Target Device Emulator (b) iROM capacity (Unit: byte) Target Device Emulator (Emulation Memory) 1K 1K 1 K to 32 K 32 K 2K 2K 33 K to 64 K 64 K 3K 3K 65 K to 128 K(V850E/MS1) 128 K 4K 129 K to 256 K 256 K 5 K to 6 K 6K 257 K to 512 K 512 KNote 7 K to 8 K 8K 9 K to 10 K 10 K 11 K to 12 K 12 K 13 K to 16 K 16 K 17 K to 20 K 20 K 21 K to 24 K 24 K 25 K to 28 K 28 K 29 K to 36 K 36 K 37 K to 44 K 44 K 45 K to 52 K 52 K 53 K to 60 K 60 K 4K (V850E/MS1) Note The emulator is mounted iROM emulation memory of 512 Kbytes. 29 CHAPTER 4 4.5 CAUTIONS Port 4 to 6, A, and B Ports 4 to 6, A, and B are connected to VHCT541, VHC541, and VHCT00, respectively. Figure 4-4. Circuit Diagram of Port 4 to 6, A, and B Evaluation chip Port B Port A Port 6 Port 5 Port 4 VHCT541 VHC541 VHCT541 VHC541 Target system VHCT00 VHCT541 VHCT541 30 Emulation memory (2 Mbytes) CHAPTER 4 4.6 CAUTIONS Bus Interface Pin There are the following differences between the emulator and the target device in the operation of the pins for bus interface. Table 4-2. Bus Interface Pin Operation List (1/3) (a) During break Pin Name Waiting for Emulator Command Internal Memory Internal ROM R Internal RAM R W External Memory Internal Peripheral I/O R Emulation RAM W R W Target System R A0 to A23 Note Note Note Note D0 to D15 Hi-Z Hi-Z Note Note WE H H H Note OE H H H Note RD H H H Note ADV/BCYST Note H Note Note UWR/UCAS H H H Note LWR/LCAS H H H Note IORD H H H Note IOWR H H H Note CS0 to CS7 H H H Note RAS0 to RAS7 H H H Note REFRQ H H H Note WAIT Invalid Note Maskable HLDRQ Maskable Maskable Maskable HLDAK Note Note Note Note W Performs the same operation as the cycle that is generated by the target device program execution. Remarks 1. 2. R : Read W : Write H : High-level output Hi-Z : High-impedance 31 CHAPTER 4 CAUTIONS Table 4-2. Bus Interface Pin Operation List (2/3) (b) During user program execution Pin Name Internal Memory Internal ROM F R Internal RAM F R External Memory Internal Peripheral I/O W R Emulation RAM W F R Target System W F A0 to A23 Note Note Note D0 to D15 Hi-Z Note Note WE H H Note OE H H Note RD H H Note ADV/ BCYST H Note Note UWR/ UCAS H H Note LWR/ LCAS H H Note IROD H H Note IOWR H H Note CS0 to CS7 H H Note RAS0 to RAS7 H H Note REFRQ H H Note WAIT Note Maskable HLDRQ Maskable Maskable HLDAK Note Note Note Performs the same operation as the cycle that is generated by the target device program execution. Remarks 1. 2. F : Fetch R : Read W : Write H : High-level output Hi-Z : High-impedance 32 R W CHAPTER 4 CAUTIONS Table 4-2. Bus Interface Pin Operation List (3/3) (c) Refresh cycle Pin Name Operation A0 to A23 Note D0 to D15 Note WE Note OE Note RD Note ADV/BCYST Note UWR/UCAS Note LWR/LCAS Note IORD Note IOWR Note CS0 to CS7 Note RAS0 to RAS7 Note REFRQ Note WAIT Maskable HLDRQ Maskable HLDAK Note Note 4.7 Performs the same operation as the cycle that is generated by the target device program execution. Emulation Memory Operation Timing Difference When the area of the DRAM, synchronous flash memory, or page ROM in the target system has been allocated to the emulation memory, the operation timing is the SRAM access timing. When measuring the performance by using the emulation memory, adjust the setting so that the wait set matches the memory access timing that is actually used. 33 [MEMO] 34 APPENDIX A DIMENSIONS (1) IE-703102-MC + IE-703102-MC-EM1 (Unit: mm) 461 55 240 58.8 90 166 Top View 57 Pin 1 direction Side View 27 IE-703102-MC IE-703102-MC-EM1 Bottom View 207 29.0 96 37.5 15.88 Top View 29.0 35 APPENDIX A DIMENSIONS (2) SC-144SD (Unit: mm) 109 108 36 37 73 72 46 144 43 1 40 130 43 36 13 13 213 APPENDIX A DIMENSIONS (3) NQPACK144SD (Unit: mm) 27.0 0.5 x 35 = 17.5 C1.5 [Top View] 0.5 7.0 3-R1.5 0.3 144 109 1 108 7.0 18.9 26.2 22.65 3-1.0 36 73 2.5 37 72 2.5 20.1 1.85 1.2 3.7 9.45 5.5 3.9 [Side View] 21.05 0.2 0.18 0.5 0.5 23.0 12.0 [Bottom View] 109 144 1 73 36 0.2 20.1 108 72 37 4-2.0 Height of projection 1.8 37 APPENDIX A DIMENSIONS (4) YQPACK144SD (Unit: mm) 22.65 0.5 x 35 = 17.5 C2.0 0.5 [Top View] 4-2.2 7.0 144 109 108 1 7.0 19.4 27.0 29.0 23.6 21.2 18.8 16.4 3-1.0 36 73 37 3-R2.5 72 0.25 x 0.3 0.3 2.3 2.2 3.9 7.4 3.1 9.0 1.2 3.7 2.5 [Side View] 4-R1.5 0.25 109 [Bottom View] 22.8 19.6 C1.5 144 108 20.8 1 73 36 37 0.2 72 38 APPENDIX A DIMENSIONS (5) HQPACK144SD (Unit: mm) 22.65 0.15 0.5 x 35 = 17.5 [Top View] 7.0 C2.0 0.1 4-2.2 0.1 109 3.95 2.75 144 1 108 7.0 19.4 27.0 29.0 18.4 23.9 16.0 3-1.0 73 3.95 2.75 36 37 72 4-R1.5 1.2 3-R2.5 2.3 7.4 1.6 3.9 2.25 3.1 [Side View] 0.25 [Bottom View] 109 22.8 19.6 C1.5 144 108 21.4 0.2 1 36 72 37 0.2 73 39 [MEMO] 40 APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION (1) When directly connecting device to target system (Connector for target connection is not used) Device Target system (2) When equipping device by using connector for target connection Fastening screws HQPACK144SD Device NQPACK144SD Target system (3) Connection between emulator and target system (a) When extension probe is not used Note YQPACK144SD NQPACK144SD Target system Note Connector for emulator connection (YQSOCKET144SDN) can be inserted at this position for height adjustment. 41 APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION (b) Example of use of extension probe Extension probe Note YQPACK144SD NQPACK144SD Target system Note 42 Connector for emulator connection (YQSOCKET144SDN) can be inserted at this position for height adjustment. APPENDIX C CONNECTORS FOR TARGET CONNECTION C.1 Use (1) When mounting NQPACK144SD to target system <1> Coat the tip of four projections (points) at the bottom of the NQPACK144SD with two-component type epoxy adhesive (cure time longer than 30 min.) and bond the NQPACK144SD to the target system. If not bonded properly, the pad of the printed circuit board may peel off when the emulator is removed from the target system. If the lead of the NQPACK144SD does not coincide with the pad of the target system easily, perform step <2> to adjust the position. <2> To adjust the position, insert the guide pins for position-adjustment (NQGUIDE) provided with NQPACK144SD into the pin holes at the upper side of NQPACK144SD (refer to Figure C-1). The diameter of a hole is = 1.0 mm. There are three non-through holes (refer to APPENDIX A DIMENSIONS). <3> After setting the HQPACK144SD, solder NQPACK144SD to the target system. By following this sequence, adherence of flux or solder sputtering to contact pins of the NQPACK144SD can be avoided. Recommended soldering condition... Reflow : 240C, 20 sec. max. Partial heating : 240C, 10 sec. max. (per pin row) <4> Remove the guide pins. Figure C-1. Mounting of NQPACK144SD HQPACK144SD Guide pins (NQGUIDE) NQPACK144SD Target system Remark NQPACK144SD: Connector for target connection HQPACK144SD: Cover for device installation 43 APPENDIX C CONNECTORS FOR TARGET CONNECTION (2) When setting device Caution Check for abnormal conditions such as resin burr or bent pins before setting a device to the NQPACK144SD. Moreover, check that the hold pins of the HQPACK144SD are not broken or bent before setting HQPACK144SD. If there are broken or bent pins, fix them with a thin, flat plate such as a blade. <1> Make sure that the NQPACK144SD is clean and the device pins are parallel (flat) before setting a device to the NQPACK144SD. Then, after mounting the NQPACK144SD to the target board, set the device and HQPACK144SD (refer to Figure C-2). <2> Using the screws provided with the HQPACK144SD (four locations: M2 x 6 mm), secure the HQPACK144SD, device, and NQPACK144SD. Tighten the screws in a crisscross pattern with the provided screwdriver or driver with torque gauge (avoid tightening strongly only one screw). Tighten the screws with 0.55 kgfcm (0.054 Nm) max. torque. Excessive tightening may diminish conductivity. At this time, each pin is fixed inside the plastic wall dividers by the contact pin of the NQPACK144SD and the hold pin of the HQPACK144SD (refer to Figure C-3). Thus, pins cannot cause a short with pins of neighboring devices. Figure C-2. Mounting Device Fastening screws HQPACK144SD Device NQPACK144SD Target system Figure C-3. NQPACK100SD and Device Pin Hold pin of HQPACK144SD Divider Device Pin Contact pin of NQPACK144SD 44 APPENDIX C CONNECTORS FOR TARGET CONNECTION C.2 Cautions on Handling Connectors (1) When taking connectors out of the case, remove the sponge while holding the main unit. (2) When soldering the NQPACK144SD to the target system, cover the HQPACK144SD to protect it against splashing flux. Recommended soldering conditions... Reflow : 240C, 20 sec. max. Partial heating : 240C, 10 sec. max. (per pin row) (3) Check for abnormal conditions such as resin burr or bent pins before setting a device to the NQPACK144SD. Moreover, check that the hold pins of the HQPACK144SD are not broken or bent before setting HQPACK144SD. If there are broken or bent pins, fix them with a thin, flat plate such as a blade. (4) When securing the YQPACK144SD (connector for emulator connection) or HQPACK144SD to the NQPACK144SD with screws, tighten the four screws temporarily with the provided screwdriver or driver with torque gauge, then tighten the screws in a crisscross pattern (with 0.054 Nm max. torque). Excessive tightening of only one screw may diminish conductivity. If the conductivity is diminished after screw-tightening, stop tightening, remove the screws and check whether the NQPACK144SD is stained and make sure the device pins are parallel. (5) Device pins do not have high strength. Repeatedly connecting to the NQPACK144SD may cause pins to bend. When setting a device to the NQPACK144SD, check and adjust bent pins. 45 [MEMO] 46 APPENDIX D MOUNTING OF PLASTIC SPACER This chapter describes the mounting method for the plastic spacer supplied with the IE-703102-MC. When using the emulator connected to the target system, mount the plastic spacer as shown in Figure D-1 to fix the pod horizontally. (1) Mounting IE-703102-MC to plastic spacer <1> Remove the nylon rivet from the rear part of the pod. <2> Tighten the plastic spacer with the supplied plastic screw. <3> To adjust the height, use a user spacer or stand. Figure D-1. Mounting Method of Plastic Spacer Plastic spacer Target system 47 [MEMO] 48 Facsimile Message From: Name Company Tel. Although NEC has taken all possible steps to ensure that the documentation supplied to our customers is complete, bug free and up-to-date, we readily accept that errors may occur. Despite all the care and precautions we've taken, you may encounter problems in the documentation. Please complete this form whenever you'd like to report errors or suggest improvements to us. FAX Address Thank you for your kind support. North America Hong Kong, Philippines, Oceania NEC Electronics Inc. NEC Electronics Hong Kong Ltd. Corporate Communications Dept. 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