TM
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has...
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
FOR MORE INFORMATION CONTACT:
Technical Support:
1-800-DDC-5757 ext. 7771
®
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
FOR MORE INFORMATION CONTACT:
Technical Support:
1-800-DDC-5757 ext. 7771
FEATURES
32-Bit/33MHz, 3.3Volt, PCI Target
Interface
Fully Integrated 1553A/B Notice 2,
1760, McAir, STANAG 3838 Interface
Terminal
All +3.3V Operation or +3.3V Logic
and +5V Transceivers
0.88 inch square, 80-Pin CQFP (PCI
Mini-ACE Mark3) or 0.80 inch square
324 ball BGA (PCI Micro-ACE TE)
Compatible with PCI Enhanced Mini-
ACE, Enhanced Mini-ACE, Mini-ACE
and ACE Generations
Choice of :
- RT only with 4K RAM (BU-65743)
- BC/RT/MT with 4K RAM (BU-65843)
- BC/RT/MT with 64K RAM, and RAM
Parity (BU-65863, BU-65864)
Sleep Mode Option
Choice of 10, 12, 16, or 20 MHz 1553
Clock
Highly Autonomous BC with Built-In
Message Sequence Control:
- Frame Scheduling
- Branching
- Asynchronous Message Insertion
- General Purpose Queue
- User-defined Interrupts
Advanced RT Functions
- Global Circular Buffering
- Interrupt Status Queue
- 50% Circular Buffer Rollover
Interrupts
Selective Message Monitor or
RT/Monitor
DESCRIPTION
The PCI Mini-ACE Mark3/Micro-ACE TE family of MIL-STD-1553 terminals
provides a complete interface between a 32-Bit/33Mhz 3.3V signaling PCI Bus
and a MIL-STD-1553 bus. These terminals integrate dual transceiver, protocol
logic, and 4K or 64K words of RAM, all of which can be powered from 3.3V.
With a 0.88-inch square package, the PCI Mini-ACE Mark3 is the smallest
ceramic CQFP PCI 1553 solution available. The 0.80-inch square 324 ball BGA
PCI Micro-ACE TE has an even smaller footprint, but has a more restricted
operating temperature range. Both are 100% software compatible with the
larger PCI Enhanced Mini-ACE and add TAG_CLK inputs. The TAG_CLK input
allows a software selectable external time tag clock input. Both parts are avail-
able with a choice of either 3.3V transceivers or 5V transceivers.
The PCI Micro-ACE TE has a more restricted set of options compared to the
PCI Mini-ACE Mark3. Please consult the ordering information at the rear of the
data sheet to see which options are available. In addition, the PCI Micro-ACE
TE adds RTBOOT and 1553 clock select inputs for applications which must
boot into RT mode with Busy bit set.
The PCI Mini-ACE Mark3/Micro-ACE TE is nearly 100% software compatible
with the Enhanced Mini-ACE and previous generation Mini-ACE terminals. The
PCI interface to this terminal is not 5V tolerant.
Multiprotocol support of MIL-STD-1553A/B and STANAG 3838, including
Mark3 versions incorporating McAir compatible transmitters, is provided. There
is a choice of 10, 12, 16, or 20 MHz 1553 clocks. The BC/RT/MT versions with
64K words of RAM include built-in RAM parity checking.
BC features include a built-in message sequence control engine, with a set of
20 instructions. This provides an autonomous means of implementing multi-
frame message scheduling, message retry schemes, data double buffering,
asynchronous message insertion, and reporting to the host CPU.
The PCI Mini-ACE Mark3 and Micro-ACE TE RT offer single and circular sub-
address buffering schemes, along with a global circular buffering option, 50%
rollover interrupt for circular buffers, and an interrupt status queue.
© 2003 Data Device Corporation
BU-65743/65843/65863/65864
PCI MINI-ACE® MARK3 AND
PCI MICRO-ACE®*-TE
Make sure the next
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* The technology used in DDC’s Micro-ACE series of products may be
subject to one or more patents pending.
All trademarks are the property of their respective owners.
2
Data Device Corporation
www.ddc-web.com
BU-65743/65843/65863/65864
AD-2/12-0
FIGURE 1. PCI MINI-ACE MARK3/MICRO-ACE TE (3.3V TRANSCEIVERS) BLOCK DIAGRAM
TRANSCEIVER
A
CH. A
TRANSCEIVER
B
CH. B
DUAL
ENCODER/DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
RT ADDRESS AND
ADDRESS LATCH
4K X 16
OR
64K X 17
SHARED
RAM
ADDRESS BUS
DATA BUS
AD31-AD0
C/BE#3 - C/BE#0
33 MHZ,
32-BIT
PCI SLAVE
INTERFACE
MISCELLANEOUS
INCMD/MCRST
1553_CLK, SSFLAG/EXT_TRIG,TAG_CLK
RTAD4-RTAD0, RTADP
PCI Interrupt
TX/RX_A
TX/RX_A
TX/RX_B
TX/RX_B
NOTE 1: Shown with 3.3V transceivers. 5V transceivers are available.
RT-AD4-LAT
TX_INH A/B
BOOT_L,CLK_SEL_0/1 (Micro-ACE TE ONLY)
32 X 32
WRITE
FIFO
PAR
FRAME#, IRDY#,IDSEL
TRDY#, STOP#, DEVSEL#,
PERR#, SERR#
(PCI) CLK
INT A #
MSTCLR (RST#)
PCI CLK
PCI Control
PCI Address/Data, Parity
and Bus Command/Byte Enable
(1:2.07)
(1:2.07)
3
Data Device Corporation
www.ddc-web.com
BU-65743/65843/65863/65864
AD-2/12-0
V
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
3.45
67
110
315
515
915
67
110
335
535
995
52
95
300
500
900
52
95
320
520
980
51
230
384
752
66
245
399
767
3.15
POWER SUPPLY REQUIREMENTS
(3.3V TRANSCEIVER)
Voltages/Tolerances
+3.3V
Current Drain (Total Hybrid)
(Note 17)
BU-65863F(G)8(9)-XX0
• Idle w/ transceiver SLEEPIN
asserted
• Idle w/ transceiver SLEEPIN
negated
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65863F(G)8-XX2,
BU-65863B(R)8-E02
• Idle w/ transceiver SLEEPIN
asserted
• Idle w/ transceiver SLEEPIN
negated
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65843F(G)8(9)-XX0,
BU-65743F(G)8(9)-XX0
• Idle w/ transceiver SLEEPIN
asserted
• Idle w/ transceiver SLEEPIN
negated
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65743F(G)8-XX2,
BU-65843X8(R)-XX2
• Idle w/ transceiver SLEEPIN
asserted
• Idle w/ transceiver SLEEPIN
negated
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65X43XC/D-XXX
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65863XC/D-XXX
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
UNITSMAXTYPMINPARAMETER
TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE
SPECIFICATIONS (CONT.)
3.3
31
77
267
457
837
27
76
242
383
725
16
56
246
436
816
12
55
221
362
704
25
163
301
613
46
184
322
634
V
V
V
µA
µA
µA
V
V
µA
µA
V
V
mA
mA
pF
pF
pF
pF
0.7
10
-33
-33
0.9
70
+20
0.4
-3.4
20
10
4
6
2.1
0.4
-10
-100
-100
2.5
10
-20
2.4
3.4
LOGIC
VIH
All signals except PCI, SLEEP_
IN
VIL
All signals except PCI, SLEEP_
IN
Schmidt Hysteresis
All signals except PCI
IIH, IIL
All signals except PCI, SLEEP_
IN
IIH (Vcc=3.6V, VIN=Vcc)
IIH (Vcc=3.6V, VIN=2.7V)
IIL (Vcc=3.6V, VIN=0.4V)
VIH SLEEP_IN (Vcc=3.6V)
VIL SLEEP_IN (Vcc=3.0V)
IIH, IIL SLEEP_IN
IIH (Vcc=3.6V, VIN=2.7V)
IIL (Vcc=3.6V, VIN=0.0V)
VOH (Vcc=3.0V, IOH=max)
VOL (Vcc=3.0V, IOL=max)
IOL
IOH
CI (Input Capacitance)
PCI LOGIC see PCI spec 3.3V
signaling environment
CI (Input Capacitance) all PCI
except PCI_CLK & IDSEL
CI (Input Capacitance) PCI_CLK
CI (Input Capacitance) IDSEL
Vp-p
Vp-p
Vp-p
mVp-p
mVp
ns
ns
9
27
27
10
250
300
300
7
20
21.5
150
150
250
6
18
20
-250
100
200
TRANSMITTER
Differential Output Voltage
Direct Coupled Across 35 ,
Measured on Bus
Transformer Coupled Across
70 , Measured on Bus
(BU-65XXXXX-XX0,
BU-65XXXXX-XX2) (Note 13)
Output Noise, Diff (Direct Coupled)
Output Offset Voltage, Transformer
Coupled Across 70 ohms
Rise/Fall Time
(BU-65XXXX3,
BU-65XXXX4)
k
pF
Vp-p
Vpeak
50
0.860
10
2.5
0.200
RECEIVER
Differential Input Resistance
(Notes 1-6)
Differential Input Capacitance
(Notes 1-6, 19)
Threshold Voltage, Transformer
Coupled
Common Mode Voltage (Note 7)
V
V
V
V
V
4.0
4.5
7.0
Vdd+0.3
6.0
-0.3
-0.3
-0.3
-0.3
-0.3
ABSOLUTE MAXIMUM RATING
Supply Voltage
Logic +3.3V
Transceiver +3.3V
(BU65XX3X8/9)
Transceiver +5V(BU-65XX3F3/4,
BU-65XX3G3/4, BU-658XXB3)
Logic
Voltage Input Range
Voltage Input Range,
+5V Tolerant Pins (Note 16)
UNITSMAX
TYPMINPARAMETER
TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE
SPECIFICATIONS
4
Data Device Corporation
www.ddc-web.com
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AD-2/12-0
UNITSMAXTYPMINPARAMETER
TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE
SPECIFICATIONS (CONT.)
W
W
W
W
W
W
W
W
W
W
W
W
0.11
0.45
0.80
1.51
0.11
0.47
0.84
1.59
0.11
0.25
0.39
0.54
0.07
0.37
0.70
1.37
0.07
0.37
0.59
1.13
0.07
0.20
0.30
0.42
HOTTEST DIE (3.3V TRANSCEIVER)
BU-65XXXX8(9)-XX0
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65XXXX8-XX2
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65XX3XC/D-XXX
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
UNITSMAXTYPMINPARAMETER
TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE
SPECIFICATIONS (CONT.)
V
V
V
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
3.6
5.5
5.5
100
205
310
520
60
100
216
332
565
60
120
236
352
585
40
100
205
310
520
40
100
216
332
565
40
3.3
5.0
5.0
65
169
273
481
45
65
180
295
525
45
66
174
282
498
25
65
169
273
481
25
65
180
295
525
25
3.0
4.75
4.5
POWER SUPPLY REQUIREMENTS
(5V TRANSCEIVER)
Voltages/Tolerances
+3.3V (Logic) VCC
+5V (XCVR or 5V VCC CHA/B)
+5V (RAM for BU-65864B(R)3)
Current Drain (Total Hybrid)
BU-65863F(G)3(4)-XX0
+5V (XCVR)
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
+3.3V (Logic)
BU-65863F(G)3-XX2
+5V (XCVR)
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
+3.3V (Logic)
BU-65864B(R)3-E02
+5V (RAM, CHA, CHB)
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
+3.3V (Logic)
• BU-65743F(G)3(4)-XX0,
BU-65843F(G)3(4)-XX0
+5V (XCVR)
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
+3.3V (Logic)
• BU-65743F(G)3-XX2,
BU-65843F(G)3-XX2,
BU-65843B3-E02
+5V (XCVR or 5V ChA, 5V Ch B)
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
+3.3V (Logic)
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
0.22
0.36
0.74
1.09
1.79
0.22
0.36
0.76
1.13
1.88
0.17
0.31
0.69
1.04
1.74
0.17
0.31
0.71
1.08
1.83
0.19
0.35
0.42
0.64
0.24
0.40
0.47
0.69
0.10
0.25
0.62
0.97
1.64
0.10
0.25
0.64
1.00
1.73
0.10
0.18
0.47
0.72
1.22
0.10
0.18
0.49
0.76
1.31
0.08
0.23
0.27
0.46
0.15
0.30
0.34
0.53
POWER DISSIPATION (NOTES 17-18)
Total Hybrid (3.3V Transceiver)
BU-65863X8(9)-XX0
• Idle w/ transceiver SLEEPIN
asserted
• Idle w/ transceiver SLEEPIN
negated
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65863F(G)8-XX2,
BU-65863B8-E02
• Idle w/ transceiver SLEEPIN
asserted
• Idle w/ transceiver SLEEPIN
negated
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65743F(G)8(9)-XX0,
BU-65843F(G)8(9)-XX0
• Idle w/ transceiver SLEEPIN
asserted
• Idle w/ transceiver SLEEPIN
negated
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65743F(G)8-XX2,
BU-65843F(G)8-XX2,
BU-65843B8-E02
• Idle w/ transceiver SLEEPIN
asserted
• Idle w/ transceiver SLEEPIN
negated
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65X43XC/D-XXX
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
BU-65863XC/D-XXX
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
5
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BU-65743/65843/65863/65864
AD-2/12-0
MHz
MHz
MHz
MHz
MHz
%
%
%
%
33.3
0.01
0.10
0.001
0.01
-0.01
-0.10
-0.001
-0.01
CLOCK INPUT
PCI CLOCK INPUT FREQUENCY
1553 Clock Frequency
• Default Mode
• Option
• Option
• Option
Long Term Tolerance
• 1553A Compliance
• 1553B Compliance
Short Term Tolerance, 1 second
• 1553A Compliance
• 1553B Compliance
16.0
12.0
10.0
20.0
in.
(mm)
in.
(mm)
Oz.
(g)
in.
(mm)
Oz.
(g)
0.89 X 0.89 X 0.130
(22.6 x 22.6 x 3.3)
MSL-3
ESD Class 0
1.13
(28.7)
0.4
(10)
0.815 X 0.815 X 0.120
(20.7 x 20.7 x 3.05)
0.088
(2.5)
°C/W
°C/W
°C
°C
°C
°C
°C
°C
°C
11
12
+125
+85
+70
+100
+150
+300
+245
9
-55
-40
0
-40
-65
PHYSICAL CHARACTERISTICS
80-Pin, Ceramic Flatpack/Gull Lead
Size, MAXIMUM
Micro-ACE-TE
Moisture Sensitivity Level
Electrostatic Discharge Sensitivity
Lead Toe-to-Toe Distance
80-Pin Gull Lead, MAXIMUM
Weight
324-ball Plastic BGA
Size, Maximum
Weight
THERMAL
80-Pin, Ceramic Flatpack/Gull Lead
Thermal Resistance, Junction-to-Case,
Hottest Die (θJC) (Note 12)
324-Ball Plastic BGA
Thermal Resistance,Junction-to-Ball,
Hottest Die (θJB)
ALL PACKAGES
Operating Case/Ball Temperature
-1XX, -4XX
-2XX, -5XX
-3XX, -8XX
-EXX
Storage Temperature
Soldering
Flat Pack/Gull Wing
Lead Temperature (soldering, 10 sec.)
324-ball BGA Package
The reflow profile detailed in IPC/
JEDEC J-STD-020 is applicable for
both leaded and lead-free products
UNITSMAXTYPMINPARAMETER
TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE
SPECIFICATIONS (CONT.)
TABLE 1 NOTES:
Notes 1 through 6 are applicable to the Receiver Differential Resistance and
Differential Capacitance specifications:
1. Specifications include both transmitter and receiver (tied together internally).
2. Impedance parameters are specified directly between pins TX/RX_A(B) and
TX/RX_A(B) of the PCI Mini-ACE Mark3/PCI Micro-ACE TE hybrid.
3. It is assumed that all power and ground inputs to the hybrid are connected.
4. The specifications are applicable for both unpowered and powered condi-
tions.
5. The specifications assume a 2 volt rms balanced, differential, sinusoidal
input. The applicable frequency range is 75 kHz to 1 MHz.
6. Minimum resistance and maximum capacitance parameters are guaranteed
over the operating range, but are not tested.
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
0.75
1.00
1.23
1.68
0.75
1.04
1.34
1.94
0.80
1.09
1.39
1.97
0.63
0.85
1.07
1.51
0.63
0.86
1.09
1.56
POWER DISSIPATION (NOTE 15)
TOTAL HYBRID (5V TRANSCEIVER)
• BU-65863F(G)3(4)-XX0
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
• BU-65863F(G)3-XX2
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
• BU-65864B(R)3-E02
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
• BU-65743F(G)3(4)-XX0
BU-65843F(G)3(4)-XX0
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
• BU-65743F(G)3-XX2
BU-65843F(G)3-XX2,
BU-65843B3-E02
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
0.41
0.73
1.02
1.63
0.41
0.76
1.13
1.86
0.44
0.80
1.17
1.89
0.41
0.70
0.94
1.40
0.41
0.72
0.97
1.45
UNITSMAXTYPMINPARAMETER
TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE
SPECIFICATIONS (CONT.)
µs
µs
µs
2.5
9.5
10.0
to
10.5
1553 MESSAGE TIMING
Completion of CPU Write
(BC Start)-to-Start of First Message
(for Non-enhanced BC Mode)
BC Intermessage Gap (Note 8)
Non-enhanced
(Mini-ACE compatible) BC mode
Enhanced BC mode (Note 9)
W
W
W
W
W
W
W
W
0.28
0.51
0.75
1.22
0.28
0.58
0.88
1.48
0.18
0.42
0.66
1.14
0.18
0.48
0.78
1.39
HOTTEST DIE (5V TRANSCEIVER)
• BU-65XXXX3(4)-xx0
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
• BU-65XXXX3-xx2
• Idle
• 25% Transmitter Duty Cycle
• 50% Transmitter Duty Cycle
• 100% Transmitter Duty Cycle
µs
µs
µs
µs
µs
µs
19.5
23.5
51.5
131
7
18.5
22.5
50.5
129.5
660.5
17.5
21.5
49.5
127
4
1553 MESSAGE TIMING (CONT.)
BC/RT/MT Response Timeout
(Note 10)
• 18.5 nominal
22.5 nominal
50.5 nominal
128.0 nominal
RT Response Time
(mid-parity to mid-sync) (Note 11)
Transmitter Watchdog Timeout
6
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AD-2/12-0
TABLE 1 NOTES (Cont.):
7. Assumes a common mode voltage within the frequency range of dc to 2
MHz, applied to pins of the isolation transformer on the stub side (either
direct or transformer coupled), and referenced to hybrid ground.
Transformer must be a DDC recommended transformer or other transform-
er that provides an equivalent minimum CMRR.
8. Typical value for minimum intermessage gap time. Under software control,
this may be lengthened to 65,535 ms - message time, in increments of 1
µs. If ENHANCED CPU ACCESS, bit 14 of Configuration Register #6, is
set to logic "1", then host accesses during BC Start-of-Message (SOM)
and End-of-Message (EOM) transfer sequences could have the effect of
lengthening the intermessage gap time. For each host access during an
SOM or EOM sequence, the intermessage gap time will be lengthened by
6 clock cycles. Since there are 7 internal transfers during SOM, and 5 dur-
ing EOM, this could theoretically lengthen the intermessage gap by up to
72 clock cycles; i.e., up to 7.2 µs with a 10 MHz clock, 6.0 µs with a 12
MHz clock, 4.5 µs with a 16 MHz clock, or 3.6 µs with a 20 MHz clock.
9. For Enhanced BC mode, the typical value for intermessage gap time is
approximately 10 clock cycles longer than for the non-enhanced BC mode.
That is, an addition of 1.0 µs at 10 MHz, 833 ns at 12 MHz, 625 ns at 16
MHz, or 500 ns at 20 MHz.
10. Software programmable (4 options). Includes RT-to-RT Timeout (measured
mid-parity of transmit Command Word to mid-sync of transmitting RT
Status Word).
11. Measured from mid-parity crossing of Command Word to mid-sync cross-
ing of RT's Status Word.
12. θJC is measured to the bottom of the case, and the numbers indicated are
preliminary
13. External 10 µF Tantalum and 0.1 µF capacitors should be located as close
as possible to Pin 10, and a 0.1 µF at pins 30, 51 & 69.
14. MIL-STD-1760 requires that the PCI Mini-ACE Mark3 produce a 20 Vp-p
minimum output on the stub connection.
15. Power dissipation specifications assume a transformer coupled configura-
tion with external dissipation (while transmitting) of 0.14 watts for the active
isolation transformer, 0.08 watts for the active bus coupling transformer,
0.45 watts for each of the two bus isolation resistors and 0.15 watts for
each of the two bus termination resistors.
16. The 5V tolerant pins are RTAD0-5, RTAD_PAR, RTAD_LAT, TXINH_A/B,
SSFLAG*/EXT_TRIG, TAG_CLK, RTBOOT_L, CLK_SEL_0 and CLK_
SEL_1.
17. Current drain and power dissipation specs are based upon a small sam-
pling of 3.3V transceivers and are subject to change.
18. Power dissipation is the input power minus the power delivered to the 1553
fault isolation resistors, the power delivered to the bus termination resistors
and the copper losses in the transceiver isolation transformer and the bus
coupling transformer.
19. The effective input capacitance as seen from the 1553 bus is reduced by
the square of the turns ratio of the coupling transformer.
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One of the salient features of the PCI Mini-ACE Mark3 is its
Enhanced Bus Controller architecture. The Enhanced BC's
highly autonomous message sequence control engine provides
a means for offloading the host processor for implementing multi-
frame message scheduling, message retry schemes, data dou-
ble buffering, and asynchronous message insertion. For the
purpose of performing messaging to the host processor, the
Enhanced BC mode includes a General Purpose Queue, along
with user-defined interrupts.
The PCI Mini-ACE Mark3/Micro-ACE TE RT offers the same
choices of single and circular buffering for individual subad-
dresses as ACE, Mini-ACE(Plus), and Enhanced Mini-ACE. New
enhancements to the RT architecture include a global circular
buffering option for multiple (or all) receive subaddresses, a 50%
rollover interrupt for circular buffers, an interrupt status queue for
logging up to 32 interrupt events, and an option to automatically
initialize to RT mode with the Busy bit set. The interrupt status
queue and 50% rollover interrupt features are also included as
improvements to the PCI Mini-ACE Mark3/Micro-ACE TE's
Monitor architecture.
The PCI Mini-ACE Mark3 series terminals operate over the full
military temperature range of -55°C to +125°C. Available
screened to MIL-PRF-38534C, the terminals are ideal for military
and industrial processor to 1553 applications.
The PCI Micro-ACE TE terminals operate over an extended tem-
perature range of -40°C to +100°C.
TRANSCEIVERS
The transceivers in the PCI Mini-ACE Mark3 series terminals are
fully monolithic, requiring only a +3.3V power input or a +5V
power input. The transmitters are voltage sources, which provide
improved line driving capability over current sources. This serves
to improve performance on long buses with many taps. The
transmitters also offer an option which satisfies the MIL-
STD-1760 requirement for a minimum of 20 volts peak-to-peak,
transformer coupled output. The transceivers in the PCI Micro-
ACE TE are only available with the MIL-STD-1760 option.
Besides eliminating the demand for an additional power supply,
the use of a +3.3V only or +5V only transceiver requires the use
of a step-up, rather than a step-down, isolation transformer. This
provides the advantage of higher terminal input impedance than
is possible for a 15 volt or 12 volt transmitter. As a result, there is
a greater margin for the input impedance test, mandated for the
INTRODUCTION
The BU-65743 RT, and BU-65843/65864 BC/RT/MT PCI Mini-
ACE Mark3/Micro-ACE TE family of MIL-STD-1553 terminals
comprise a complete integrated interface between a PCI host
processor and a MIL-STD-1553 bus.
All members of the PCI Mini-ACE Mark3 family are packaged in
the same 0.88" square, 80-lead CQFP package. All members of
the PCI Micro-ACE TE family are packaged in the same 0.8"
square, 324 ball, plastic BGA package.
The PCI Mini-ACE Mark3/Micro-ACE TE hybrid's provide soft-
ware compatibility with the Enhanced Mini-ACE, Mini-ACE (Plus)
terminals, as well as software compatibility with the older ACE
series.
The PCI Mini-ACE Mark3/Micro-ACE TE provides complete mul-
tiprotocol support of MIL-STD-1553A/B/McAir and STANAG
3838. All versions integrate dual transceivers; along with proto-
col, host interface, memory management logic; and a minimum
of 4K words of RAM. In addition, the BU-6586X BC/RT/MT ter-
minals include 64K words of internal RAM, with built-in parity
checking.
The PCI Mini-ACE Mark3s include a 3.3V or 5V voltage source
transceiver for improved line driving capability, with options for
MIL-STD-1760 and McAir compatibility. The PCI Micro-ACE TEs
are available with 3.3V or 5V voltage source transceivers but do
not offer a McAir option. Please consult the ordering information
section at the end of this document for all available options.
To provide further flexibility, the PCI Mini-ACE Mark3/Micro-ACE
TE has internal 1553 master clock dividers that allow operation
with either 10, 12, 16, or 20 MHz clock inputs. The 1553 master
clock divider is software programmable or, in the case of the
Micro ACE TE, can be controlled via pins when the RTBoot
mode is strapped.
The PCI Mini-ACE Mark3/Micro-ACE TEs are fully compliant
targets, as defined by the PCI Local Bus Specification Revision
2.2, using a 32 bit interface that operates at clock speeds of up
to 33 Mhz, from a 3.3V bus. The interface supports PCI interrupts
and contains a FIFO that handles PCI burst write transfer cycles.
The FIFO is deep enough to accept an entire 1553 message.
The PCI interface is NOT 5V tolerant and can not be used in a
5V PCI signaling environment.
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1111 (Fh)MEMORY WRITE & INVALIDATE
1110 (Eh)MEMORY READ LINE
1100 (Ch)MEMORY READ MULTIPLE
1011 (Bh)
CONFIGURATION WRITE
1010 (Ah)CONFIGURATION READ
0111 (7h)MEMORY WRITE
0110 (6h)MEMORY READ
CODE (C/BE[3:0]#)COMMAND TYPE
TABLE 2. PCI TARGET COMMAND CODES
The PCI Mini-ACE Mark3 does not implement the Memory Read
Multiple, Memory Read Line or Memory Write and Invalidate
commands. However, in accordance with PCI rules, the PCI Mini-
ACE Mark3 will accept these requests and alias them to the
basic memory commands. For example, Memory Read Multiple
and Memory Read Line commands will be accepted and treated
as Memory Read commands. Similarly, the PCI Mini-ACE Mark3
will accept a memory Write and Invalidate command and treat it
as a Memory Write command.
ACE memory is accessed internally in 16-bit words, but memory
is accessed sequentially allowing for 32-bits of data to be read
from the PCI bus. In other words, if a 32-bit PCI read is request-
ed the first 16 bits of data would be read from the requested
internal address, the next 16 bits of data would be read from the
initial internal address + 1, and then the resulting 32-bit double
word would be transferred to the PCI bus. The PCI Mini-ACE
Mark3 supports 32-bit and 16-bit read and write operations, 8 bit
reads will return 16 bit data, and 8 bit writes are illegal and will
cause target-aborts.
1553 validation test. This characteristic allows for longer cable
lengths between a system connector and the isolation transform-
ers of an embedded 1553 terminal.
To provide compatibility to McAir specs, the PCI Mini-ACE Mark3
is available with an option for transmitters with increased rise and
fall times.
All PCI Micro-ACE TE parts can be operated with external trans-
ceivers. This is achieved by bonding out the required protocol and
transceiver I/O pads to BGA balls. Most applications will use the
internal transceivers, which requires PCB traces to interconnect
protocol output balls to transceiver input balls and transceiver
output balls to protocol input balls. These interconnections are
listed in TABLE 71.
The 3.3V transceiver parts also have a SLEEP_IN input.
Asserting SLEEP_IN puts the transceivers into a power saving
mode during which the receiver and transmitter of the transceiv-
ers are disabled.
The receiver sections of the PCI Mini-ACE Mark3/Micro-ACE TE
are fully compliant with MIL-STD-1553B Notice 2 in terms of
front-end overvoltage protection, threshold, common mode rejec-
tion, and word error rate.
PCI REGISTER AND MEMORY ADDRESS
The PCI Interface contains a set of "Type 00h" PCI configuration
registers that are used to map the device into the host system.
There are two Base Address Registers that are used to imple-
ment ACE memory space (BAR0) and register space (BAR1).
The PCI configuration register space is mapped in accordance
with PCI revision 2.2 specifications.
The PCI Mini-ACE Mark3 acts as a target and responds to the
following PCI commands:
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The ACE register mapping is located in PCI memory space.
Although the PCI Mini-ACE Mark3 can be accessed in 32-bit
words, all ACE registers are accessed in 16 bit word reads /
writes. If a 32-bit read is performed from the PCI bus in ACE
register space only the first 16 bits of data are valid.
This data sheet will only describe the PCI registers that are spe-
cific to configuring the integrated terminal and shared RAM. For
specifics or definitions on other PCI bus configuration registers,
please see the PCI Local Bus specification revision 2.2.
Vendor ID field contains the vendor's ID configuration register.
Data Device Corporation's ID code is 4DDCh.
Device ID field is used to indicate the device being used. This
field is configured by DDC to reflect the part value of the device.
The following TABLE 4 represents all possible combinations for
the Device ID field:
TABLE 3. CONFIGURATION REGISTER SPACE FOR THE PCI MINI-ACE MARK3/MICRO-ACE TE
00h
ADDRESS
04h
08h
04h
31 24 23 16 15 8 7 0
Device ID Vendor ID
0Xh
(X varies with part #,
see text)
DDC Manufacturer Device ID value (4DDCH)
Status Register Command Register
Class Code = 078000h Rev ID = 02h
0Ch BIST
00h
Cache Line Size
00h
Header Type
00h
Latency Timer
00h
10h R/W
Base Address Register 0 (for ACE memory)
R/W and 0’s
(see text) 00h 00h
14h R/W
Base Address Register 1 (for ACE registers)
R/W R/W and 0’s
(see text) 00h
18h - 24h Base Address Registers 2 through 5 (not used) 00000000h
28h Card Bus CIS pointer (not used) 00000000h
2Ch Subsystem Device and Subsystem Vendor ID Same as Configuration Register 0, Alias Reads to Configuration Register 00
30h Expansion ROM Base Address (Not Used, bit = 0)
34h-38h Reserved
3Ch Max Lat
00h
Interrupt Line
R/W
Min Gnt
00h
Interrupt Pin
01h
RT ONLY WITH 4K OF RAM (BU-65743)0404h
BC/RT/MT WITH 64K OF RAM (BU-65864)
0402h
BC/RT/MT WITH 4K OF RAM (BU-65843)0400h
DESCRIPTION
DEVICE ID
TABLE 4. DEVICE ID FIELD MAPPING
SERR# ENABLE8
09
RESERVED, 0’S15:10
DESCRIPTION
BIT
TABLE 5. PCI COMMAND REGISTER
0
5:2
PARITY ERROR CONTROL
6
0
7
0
0 (LSB)
MEMORY SPACE1
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PCI COMMAND REGISTER
Reserved: These bits are read-only and return zeroes when
read.
SERR# Enable: This is an enable bit for the SERR# driver. A
value of 0b disables the driver. A value of 1b enables the driver.
The value after RST# is 0b.
Parity Error Control: This bit controls the device's response to
parity errors. When the bit is 1b, the device will take its normal
action when a parity error is detected. When this bit is 0b, the
device will ignore any parity errors that it detects and continue
normal operation. The value after RST# is 0b.
Memory Space: This bit controls the device's response to
memory space accesses. A value of 0b disables the device
response. A value of 1b allows the device to respond to memory
space accesses. The value after RST# is 0b.
PCI STATUS REGISTER
This register records status information for PCI bus related
events. Reads to this register behave normally, but writes can
only reset bits. A bit is reset whenever the register is written and
the data in the corresponding bit location is a 1.
Detected Parity Error: This bit will be set by the device when-
ever it detects a parity error, even if the Parity Error Control bit in
the PCI Control register is 0b.
Signaled System Error: This bit indicates when the device has
asserted SERR#. The value after RST# is 0b.
Signaled Target Abort: This bit is set whenever the device ter-
minates a transaction with a Target-Abort. The value after RST#
is 0b.
DEVSEL# Timing: The PCI Mini-ACE Mark3 is 01b, medium.
Fast Back-to-Back Capable: This bit is set to 1b and indicates
that the device is capable of accepting fast back-to-back transac-
tions.
Reserved: These bits are read-only and return zeroes when
read.
Subsystem Vendor ID/Subsystem Device ID: Field is an alias
of the Vendor ID/Device ID fields in Configuration Register 00h.
Base Address Registers: Used to implement ACE memory
space (BAR0) and ACE register space (BAR1). Base Address
Registers 2 through 5 are not used.
BAR0: Used to access ACE memory space. The ACE is allotted
a maximum of 64K words, 128K bytes, for its memory space.
BAR0 will read back as FFFE0000 after all Fs are written to it.
029:28
SIGNALED SYSTEM ERROR
30
DETECTED PARITY ERROR
31
DESCRIPTIONBIT
TABLE 6. PCI STATUS REGISTER
0
24
DEVSEL# TIMING = 01 (MEDIUM)
26:25
SIGNALED TARGET ABORT27
022:21
FAST BACK-TO-BACK CAPABLE = 123
RESERVED, 0’S20:16
BAR0 will read back the same for both the 4K word ACE parts
(BU-65743/843) and the 64K word ACE (BU-65864).
PCI Mini-ACE MARK3/Micro-ACE TE Memory Space: The
least significant bit (LSB) of the PCI address is dropped to form
the ACE memory address.
BAR1: Used to access ACE register locations. The ACE is allot-
ted a maximum of 4K bytes for its register space. BAR1 will read
back as FFFFF000h after all Fs are written to it. All ACE register
locations are accessible through the PCI host via the BAR1 off-
sets 000h to 0FCh. The PCI-to-ACE interface control/status
registers are at 800h to 81Ch. PCI accesses outside of these
specific regions (e.g., to offset 100h or 820h, etc.) will produce
Target Aborts.
PCI Mini-ACE MARK3/Micro-ACE TE Register Space: Register
accesses are on a 32-bit boundary: the last 2 bits of the PCI
address are dropped to form the internal ACE address. (e.g. 000
= ACE Reg 0, 004 = ACE Reg1, 008 = ACE Reg2, etc.). Refer to
TABLE 18 for a listing of these registers. These registers are
nearly 100% compatible with the Enhanced Mini-ACE registers.
For an exhaustive discussion of these registers and 1553 BC/RT/
MT operation, please refer to the "Enhanced Mini-ACE User
Guide".
PCI MINI-ACE MARK3/MICRO-ACE TE
MEMORY SPACE
00000-1FFFC
DEFINITION
ADDRESS
OFF-SET
TABLE 7. (BAR0) ACE MEMORY
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PCI MINI-ACE MARK3/MICRO-ACE TE/REGISTER SPACE
ACE000-0FC
DEFINITION/ACCESSIBILITY
ADDRESS
OFFSET
TABLE 8. (BAR1)ACE/CONTROL REGISTERS
- 4K BYTE TOTAL SPACE
NAME
FAIL-SAFE OPERATION/INTERRUPT (RW/WR)
REG1804
RESERVED (TARGET ABORT IF ACCESSED)--100-7FC
GLOBAL ACTIVITY (RD)
REG0
800
FAIL-SAFE TIMER (RD)
REG2808
DISCARD TIMER PRELOAD (RD/WR)REG5814
FAIL-SAFE TIMER PRELOAD (RD/WR)
REG3
80C
DISCARD TIMER (RD)
REG4
810
GENERAL PURPOSE, CUSTOMER USE (RD/WR)
REG6818
CLEAR FAIL-SAFE INT/RESET ACE (WR)
REG7
81C
RESERVED (TARGET ABORT IF ACCESSED)
--
820-FFC
PCI INTERRUPT ACTIVE
31 (MSB)
DESCRIPTION
BIT
TABLE 9. REG0 GLOBAL ACTIVITY REGISTER (READ 800H)
028
FIFO NOT EMPTY30
029
027
1
24
026
025
BAR1 DRR_DATA_DISCARD
23
FAIL_SAFE ERROR22
021
018
020
019
0
17
PCI MINI-ACE MARK3/MICRO-ACE TE INTERRUPT ACTIVE
16
0
15
00 (LSB)
This register will be all 0s after RST#, except for bit 24.
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PCI_INTERRUPT ACTIVE: When set to '1', indicates that PCI
Mini-ACE Mark3/Micro-ACE TE has asserted it's interrupt pin.
The three possible sources (if enabled and active) are the ACE
core, FailSafe timer and BAR1 DRR_DATA_DISCARD.
FIFO NOT EMPTY: When set to '1', indicates that the write FIFO
is not empty.
BAR1 DRR_DATA_DISCARD: If the data discard timer times
out while waiting for a retry on a BAR1 access, this bit will be set.
If BAR1 read is discarded, it may have caused an action (for
example clearing an ACE interrupt) that has not been recognized
by the PCI MASTER.
FAIL SAFE ERROR: If not in FAIL_SAFE OFF mode and fail
safe error occurs (ACE does not respond), this bit will be set.
Failsafe errors are extremely unlikely.
DRR_HOLD: When '0', a delayed read request is discarded if the
PCI Mini-ACE Mark3/Micro-ACE TE has obtained requested
data and a different transaction is requested. When '1', delayed
read request is held until master repeats original request or tim-
eout occurs.
DRR_HOLD
31 (MSB)
DESCRIPTION
BIT
TABLE 10. REG1 FAIL-SAFE OPERATION/INTERRUPT REGISTER
(READ/WRITE 804H)
RESERVED, WRITE AS 030
BAR1 DRR_DATA_DISCARD INTERRUPT ENABLE20
RESERVED, WRITE AS 022
PCI MINI-ACE MARK3/MICRO-ACE TE INTERRUPT ENABLE21
FAILSAFE INTERRUPT ENABLE
19
FAILSAFE INTERRUPT AUTOCLEAR ENABLE
18
FAILSAFE MODE - BIT 1 (MSB)17
FAILSAFE MODE - BIT 0 (LSB)16
RESERVED , WRITE AS 015
RESERVED, WRITE AS 0
0(LSB)
This register will be all 0s after RST#, except for bit 17 will be 1 (Fail-safe mode =
fail-safe halt). Note that Failsafe errors are extremely unlikely.
BITS 30 - 22: Reserved, write as 0s
PCI MINI-ACE MARK3/MICRO-ACE TE INTERRUPT ENABLE:
Must be set to "1".
BAR1 DRR_DATA_DISCARD INTERRUPT ENABLE: Enables
interrupt to occur on a BAR1 delayed read timeout.
FAILSAFE INTERRUPT ENABLE: When set to a "1", an inter-
rupt is generated if not in FAILSAFE OFF mode and a FAILSAFE
error is detected.
FAILSAFE INTERRUPT AUTOCLEAR ENABLE: If set, causes
interrupt and the FAIL_SAFE ERROR bit (REG0-bit 22) to be
cleared whenever upper word of REG0 is read by the PCI
MASTER. If not set, bit 1 in Reg 7 must be used to clear Failsafe
interrupts.
FAILSAFE MODE: Fail Safe Errors occur when the internal ACE
fails to assert it's hand-shake signal within 1 millisecond (pro-
grammable) of when the internal Strobe or Request signal is
asserted. Four possible FAILSAFE Modes determine how this
situation is handled.
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FAILSAFE SKIP
1
FAILSAFE HALT
1
FAILSAFE RETRY
0
FAILSAFE OFF0
FAILSAFE MODEBIT 17
TABLE 11. FAILSAFE MODE
BIT 16
1
0
1
0
NOTE: FAILSAFE errors are extremely unlikely.
MODE 1 - FAILSAFE OFF. PCI Mini-ACE Mark3/Micro-ACE TE
will wait indefinitely for the transaction to complete. The local bus
could hang as a result. The FAILSAFE ERROR bit and interrupt
will not be generated even if the enable bit is set.
MODE 2 - FAILSAFE RETRY. PCI Mini-ACE Mark3/Micro-ACE
TE will retry the transfer on the local bus when the FAILSAFE
timer times out.
MODE 3 - FAILSAFE HALT. Once the FAILSAFE timer times
out, all future transfers will be terminated with a target abort until
the PCI master clears the interrupt.
MODE 4 - FAILSAFE SKIP. Once the FAILSAFE timer times out,
the current transaction is discarded or skipped and the next
transaction, whether a stored write in the FIFO or a new transac-
tion, will be attempted.
BITS 15-0 ARE RESERVED: Write these bits as 0s.
031(MSB)
DESCRIPTIONBIT
TABLE 13. REG3 FAIL-SAFE TIMER PRELOAD
REGISTER (READ/WRITE 80CH)
FAIL-SAFE TIMER VALUE - BIT 15 (MSB)
15
016
FAIL-SAFE TIMER VALUE - BIT 0 (LSB)0 (LSB)
031(MSB)
DESCRIPTIONBIT
TABLE 12. REG2 FAIL-SAFE TIMER REGISTER
(READ 808H)
FAIL-SAFE TIMER COUNT - BIT 15 (MSB)
15
0
16
FAIL-SAFE TIMER COUNT - BIT 0 (LSB)0 (LSB)
FAIL-SAFE TIMER COUNT: Read this register to obtain the cur-
rent value of the fail-safe timer. Default is 8400h.
FAIL-SAFE TIMER VALUE: Write to this register to set the value
for the fail-safe timer. The default value is 8400h and no access
to this register is needed for normal applications.
031(MSB)
DESCRIPTIONBIT
TABLE 14. REG4 DISCARD TIMER REGISTER
(READ 810H)
DISCARD TIMER CURRENT - BIT 15 (MSB)
15
016
DISCARD TIMER CURRENT - BIT 0 (LSB)
0 (LSB)
DISCARD TIMER CURRENT: Read this register to obtain the
current value of the DISCARD TIMER. Default is 0000h.
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0
31(MSB)
DESCRIPTIONBIT
TABLE 15. REG5 DISCARD TIMER PRELOAD
REGISTER (READ/WRITE 814H)
DISCARD TIMER VALUE - BIT 15 (MSB)
15
0
16
DISCARD TIMER VALUE - BIT 0 (LSB)0 (LSB)
DISCARD TIMER VALUE: Write this register to set the value to
be used for the discard timer. The default value is "0". The default
value meets the PCI spec and no access to this register is
needed for normal applications.
RESERVED - BIT 31 (MSB)31(MSB)
DESCRIPTIONBIT
TABLE 16. REG6 GENERAL PURPOSE REGISTER
(READ/WRITE 818H)
RESERVED - BIT 0 (LSB)
0 (LSB)
This register will be all 0s after RST#. This read/write register is
available for customer use, perhaps as a flag register for signal-
ing between bus masters.
RESERVED, WRITE AS 0 - BIT 31 (MSB)31(MSB)
DESCRIPTIONBIT
TABLE 17. REG7 RESERVED REGISTER
(WRITE 81CH)
RESERVED - BIT 0 (LSB)0 (LSB)
CLEAR FAILSAFE INTERRUPT
1
This register will be all 0s after RST#. No access to this register
is needed for normal applications.
BITS 31-2 ARE RESERVED AND MUST BE WRITTEN AS 0s
CLEAR FAILSAFE INTERRUPT: Clears the Failsafe Interrupt
when set to "1". Failsafe interrupts can also be cleared via the
Failsafe Interrupt Autoclear mechanism, enabled by bit 18 in Reg
1.
ACE RESET: Resets the ACE when set to "1".
PCI MINI-ACE MARK3/MICRO-ACE TE REGISTER AND
MEMORY ADDRESSING
The software interface of the enhanced Mini-ACE portion of the
PCI Mini-ACE Mark3/Micro ACE TE to the host processor con-
sists of 24 internal operational registers for normal operation, an
additional 24 test registers, plus 64K words of shared memory
address space. The PCI Mini-ACE Mark3/Micro-ACE TE's 4K X
16 or 64K X 17 internal RAM resides in this address space.
For normal operation, the host processor only needs to access
the lower 32 register address locations (internal address 00-1F).
The next 32 locations (internal address 20-3F) should be
reserved, since many of these are used for factory test.
INTERNAL REGISTERS
The internal address mapping, with the corresponding PCI BAR1
address offset, for the PCI Mini-ACE Mark3/Micro-ACE TE regis-
ters is illustrated in TABLE 18. Note that the address lines shown
are the PCI Mini-ACE Mark3/Micro-ACE TE's internal ACE reg-
ister bus and are left shifted 2 bits with respect to the PCI
address: A0 = PCI A2, A1 = PCI A3, etc. For example, Interrupt
mask register #1 is located at PCI address BAR1 offset + 0h,
Configuration Register #1 is at BAR1 offset + 4h, etc. Note that
the table below does not show the internal A5 register address
line, which is normally 0 and is set only for access to the reserved
factory test registers.
Also note that the ACE registers are internally 16 bits wide,
appear in the lower 16 bits of a 32-bit PCI DWord and that the
upper 16 bits will read as zeroes during a 32-bit PCI read.
The configuration registers will be cleared to 0000h after hard-
ware or software reset, with the exception of the Enhanced CPU
Access bit (bit 14 in Configuration register #6).
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BC General Purpose Queue Pointer /
RT-MT Interrupt Status Queue Pointer Register (RD/
WR)
1
1
111
BC General Purpose Flag Register (WR)
Interrupt Mask Register #2 (RD/WR)
RESERVED
1
1
0
1
0
1
0
1
0
1
1
1
1
1
1
Interrupt Status Register #2 (RD)
BC Condition Code Register (RD)
BIT Test Status Register (RD)
Configuration Register #7 (RD/WR)
0
1
0
1
1
1
0
0
1
0
1
0
1
1
1
1
1
1
1
1
Configuration Register #6 (RD/WR)0001
1
Test Mode Register 7
11101
Test Mode Register 6
Test Mode Register 4
Test Mode Register 2
0
0
0
1
0
1
1
1
0
0
0
0
1
1
1
Test Mode Register 5
Test Mode Register 3
Test Mode Register 1
1
1
1
0
1
0
1
0
0
0
0
0
1
1
1
Test Mode Register 000001
RT BIT Word Register (RD)
11110
RT Status Word Register (RD)0111
0
Non-Enhanced BC Frame Time / Enhanced BC
Initial Instruction Pointer / RT Last Command /
MT Trigger Word Register(RD/WR)
1
0
1
10
BC Time Remaining to Next Message Register
(RD)
00110
BC Frame Time Remaining Register (RD)
11
0
1
0
RT / Monitor Data Stack Address Register (RD/WR)
010
10
Configuration Register #5 (RD/WR)100
1
0
Configuration Register #4 (RD/WR)00
0
10
Configuration Register #3 (RD/WR)11100
Interrupt Status Register #1 (RD)
0
1
1
0
0
Time Tag Register (RD/WR)
10100
BC Control Word /
RT Subaddress Control Word Register (RD/WR)
00100
Non-Enhanced BC/RT Command Stack Pointer /
Enhanced BC Instruction List Pointer Register
(RD)
1
1
0
00
Start/Reset Register (WR)11000
Configuration Register #2 (RD/WR)0
1
000
Configuration Register #1 (RD/WR)
10000
Interrupt Mask Register #1 (RD/WR)00000
A0A1A2A3A4
REGISTER
DESCRIPTION/ACCESSIBILITY
ADDRESS LINES
TABLE 18. ACE REGISTER ADDRESS MAPPING
BAR1 ADDR
OFFSET
00h
04h
08h
0Ch
0Ch
10h
14h
18h
1Ch
20h
24h
28h
2Ch
30h
34h
38h
3Ch
40h
44h
48h
4Ch
50h
54h
58h
5Ch
60h
64h
68h
6Ch
6Ch
70h
74h
78h
7Ch
16
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TABLE 19. INTERRUPT MASK REGISTER #1
(READ/WRITE 00H,PCI 00H)
BIT DESCRIPTION
15(MSB) RESERVED
14 RAM PARITY ERROR
13 BC/RT TRANSMITTER TIMEOUT
12 BC/RT COMMAND STACK ROLLOVER
11 MT COMMAND STACK ROLLOVER
10 MT DATA STACK ROLLOVER
9HANDSHAKE FAIL
8BC RETRY
7RT ADDRESS PARITY ERROR
6TIME TAG ROLLOVER
5RT CIRCULAR BUFFER ROLLOVER
4RT SUBADDRESS CONTROL WORD EOM
3BC END OF FRAME
2FORMAT ERROR
1BC STATUS SET/RT MODE CODE/MT PATTERN TRIGGER
0(LSB) END OF MESSAGE
TABLE 20. CONFIGURATION REGISTER #1
(READ/WRITE 01H, PCI 04H)
BIT BC FUNCTION (Bits
11-0 Enhanced Mode Only)
RT WITHOUT ALTERNATE
STATUS
RT WITH ALTERNATE
STATUS (Enhanced Only)
MONITOR FUNCTION
(Enhanced mode only bits 12-0)
15 (MSB) RT/BC-MT (logic 0) (logic 1) (logic 1) (logic 0)
14 MT/BC-RT (logic 0) (logic 0) (logic 0) (logic 1)
13 CURRENT AREA B/ACURRENT AREA B/ACURRENT AREA B/ACURRENT AREA B/A
12 MESSAGE STOP-ON-ERROR MESSAGE MONITOR ENABLED
(MMT)
MESSAGE MONITOR
ENABLED
MESSAGE MONITOR ENABLED
11 FRAME STOP-ON-ERROR S10 TRIGGER WORD ENABLED
10 STATUS SET
STOP-ON-MESSAGE
BUSY S09 START-ON-TRIGGER
9STATUS SET
STOP-ON-FRAME
SERVICE REQUEST S08 STOP-ON-TRIGGER
8FRAME AUTO-REPEAT SSFLAG S07 NOT USED
7EXTERNAL TRIGGER
ENABLED
RTFLAG (Enhanced Mode Only) S06 EXTERNAL TRIGGER ENABLED
6INTERNAL TRIGGER ENABLED NOT USED S05 NOT USED
5INTERMESSAGE GAP TIMER
ENABLED
NOT USED S04 NOT USED
4RETRY ENABLED NOT USED S03 NOT USED
3 DOUBLED/SINGLE RETRY NOT USED S02 NOT USED
2BC ENABLED (Read Only) NOT USED S01 MONITOR ENABLED(Read Only)
1BC FRAME IN PROGRESS
(Read Only)
NOT USED S00 MONITOR TRIGGERED
(Read Only)
0 (LSB) BC MESSAGE IN PROGRESS
(Read Only)
RT MESSAGE IN PROGRESS
(Enhanced mode only,Read Only)
RT MESSAGE IN
PROGRESS (Read Only)
MONITOR ACTIVE
(Read Only)
DYNAMIC BUS CONTROL
ACCEPTANCE
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SEPARATE BROADCAST DATA0(LSB)
ENHANCED RT MEMORY MANAGEMENT1
CLEAR SERVICE REQUEST2
LEVEL/PULSE INTERRUPT REQUEST3
INTERRUPT STATUS AUTO CLEAR4
LOAD TIME TAG ON SYNCHRONIZE5
CLEAR TIME TAG ON SYNCHRONIZE6
TIME TAG RESOLUTION 0 7
TIME TAG RESOLUTION 1 8
TIME TAG RESOLUTION 2 9
256-WORD BOUNDARY DISABLE10
OVERWRITE INVALID DATA11
RESERVED FOR FUTURE USE, MUST BE 012
BUSY LOOKUP TABLE ENABLE13
RAM PARITY ENABLE14
ENHANCED INTERRUPTS15(MSB)
DESCRIPTIONBIT
TABLE 21. CONFIGURATION REGISTER #2
(READ/WRITE 02H, PCI 08H)
TABLE 22. START/RESET REGISTER
(WRITE 03H, PCI 0CH)
BIT DESCRIPTION
15(MSB) RESERVED
14 RESERVED
12
13
RESERVED
RESERVED
8
10
9
11
RESERVED
CLEAR SELF-TEST REGISTER
INITIATE RAM SELF-TEST
CLEAR RT HALT
7 RESERVED
6BC/MT STOP-ON-MESSAGE
5BC STOP-ON-FRAME
4TIME TAG TEST CLOCK
3TIME TAG RESET
2INTERRUPT RESET
1BC/MT START
0(LSB) RESET
COMMAND STACK POINTER 00(LSB)
COMMAND STACK POINTER 1515(MSB)
DESCRIPTIONBIT
TABLE 23. BC/RT COMMAND STACK POINTER
REGISTER (READ 03H, PCI 0CH)
RT-to-RT FORMAT0(LSB)
BROADCAST FORMAT1
MODE CODE FORMAT2
SUBSYSTEM FLAG BIT MASK
1553A/B SELECT3
EOM INTERRUPT ENABLE4
MASK BROADCAST BIT5
OFF-LINE SELF-TEST6
BUS CHANNEL A/B7
RETRY ENABLED8
RESERVED BITS MASK9
TERMINAL FLAG BIT MASK10
BUSY BIT MASK12
SERVICE REQUEST BIT MASK13
MESSAGE ERROR MASK14
RESERVED 15(MSB)
DESCRIPTIONBIT
11
TABLE 24. BC CONTROL WORD REGISTER
(READ/WRITE 04H, PCI 10H)
BCST: MEMORY MANAGEMENT 0 (MM0)0(LSB)
BCST: MEMORY MANAGEMENT 1 (MM1)1
BCST: MEMORY MANAGEMENT 2 (MM2)2
TX: MEMORY MANAGEMENT 1 (MM1)
BCST: CIRC BUF INT3
BCST: EOM INT4
RX: MEMORY MANAGEMENT 0 (MM0)5
RX: MEMORY MANAGEMENT 1 (MM1)6
RX: MEMORY MANAGEMENT 2 (MM2)7
RX: CIRC BUF INT8
RX: EOM INT9
TX: MEMORY MANAGEMENT 0 (MM0)10
TX: MEMORY MANAGEMENT 2 (MM2)12
TX: CIRC BUF INT13
TX: EOM INT14
RX: GLOBAL CIRCULAR BUFFER ENABLE15(MSB)
DESCRIPTIONBIT
11
TABLE 25. RT SUBADDRESS CONTROL WORD
(READ/WRITE 04H, PCI 10H)
TIME TAG 00(LSB)
TIME TAG 1515(MSB)
DESCRIPTIONBIT
TABLE 26. TIME TAG REGISTER
(READ/WRITE 05H, PCI 14H)
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END OF MESSAGE0(LSB)
BC STATUS SET / RT MODE CODE /
MT PATTERN TRIGGER
1
FORMAT ERROR2
MT COMMAND STACK ROLLOVER
BC END OF FRAME3
RT SUBADDRESS CONTROL WORD EOM4
RT CIRCULAR BUFFER ROLLOVER5
TIME TAG ROLLOVER6
RT ADDRESS PARITY ERROR7
BC RETRY8
HANDSHAKE FAIL9
MT DATA STACK ROLLOVER10
BC/RT COMMAND STACK ROLLOVER12
TRANSMITTER TIMEOUT13
RAM PARITY ERROR14
MASTER INTERRUPT15(MSB)
DESCRIPTIONBIT
11
TABLE 27. INTERRUPT STATUS REGISTER #1
(READ 06H, PCI 18H)
ENHANCED MODE CODE HANDLING0(LSB)
1553A MODE CODES ENABLE1
RTFAIL / RTFLAG WRAP ENABLE2
MT COMMAND STACK SIZE 0
RESERVED, SET TO 03
ILLEGAL RX TRANSFER DISABLE4
ALTERNATE STATUS WORD ENABLE5
OVERRIDE MODE T/R ERROR6
ILLEGALIZATION DISABLED7
MT DATA STACK SIZE 08
MT DATA STACK SIZE 19
MT DATA STACK SIZE 210
MT COMMAND STACK SIZE 112
BC/RT COMMAND STACK SIZE 013
BC/RT COMMAND STACK SIZE 114
ENHANCED MODE ENABLE15(MSB)
DESCRIPTIONBIT
11
TABLE 28. CONFIGURATION REGISTER #3
(READ/WRITE 07H, PCI 1CH)
RT ADDRESS PARITY0(LSB)
RT ADDRESS 01
RT ADDRESS 12
EXPANDED CROSSING ENABLED
RT ADDRESS 23
RT ADDRESS 34
RT ADDRESS 45
RT ADDRESS LATCH/TRANSPARENT 6
BROADCAST DISABLED7
GAP CHECK ENABLED8
RESPONSE TIMEOUT SELECT 09
RESPONSE TIMEOUT SELECT 110
EXTERNAL TX INHIBIT B12
EXTERNAL TX INHIBIT A13
SINGLE-ENDED SELECT14
12 / 16 MHZ CLOCK SELECT 15(MSB)
DESCRIPTIONBIT
11
TABLE 30. CONFIGURATION REGISTER #5
(READ/WRITE 09H, PCI 24H)
RT / MONITOR DATA STACK ADDRESS 00(LSB)
RT / MONITOR DATA STACK ADDRESS 1515(MSB)
DESCRIPTIONBIT
TABLE 31. RT / MONITOR DATA STACK ADDRESS
REGISTER
(READ/WRITE 0AH, PCI 28H)
TEST MODE 00(LSB)
TEST MODE 11
TEST MODE 22
BROADCAST MASK ENA/XOR
LATCH RT ADDRESS WITH CONFIG #53
MT TAG GAP OPTION4
VALID BUSY/NO DATA5
VALID M.E./NO DATA6
2ND RETRY ALT/SAME BUS7
1ST RETRY ALT/SAME BUS8
RETRY IF STATUS SET9
RETRY IF -A AND M.E.10
Expanded Control Word12
Mode Command Override Busy13
Inhibit Bit Word if Busy14
External Bit Word Enable15(MSB)
DESCRIPTIONBIT
11
TABLE 29. CONFIGURATION REGISTER #4
(READ/WRITE 08H, PCI 20H)
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BC FRAME TIME REMAINING 00(LSB)
BC FRAME TIME REMAINING 1515(MSB)
DESCRIPTIONBIT
TABLE 32. BC FRAME TIME REMAINING REGISTER
(READ/WRITE 0BH, PCI 2CH)
Note: resolution = 100 µs per LSB
BC MESSAGE TIME REMAINING 00(LSB)
BC MESSAGE TIME REMAINING 1515(MSB)
DESCRIPTIONBIT
TABLE 33. BC MESSAGE TIME REMAINING
REGISTER
(READ/WRITE 0CH, PCI 30H)
Note: resolution = 1 µs per LSB
BIT 00(LSB)
BIT 1515(MSB)
DESCRIPTIONBIT
TABLE 34. BC FRAME TIME / RT LAST COMMAND /
MT TRIGGER REGISTER (READ/WRITE 0DH,
PCI 34H)
TABLE 35. RT STATUS WORD REGISTER
(READ/WRITE 0EH, PCI 38H)
11
BIT DESCRIPTION
15(MSB) LOGIC “0”
12 LOGIC “0”
14 LOGIC “0”
13 LOGIC “0”
10 MESSAGE ERROR
9 INSTRUMENTATION
8SERVICE REQUEST
7 RESERVED
6 RESERVED
5 RESERVED
4BROADCAST COMMAND RECEIVED
3 BUSY
LOGIC “0”
2 SSFLAG
1DYNAMIC BUS CONTROL ACCEPT
0(LSB) TERMINAL FLAG
COMMAND WORD CONTENTS ERROR0(LSB)
RT-to-RT 2ND COMMAND WORD ERROR1
RT-to-RT NO RESPONSE ERROR2
TRANSMITTER SHUTDOWN B
RT-to-RT GAP / SYNCH / ADDRESS ERROR3
PARITY / MANCHESTER ERROR RECEIVED4
INCORRECT SYNC RECEIVED5
LOW WORD COUNT6
HIGH WORD COUNT7
BIT TEST FAIL8
TERMINAL FLAG INHIBITED9
TRANSMITTER SHUTDOWN A10
HANDSHAKE FAILURE12
LOOP TEST FAILURE A13
LOOP TEST FAILURE B14
TRANSMITTER TIMEOUT
15(MSB)
DESCRIPTIONBIT
11
TABLE 36. RT BIT WORD REGISTER
(READ 0FH, PCI 3CH)
CLOCK SELECT 00(LSB)
CLOCK SELECT 11
64-WORD REGISTER SPACE2
GLOBAL CIRCULAR BUFFER SIZE 2
RESERVED3
ENHANCED MESSAGE MONITOR4
RT ADDRESS SOURCE5
INTERRUPT STATUS QUEUE ENABLE6
DISABLE VALID MESSAGES TO INTERRUPT STATUS
QUEUE
7
DISABLE INVALID MESSAGES TO INTERRUPT STATUS
QUEUE
8
GLOBAL CIRCULAR BUFFER SIZE 09
GLOBAL CIRCULAR BUFFER SIZE 110
GLOBAL CIRCULAR BUFFER ENABLE12
COMMAND STACK POINTER INCREMENT ON EOM
(RT, MT)
13
ENHANCED CPU ACCESS14
ENHANCED BUS CONTROLLER
15(MSB)
DESCRIPTIONBIT
11
TABLE 37. CONFIGURATION REGISTER #6
(READ/WRITE 18H, PCI 60H)
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MODE CODE RESET / INCMD SELECT
0(LSB)
ENHANCED BC WATCHDOG TIMER ENABLED
1
ENHANCED TIMETAG SYNCHRONIZE
2
MEMORY MANAGEMENT BASE ADDRESS 11
1553B RESPONSE TIME3
RT HALT ENABLE
4
RESERVED5
RESERVED6
RESERVED7
RESERVED8
RESERVED9
MEMORY MANAGEMENT BASE ADDRESS 1010
MEMORY MANAGEMENT BASE ADDRESS 1212
MEMORY MANAGEMENT BASE ADDRESS 1313
MEMORY MANAGEMENT BASE ADDRESS 1414
MEMORY MANAGEMENT BASE ADDRESS 15
15(MSB)
DESCRIPTIONBIT
11
TABLE 38. CONFIGURATION REGISTER #7
(READ/WRITE 19H, PCI 64H)
EQUAL FLAG / GENERAL PURPOSE FLAG 10(LSB)
LESS THAN FLAG / GENERAL PURPOSE FLAG 11
GENERAL PURPOSE FLAG 22
MESSAGE STATUS SET
GENERAL PURPOSE FLAG 33
GENERAL PURPOSE FLAG 44
GENERAL PURPOSE FLAG 55
GENERAL PURPOSE FLAG 66
GENERAL PURPOSE FLAG 77
NO RESPONSE8
FORMAT ERROR9
GOOD BLOCK TRANSFER10
BAD MESSAGE12
RETRY 013
RETRY 114
ALWAYS15(MSB)
DESCRIPTIONBIT
11
TABLE 39. BC CONDITION REGISTER
(READ 1BH, PCI 6CH)
SET GENERAL PURPOSE FLAG 00(LSB)
SET GENERAL PURPOSE FLAG 11
SET GENERAL PURPOSE FLAG 22
CLEAR GENERAL PURPOSE FLAG 3
SET GENERAL PURPOSE FLAG 33
SET GENERAL PURPOSE FLAG 44
SET GENERAL PURPOSE FLAG 55
SET GENERAL PURPOSE FLAG 66
SET GENERAL PURPOSE FLAG 77
CLEAR GENERAL PURPOSE FLAG 08
CLEAR GENERAL PURPOSE FLAG 19
CLEAR GENERAL PURPOSE FLAG 210
CLEAR GENERAL PURPOSE FLAG 412
CLEAR GENERAL PURPOSE FLAG 513
CLEAR GENERAL PURPOSE FLAG 614
CLEAR GENERAL PURPOSE FLAG 715(MSB)
DESCRIPTIONBIT
11
TABLE 40. BC GENERAL PURPOSE FLAG REGISTER
(WRITE 1BH, PCI 6CH)
LOGIC “0”0(LSB)
LOGIC “0”1
LOGIC “0”2
LOGIC “0”
LOGIC “0”3
LOGIC “0”4
RAM BUILT-IN TEST IN-PASSED5
RAM BUILT-IN TEST IN-PROGRESS6
RAM BUILT-IN TEST COMPLETE7
LOGIC “0”8
LOGIC “0”9
LOGIC “0”10
LOGIC “0”12
LOGIC “0”13
LOGIC “0”14
LOGIC “0”15(MSB)
DESCRIPTIONBIT
11
TABLE 41. BIT TEST STATUS REGISTER
(READ 1CH, PCI 70H)
Note: If the Enhanced Mini-ACE is not online in enhanced BC mode
(i.e., processing instructions), the BC condition code register will always
return a value of 0000.
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NOT USED0(LSB)
BIT TEST COMPLETE1
ENHANCED BC IRQ02
CALL STACK POINTER REGISTER ERROR
ENHANCED BC IRQ13
ENHANCED BC IRQ24
ENHANCED BC IRQ35
MONITOR DATA STACK 50% ROLLOVER6
MONITOR COMMAND STACK 50% ROLLOVER7
RT CIRCULAR BUFFER 50% ROLLOVER8
RT COMMAND STACK 50% ROLLOVER9
BC TRAP OP CODE10
GENERAL PURPOSE QUEUE /
INTERRUPT STATUS QUEUE ROLLOVER
12
ILLEGAL COMMAND13
BC OP CODE PARITY ERROR14
NOT USED15(MSB)
DESCRIPTIONBIT
11
TABLE 42. INTERRUPT MASK REGISTER #2
(READ/WRITE 1DH, PCI 74H)
INTERRUPT CHAIN BIT0(LSB)
BIT TEST COMPLETE1
ENHANCED BC IRQ02
CALL STACK POINTER REGISTER ERROR
ENHANCED BC IRQ13
ENHANCED BC IRQ24
ENHANCED BC IRQ35
MONITOR DATA STACK 50% ROLLOVER6
MONITOR COMMAND STACK 50% ROLLOVER7
RT CIRCULAR BUFFER 50% ROLLOVER8
RT COMMAND STACK 50% ROLLOVER9
BC TRAP OP CODE10
GENERAL PURPOSE QUEUE /
INTERRUPT STATUS QUEUE ROLLOVER
12
ILLEGAL COMMAND13
BC OP CODE PARITY ERROR14
MASTER INTERRUPT15(MSB)
DESCRIPTIONBIT
11
TABLE 43. INTERRUPT STATUS REGISTER #2
(READ 1EH, PCI 78H)
QUEUE POINTER BASE ADDRESS 0
0(LSB)
QUEUE POINTER BASE ADDRESS 11
QUEUE POINTER BASE ADDRESS 22
QUEUE POINTER BASE ADDRESS 11
QUEUE POINTER BASE ADDRESS 33
QUEUE POINTER BASE ADDRESS 44
QUEUE POINTER BASE ADDRESS 55
QUEUE POINTER BASE ADDRESS 66
QUEUE POINTER BASE ADDRESS 77
QUEUE POINTER BASE ADDRESS 88
QUEUE POINTER BASE ADDRESS 99
QUEUE POINTER BASE ADDRESS 1010
QUEUE POINTER BASE ADDRESS 1212
QUEUE POINTER BASE ADDRESS 1313
QUEUE POINTER BASE ADDRESS 1414
QUEUE POINTER BASE ADDRESS 1515(MSB)
DESCRIPTIONBIT
11
TABLE 44. BC GENERAL PURPOSE QUEUE
POINTER REGISTER
RT, MT INTERRUPT STATUS QUEUE POINTER
REGISTER
(READ/WRITE 1FH, PCI 7CH)
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COMMAND WORD CONTENTS ERROR0(LSB)
RT-to-RT 2ND COMMAND ERROR1
RT-to-RT GAP / SYNC / ADDRESS ERROR2
RT-to-RT FORMAT
INVALID WORD3
INCORRECT DATA SYNC4
WORD COUNT ERROR5
ILLEGAL COMMAND WORD6
DATA STACK ROLLOVER7
LOOP TEST FAIL8
NO RESPONSE TIMEOUT9
FORMAT ERROR 10
ERROR FLAG12
CHANNEL B/A13
SOM14
EOM
15(MSB)
DESCRIPTIONBIT
11
TABLE 46. RT MODE BLOCK STATUS WORD
GAP TIME
MODE_CODE0(LSB)
CONTIGUOUS DATA / GAP1
CHANNEL B/A2
COMMAND / DATA3
ERROR4
BROADCAST5
THIS RT6
WORD FLAG7
GAP TIME 15(MSB)
DESCRIPTIONBIT
8
TABLE 48. WORD MONITOR IDENTIFICATION
WORD
DATA WORD COUNT / MODE CODE BIT 00(LSB)
DATA WORD COUNT / MODE CODE BIT 11
DATA WORD COUNT / MODE CODE BIT 22
REMOTE TERMINAL ADDRESS BIT 0
DATA WORD COUNT / MODE CODE BIT 33
DATA WORD COUNT / MODE CODE BIT 44
SUBADDRESS / MODE CODE BIT 05
SUBADDRESS / MODE CODE BIT 16
SUBADDRESS / MODE CODE BIT 27
SUBADDRESS / MODE CODE BIT 38
SUBADDRESS / MODE CODE BIT 49
TRANSMIT / RECEIVE10
REMOTE TERMINAL ADDRESS BIT 112
REMOTE TERMINAL ADDRESS BIT 213
REMOTE TERMINAL ADDRESS BIT 314
REMOTE TERMINAL ADDRESS BIT 415(MSB)
DESCRIPTIONBIT
11
TABLE 47. 1553 COMMAND WORD
NOTE: TABLES 45 TO 51 ARE NOT REGISTERS, BUT THEY ARE WORDS STORED IN RAM.
INVALID WORD0(LSB)
INCORRECT SYNC TYPE1
WORD COUNT ERROR2
STATUS SET
WRONG STATUS ADDRESS / NO GAP3
GOOD DATA BLOCK TRANSFER4
RETRY COUNT 05
RETRY COUNT 16
MASKED STATUS SET7
LOOP TEST FAIL8
NO RESPONSE TIMEOUT9
FORMAT ERROR 10
ERROR FLAG12
CHANNEL B/A13
SOM14
EOM
15(MSB)
DESCRIPTIONBIT
11
TABLE 45. BC MODE BLOCK STATUS WORD
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COMMAND WORD CONTENTS ERROR0(LSB)
RT-to-RT 2ND COMMAND ERROR1
RT-to-RT GAP / SYNC / ADDRESS ERROR2
RT-to-RT TRANSFER
INVALID WORD3
INCORRECT SYNC4
WORD COUNT ERROR5
RESERVED6
DATA STACK ROLLOVER7
GOOD DATA BLOCK TRANSFER8
NO RESPONSE TIMEOUT9
FORMAT ERROR 10
ERROR FLAG12
CHANNEL B/A13
SOM14
EOM
15(MSB)
DESCRIPTIONBIT
11
TABLE 49. MESSAGE MONITOR MODE BLOCK
STATUS WORD
TERMINAL FLAG0(LSB)
DYNAMIC BUS CONTROL ACCEPTANCE1
SSFLAG2
REMOTE TERMINAL ADDRESS BIT 0
BUSY3
BROADCAST COMMAND RECEIVED4
RESERVED5
RESERVED6
RESERVED7
SERVICE REQUEST8
INSTRUMENTATION9
MESSAGE ERROR10
REMOTE TERMINAL ADDRESS BIT 112
REMOTE TERMINAL ADDRESS BIT 213
REMOTE TERMINAL ADDRESS BIT 314
REMOTE TERMINAL ADDRESS BIT 415(MSB)
DESCRIPTIONBIT
11
TABLE 50. 1553B STATUS WORD
NON-TEST REGISTER FUNCTION SUMMARY
A summary of the PCI Mini-ACE Mark3/Micro-ACE TE’s 24 non-
test registers follows.
INTERRUPT MASK REGISTERS #1 AND #2
Interrupt Mask Registers #1 and #2 are used to enable and dis-
able interrupt requests for various events and conditions.
NOTE: Please see Appendix “F” of the Enhanced Mini-ACE
User’s Guide for important information applicable only to RT
MODE operation, enabling of the interrupt status queue and
use of specific non-message interrupts.
CONFIGURATION REGISTERS #1 AND #2
Configuration Registers #1 and #2 are used to select the PCI
Mini-ACE Mark3/Micro-ACE TE’s mode of operation, and for
software control of RT Status Word bits, Active Memory Area, BC
Stop-On-Error, RT Memory Management mode selection, and
control of the Time Tag operation. Note that the LEVEL/PULSE
INTERRUPT REQUEST bit in Configuration Register #2 MUST
be set to 1 for correct PCI operation.
START/RESET REGISTER
The Start/Reset Register is used for "command" type functions
such as software reset, BC/MT Start, Interrupt reset, Time Tag
Reset, Time Tag Register Test, Initiate RAM self-test, Clear self-
test register, and Clear RT Halt. The Start/Reset Register also
includes provisions for stopping the BC in its auto-repeat mode,
either at the end of the current message or at the end of the cur-
rent BC frame.
“1” FOR MESSAGE INTERRUPT EVENT
“0” FOR NON-MESSAGE INTERRUPT EVENT
0
END-OF-MESSAGE (EOM) RAM PARITY ERROR1
SUBADDRESS CONTROL
WORD EOM NOT USED2
RT CIRCULAR BUFFER 50%
ROLLOVER NOT USED
MODE CODE INTERRUPT RT ADDRESS PARITY
ERROR
3
FORMAT ERROR TIME TAG ROLLOVER4
HANDSHAKE FAIL NOT USED5
RT COMMAND (DESCRIPTOR)
STACK ROLLOVER NOT USED6
RT COMMAND (DESCRIPTOR)
STACK 50% ROLLOVER NOT USED7
MONITOR COMMAND
(DESCRIPTOR) STACK
ROLLOVER
NOT USED8
MONITOR COMMAND
(DESCRIPTOR) STACK 50%
ROLLOVER
NOT USED9
RT CIRCULAR BUFFER
ROLLOVER NOT USED10
MONITOR DATA STACK
ROLLOVER NOT USED12
MONITOR DATA STACK 50%
ROLLOVER NOT USED13
ILLEGAL COMMAND NOT USED14
TRANSMITTER TIMEOUT NOT USED15
DEFINITION FOR MESSAGE
INTERRUPT EVENT
DEFINITION FOR
NON-MESSAGE
INTERRUPT EVENT
BIT
11
TABLE 51. RT/MONITOR INTERRUPT STATUS WORD
(FOR INTERRUPT STATUS QUEUE)
24
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alternate (fully software programmable) RT Status Word. For MT
mode, use of the Enhanced Mode enables the Selective
Message Monitor, the combined RT/Selective Monitor modes,
and the monitor triggering capability.
RT/MONITOR DATA STACK ADDRESS REGISTER
The RT/Monitor Data Stack Address Register provides a read/
writable indication of the last data word stored for RT or Monitor
modes.
BC FRAME TIME REMAINING REGISTER
The BC Frame Time Remaining Register provides a read-only
indication of the time remaining in the current BC frame. In the
enhanced BC mode, this timer may be used for minor or major
frame control, or as a watchdog timer for the BC message
sequence control processor. The resolution of this register is
100 µs/LSB.
BC TIME REMAINING TO NEXT MESSAGE REGISTER
The BC Time Remaining to Next Message Register provides a
read-only indication of the time remaining before the start of the
next message in a BC frame. In the enhanced BC mode, this
timer may also be used for the BC message sequence control
processor's Delay (DLY) instruction, or for minor or major frame
control. The resolution of this register is 1 µs/LSB.
BC FRAME TIME/ RT LAST COMMAND /MT TRIGGER
WORD REGISTER
In BC mode, this register is used to program the BC frame time,
for use in the frame auto-repeat mode. The resolution of this
register is 100 µs/LS, with a range up to 6.55 seconds. In RT
mode, this register stores the current (or most previous) 1553
Command Word processed by the PCI Mini-ACE Mark3/Micro-
ACE TE RT. In the Word Monitor mode, this register is used to
specify a 16-bit Trigger (Command) Word. The Trigger Word may
be used to start or stop the monitor, or to generate interrupts.
BC INITIAL INSTRUCTION LIST POINTER REGISTER
The BC Initial Instruction List Pointer Register enables the host
to assign the starting address for the enhanced BC Instruction
List.
RT STATUS WORD REGISTER AND BIT WORD
REGISTERS
The RT Status Word Register and BIT Word Registers provide
read-only indications of the RT Status and BIT Words.
CONFIGURATION REGISTERS #6 AND #7
Configuration Registers #6 and #7 are used to enable the PCI
Mini-ACE Mark3/Micro-ACE TE features that extend beyond the
architecture of the ACE/Mini-ACE (Plus). These include the
Enhanced BC mode; Enhanced CPU Access (note that this bit is
the only configuration bit that is SET after reset), RT Global
Circular Buffer (including buffer size); the RT/MT Interrupt Status
Queue, including valid/invalid message filtering; enabling a soft-
ware-assigned RT address; clock frequency selection; a base
BC/RT COMMAND STACK REGISTER
The BC/RT Command Stack Register allows the host CPU to
determine the pointer location for the current or most recent
message.
BC INSTRUCTION LIST POINTER REGISTER
The BC Instruction List Pointer Register may be read to deter-
mine the current location of the Instruction List Pointer for the
Enhanced BC mode.
BC CONTROL WORD/RT SUBADDRESS CONTROL
WORD REGISTER
In BC mode, the BC Control Word/RT Subaddress Control Word
Register allows host access to the current word or most recent
BC Control Word. The BC Control Word contains bits that select
the active bus and message format, enable off-line self-test,
masking of Status Word bits, enable retries and interrupts, and
specify MIL-STD-1553A or -1553B error handling. In RT mode,
this register allows host access to the current or most recent
Subaddress Control Word. The Subaddress Control Word is
used to select the memory management scheme and enable
interrupts for the current message.
TIME TAG REGISTER
The Time Tag Register maintains the value of a real-time clock.
The resolution of this register is programmable from among 2, 4,
8, 16, 32, and 64 µs/LSB. The Start-of-Message (SOM) and
End-of-Message (EOM) sequences in BC, RT, and Message
Monitor modes cause a write of the current value of the Time Tag
Register to the stack area of the RAM.
INTERRUPT STATUS REGISTERS #1 AND #2
Interrupt Status Registers #1 and #2 allow the host processor to
determine the cause of an interrupt request by means of one or
two read accesses. The interrupt events of the two Interrupt
Status Registers are mapped to correspond to the respective bit
positions in the two Interrupt Mask Registers. Interrupt Status
Register #2 contains an INTERRUPT CHAIN bit, used to indi-
cate an interrupt event from Interrupt Status Register #1.
CONFIGURATION REGISTERS #3, #4, AND #5
Configuration Registers #3, #4, and #5 are used to enable many
of the Mini-ACE Mark3/Micro-ACE TE’s advanced features that
were implemented by the prior generation products, the ACE and
Mini-ACE (Plus). For BC, RT, and MT modes, use of the
Enhanced Mode enables the various read-only bits in
Configuration Register #1. For BC mode, Enhanced Mode fea-
tures include the expanded BC Control Word and BC Block
Status Word, additional Stop-On-Error and Stop-On-Status Set
functions, frame auto-repeat, programmable intermessage gap
times, automatic retries, expanded Status Word Masking, and
the capability to generate interrupts following the completion of
any selected message. For RT mode, the Enhanced Mode fea-
tures include the expanded RT Block Status Word, combined RT/
Selective Message Monitor mode, internal wrapping of the
RTFAIL output signal to the RTFLAG RT Status Word bit, and the
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address for the "non-data" portion of Mini-ACE Mark3/Micro-
ACE TE memory; LSB filtering for the Synchronize (with data)
time tag operations; and enabling a watchdog timer for the
Enhanced BC message sequence control engine.
NOTE: Please see Appendix “F” of the Enhanced Mini-ACE
User’s Guide for important information applicable only to RT
MODE operation, enabling of the interrupt status queue and
use of specific non-message interrupts.
BC CONDITION CODE REGISTER
The BC Condition Code Register is used to enable the host pro-
cessor to read the current value of the Enhanced BC Message
Sequence Control Engine's condition flags.
BC GENERAL PURPOSE FLAG REGISTER
The BC General Purpose Flag Register allows the host processor
to be able to set, clear, or toggle any of the Enhanced BC Message
Sequence Control Engine's General Purpose condition flags.
BIT TEST STATUS REGISTER
The BIT Test Status Register is used to provide read-only access
to the status of the RAM built-in self-tests (BIT).
BC GENERAL PURPOSE QUEUE POINTER
The BC General Purpose Queue Pointer provides a means for
initializing the pointer for the General Purpose Queue, for the
Enhanced BC mode. In addition, this register enables the host to
determine the current location of the General Purpose Queue
pointer, which is incremented internally by the Enhanced BC
message sequence control engine.
RT/MT INTERRUPT STATUS QUEUE POINTER
The RT/MT Interrupt Status Queue Pointer provides a means for
initializing the pointer for the Interrupt Status Queue, for RT, MT,
and RT/MT modes. In addition, this register enables the host to
determine the current location of the Interrupt Status Queue
pointer, which is incremented by the RT/MT message proces-
sor.
BUS CONTROLLER (BC) ARCHITECTURE
The BC functionality for the PCI Mini-ACE Mark3/Micro-ACE TE
includes two separate architectures: (1) the older, non-Enhanced
Mode, which provides complete compatibility with the previous
ACE and Mini-ACE (Plus) generation products; and (2) the
newer, Enhanced BC mode. The Enhanced BC mode offers sev-
eral new powerful architectural features. These include the incor-
poration of a highly autonomous BC message sequence control
engine, which greatly serves to offload the operation of the host
CPU.
The Enhanced BC's message sequence control engine provides
a high degree of flexibility for implementing major and minor
frame scheduling; capabilities for inserting asynchronous mes-
sages in the middle of a frame; to separate 1553 message data
from control/status data for the purpose of implementing double
buffering and performing bulk data transfers; for implementing
message retry schemes, including the capability for automatic
bus channel switchover for failed messages; and for reporting
various conditions to the host processor by means of 4 user-
defined interrupts and a general purpose queue.
In both the non-Enhanced and Enhanced BC modes, the PCI
Mini-ACE Mark3/Micro-ACE TE BC implements all MIL-STD-
1553B message formats. Message format is programmable on a
message-by-message basis by means of the BC Control Word
and the T/R bit of the Command Word for the respective mes-
sage. The BC Control Word allows 1553 message format,
1553A/B type RT, bus channel, self-test, and Status Word mask-
ing to be specified on an individual message basis. In addition,
automatic retries and/or interrupt requests may be enabled or
disabled for individual messages. The BC performs all error
checking required by MIL-STD-1553B. This includes validation of
response time, sync type and sync encoding, Manchester II
encoding, parity, bit count, word count, Status Word RT Address
field, and various RT-to-RT transfer errors. The PCI Mini-ACE
Mark3/Micro-ACE TE BC response timeout value is program-
mable with choices of 18, 22, 50, and 130 µs. The longer
response timeout values allow for operation over long buses and/
or the use of repeaters.
In its non-Enhanced Mode, the PCI Mini-ACE Mark3/Micro-ACE
TE may be programmed to process BC frames of up to 512 mes-
sages with no processor intervention. In the Enhanced BC mode,
there is no explicit limit to the number of messages that may be
processed in a frame. In both modes, it is possible to program for
either single frame or frame auto-repeat operation. In the auto-
repeat mode, the frame repetition rate may be controlled either
internally, using a programmable BC frame timer, or from an
external trigger input.
FIGURE 2. BC MESSAGE SEQUENCE CONTROL
OP CODE
DATA BLOCK
MESSAGE
CONTROL/STATUS
PARAMETER
(POINTER)
BLOCK
BC INSTRUCTION
LIST
BC INSTRUCTION
LIST POINTER REGISTER
BC CONTROL
WORD
COMMAND WORD
(Rx Command for
RT-to-RT transfer)
DATA BLOCK POINTER
TIME-TO-NEXT MESSAGE
TIME TAG WORD
BLOCK STATUS WORD
LOOPBACK WORD
RT STATUS WORD
2nd (Tx) COMMAND WORD
(for RT-to-RT transfer)
2nd RT STATUS WORD
(for RT-to-RT transfer)
INITIALIZE BY REGISTER
0D (RD/WR); READ CURRENT
VALUE VIA REGISTER 03
(RD ONLY)
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ENHANCED BC MODE: MESSAGE SEQUENCE CONTROL
One of the major new architectural features of the PCI Mini-ACE
Mark3/Micro-ACE TE series is its advanced capability for BC
message sequence control. The PCI Mini-ACE Mark3/Micro-
ACE TE supports highly autonomous BC operation, which
greatly offloads the operation of the host processor.
The operation of the PCI Mini-ACE Mark3/Micro-ACE TE's mes-
sage sequence control engine is illustrated in FIGURE 2. The BC
message sequence control involves an instruction list pointer reg-
ister; an instruction list which contains multiple 2-word entries; a
message control/status stack, which contains multiple 8-word or
10-word descriptors; and data blocks for individual messages.
The initial value of the instruction list pointer register is initialized
by the host processor (via Register 0D), and is incremented by
the BC message sequence processor (host readable via
Register 03). During operation, the message sequence control
processor fetches the operation referenced by the instruction list
pointer register from the instruction list.
Note that the pointer parameter referencing the first word of a
message's control/status block (the BC Control Word) must con-
tain an address value that is modulo 8. Also, note that if the
message is an RT-to-RT transfer, the pointer parameter must
contain an address value that is modulo 16.
OP CODES
The instruction list pointer register references a pair of words in
the BC instruction list: an op code word, followed by a parameter
word. The format of the op code word, which is illustrated in
FIGURE 3, includes a 5-bit op code field and a 5-bit condition
code field. The op code identifies the instruction to be executed
by the BC message sequence controller.
Most of the operations are conditional, with execution dependent
on the contents of the condition code field. Bits 3-0 of the condi-
tion code field identifies a particular condition. Bit 4 of the condi-
tion code field identifies the logic sense ("1" or "0") of the
selected condition code on which the conditional execution is
dependent. TABLE 52 lists all the op codes, along with their
respective mnemonic, code value, parameter, and description.
TABLE 53 defines all the condition codes.
Eight of the condition codes (8 through F) are set or cleared as the
result of the most recent message. The other eight are defined as
"General Purpose" condition codes GP0 through GP7. There are
three mechanisms for programming the values of the General
Purpose Condition Code bits: (1) They may be set, cleared, or
toggled by the host processor, by means of the BC GENERAL
PURPOSE FLAG REGISTER; (2) they may be set, cleared, or
toggled by the BC message sequence control processor, by
means of the GP Flag Bits (FLG) instruction; and (3) GP0 and
GP1 only (but none of the others) may be set or cleared by means
of the BC message sequence control processor's Compare Frame
Timer (CFT) or Compare Message Timer (CMT) instructions.
The host processor also has read-only access to the BC condi-
tion codes by means of the BC CONDITION CODE
REGISTER.
Note that four (4) instructions are unconditional. These are
Compare to Frame Timer (CFT), Compare to Message Timer
(CMT), GP Flag Bits (FLG), and Execute and Flip (XQF). For
these instructions, the Condition Code Field is "don't care". That
is, these instructions are always executed, regardless of the
result of the condition code test.
All of the other instructions are conditional. That is, they will only be
executed if the condition code specified by the condition code field
in the op code word tests true. If the condition code field tests false,
the instruction list pointer will skip down to the next instruction.
As shown in TABLE 52, many of the operations include a single-
word parameter. For an XEQ (execute message) operation, the
parameter is a pointer to the start of the message’s Control /
Status block. For other operations, the parameter may be an
address, a time value, an interrupt pattern, a mechanism to set
or clear general purpose flag bits, or an immediate value. For
several op codes, the parameter is "don't care" (not used).
As described above, some of the op codes will cause the mes-
sage sequence control processor to execute messages. In this
case, the parameter references the first word of a message
Control/Status block. With the exception of RT-to-RT transfer
messages, all message status/control blocks are eight words
long: a block control word, time-to-next-message parameter,
data block pointer, command word, status word, loopback word,
block status word, and time tag word.
In the case of an RT-to-RT transfer message, the size of the mes-
sage control/status block increases to 16 words. However, in this
case, the last six words are not used; the ninth and tenth words are
for the second command word and second status word.
The third word in the message control/status block is a pointer
that references the first word of the message's data word block.
Note that the data word block stores only data words, which are
to be either transmitted or received by the BC. By segregating
data words from command words, status words, and other con-
trol and "housekeeping" functions, this architecture enables the
FIGURE 3. BC OP CODE FORMAT
15 1011121314 56789 01234
Odd Parity 00OpCode Field 11 0 Condition Code Field
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TABLE 52. BC OPERATIONS FOR MESSAGE SEQUENCE CONTROL
INSTRUCTION MNEMONIC OP CODE
(HEX) PARAMETER
CONDITIONAL
OR
UNCONDITIONAL
DESCRIPTION
Interrupt
Request
Execute
Message
IRQ
XEQ
0006
0001
Interrupt
Bit Pattern
in 4 LS bits
Message Control /
Status Block
Address
Conditional
Conditional
(See Note)
Generate an interrupt if the condition flag tests TRUE, other-
wise continue execution at the next OpCode in the instruction
list. The passed parameter (Interrupt Bit Pattern) specifies
which of the ENHANCED BC IRQ bit(s) (bits 5-2) will be set in
Interrupt Status Register #2. Only the four LSBs of the passed
parameter are used. A parameter where the four LSBs are logic
"0" will not generate an interrupt.
Executes the message at the specified Message Control/Status
Block Address if the condition flag tests TRUE, otherwise con-
tinue execution at the next OpCode in the instruction list.
Compare to
Frame Timer
Halt
Jump
CFT
HLT
JMP
000A
0007
0002
Delay Time Value
(Resolution
= 100µS / LSB)
Not Used
(Don’t Care)
Instruction List
Address
Unconditional
Conditional
Conditional
Compare Time Value to Frame Time Counter, and set or clear
the LT and EQ flag based on the results of the compare.
Stop execution of the Message Sequence Control Program until
a new BC Start is issued by the host if the condition flag tests
TRUE, otherwise continue execution at the next OpCode in the
instruction list.
Jump to the OpCode specified in the Instruction List if the con-
dition flag tests TRUE, otherwise continue execution at the next
OpCode in the instruction list.
Compare to
Message
Timer
Delay
Subroutine
Call
CMT
D LY
CAL
000B
0008
0003
Delay Time Value
(Resolution
= 1µS / LSB)
Delay Time Value
(Resolution = 1µS
/ LSB)
Instruction List
Address
Unconditional
Conditional
Conditional
Compare Time Value to Frame Time Counter, and set or clear
the LT and EQ flag based on the results of the compare.
Delay the time specified by the Time parameter before execut-
ing the next OpCode if the condition flag tests TRUE, otherwise
continue execution at the next OpCode without delay. The delay
generated will use the Time to Next Message Timer.
Jump to the OpCode specified by the Instruction List Address
and push the Address of the Next OpCode on the Call Stack if
the condition flag tests TRUE, otherwise continue execution at
the next OpCode in the instruction list. Note that the maximum
depth of the subroutine call stack is four.
Wait Until
Frame Timer
= 0
Subroutine
Return
WFT
RTN
0009
0004
Not Used
(Don’t Care)
Not Used
(Don’t Care)
Conditional
Conditional
Wait until Frame Time counter is equal to Zero before continu-
ing execution of the Message Sequence Control Program if the
condition flag tests TRUE, otherwise continue execution at the
next OpCode without delay.
Return to the OpCode popped off the Call Stack if the condition
flag tests TRUE, otherwise continue execution at the next
OpCode in the instruction list.
GP Flag Bits FLG 000C Used to set,
clear, or toggle
GP(General
Purpose)
Flag bits
(See description)
Unconditional Used to set, toggle, or clear any or all of the eight general pur-
pose flags. The table below illustrates the use of the GP Flag
Bits instruction for the case of GP0 (General Purpose Flag 0).
Bits 1 and 9 of the parameter byte affect flag GP1, bits 2 and
10 effect GP2, etc., according to the following rules:
Bit 8
0
0
1
0
1
0
1
1
Bit 0 Effect on GP0
No Change
Set Flag
Clear Flag
Toggle Flag
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Push Block
Status Word
PBS 0011 Not Used
(Don't Care)
Conditional Push the Block Status Word for the most recent message on
the General Purpose Queue if the condition flag tests TRUE,
otherwise continue execution at the next OpCode in the
instruction list.
TABLE 52. BC OPERATIONS FOR MESSAGE SEQUENCE CONTROL (CONT.)
INSTRUCTION MNEMONIC OP CODE
(HEX) PARAMETER DESCRIPTION
Load Time Tag
Counter
LTT 000D Time Value.
Resolution (µs/
LSB) is defined
by bits 9, 8, and
7 of
Configuration
Register #2.
Conditional Load Time Tag Counter with Time Value if the condition flag
tests TRUE, otherwise continue execution at the next
OpCode in the instruction list.
Load Frame
Timer
LFT 000E Time Value
(resolution =
100 µs/LSB)
Conditional Load Frame Timer Register with the Time Value parameter
if the condition flag tests TRUE, otherwise continue execu-
tion at the next OpCode in the instruction list.
Start Frame
Timer
SFT 000F Not Used
(Don't Care)
Conditional Start Frame Time Counter with Time Value in Time Frame
register if the condition flag tests TRUE, otherwise continue
execution at the next OpCode in the instruction list.
Push Time Tag
Register
PTT 0010 Not Used
(Don't Care)
Conditional Push the value of the Time Tag Register on the General
Purpose Queue if the condition flag tests TRUE, otherwise
continue execution at the next OpCode in the instruction list.
Push Immediate
Value
PSI 0012 Immediate Value Conditional Push Immediate data on the General Purpose Queue if the
condition flag tests TRUE, otherwise continue execution at
the next OpCode in the instruction list.
Push Indirect PSM 0013 Memory
Address
Conditional Push the data stored at the specified memory location on
the General Purpose Queue if the condition flag tests TRUE,
otherwise continue execution at the next OpCode in the
instruction list.
Wait for
External
Trigger
WTG 0014 Not Used
(Don't Care)
Conditional Wait for a logic "0"-to-logic "1" transition on the EXT_TRIG
input signal before proceeding to the next OpCode in the
instruction list if the condition flag tests TRUE, otherwise
continue execution at the next OpCode without delay.
Execute and
Flip
XQF 0015 Message
Control /
Status Block
Address
Unconditional Execute (unconditionally) the message referenced by the
Message Control/Status Block Address. Following the pro-
cessing of this message, if the condition flag tests TRUE,
then flip bit 4 in the Message Control/Status Block Address,
and store the new Message Block Address as the updated
value of the parameter following the XQF instruction code.
As a result, the next time that this line in the instruction list
is executed, the Message Control/Status Block at the
updated address (old address XOR 0010h), rather than
the old address, will be processed. If the condition flag tests
FALSE, the value of the Message Control/Status Block
Address parameter will not change.
CONDITIONAL
OR
UNCONDITIONAL
NOTE: While the XEQ (Execute Message) instruction is conditional, not all condition codes may be used to enable its use. The ALWAYS and NEVER
condition codes may be used. The eight general purpose flag bits, GP0 through GP7, may also be used. However, if GP0 through GP7 are used, it
is imperative that the host processor not modify the value of the specific general purpose flag bit that enabled a particular message while that mes-
sage is being processed. Similarly, the LT, GT-EQ, EQ, and NE flags, which the BC only updates by means of the CFT and CMT instructions, may
also be used. However, these two flags are dual use. Therefore, if these are used, it is imperative that the host processor not modify the value of the
specific flag (GP0 or GP1) that enabled a particular message while that message is being processed. The NORESP, FMT ERR, GD BLK XFER,
MASKED STATUS SET, BAD MESSAGE, RETRY0, and RETRY1 condition codes are not available for use with the XEQ instruction and should not
be used to enable its execution.
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8
TABLE 53. CONDITION CODES
BIT
CODE
LT/GP0
EQ/GP1
RETRY0
RETRY1
RETRY0
RETRY1
D
E
GP2
GP3
GP4
GP5
GP6
GP7
NORESP
GD BLK
XFER
NAME
(BIT 4 = 0)
These two bits reflect the retry status of the most recent message. The number of times that the mes-
sage was retried is delineated by these two bits as shown below:
RETRY COUNT 1 RETRY COUNT 0 Number of
(bit 14) (bit 13) Message Retries
0 0 0
0 1 1
1 0 N/A
1 1 2
FUNCTIONAL DESCRIPTION
INVERSE
(BIT 4 = 1)
GT/
GP0
NE/GP1
0
ALWAYS
Less Than Flag set or cleared after CFT or CMT operation. Also, General Purpose Flag 0 may be set
or cleared by a FLG operation.
NEVERF
GP2
GP3
GP4
GP5
GP6
GP7
1
RESP
Equal Flag set or cleared after CFT or CMT operation. Also, General Purpose Flag 1 may also be set
or cleared by a FLG operation.
GD BLK
XFER
BAD
MESSAGE
GOOD
MESSAGE
The ALWAYS bit should be set (bit 4 = 0) to designate an instruction as unconditional. The NEVER bit
(bit 4 =1) can be used to implement an NOP instruction.
CBAD MESSAGE indicates either a format error, loop test fail, or no response error for the most recent
message. Note that a "Status Set" condition has no effect on the "BAD MESSAGE/GOOD
MESSAGE" condition code.
FMT ERR FMT ERR9FMT ERR indicates that the received portion of the most recent message contained one or more vio-
lations of the 1553 message validation criteria (sync, encoding, parity, bit count, word count, etc.), or
the RT's status word received from a responding RT contained an incorrect RT address field.
MASKED
STATUS
BIT
MASKED
STATUS
BIT
B
General Purpose Flags may be set, cleared, or toggled by a FLG operation. The host processor can
set, clear, or toggle these flags in the same way as the FLG instruction by means of the BC
GENERAL PURPOSE FLAG REGISTER.
Indicates that one or both of the following conditions have occurred for the most recent message: (1) If
one (or more) of the Status Mask bits (14 through 9) in the BC Control Word is logic "0" and the corre-
sponding bit(s) is (are) set (logic "1") in the received RT Status Word. In the case of the RESERVED
BITS MASK (bit 9) set to logic "0", any or all of the 3 Reserved Status Word bits being set will result in
a MASKED STATUS SET condition; and/or (2) If BROADCAST MASK ENABLED/XOR (bit 11 of
Configuration Register #4) is logic "1" and the MASK BROADCAST bit of the message's BC Control
Word is logic "0" and the BROADCAST COMMAND RECEIVED bit in the received RT Status Word is
logic "1".
2
3
4
5
6
7
NORESP indicates that an RT has either not responded or has responded later than the BC No
Response Timeout time. The PCI Mini-ACE Mark3/Micro-ACE TE's No Response Timeout Time is
defined per MIL-STD-1553B as the time from the mid-bit crossing of the parity bit to the mid-sync cross-
ing of the RT Status Word. The value of the No Response Timeout value is programmable from among
the nominal values 18.5, 22.5, 50.5, and 130 µs (±1 µs) by means of bits 10 and 9 of Configuration
Register #5.
AFor the most recent message, GD BLK XFER will be set to logic "1" following completion of a valid
(error-free) RT-to-BC transfer, RT-to-RT transfer, or transmit mode code with data message. This bit is
set to logic "0" following an invalid message. GOOD DATA BLOCK TRANSFER is always logic "0" fol-
lowing a BC-to-RT transfer, a mode code with data, or a mode code without data. The Loop Test has
no effect on GOOD DATA BLOCK TRANSFER. GOOD DATA BLOCK TRANSFER may be used to
determine if the transmitting portion of an RT-to-RT transfer was error free.
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XQF
POINTER XX00h
(part of) BC INSTRUCTION LIST MESSAGE
CONTROL/STAT US
BLOCK 0
DATA BLOCK 0
XX10h
MESSAGE
CONTROL/STAT US
BLOCK 1
DATA BLOCK 1
POINTER
POINTER
FIGURE 4. EXECUTE and FLIP (XQF) OPERATION
use of convenient, usable data structures, such as circular buf-
fers and double buffers.
Other operations support program flow control; i.e., jump and call
capability. The call capability includes maintenance of a call stack
which supports a maximum of four (4) entries; there is also a
return instruction. In the case of a call stack overrun or underrun,
the BC will issue a CALL STACK POINTER REGISTER ERROR
interrupt, if enabled.
Other op codes may be used to delay for a specified time; start a new
BC frame; wait for an external trigger to start a new frame; perform
comparisons based on frame time and time-to-next message; load
the time tag or frame time registers; halt; and issue host interrupts. In
the case of host interrupts, the message control processor passes a
4-bit user-defined interrupt vector to the host, by means of the PCI
Mini-ACE Mark3/Micro-ACE TE's Interrupt Status Register.
The purpose of the FLG instruction is to enable the message
sequence controller to set, clear, or toggle the value(s) of any or
all of the eight general purpose condition flags.
The op code parity bit encompasses all sixteen bits of the op
code word. This bit must be programmed for odd parity. If the
message sequence control processor fetches an undefined op
code word, an op code word with even parity, or bits 9-5 of an op
code word do not have a binary pattern of 01010, the message
sequence control processor will immediately halt the BC's opera-
tion. In addition, if enabled, a BC TRAP OP CODE interrupt will
be issued. Also, if enabled, a parity error will result in an OP
CODE PARITY ERROR interrupt. TABLE 53 describes the
Condition Codes.
BC MESSAGE SEQUENCE CONTROL
The PCI Mini-ACE Mark3/Micro-ACE TE BC message sequence
control capability enables a high degree of offloading of the host
processor. This includes using the various timing functions to
enable autonomous structuring of major and minor frames. In
addition, by implementing conditional jumps and subroutine
calls, the message sequence control processor greatly simplifies
the insertion of asynchronous, or "out-of-band" messages.
Execute and Flip Operation. The PCI Mini-ACE Mark3/Micro-
ACE TE BC's XQF, or "Execute and Flip" operation, provides
some unique capabilities. Following execution of this uncondi-
tional instruction, if the condition code tests TRUE, the BC will
modify the value of the current XQF instruction's pointer param-
eter by toggling bit 4 of the pointer. That is, if the selected condi-
tion flag tests true, the value of the parameter will be updated to
the value = old address XOR 0010h. As a result, the next time
that this line in the instruction list is executed, the Message
Control/Status Block at the updated address (old address XOR
0010h) will be processed, rather than the one at the old address.
The operation of the XQF instruction is illustrated in FIGURE 4.
There are multiple ways of utilizing the "execute and flip" instruc-
tion. One is to facilitate the implementation of a double buffering
data scheme for individual messages. This allows the message
sequence control processor to "ping-pong" between a pair of
data buffers for a particular message. By doing so, the host pro-
cessor can access one of the two Data Word blocks, while the
BC reads or writes the alternate Data Word block.
A second application of the "execute and flip" capability is in
conjunction with message retries. This allows the BC to not only
switch buses when retrying a failed message, but to automati-
cally switch buses permanently for all future times that the same
message is to be processed. This not only provides a high
degree of autonomy from the host CPU, but saves BC band-
width, by eliminating the need for future attempts to process
messages on an RT's failed channel.
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General Purpose Queue. The PCI Mini-ACE Mark3/Micro-ACE
TE BC allows for the creation of a general purpose queue. This
data structure provides a means for the message sequence
processor to convey information to the BC host. The BC op
code repertoire provides mechanisms to push various items on
this queue. These include the contents of the Time Tag Register,
the Block Status Word for the most recent message, an imme-
diate data value, or the contents of a specified memory
address.
FIGURE 5 illustrates the operation of the BC General Purpose
Queue. Note that the BC General Purpose Queue Pointer
Register will always point to the next address location (modulo
64); that is, the location following the last location written by the
BC message sequence control engine.
If enabled, a BC GENERAL PURPOSE QUEUE ROLLOVER
interrupt will be issued when the value of the queue pointer
address rolls over at a 64-word boundary. The rollover will always
occur at a modulo 64 address.
REMOTE TERMINAL (RT) ARCHITECTURE
The PCI Mini-ACE Mark3/Micro-ACE TE's RT architecture builds
upon that of the ACE and Mini-ACE. The PCI Mini-ACE Mark3/
Micro-ACE TE provides multiprotocol support, with full compli-
ance to all of the commonly used data bus standards, including
MIL-STD-1553A, MIL-STD-1553B Notice 2, STANAG 3838,
General Dynamics 16PP303, and McAirA3818, A5232, and
A5690. For the PCI Mini-ACE Mark3/Micro-ACE TE RT mode,
there is programmable flexibility enabling the RT to be configured
to fulfill any set of system requirements. This includes the capabil-
ity to meet the MIL-STD-1553A response time requirement of 2
to 5 µs, and multiple options for mode code subaddresses, mode
codes, RT status word, and RT BIT word.
The PCI Mini-ACE Mark3/Micro-ACE TE RT protocol design
implements all of the MIL-STD-1553B message formats and dual
redundant mode codes. The design has passed validation testing
for MIL-STD-1553B compliance. The PCI Mini-ACE Mark3/Micro-
ACE TE RT performs comprehensive error checking including
word and format validation, and checks for various RT-to-RT
transfer errors. One of the main features of the PCI Mini-ACE
Mark3/Micro-ACE TE RT is its choice of memory management
options. These include single buffering by subaddress, circular
buffering by individual subaddresses, and global circular buffering
for multiple (or all) subaddresses.
Other features of the PCI Mini-ACE Mark3/Micro-ACE TE RT
include a set of interrupt conditions, an interrupt status queue
with filtering based on valid and/or invalid messages, internal
command illegalization, programmable busy by subaddress, mul-
tiple options on time tagging.
LAST LOCATION
BC GENERAL
PURPOSE QUEUE
(64 Locations)
BC GENERAL
PURPOSE QUEUE
POINTER
REGISTER
NEXT LOCATION
FIGURE 5. BC GENERAL PURPOSE QUEUE
32
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RT MEMORY ORGANIZATION
TABLE 54 illustrates a typical memory map for a PCI Mini-ACE
Mark3/Micro-ACE TE RT with 4K RAM. Note that this table and
subsequent references to it are using word addressing: PCI
BAR0 address offsets (byte addresses) are TWO times the word
addresses indicated. The two Stack Pointers reside in fixed loca-
tions in the shared RAM address space: address 0100h (PCI
BAR0 offset 0200h) for the Area A Stack Pointer and address
0104h (PCI BAR0 offset 208h) for the Area B Stack Pointer. In
addition to the Stack Pointer, there are several other areas of the
shared RAM address space that are designated as fixed loca-
tions (all shown in bold). These are for the Area A and Area B
lookup tables, the illegalization lookup table, the busy lookup
table, and the mode code data tables.
The RT lookup tables provide a mechanism for allocating data
blocks for individual transmit, receive, or broadcast subaddress-
es. The RT lookup tables include subaddress control words as
well as the individual data block pointers. If command illegaliza-
tion is used, address range 0300-03FF is used for command
illegalizing. The descriptor stack RAM area, as well as the indi-
vidual data blocks, may be located in any of the non-fixed areas
in the shared RAM address space.
Note that in TABLE 54, there is no area allocated for "Stack B".
This is shown for purpose of illustration. Also, note that in TABLE
54, the allocated area for the RT command stacks is 256 words.
However, larger stack sizes are possible. That is, the RT com-
mand stack size may be programmed for 256 words (64 mes-
sages), 512, 1024, or 2048 words (512 messages) by means of
bits 14 and 13 of Configuration Register 3.
STACK POINTER B
0104
RESERVED0102-0103
GLOBAL CIRCULAR BUFFER A POINTER
0101
STACK POINTER A
0100
STACK A
0000-00FF
DESCRIPTION
WORD ADDRESS
(HEX)
TABLE 54. TYPICAL RT MEMORY MAP (SHOWN AS 4K RAM)
PCI BAR0
OFFSET(HEX)
0000-01FE
0200
0202
0204-0206
0208
LOOKUP TABLE A
0140-01BF
MODE CODE DATA
0110-013F
MODE CODE SELECTIVE INTERRUPT TABLE
0108-010F
RESERVED
0106-0107
GLOBAL CIRCULAR BUFFER B POINTER
0105 020A
020C-020E
0210-021E
0220-027E
0280-037E
DATA BLOCK 1-40280-02FF
DATA BLOCK 0
0260-027F
(NOT USED)
0248-025F
BUSY BIT LOOKUP TABLE
0240-0247
LOOKUP TABLE B
01C0-023F 0380-047E
0480-048E
0490-04BE
04C0-04FE
0500-05FE
COMMAND ILLEGALIZING TABLE
0300-03FF 0600-07FE
DATA BLOCK 5
0400-041F 0800-083E
DATA BLOCK 60420-043F 0840-087E
DATA BLOCK 1000FE0-0FFF 1FC0-1FFE
33
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RT MEMORY MANAGEMENT
The PCI Mini-ACE Mark3/Micro-ACE TE provides a variety of RT
memory management capabilities. As with the ACE and Mini-
ACE (Plus), and Enhanced Mini-ACE the choice of memory
management scheme is fully programmable on a transmit/
receive/broadcast subaddress basis.
In compliance with MIL-STD-1553B Notice 2, received data from
broadcast messages may be optionally separated from non-
broadcast received data. For each transmit, receive or broadcast
subaddress, either a single-message data block, or a variable-
sized (128 to 8192 words) subaddress circular buffer may be
allocated for data storage. The memory management scheme for
individual subaddresses is designated by means of the subad-
dress control word (reference TABLE 56).
For received data, there is also a global circular buffer mode. In
this configuration, the data words received from multiple (or all)
subaddresses are stored in a common circular buffer structure.
Like the subaddress circular buffer, the size of the global circular
buffer is programmable, with a range of 128 to 8192 data
words.
In addition to helping ensure data sample consistency, the circu-
lar buffer options provide a means for greatly reducing host pro-
cessor overhead for multi-message bulk data transfer applica-
tions.
End-of-message interrupts may be enabled either globally (fol-
lowing all messages), following error messages, on a transmit/
receive/broadcast subaddress or mode code basis, or when a
circular buffer reaches its midpoint (50% boundary) or lower
(100%) boundary. A pair of interrupt status registers allow the
host processor to determine the cause of all interrupts by means
of a single read operation.
SINGLE BUFFERED MODE
The operation of the single buffered RT mode is illustrated in
FIGURE 6. In the single buffered mode, the respective lookup
table entry must be written by the host processor. Received data
words are written to, or transmitted data words are read from the
data word block with starting address referenced by the lookup
table pointer. In the single buffered mode, the current lookup
table pointer is not updated by the PCI Mini-ACE Mark3/Micro-
ACE TE memory management logic. Therefore, if a subsequent
message is received for the same subaddress, the same Data
Word block will be overwritten or overread.
CIRCULAR BUFFER MODE
The operation of the PCI Mini-ACE Mark3/Micro-ACE TE circular
buffer RT memory management mode is illustrated in FIGURE 7.
As in the single buffered mode, the individual lookup table entries
are initially loaded by the host processor. At the start of each
message, the lookup table entry is stored in the third position of
the respective message block descriptor in the descriptor stack
area of RAM. Receive or transmit data words are transferred to
(from) the circular buffer, starting at the location referenced by
the lookup table pointer.
In general, the location after the last data word written or read
(modulo the circular buffer size) during the message is written to
the respective lookup table location during the end-of-message
sequence. By so doing, data for the next message for the respec-
tive transmit, receive(/broadcast), or broadcast subaddress will
be accessed from the next lower contiguous block of locations in
the circular buffer.
DATA
BLOCKS
DATA BLOCK
DATA BLOCK
BLOCK STATUS WORD
TIME TAG WORD
DATA BLOCK POINTER
RECEIVED COMMAND
WORD
DESCRIPTOR
STACKS
LOOK-UP
TABLE ADDR
LOOK-UP TABLE
(DATA BLOCK ADDR)
15 13 0
CURRENT
AREA B/A
CONFIGURATION
REGISTER
STACK
POINTERS
(See note)
Note: Lookup table is not used for mode commands when enhanced mode codes are enabled.
FIGURE 6. RT SINGLE BUFFERED MODE
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Subaddress -
specific circular buffer
of specified size.
8192-Word
1
(for receive and / or broadcast subaddresses only)
Global Circular Buffer: The buffer size is specified by Configuration
Register #6, bits 11-9. The pointer to the global circular buffer is
stored at address 0101h (for Area A, PCI BAR0 offset 0202h) or
address 0105h (for Area B, PCI BAR0 offset 020Ah)
1
1
1
1
0
1
1
4096-Word010 1
1024-Word000 1
512-Word110 0
256-Word010 0
128-Word100 0
Reserved for future use
Single Message
0
0
0
0
1
0
0
0
SUBADDRESS CONTROL WORD BITS
MM0
MEMORY MANAGEMENT SUBADDRESS
BUFFER SCHEME DESCRIPTION
MM1
GLOBAL CIRCULAR
BUFFER (bit 15) MM2
TABLE 56. RT SUBADDRESS CONTROL WORD - MEMORY MANAGEMENT OPTIONS
2048-Word100 1
For the case of a receive (or broadcast receive) message with a
data word error, there is an option such that the lookup table
pointer will only be updated following receipt of a valid message.
That is, the pointer will not be updated following receipt of a
message with an error in a data word. This allows failed mes-
sages in a bulk data transfer to be retried without disrupting the
circular buffer data structure, and without intervention by the
RT's host processor.
GLOBAL CIRCULAR BUFFER
Beyond the programmable choice of single buffer mode or circu-
lar buffer mode, programmable on an individual subaddress
basis, the PCI Mini-ACE Mark3/Micro-ACE TE architecture pro-
vides an additional option, a variable sized global circular buf-
fer.
Subaddress
Control Word
Lookup Table
(OptiOnal)
SACW SA0
SACW SA31
0440
047E
0220
023F
Broadcast
Lookup
Pointer
Table
(Optional)
Bcst SA0
Bcst SA31
0400
043F
0200
021F
Transmit
Lookup
Pointer
Table
Tx SA0
Tx SA31
03C0
03FE
01E0
01FF
Receive
(/Broadcast)
Lookup
Pointer
Table
Rx(/Bcst) SA0
Rx(/Bcst) SA31
0380
03BE
01C0
01DF
COMMENTDESCRIPTION
TABLE 55. RT LOOK-UP TABLES (ALL ADDRESSES IN HEX)
0340
037E
01A0
01BF
0300
033E
0180
019F
02C0
02FE
0160
017F
0280
02BE
0140
015F
AREA A
(INTERNAL MEMO-
RY OFFSET
AREA A
(PCI BAR0
OFFSET)
AREA B
(INTERNAL MEM-
ORY OFFSET)
AREA B
(PCI BAR0
OFFSET)
35
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CIRCULAR
BUFFER
ROLLOVER
15 13 0
RECEIVED
(TRANSMITTED)
MESSAGE
DATA
(NEXT LOCATION)
128,
256
8192
WORDS
POINTER TO
CURRENT
DATA BLOCK
POINTER TO
NEXT DATA
BLOCK
LOOK-UP TABLE
ENTRY
CIRCULAR
DATA
BUFFER
LOOK-UP TABLES
LOOK-UP
TABLE
ADDRESS
BLOCK STATUS WORD
TIME TAG WORD
DATA BLOCK POINTER
RECEIVED COMMAND
WORD
CONFIGURATION
REGISTER
STACK
POINTERS
DESCRIPTOR
STACK
CURRENT
AREA B/A
1. TX/RS/BCST_SA look-up table entry is updated following valid receive (broadcast) message
or following completion of transit message
Notes:
*
2. For the Global Circular Buffer Mode, the pointer is read from and re-written to Address 0101 (for Area A)
or Address 0105 (for Area B).
FIGURE 7. RT CIRCULAR BUFFERED MODE
FIGURE 8. 50% and 100% ROLLOVER INTERRUPTS
DATA POINTER
CIRCULAR
BUFFER*
(128,256,...8192 WORDS)
LOOK-UP TABLE
RECEIVED
(TRANSMITTED)
MESSAGE DATA
BLOCK STATUS WORD
TIME TAG WORD
DATA BLOCK POINTER
RECEIVED COMMAND WORD
DESCRIPTOR STACK
50%
ROLLOVER
INTERRUPT
50%
The example shown is for an RT Subaddress Circular Buffer.
The 50% and 100% Rollover Interrupts are also applicable to
the RT Global Circulat Buffer, RT Command Stack,
Monitor Command Stack, and Monitor Data Stack.
Note
100%
ROLLOVER
INTERRUPT
100%
In the global circular buffer mode, the data for multiple receive
subaddresses is stored in the same circular buffer data structure.
The size of the global circular buffer may be programmed for 128,
256, 512, 1024, 2048, 4096, or 8192 words, by means of bits 11,
10, and 9 of Configuration Register #6. As shown in TABLE 56,
individual subaddresses may be mapped to the global circular
buffer by means of their respective subaddress control words.
The pointer to the Global Circular Buffer will be stored in location
0101 (for Area A, PCI BAR0 offset 0202h), or location 0105h (for
Area B, PCI BAR0 offset 020Ah).
The global circular buffer option provides a highly efficient meth-
od for storing received message data. It allows for frequently
used subaddresses to be mapped to individual data blocks, while
also providing a method for asynchronously received messages
to infrequently used subaddresses to be logged to a common
area. Alternatively, the global circular buffer provides an efficient
means for storing the received data words for all subaddresses.
Under this method, all received data words are stored chrono-
logically, regardless of subaddress.
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RT DESCRIPTOR STACK
The descriptor stack provides a chronology of all messages pro-
cessed by the PCI Mini-ACE Mark3/Micro-ACE TE RT. Reference
FIGURES 6 and 7. Similar to BC mode, there is a four-word block
descriptor in the Stack for each message processed. The four
entries to each block descriptor are the Block Status Word, Time
Tag Word, the pointer to the start of the message's data block,
and the 16-bit received Command Word.
The RT Block Status Word includes indications of whether a
particular message is ongoing or has been completed, what bus
channel it was received on, indications of illegal commands, and
flags denoting various message error conditions. For the subad-
dress circular buffering, and global circular buffering modes, the
data block pointer may be used for locating the data blocks for
specific messages. Note that for mode code commands, there is
an option to store the transmitted or received data word as the
third word of the descriptor, in place of the data block pointer.
The Time Tag Word provides a 16-bit indication of relative time
for individual messages. The resolution of the PCI Mini-ACE
Mark3/Micro-ACE TE's time tag is programmable from among 2,
4, 8, 16, 32, or 64 µs/LSB using the internal clock, or it can be
programmed to increment directly from the TAG_CLK input by
writing all ones to the time tag resolution bits. If enabled, there is
a time tag rollover interrupt, which is issued when the value of
the time tag rolls over from FFFF(hex) to 0. Other time tag
options include the capabilities to clear the time tag register fol-
lowing receipt of a Synchronize (without data) mode command
and/or to set the time tag following receipt of a Synchronize (with
data) mode command. For that latter, there is an added option to
filter the "set" capability based on the LSB of the received data
word being equal to logic "0".
RT INTERRUPTS
The PCI Mini-ACE Mark3/Micro-ACE TE offers a great deal of
flexibility in terms of RT interrupt processing. By means of the
Enhanced Mini-ACE/Micro-ACE’s two Interrupt Mask Registers,
the PCI Mini-ACE Mark3/Micro-ACE TE’s RT may be pro-
grammed to issue interrupt requests for the following events/con-
ditions: End-of-(every)Message, Message Error, Selected (trans-
mit or receive) Subaddress, 100% Circular Buffer Rollover, 50%
Circular Buffer Rollover, 100% Descriptor Stack Rollover, 50%
Descriptor Stack Rollover, Selected Mode Code, Transmitter
Timeout, Illegal Command, and Interrupt Status Queue Rollover.
Interrupts for 50% Rollovers of Stacks and Circular Buffers.
The PCI Mini-ACE Mark3/Micro-ACE TE RT and Monitor are
capable of issuing host interrupts when a subaddress circular
buffer pointer or stack pointer crosses its mid-point boundary. For
RT circular buffers, this is applicable for both transmit and
receive subaddresses. Reference FIGURE 8. There are four
interrupt mask and interrupt status register bits associated with
the 50% rollover function:
(1) RT circular buffer;
(2) RT command (descriptor) stack;
(3) Monitor command (descriptor) stack; and
(4) Monitor data stack.
The 50% rollover interrupt is beneficial for performing bulk data
transfers. For example, when using circular buffering for a par-
ticular receive subaddress, the 50% rollover interrupt will inform
the host processor when the circular buffer is half full. At that
time, the host may proceed to read the received data words in
the upper half of the buffer, while the PCI Mini-ACE Mark3/Micro-
ACE TE RT writes received data words to the lower half of the
circular buffer. Later, when the RT issues a 100% circular buffer
rollover interrupt, the host can proceed to read the received data
from the lower half of the buffer, while the PCI Mini-ACE Mark3/
FIGURE 9. RT (and MONITOR) INTERRUPT STATUS QUEUE
(shown for message Interrupt event)
INTERRUPT
VECTOR
DATA WORD
BLOCK
DESCRIPTOR
STACK
PARAMETER
(POINTER)
INTERRUPT STATUS QUEUE
(64 Locations)
INTERRUPT VECTOR
QUEUE POINTER
REGISTER (IF)
BLOCK STATUS WORD
TIME TAG
DATA BLOCK POINTER
RECEIVED COMMAND
NEXT
VECTOR
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Micro-ACE TE RT continues to write received data words to the
upper half of the buffer.
Interrupt status queue. The PCI Mini-ACE Mark3/Micro-ACE
TE RT, Monitor, and combined RT/Monitor modes include the
capability for generating an interrupt status queue. As illustrated
in FIGURE 9, this provides a chronological history of interrupt
generating events and conditions. In addition to the Interrupt
Mask Register, the Interrupt Status Queue provides additional
filtering capability, such that only valid messages and/or only
invalid messages may result in the creation of an entry to the
Interrupt Status Queue. Queue entries for invalid and/or valid
messages may be disabled by means of bits 8 and 7 of configura-
tion register #6.
The pointer to the Interrupt Status Queue is stored in the
INTERRUPT VECTOR QUEUE POINTER REGISTER (register
address 1F). This register must be initialized by the host, and is
subsequently incremented by the RT message processor. The
interrupt status queue is 64 words deep, providing the capability
to store entries for up to 32 messages.
The queue rolls over at addresses of modulo 64. The events that
result in queue entries include both message-related and non-
message-related events. Note that the Interrupt Vector Queue
Pointer Register will always point to the next location (modulo 64)
following the last vector/pointer pair written by the PCI Mini-
ACE Mark3/Micro-ACE TE RT, Monitor, or RT/Monitor.
Each event that causes an interrupt results in a two-word entry
to be written to the queue. The first word of the entry is the inter-
rupt vector. The vector indicates which interrupt event(s)/
condition(s) caused the interrupt.
The interrupt events are classified into two categories: message
interrupt events and non-message interrupt events. Message-
based interrupt events include End-of-Message, Selected mode
code, Format error, Subaddress control word interrupt, RT
Circular buffer Rollover, Handshake failure, RT Command stack
rollover, transmitter timeout, MT Data Stack rollover,
MT Command Stack rollover, RT Command Stack 50% rollover,
MT Data Stack 50% rollover, MT Command Stack 50% rollover,
and RT Circular buffer 50% rollover. Non-message interrupt
events/conditions include time tag rollover, RT address parity
error, RAM parity error, and BIT completed.
Bit 0 of the interrupt vector (interrupt status) word indicates
whether the entry is for a message interrupt event (if bit 0 is logic
"1") or a non-message interrupt event (if bit 0 is logic "0"). It is
not possible for one entry on the queue to indicate both a mes-
sage interrupt and a non-message interrupt.
As illustrated in FIGURE 9, for a message interrupt event, the
parameter word is a pointer. The pointer will reference the first word
of the RT or MT command stack descriptor (i.e., the Block Status
Word).
For a RAM Parity Error non-message interrupt, the parameter
will be the RAM address where the parity check failed. For the
RT address Parity Error, and Time Tag rollover non-message
interrupts, the parameter is not used; it will have a value of
0000.
If enabled, an INTERRUPT STATUS QUEUE ROLLOVER inter-
rupt will be issued when the value of the queue pointer address
rolls over at a 64-word address boundary.
RT COMMAND ILLEGALIZATION
The PCI Mini-ACE Mark3/Micro-ACE TE provides an internal
mechanism for RT Command Word illegalizing. By means of a
256-word area in shared RAM, the host processor may desig-
nate that any message be illegalized, based on the command
word T/R bit, subaddress, and word count/mode code fields. The
PCI Mini-ACE Mark3/Micro-ACE TE illegalization scheme pro-
vides the maximum in flexibility, allowing any subset of the 4096
possible combinations of broadcast/own address, T/R bit, subad-
dress, and word count/mode code to be illegalized.
The address map of the PCI Mini-ACE Mark3/Micro-ACE TE's
illegalizing table is illustrated in TABLE 57.
BUSY BIT
The PCI Mini-ACE Mark3/Micro-ACE TE RT provides two differ-
ent methods for setting the Busy status word bit: (1) globally, by
means of Configuration Register #1; or (2) on a T/R-bit/subad-
dress basis, by means of a RAM lookup table. If the host CPU
asserts the BUSY bit low in Configuration Register #1, the PCI
Mini-ACE Mark3/Micro-ACE TE RT will respond to all non-
broadcast commands with the Busy bit set in its RT Status
Word.
Alternatively, there is a Busy lookup table in the PCI Mini-ACE
Mark3/Micro-ACE TE shared RAM. By means of this table, it is pos-
sible for the host processor to set the busy bit for any selectable
subset of the 128 combinations of broadcast/own address, T/R bit,
and subaddress.
If the busy bit is set for a transmit command, the PCI Mini-ACE
Mark3/Micro-ACE TE RT will respond with the busy bit set in the
status word, but will not transmit any data words. If the busy bit is
set for a receive command, the RT will also respond with the busy
status bit set. There are two programmable options regarding the
reception of data words for a non-mode code receive command
for which the RT is busy: (1) to transfer the received data words to
shared RAM; or (2) to not transfer the data words to shared
RAM.
RT ADDRESS
The PCI Mini-ACE Mark3/Micro-ACE TE offers several different
options for designating the Remote Terminal address. These
include the following: (1) hardwired, by means of the 5 RT
ADDRESS inputs, and the RT ADDRESS PARITY input; (2) by
means of the RT ADDRESS (and PARITY) inputs, but latched via
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TABLE 57. ILLEGALIZATION TABLE MEMORY MAP
3FC
3BE
37D
3C2
381
33F
300
ADDRESS
Own Addr / Tx, SA 30, WC15-0
Own Addr / Rx, SA 31, MC15-0
Brdcst / Tx, SA 30, WC31-16
Own Addr / Tx, SA 1, WC15-0
Own Addr / Rx, SA 0, MC31-16
Brdcst / Rx, SA 0, MC15-0
Brdcst / Rx, SA 0, MC15-0
DESCRIPTION
3FD
3BF
37E
3C3
382
340
301
Own Addr / Tx, SA 30, WC31-16
Own Addr / Rx, SA 31, MC31-16
Brdcst / Tx, SA 31, MC15-0
Own Addr / Tx, SA 1, WC31-16
Own Addr / Rx, SA 1, WC15-0
Brdcst / Tx, SA 0, MC31-16
Brdcst / SA 0, MC31-16
3FE
3C0
37F
383
341
302
Own Addr / Tx, SA 31, MC15-0
Own Addr / Tx, SA 0, MC15-0
Brdcst / Tx, SA 31, MC31-16
Own Addr / Rx, SA 1, WC31-15
Brdcst / Tx, SA 1,WC15-0
Brdcst / Rx, SA 1, WC15-0
3FF
3C1
380
342
303
Own Addr / Tx, SA 31, MC31-16
Own Addr / Tx, SA 0, MC31-16
Own Addr / Rx, SA 0, MC15-0
Brdcst / Tx, SA 1, WC31-16
Brdcst / Rx, SA 1, WC31-16
hardware, on the rising edge of the RT_AD_LAT input signal; (3)
input by means of the RT ADDRESS (and PARITY) inputs, but
latched via host software; and (4) software programmable, by
means of an internal register. In all four configurations, the RT
address is readable by the host processor.
RT BUILT-IN-TEST (BIT) WORD
The bit map for the PCI Mini-ACE Mark3/Micro-ACE TE's internal
RT Built-in-Test (BIT) Word is indicated in TABLE 58.
OTHER RT FEATURES
The PCI Mini-ACE Mark3/Micro-ACE TE includes options for the
Terminal flag status word bit to be set either under software con-
trol and/or automatically following a failure of the loopback self-
test. Other software programmable RT options include software
programmable RT status and RT BIT words, automatic clearing
of the Service Request bit following receipt of a Transmit vector
word mode command, options regarding Data Word transfers for
the Busy and Message error (illegal) Status word bits, and
options for the handling of 1553A and reserved mode codes.
MONITOR ARCHITECTURE
The PCI Mini-ACE Mark3/Micro-ACE TE includes three monitor
modes:
(1) A Word Monitor mode
(2) A selective message monitor mode
(3) A combined RT/message monitor mode
For new applications, it is recommended that the selective mes-
sage monitor mode be used, rather than the word monitor mode.
Besides providing monitor filtering based on RT address, T/R bit,
and subaddress, the message monitor eliminates the need to
determine the start and end of messages by software.
7F8
77C
6FA
784
702
67E
600
PCI BAR0 OFFSET
7FA
77E
6FC
786
704
680
602
7FC
780
6FE
706
682
604
7FE
782
700
684
606
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WORD MONITOR MODE
In the Word Monitor Terminal mode, the PCI Mini-ACE Mark3/
Micro-ACE TE monitors both 1553 buses. After the software ini-
tialization and Monitor Start sequences, the PCI Mini-ACE
Mark3/Micro-ACE TE stores all Command, Status, and Data
Words received from both buses. For each word received from
either bus, a pair of words is stored to the PCI Mini-ACE Mark3/
Micro-ACE TE's shared RAM. The first word is the word received
from the 1553 bus. The second word is the Monitor Identification
(ID), or "Tag" word. The ID word contains information relating to
bus channel, word validity, and inter-word time gaps. The data
and ID words are stored in a circular buffer in the shared RAM
address space.
WORD MONITOR MEMORY MAP
A typical word monitor memory map is illustrated in TABLE 59.
TABLE 59 assumes a 64K address space for the PCI Mini-ACE
Mark3/Micro-ACE TE's monitor. The Active Area Stack pointer
provides the address where the first monitored word is stored. In
the example, it is assumed that the Active Area Stack Pointer for
Area A (location 0100) is initialized to 0000. The first received
data word is stored in location 0000, the ID word for the first word
is stored in location 0001, etc.
The current Monitor address is maintained by means of a coun-
ter register. This value may be read by the CPU by means of the
Data Stack Address Register. It is important to note that when
the counter reaches the Stack Pointer address of 0100 or 0104,
the initial pointer value stored in this shared RAM location will be
overwritten by the monitored data and ID Words. When the
internal counter reaches an address of FFFF (or 0FFF, for an
PCI Mini-ACE Mark3/Micro-ACE TE with 4K RAM), the counter
rolls over to 0000.
WORD MONITOR TRIGGER
In the Word Monitor mode, there is a pattern recognition trigger
and a pattern recognition interrupt. The 16-bit compare word for
both the trigger and the interrupt is stored in the Monitor Trigger
Word Register. The pattern recognition interrupt is enabled by set-
ting the MT Pattern Trigger bit in Interrupt Mask Register. The
pattern recognition trigger is enabled by setting the Trigger Enable
bit in Configuration Register #1 and selecting either the Start-on-
trigger or the Stop-on-trigger bit in Configuration Register #1. The
Word Monitor may also be started by means of a low-to-high
transition on the EXT_TRIG input signal.
SELECTIVE MESSAGE MONITOR MODE
The PCI Mini-ACE Mark3/Micro-ACE TE Selective Message
Monitor provides monitoring of 1553 messages with filtering
based on RT address, T/R bit, and subaddress with no host pro-
cessor intervention. By autonomously distinguishing between
1553 command and status words, the Message Monitor deter-
mines when messages begin and end, and stores the messages
into RAM, based on a programmable filter of RT address, T/R bit,
and subaddress.
The selective monitor may be configured as just a monitor, or as a
combined RT/Monitor. In the combined RT/Monitor mode, the
PCI Mini-ACE Mark3/Micro-ACE TE functions as an RT for one
RT address (including broadcast messages), and as a selective
message monitor for the other 30 RT addresses. The PCI Mini-
ACE Mark3/Micro-ACE TE Message Monitor contains two stacks,
a command stack and a data stack, that are independent from the
COMMAND WORD CONTENTS ERROR0(LSB)
RT-to-RT 2ND COMMAND WORD ERROR1
RT-to-RT NO RESPONSE ERROR2
TRANSMITTER SHUTDOWN B
RT-to-RT GAP / SYNC ADDRESS ERROR3
PARITY / MANCHESTER ERROR RECEIVED4
INCORRECT SYNC RECEIVED5
LOW WORD COUNT6
HIGH WORD COUNT7
BIT TEST FAILURE8
TERMINAL FLAG INHIBITED9
TRANSMITTER SHUTDOWN A10
HANDSHAKE FAILURE12
LOOP TEST FAILURE A13
LOOP TEST FAILURE B14
TRANSMITTER TIMEOUT15(MSB)
DESCRIPTIONBIT
11
TABLE 58. RT BIT WORD
Third Received 1553 Word
Received 1553 Words and Identification Word
FFFF
Stack Pointer
(Fixed Location - gets overwritten)
0100
Third Identification Word005
Second Identification Word0003
Second Received 1553 Word0002
First Identification Word0001
First Received 1553 Word0000
FUNCTION
HEX
ADDRESS
0004
TABLE 59. TYPICAL WORD MONITOR MEMORY MAP
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RT command stack. The pointers for these stacks are located at
fixed locations in RAM.
MONITOR SELECTION FUNCTION
Following receipt of a valid command word in Selective Monitor
mode, the PCI Mini-ACE Mark3/Micro-ACE TE will reference the
selective monitor lookup table to determine if the particular com-
mand is enabled. The address for this location in the table is
determined by means of an offset based on the RT Address, T/R
bit, and Subaddress bit 4 of the current command word, and
concatenating it to the monitor lookup table base address of
0280 (hex). The bit location within this word is determined by
subaddress bits 3-0 of the current command word.
If the specified bit in the lookup table is logic "0", the command
is not enabled, and the PCI Mini-ACE Mark3/Micro-ACE TE will
ignore this command. If this bit is logic "1", the command is
enabled and the PCI Mini-ACE Mark3/Micro-ACE TE will create
an entry in the monitor command descriptor stack (based on the
monitor command stack pointer), and store the data and status
words associated with the command into sequential locations in
the monitor data stack. In addition, for an RT-to-RT transfer in
which the receive command is selected, the second command
word (the transmit command) is stored in the monitor data
stack.
NOTE: After a command is discarded the monitor will immedi-
ately look for another "Command." Where only a subset of
Subaddresses are enabled, it is possible that a succeeding
Status words may be captured as a "Command". This will always
be flagged as an error because the Word Count or timing will
fail.
The address definition for the Selective Monitor Lookup TABLE
is illustrated in TABLE 60.
SELECTIVE MESSAGE MONITOR MEMORY
ORGANIZATION
A typical memory map for the PCI Mini-ACE Mark3/Micro-ACE
TE in the Selective Message Monitor mode, assuming a 4K RAM
space, is illustrated in TABLE 61. This mode of operation defines
several fixed locations in the RAM. These locations are allocated
in a way in which none of them overlap with the fixed RT loca-
tions. This allows for the combined RT/Selective Message
Monitor mode.
The fixed memory map consists of two Monitor Command Stack
Pointers (locations 102 and 106 hex), two Monitor Data Stack
Pointers (locations 103 and 107 hex), and a Selective Message
Monitor Lookup Table (locations 0280 through 02FF hex).
For this example, the Monitor Command Stack size is assumed
to be 1K words, and the Monitor Data Stack size is assumed to
be 2K words.
FIGURE 10 illustrates the Selective Message Monitor operation.
Upon receipt of a valid Command Word, the PCI Mini-ACE Mark3/
Micro-ACE TE will reference the Selective Monitor Lookup Table
to determine if the current command is enabled. If the current
command is disabled, the PCI Mini-ACE Mark3/Micro-ACE TE
monitor will ignore (and not store) the current message. If the com-
mand is enabled, the monitor will create an entry in the Monitor
Command Stack at the address location referenced by the Monitor
Command Stack Pointer, and an entry in the monitor data stack
starting at the location referenced by the Monitor Data Stack
Pointer.
The format of the information in the data stack depends on the
format of the message that was processed. For example, for a
BC-to-RT transfer (receive command), the monitor will store the
command word in the monitor command descriptor stack, with
the data words and the receiving RT's status word stored in the
monitor data stack.
The size of the monitor command stack is programmable, with
choices of 256, 1K, 4K, or 16K words. The monitor data stack
size is programmable with choices of 512, 1K, 2K, 4K, 8K, 16K,
32K or 64K words.
MONITOR INTERRUPTS
Selective monitor interrupts may be issued for End-of-message and
for conditions relating to the monitor command stack pointer and
monitor data stack pointer. The latter, which are shown in FIGURE
8, include Command Stack 50% Rollover, Command Stack 100%
Rollover, Data Stack 50% Rollover, and Data Stack 100% Rollover.
The 50% rollover interrupts may be used to inform the host proces-
sor when the command stack or data stack is half full. At that time,
SUBADDRESS 40(LSB)
TRANSMIT / RECEIVE1
RTAD_02
Logic “0”
RTAD_13
RTAD_24
RTAD_35
RTAD_46
Logic “1”7
Logic “0”8
Logic “1”9
Logic “0”10
Logic “0”12
Logic “0”13
Logic “0”14
Logic “0”15(MSB)
DESCRIPTIONBIT
11
TABLE 60. MONITOR SELECTION TABLE LOOKUP
ADDRESS
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the host may proceed to read the received messages in the upper
half of the respective stack, while the PCI Mini-ACE Mark3/Micro-
ACE TE monitor writes messages to the lower half of the stack.
Later, when the monitor issues a 100% stack rollover interrupt, the
host can proceed to read the received data from the lower half of
the stack, while the PCI Mini-ACE Mark3/Micro-ACE TE monitor
continues to write received data words to the upper half of the
stack.
INTERRUPT STATUS QUEUE
Like the PCI Mini-ACE Mark3/Micro-ACE TE RT, the Selective
Monitor mode includes the capability for generating an interrupt
status queue. As illustrated in FIGURE 9, this provides a chrono-
logical history of interrupt generating events. Besides the two
Interrupt Mask Registers, the Interrupt Status Queue provides
additional filtering capability, such that only valid messages and/
or only invalid messages may result in entries to the Interrupt
Status Queue. The interrupt status queue is 64 words deep, pro-
viding the capability to store entries for up to 32 monitored mes-
sages.
MISCELLANEOUS
1553 CLOCK INPUT
The PCI Mini-ACE Mark3/Micro-ACE TE decoder is capable of
operating from a 10, 12, 16, or 20 MHz clock input. The clock
frequency may be specified by means of the host processor writ-
ing to Configuration Register #6. In addition when PCI Micro-
ACE TE parts have their RTBOOT_L ball asserted, the 1553
input clock divider is controlled by the CLK_SEL 0 and CLK_
SEL_1 balls.
ENCODER/DECODERS
For the selected clock frequency, there is internal logic to derive
the necessary clocks for the Manchester encoder and decoders.
For all clock frequencies, the decoders sample the receiver out-
puts on both edges of the input clock. By in effect doubling the
decoders' sampling frequency, this serves to widen the tolerance
to zero-crossing distortion, and reduce the bit error rate.
TIME TAG
The PCI Mini-ACE Mark3/Micro-ACE TE includes an internal
read/writable Time Tag Register. This register is a CPU read/writ-
able 16-bit counter with a programmable resolution of either 2, 4,
8, 16, 32, or 64 ms per LSB. In addition, this register can be
incremented directly by the TAG_CLK input pin by writing all
ones to the time tag resolution bits. Another option allows soft-
ware controlled incrementing of the Time Tag Register. This sup-
ports self-test for the Time Tag Register. For each message
processed, the value of the Time Tag Register is loaded into the
second location of the respective descriptor stack entry ("TIME
TAG WORD") for BC/RT/MT modes.
The functionality of the Time Tag Register is compatible with
ACE/Mini-ACE (Plus) includes: the capability to issue an inter-
rupt request and set a bit in the Interrupt Status Register when
the Time Tag Register rolls over FFFF to 0000; for RT mode, the
capability to automatically clear the Time Tag Register following
reception of a Synchronize (without data) mode command, or to
load the Time Tag Register following a Synchronize (with data)
mode command.
Additional time tag features supported by the PCI Mini-ACE
Mark3/Micro-ACE TE include the capability for the BC to transmit
the contents of the Time Tag Register as the data word for a
Synchronize (with data) mode command; the capability for the
RT to "filter" the data word for the Synchronize with data mode
command, by only loading the Time Tag Register if the LSB of
the received data word is "0"; an instruction enabling the BC
Message Sequence Control engine to autonomously load the
Time Tag Register with a specified value; and an instruction
enabling the BC Message Sequence Control engine to write the
value of the Time Tag Register to the General Purpose Queue.
INTERRUPTS
The PCI Mini-ACE Mark3/Micro-ACE TE series terminals provide
many programmable options for interrupt generation and han-
dling. The interrupt output pin (INT) has two software program-
mable modes of operation: a level output cleared under software
control, or a level output automatically cleared following a read of
the Interrupt Status Register (#1 or #2).
Individual interrupts are enabled by the two Interrupt Mask
Registers. The host processor may determine the cause of the
interrupt by reading the two Interrupt Status Registers, which
provide the current state of interrupt events and conditions. The
Interrupt Status Registers may be updated in two ways. In one
interrupt handling mode, a particular bit in Interrupt Status
Register #1 or #2 will be updated only if the event occurs and the
corresponding bit in Interrupt Mask Register #1 or #2 is enabled.
In the enhanced interrupt handling mode, a particular bit in one
of the Interrupt Status Registers will be updated if the event/
condition occurs regardless of the value of the corresponding
Monitor Command Stack Pointer B (fixed location)
Monitor Data Stack A0800-0FFF
Monitor Command Stack A0400-07FF
Not Used
0300-03FF
Selective Monitor Lookup Table0280-02FF
Not Used
0108-027F
Monitor Data Stack Pointer B (fixed location)0107
Not Used
0104-0105
Monitor Data Stack Pointer A (fixed location)0103
Monitor Command Stack Pointer A (fixed location)0102
Not Used
0100-0101
DESCRIPTION
ADDRESS
(HEX)
0106
TABLE 61. TYPICAL SELECTIVE MESSAGE
MONITOR MEMORY MAP (shown for 4K RAM for
“Monitor only” mode)
42
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Interrupt Mask Register bit. In either case, the respective
Interrupt Mask Register (#1 or #2) bit is used to enable an inter-
rupt for a particular event/condition.
The PCI Mini-ACE Mark3/Micro-ACE TE supports all the inter-
rupt events from ACE/Mini-ACE (Plus) and Enhanced Mini-ACE
including RAM Parity Error, Transmitter Timeout, BC/RT
Command Stack Rollover, MT Command Stack and Data Stack
Rollover, Handshake Error, BC Retry, RT Address Parity Error,
Time Tag Rollover, RT Circular Buffer Rollover, BC Message, RT
Subaddress, BC End-of-Frame, Format Error, BC Status Set, RT
Mode Code, MT Trigger, and End-of-Message.
For the PCI Mini-ACE Mark3/Micro-ACE TE's Enhanced BC
mode, there are four user-defined interrupt bits. The BC Message
Sequence Control Engine includes an instruction enabling it to
issue these interrupts at any time.
For RT and Monitor modes, the PCI Mini-ACE Mark3/Micro-ACE
TE architecture includes an Interrupt Status Queue. This pro-
vides a mechanism for logging messages that result in interrupt
requests. Entries to the Interrupt Status Queue may be filtered
such that only valid and/or invalid messages will result in entries
on the queue.
The PCI Mini-ACE Mark3/Micro-ACE TE incorporates additional
interrupt conditions beyond ACE/Mini-ACE (Plus), based on the
addition of Interrupt Mask Register #2 and Interrupt Status
Register #2. This is accomplished by chaining the two Interrupt
Status Registers using the INTERRUPT CHAIN BIT (bit 0) in
Interrupt Status Register #2 to indicate that an interrupt has
occurred in Interrupt Status Register #1. Additional interrupts
include "Self-Test Completed", masking bits for the Enhanced
BC Control Interrupts, 50% Rollover interrupts for RT Command
Stack, RT Circular Buffers, MT Command Stack, and MT Data
Stack; BC Op Code Parity Error, (RT) Illegal Command, (BC)
General Purpose Queue or (RT/MT) Interrupt Status Queue
Rollover, Call Stack Pointer Register Error, BC Trap Op Code,
and four User-Defined interrupts for the Enhanced BC mode.
RAM PARITY
The BC/RT/MT version of the PCI Mini-ACE Mark3/Micro-ACE
TE is available with options of 4K or 64K words of internal RAM.
For the 64K option, the RAM is 17 bits wide. The 64K X 17 inter-
nal RAM allows for parity generation for RAM write accesses,
and parity checking for RAM read accesses. When the PCI Mini-
ACE Mark3/Micro-ACE TE detects a RAM parity error, it reports
it to the host processor by means of an interrupt and a register
bit. Also, for the RT and Selective Message Monitor modes, the
RAM address(es) where a parity error(s) was detected will be
stored on the Interrupt Status Queue (if enabled).
FIGURE 11 illustrates a generic connection diagram between a
PCI "Initiator" and a PCI Mini-ACE Mark3/Micro-ACE TE
"Target."
The following timing diagrams illustrate the PCI commands that
the PCI Mini-ACE Mark3/Micro-ACE TE responds to. Note that
these diagrams are meant to show the basic PCI bus operation
of the PCI Mini-ACE Mark3/Micro-ACE TE itself and do not show
masters inserting wait states, masters burst reading or writing
past address boundaries, masters writing into a full FIFO, etc.
To help understand the following timing diagrams an explanation
of the basic architecture of the PCI Mini-ACE Mark3/Micro-ACE
TE is helpful. The PCI Mini-ACE Mark3/Micro-ACE TE can be
15 13 0
BLOCK STATUS WORD
TIME TAG WORD
DATA BLOCK POINTER
RECEIVED COMMAND
WORD
CONFIGURATION
REGISTER #1
MONITOR COMMAND
STACK POINTERS
MONITOR
COMMAND STACKS
CURRENT
AREA B/A
MONITOR DATA
STACKS
MONITOR DATA
BLOCK #N + 1
MONITOR DATA
BLOCK #N
CURRENT
COMMAND WORD
MONITOR DATA
STACK POINTERS
IF THIS BIT IS "0" (NOT SELECTED)
NO WORDS ARE STORED IN EITHER
THE COMMAND STACK OR DATA STACK.
IN ADDITION, THE COMMAND AND DATA
STACK POINTERS WILL NOT BE UPDATED.
NOTE
SELECTIVE MONITOR
LOOKUP TABLES
SELECTIVE MONITOR
ENABLE
(SEE NOTE)
OFFSET BASED ON
RTA4-RTA0, T/R, SA4
FIGURE 10. SELECTIVE MESSAGE MONITOR MEMORY MANAGEMENT
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thought of as the very successful Mini-ACE terminal family inte-
grated with a 3.3V 33MHz PCI target interface. To simplify
descriptions of the PCI Mini-ACE Mark3/Micro-ACE TE architec-
ture, the term ACE will be used as a substitute for "enhanced
Mini-ACE" even though the 1553 terminal function is really an
enhanced Mini-ACE. When reference is made to ACE memory
(BAR0) or ACE registers (BAR1 00-FCh) these functions are
part of the ACE portion of the die. These ACE functions are
accessed via the write FIFO (for writes) and delayed read
request logic (for reads). The "PCI interface registers" (BAR1
800-81Ch) are part of the PCI interface portion of the die and are
written and read directly from the PCI bus, without use of the
write FIFO or delayed read request logic.
The PCI Mini-ACE Mark3/Micro-ACE TE's basic PCI transaction
takes 3 PCI clocks, on top of the command phase. For example,
a single write to any location within the PCI Mini-ACE Mark3/
Micro-ACE TE's memory space takes 4 PCI clocks, as shown in
FIGURE 12. Note that this is a single write, not an attempted
burst write: FRAME# is not held asserted by the master. Also
note that a write to the ACE registers or ACE memory is actually
a write into the write FIFO whereas a write to the PCI interface
PCI
"MASTER"
CH. A
TX/RXA
TX/RXA
CH. B
TX/RXB
TX/RXB
RTAD0-RTAD4 RT
ADDRESS,
PARITY
RTADP
AD0-AD31
Vcc/GND
OSCILLATOR
PAR
C/BE[0]#-C/BE[3]#
PCI
Mini-ACE
Mark3/
Micro-ACE
TE
"Target"
FRAME#
TRDY#
IRDY#
STOP#
DEVSEL#
IDSEL
INTA#
TAG_CLK
SSFLAG/EXT_TRIG
INCMD/MCRST
SERR#
PERR#
PCI_CLK
MSTCLR (RST#)
RT_AD_LAT
TX_INH_A/B
FIGURE 11. PCI INITIATOR TO PCI MINI-ACE MARK3/MICRO-ACE TE TARGET INTERFACE
44
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registers (BAR1 800-81Ch) is a write to the registers them-
selves.
Table 62 provides the timing parameters for 3.3V PCI signaling
environments applicable to the PCI Mini-ACE Mark3/Micro-ACE
TE, and FIGURE 13 shows the timing reference points. The tim-
ing parameters apply to the other timing diagrams, but are not
illustrated. The PCI Mini-ACE Mark3/Micro-ACE TE conforms to
revision 2.2 of the PCI Local Bus specification. The timing
parameters are provided here for ease of reference only.
FIGURE 13 illustrates a PCI read from the PCI Mini-ACE Mark3/
Micro-ACE TE's configuration space. The PCI Mini-ACE Mark3/
Micro-ACE TE only responds to Type Zero configuration access:
AD[1:0] must be 00 during the command phase. The PCI Mini-
ACE Mark3/Micro-ACE TE will drive a full Dword on the AD lines
independent of which byte enables are asserted during the con-
figuration read.
FIGURE 14 illustrates a PCI single write to PCI Mini-ACE Mark3/
Micro-ACE TE configuration space. The PCI Mini-ACE Mark3/
Micro-ACE TE only responds to Type Zero configuration access:
AD[1:0] must be 00 during the command phase. Note that all
combinations of byte enables for configuration writes are sup-
ported. If no byte enables are asserted during a burst write to
configuration space no internal write will occur, but the internal
address will be incremented.
FIGURE 15 shows the specific case of memory reads from the
PCI-ACE interface registers at BAR1 800h-81Ch. Note that
these registers are accessed quickly and without the Delayed
Read Request mechanism required by reads from the other
memory locations (see next section).
FIGURE 16 illustrates the process of reading an ACE memory
(BAR0) or ACE register (BAR1 00-FCh) location. The actual read
shown is that of a single word read, due to the ~600 nS response
time shown, see following text and timing formula tables. If the write
FIFO is empty and there isn't a previous Delayed Read Request
(DRR) pending, a read from these locations enques a DRR, which
is then processed by the PCI Mini-ACE Mark3/Micro-ACE TE. If
either of these conditions is true, the PCI Mini-ACE Mark3/Micro-
ACE TE will respond with a Retry, but will not enque any new
DRR.
The PCI Mini-ACE Mark3/Micro-ACE TE responds to the first read
with a Retry. By PCI rules the master must repeat the same exact
request until it completes. This is shown by the master's second
read attempt, which also produces a Retry. Each repeated read
request from the master will be target terminated with a Retry until
the data from the enqued DRR is present in the PCI Mini-ACE
Mark3/Micro-ACE TE's PCI interface. The successful completion is
FIGURE 12. PCI SINGLE MEMORY WRITE TO PCI MINI-ACE MARK3/MICRO-ACE TE
1234567
PCI single write to any legal memory location (C/BE# = 7h)
ADRS DATA
7h Byte Enables
0ns 50ns 100ns 150ns
I PCICLK
IO AD
IC/BE[3:0]#
I FRAME#
I IRDY#
O TRDY#
O STOP#
O DEVSEL#
INPUT HOLD TIME FROM CLKth
INPUT SETUP TIME TO CLKtsu
CLK TO SIGNAL VALID DELAYtv
PARAMETERSYMBOL
TABLE 62. PCI INTERFACE TIMINGS
0
7
2
MIN
11
MAX
ns
ns
ns
UNITS
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FIGURE 14. PCI SINGLE WRITE TO CONFIGURATION SPACE
1 2 3 4 5 6
PCI single write to PACE configuration space (C/BE# = Bh)
ADRS DATA
Bh
0ns 50ns 100ns 150ns
IPCICLK
IO AD[31:0]
IC/BE[3:0]#
IFRAME#
IIRDY#
OTRDY#
OSTOP#
ODEVSEL#
IIDSEL
Figure 14. PCI single writ e to conguration space
FIGURE 13. PCI SINGLE READ OF CONFIGURATION SPACE WITH TIMING
1234567
th
tsu
tv
tv
thtsu
th
tsu
th
th
tsutsu
tsu
th
tsu
PCI single read from PACE configuration space (C/BE# = Ah)
with PCI timing parameters. AD[31:0]: address driven by master; data driven by PACE
ADDRS DATA
ByteEnablesAh
0ns 50ns 100ns 150ns
IPCICLK
IO AD
IC/BE[3:0]#
IFRAME#
IIRDY#
OTRDY#
OSTOP#
ODEVSEL#
IIDSEL
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FIGURE 15. PCI READ OF PCI-ACE IF REGISTERS (BAR1 800-81CH)
1 2 3 4 5 6 7
PCI memory read from PCI-ACE interface register space (BAR1 800-81Ch)
ADRS DATA
BYTE ENABLES6h
0ns 50ns 100ns 150ns
I PCICLK
IO AD
IC/BE[3:0]#
I FRAME#
I IRDY#
O TRDY#
O STOP#
O DEVSEL#
shown at the third read request, which produces a Disconnect with
Data.
This process applies to any memory read from legal address space
other than the PCI-ACE interface registers at BAR1 offset 800-81Ch.
Note that one of the conditions for enquing a DRR is that the
write FIFO must be empty. For efficient use of PCI bus band-
width, the driver software should be written such that it checks
the FIFO condition (BAR1 800-81CH registers are directly read-
able, bypassing the DRR mechanism) before reading from the
other PCI Mini-ACE Mark3/Micro-ACE TE locations. If the FIFO
is not empty (BAR1 800h bit 30 is the FIFO not empty flag) and
a read is attempted, the bus master will be using PCI bandwidth
repeating the read request while the FIFO empties, BEFORE the
read request is actually enqued as a DRR.
When reading ACE memory (BAR0), any combination of byte
enables is supported, but the PCI Mini-ACE Mark3/Micro-ACE
TE will drive the entire word onto the AD lines when only a single
byte enable in the word is asserted.
When reading ACE registers (BAR 00-FCh), byte enable combi-
nations where only a single byte within a word is requested will
cause the PCI Mini-ACE Mark3/Micro-ACE TE to terminate the
transaction with a target abort. The PCI Mini-ACE Mark3/Micro-
ACE TE will drive all zeros onto the AD lines if only the upper
word byte enables or no byte enables are asserted.
With relation to actual timing, PCI double word reads of ACE
memory (BAR0) will take longer to complete than single word
ACE memory reads because the internal ACE memory data path
is 16 bits wide. In addition, read cycles will take longer to com-
plete with slower ACE clocks. See Table 63 for min/max formulas
for calculating completion time for the various types of reads.
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FIGURE 16. PCI READ OF ACE MEMORY/REGISTER
123456789101112131415161718192021222324252627282
9
PCI memory read from ACE registers/memory with no DRR pending & FIFO empty
produces Retry & enques DRR. Master should attempt read as soon as possible
(preferably within 33 clocks). 3rd read produces disconnect with data, DRR complete
AA A DAT
6h 6h 6h
0ns 250ns 500ns 750ns
IPCICLK
IO AD[31:0]
IC/BE[3:0]#
IFRAME#
IIRDY#
OTRDY#
OSTOP#
ODEVSEL#
ACE MEMORY
(BAR0), DOUBLE
WORD
TYPE OF READ
TABLE 63. MIN/MAX DELAYED READ FORMULAS
ACE MEMORY
(BAR0), SINGLE
WORD OR ACE
REGISTER
(BAR1, DOUBLE
WORD OR
LOWER WORD
No CBEN#
ASSERTED OR
ACE REGISTER
(BAR1) UPPER
WORD
13 x PCI_CLK PERIOD
+ 11 x ACE_CLK
PERIOD
MIN TIME FORMULA
8 x PCI_CLK PERIOD
+ 5 x ACE_CLK
PERIOD
3 x PCI_CLK PERIOD
MAX TIME FORMULA
16 x PCI_CLK PERIOD
+ 14 x ACE_CLK
PERIOD
10 x PCI_CLK PERIOD
+ 6 x ACE_CLK
PERIOD
3 x PCI_CLK PERIOD
The third case returns all zeroes and is shown only for complete-
ness.
The following examples have the same conditions: PCI clock =
33MHz, ACE clock = 16MHz, no ACE contention.
Single word read
Min time = 8 x 30 nS + 5 x 62.5 nS = 552.5 nS
Max time = 10 x 30nS + 6 x 62.5 nS = 675 nS
Double word read
Min time = 13 x 30 nS + 11 x 62.5 nS = 1077.5 nS
Max time = 16 x 30nS + 14 x 62.5 nS = 1167.5 nS
In addition, the following amount of ACE clocks should be added
for maximum time if the ACE is active.
ENHANCED CPU ACCESS ENABLED,
SINGLE WORD XFER
ACE OPERATING MODE
TABLE 64. ADDITIONAL DRR DELAY FOR
CONTESTED ACE RAM ACCESS
MAXIMUM ADDITIONAL
ACE CLOCKS
3
ENHANCED CPU ACCESS ENABLED,
DOUBLE WORD XFER 6
ENHANCED CPU ACCESS DISABLED,
SINGLE WORD XFER 67
ENHANCED CPU ACCESS DISABLED,
DOUBLE WORD XFER 74
THE ENHANCED CPU ACCESS IC CONTROLLED BY BIT 14 OF
CONFIGURATION REGISTER #6
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FIGURE 17 illustrates a 16 Dword (32 word) PCI memory write
burst, with the write FIFO empty (or with enough free space to
absorb the 16 Dwords in the FIFO). The write FIFO accepts PCI
memory writes to the ACE memory (BAR0) and ACE registers
(BAR1 offset 00h - FCh). It does not accept writes to the PCI
interface registers at BAR1 offset 800-81Ch. Writes to the BAR1
800-81Ch space go directly into the PCI interface registers. The
32 byte write shown could be an entire 1553 message being
written to ACE memory.
Writes into the BAR 0 space must be word or Dword. If only one
byte enable is asserted in a word, the PCI Mini-ACE Mark3/
Micro-ACE TE terminates the transaction with a Target-Abort.
Writes into the BAR 1 00-FCh space must be word or Dword.
If only one byte enable is asserted in a word, the PCI Mini-
ACE Mark3/Micro-ACE TE terminates the transaction with a
Target-Abort. Since the ACE registers in this space are really
16 bit registers packed into the lower word of a 32-bit struc-
ture, only lower word or Dword writes transfer bits into these
ACE registers.
In addition, as per PCI spec, a Memory Write and Invalidate (C/
BE[3:0]# = Fh) command will be aliased to the basic Memory
Write command and the timing diagram would look the same as
FIGURE 17.
FIGURE 17. PCI WRITE BURST TO ACE MEMORY WITH FIFO EMPTY
DAT3
0ns 500ns 1000ns
1
PCICLK
AD
FRAME#
IRDY#
TRDY#
STOP#
DEVSEL#
DAT2DAT1A DAT4 DAT5 DAT6 DAT7 DAT8 DAT9 DAT10 DAT11 DAT12 DAT13 DAT14 DAT15 DAT16
110 20 30 40 50
9
8
7
6
5
4
3
211 12 13 14 15 16 17 18 19 21 22 23 24 25 26 27 28 29 31 32 33 34 35 36 37 38 39 41 42 43 44 45 46 47 48 49
49
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FIGURE 18. BU-65XXXX8/9 (3.3V TRANSCEIVER) INTERFACE TO MIL-STD-1553 BUS
PCI
Mini-ACE Mark3
DATA
BUS
Z0
55 W
55 W
TX/RX
TX/RX
(1:3.75)
7.4 Vpp 28 Vpp
1FT MAX
Z0
(1:2.7)
7.4 Vpp 20 Vpp
(1:1.41)
COUPLING
TRANSFORMER
0.75 Z0
0.75 Z0
LONG STUB
(TRANSFORMER
COUPLED)
20 FT MAX
28 Vpp
SHORT STUB
(DIRECT COUPLED)
OR
Z0=70TO85 OHMS
TRANSFORMER-COUPLED
ISOLATION
TRANSFORMER
DIRECT-COUPLED
ISOLATION
TRANSFORMER
7 Vpp
7 Vpp
PCI
Mini-ACE Mark3
3.3V
3.3V
.01µF
10µF
.01µF
10µF
+
+
INTERFACE TO MIL-STD-1553 BUS WITH
3.3V TRANSCEIVERS (BU-65XXXX8/9)
FIGURE 18 illustrates the interface between the BU-65XXXX8/9
(3.3V transceivers) and a MIL-STD-1553 bus. Connections for
both direct (short stub) and transformer (long stub) coupling, as
well as the peak to peak voltage levels at various points (when
transmitting), are indicated in the diagram.
The center tap of the primary winding (the side of the trans-
former that connects to the device) must be directly connected to
the 3.3V plane. Additionally, a 10µF low inductance tantalum
capacitor and 0.01µF ceramic capacitor must be mounted as
close as possible and with the shortest leads to the center tap of
the transformer(s) and the ground plane.
Furthermore, when the transmitter is transmitting, large currents
will flow from the 3.3V plane, into the transformer center tap, thru
the primaries, into the TX/RX pins and then out thru the trans-
ceiver ground pins into the ground plane. The traces in this path
should be sized accordingly and the connections to the ground
plane should be as short as possible.
50
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3.3V TRANSFORMERS (PCI MINI-ACE MARK3/PCI
MICRO-ACE TE WITH 3.3V TRANSCEIVER OPTION)
In selecting 3.3V isolation transformers to be used with the PCI
Mini-ACE Mark3/Micro-ACE TE, there is a limitation on the maxi-
mum amount of leakage inductance. If this limit is exceeded, the
transmitter rise and fall times may increase, possibly causing the
bus amplitude to fall below the minimum level required by MIL-
STD-1553. In addition, an excessive leakage imbalance may
result in a transformer dynamic offset that exceeds 1553 specifi-
cations.
The maximum allowable leakage inductance is a function of the
coupling method. For Transformer Coupled applications, it is a
maximum of 5.0 µH. For Direct it is a maximum of 10.0 µH, and
is measured as follows:
The side of the transformer that connects to the device is defined
as the "primary" winding. If one side of the primary is shorted to
the primary center-tap, the inductance should be measured
across the "secondary" (stub side) winding.
This inductance must be less than 5.0 µH (Transformer Coupled)
and 10.0 µH (Direct Coupled). Similarly, if the other side of the
primary is shorted to the primary center-tap, the inductance mea-
sured across the "secondary" (stub side) winding must also be
less than 5.0 µH (Transformer Coupled) and 10.0 µH (Direct
Coupled).
The difference between these two measurements is the "differen-
tial" leakage inductance. This value must be less than 1.0 µH
(Transformer Coupled) and 2.0 µH (Direct Coupled).
Beta Transformer Technology Corporation (BTTC), a subsidiary
of DDC, manufactures 3.3V transformers in a variety of mechan-
ical configurations with the required turns ratios of 1:3.75 direct
coupled, and 1:2.7 transformer coupled for the BU-6XXXX8/9 or
1:2.65 direct coupled and 1:2.07 transformer coupled for the
BU-6XXXXC/D. Table 65 provides a listing of these transformers.
For further information, contact BTTC at 631-244-7393 or at
www.bttc-beta.com.
FIGURE 19. BU-65XXXXC/D (3.3V TRANSCEIVER) INTERFACE TO MIL-STD-1553 BUS
PCI
Mini-ACE Mark3
DATA
BUS
Z0
55
55
TX/RX
TX/RX
(1:2.65)
28 Vpp
1FT MAX
Z0
(1:2.07)
20 Vpp
(1:1.41)
COUPLING
TRANSFORMER
0.75 Z0
0.75 Z0
LONG STUB
(TRANSFORMER
COUPLED)
20 FT MAX
28 Vpp
SHORT STUB
(DIRECT COUPLED)
OR
Z0=70TO85 OHMS
TRANSFORMER-COUPLED
ISOLATION
TRANSFORMER
DIRECT-COUPLED
ISOLATION
TRANSFORMER
7 Vpp
7 Vpp
PCI
Mini-ACE Mark3
3.3V
.01µF
10µF +
3.3V
.01µF
10µF +
INTERFACE TO MIL-STD-1553 BUS WITH
3.3V TRANSCEIVERS (BU-65XXXXC/D)
FIGURE 19 illustrates the two possible interface methods
between the BU-65XXXXC/D and a MIL-STD-1553 bus.
Connections for both direct (short stub, 1:2.65) and transformer
(long stub, 1:2.07) coupling, as well as nominal peak-to-peak
voltage levels at various points (when transmitting), are indicated
in the diagram.
The center tap of the primary winding (the side of the trans-
former that connects to the Mark3) must be directly connected to
ground.
Additionally, during transmission, large currents flow from the
transceiver power supply through the TX/RX pins into the trans-
former primaries and then out the center tap into the ground
plane. The traces in this path should be sized accordingly and the
connections to the ground plane should be as short as possible.
A 10µf, low inductance tantalum capacitor and a 0.01µf ceramic
capacitor must be mounted as close as possible and with the
shortest leads to the transceiver power input of the Mini-ACE
Mark 3.
51
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INTERFACE TO MIL-STD-1553 BUS
(PCI MINI-ACE MARK3/PCI MICRO-ACE TE WITH 5V
TRANSCEIVER OPTION)
FIGURE 20 illustrates the interface between the PCI Mini-ACE
Mark3/PCI Micro-ACE TE with 5V transceiver option, and a MIL-
STD-1553 bus. Connections for both direct (short stub) and
transformer (long stub) coupling, as well as the peak to peak volt-
age levels at various points (when transmitting), are indicated in
the diagram.
5V TRANSFORMERS
In selecting 5V isolation transformers to be used with the PCI
Mini-ACE Mark3/Micro-ACE TE, there is a limitation on the maxi-
mum amount of leakage inductance. If this limit is exceeded, the
transmitter rise and fall times may increase, possibly causing the
bus amplitude to fall below the minimum level required by MIL-
STD-1553. In addition, an excessive leakage inductance imbal-
ance may result in a transmitter dynamic offset that exceeds
1553 specifications.
The maximum allowable leakage inductance is 6.0µH. It is mea-
sured as follows:
Defining the side of the transformer that connects to the device
as the "primary" winding, if one side of the primary is shorted to
the primary center-tap, the inductance should be measured
across the "secondary" (stud side) winding. This inductance
must be less than 6.0µH. Similarly, if the other side of the pri-
mary is shorted to the primary center-tap, the inductance mea-
sured across the "secondary" (stub side) winding must also be
less than 6.0µH.
The difference between those two measurement is the "differen-
tial" leakage inductance. This value must be less than 1.0µH.
Beta Transformer Technology Corporation (BTTC), a subsidiary
of DDC, manufactures 5V transformers in a variety of mechanical
configurations with the required turns ratios of 1:2.5 direct cou-
pled, and 1:1.79 transformer coupled. Table 66 provides a listing
of these transformers.
For further information, contact BTTC at 631-244-7393 or at
www.bttc-beta.com.
TABLE 65. BTTC TRANSFORMERS FOR USE WITH +3.3 VOLT PCI Mini-ACE Mark3 AND PCI MICRO-ACE-TE
MODEL
NUMBER
BTTC PART
NUMBER
# OF CHANNELS,
CONFIGURATION
COUPLING
RATIO
DESCRIPTION
COUPLING
RATIO
(1:X)
MOUNTING MAX
HEIGHT
WIDTH
(INCLUDING
LEADS)
LENGTH
(INCLUDING
LEADS)
BU-6XXXXX8/9 MLP-2033 Single Direct (1:3.75) SMT 0.185" 0.4" 0.52"
BU-6XXXXXC/D MLP-2030 Single Direct (1:2.65) SMT 0.185" 0.4" 0.52"
BU-6XXXXX8/9 MLP-3033 Single Direct (1:3.75) Through Hole 0.185" 0.4" 0.4"
BU-6XXXXX8/9 MLP-2233 Single Transformer (1:2.7) SMT 0.185" 0.4" 0.52"
BU-6XXXXXC/D MLP-2230 Single Transformer (1:2.07) SMT 0.185" 0.4" 0.52"
BU-6XXXXX8/9 MLP-3233 Single Transformer (1:2.7) Through Hole 0.185" 0.4" 0.4"
BU-6XXXXX8/9 MLP-3333 Single Direct &
Transformer
(1:3.75) &
(1:2.7) Through Hole 0.185" 0.4" 0.4"
BU-6XXXXXC/D LVB-4230 Single Transformer (1:2.07) SMT 0.165" 1.125" 0.625"
BU-6XXXXXC/D DSS-3330 Dual (Side-by-Side) Direct &
Transformer
(1:2.65) &
(1:2.07) SMT 0.185" 0.52" 0.675"
BU-6XXXXX8/9 DSS-2033 Dual (Side-by-Side) Direct (1:3.75) SMT 0.13" 0.72" 0.96"
BU-6XXXXX8/9 DSS-2233 Dual (Side-by-Side) Transformer (1:2.7) SMT 0.13" 0.72" 0.96"
BU-6XXXXX8/9 DSS-1003 Dual (Side-by-Side) Direct &
Transformer
(1:3.75) &
(1:2.7) SMT 0.165" 0.72" 0.96"
BU-6XXXXXC/D DSS-1630 Dual (Side-by-Side) Direct &
Transformer
(1:2.65) &
(1:2.07) SMT 0.165" 0.72" 0.96"
BU-6XXXXXC/D DLVB-4230 Dual (Stacked) Transformer (1:2.07) SMT 0.165" 0.72" 0.96"
BU-6XXXXX8/9 TSM-2033 Dual (Stacked) Direct (1:3.75) SMT 0.32" 0.4" 0.52"
BU-6XXXXX8/9 TSM-2233 Dual (Stacked) Transformer (1:2.7) SMT 0.32" 0.4" 0.52"
BU-6XXXXXC/D TSM-2230 Dual (Stacked) Transformer (1:2.07) SMT 0.32" 0.4" 0.52"
52
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FIGURE 20. BU-65XXXX3/4 (5V TRANSCEIVER) INTERFACE TO MIL-STD-1553 BUS
PCI
Mini-ACE Mark3/
PCI Micro-ACE TE
with 5V
Transceiver
Z0
55
55
(1:2.5)
11.6 Vpp 28 Vpp
1FT MAX
Z0
(1:1.79)
11.6 Vpp 20 Vpp
(1:1.4)
COUPLING
TRANSFORMER
0.75 Z0
0.75 Z0
LONG STUB
(TRANSFORMER
COUPLED)
20 FT MAX
28 Vpp
SHORT STUB
(DIRECT COUPLED)
Z0=70TO85 OHMS
ISOLATION
TRANSFORMER
ISOLATION
TRANSFORMER
OR
5V
.01µF
10µF +
PCI
Mini-ACE Mark3/
PCI Micro-ACE TE
with 5V
Transceiver
5V
.01µF
10µF +
TABLE 66. BTTC TRANSFORMERS FOR USE WITH +5.0 VOLT PCI Mini-ACE Mark3 / PCI MICRO-ACE-TE
BTTC PART
NUMBER
# OF CHANNELS,
CONFIGURATION
COUPLING RATIO
DESCRIPTION
COUPLING
RATIO (1:X) MOUNTING MAX HEIGHT
WIDTH
(INCLUDING
LEADS)
LENGTH
(INCLUDING
LEADS)
MLP-2005 Single Direct (1:2.5) SMT 0.185" 0.4" 0.52"
MLP-3005 Single Direct (1:2.5) Through Hole 0.185" 0.4" 0.4"
B-3230 (-30) # Single Direct (1:2.5) Through Hole 0.25" 0.35" 0.5"
MLP-2205 Single Transformer (1:1.79) SMT 0.185" 0.4" 0.52"
MLP-3205 Single Transformer (1:1.79) Through Hole 0.185" 0.4" 0.4"
B-3229 (-29) # Single Transformer (1:1.79) Through Hole 0.25" 0.35" 0.5"
HLP-6015 # Single Direct & Transformer (1:2.5) &
(1:1.79) SMT 0.19" 0.63" 1.13"
B-3227 (-27) # Single Direct & Transformer (1:2.5) &
(1:1.79) SMT 0.29" 0.63" 1.13"
MLP-3305 Single Direct & Transformer (1:2.5) &
(1:1.79) Through Hole 0.185" 0.4" 0.4"
B-3226 (-26) # Single Direct & Transformer (1:2.5) &
(1:1.79) Through Hole 0.25" 0.625" 0.625"
HLP-6014 # Single Direct & Transformer (1:2.5) &
(1:1.79) Flat Pack 0.19" 0.63" 1.13"
B-3231 (-31) # Single Direct & Transformer (1:2.5) &
(1:1.79) Flat Pack 0.29" 0.63" 1.13"
DSS-2005 Dual (Side-by-Side) Direct (1:2.5) SMT 0.13" 0.72" 0.96"
DSS-2205 Dual (Side-by-Side) Transformer (1:1.79) SMT 0.13" 0.72" 0.96"
DSS-1005 Dual (Side-by-Side) Direct & Transformer (1:2.5) &
(1:1.79) SMT 0.165" 0.72" 0.96"
53
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Notes:
1. All Transformers in the table above can be used with BU-6XXXXX3/6 (1553B transceivers).
2. Transformers identified with "#" in the table above are not recommended for use with the BU-6XXXXX4 (McAir-Compatable transceivers)
TABLE 66. BTTC TRANSFORMERS FOR USE WITH +5.0 VOLT PCI Mini-ACE Mark3 / PCI MICRO-ACE-TE
(CONT.)
BTTC PART
NUMBER
# OF CHANNELS,
CONFIGURATION
COUPLING RATIO
DESCRIPTION
COUPLING
RATIO (1:X) MOUNTING MAX HEIGHT
WIDTH
(INCLUDING
LEADS)
LENGTH
(INCLUDING
LEADS)
TSM-2005 Dual (Stacked) Direct (1:2.5) SMT 0.32" 0.4" 0.52"
TSM-2205 Dual (Stacked) Transformer (1:1.79) SMT 0.32" 0.4" 0.52"
TST-9117 # Dual (Stacked) Direct & Transformer (1:2.5) &
(1:1.79) SMT 0.335" 1.125" 1.125"
TST-9107 # Dual (Stacked) Direct & Transformer (1:2.5) &
(1:1.79) Through Hole 0.335" 0.625" 0.625"
TST-9127 # Dual (Stacked) Direct & Transformer (1:2.5) &
(1:1.79) Flat Pack 0.335" 0.625" 0.625"
THERMAL MANAGEMENT FOR PCI MICRO-ACE TE
(BGA PACKAGE)
Ball Grid Array (BGA) components necessitate that thermal manage-
ment issues be considered early in the design stage for MIL-
STD-1553 terminals. This is especially true if high transmitter duty
cycles are expected. The temperature range specified for the PCI
Micro-ACE TE devices refer to the temperature at the ball, not the
case.
All PCI Micro-ACE TE devices incorporate multiple package con-
nections (28-balls for 3.3V transceiver, 34 balls for 5V transceiv-
ers) which perform the dual function of transceiver circuit ground
and thermal heat sink. Each transceiver has 14 or 17 contiguous
balls arranged in a rectangle. Refer to FIGURE 21 and FIGURE
24 for a visual representation of the thermal ball locations. It is
mandatory that these thermal balls be directly soldered to a cir-
cuit ground plane (a circuit trace is insufficient). Operation without
an adequate ground/thermal plane is not recommended and
extended exposure to these conditions may affect device reliabil-
ity.
The purpose of this ground/thermal plane is to conduct the heat
being generated by the transceivers within the package away
from the PCI Micro-ACE-TE. Since the thermal balls are contigu-
ous, a mini-plane can be created on the PCB top layer and ther-
mal vias can then be sunk down thru the top-side mini-plane into
the appropriate thermal plane.
FIGURE 21. THERMAL BALL LOCATIONS FOR PCI MICRO-ACE-TE (BGA PACKAGE)
V U T R P N M L K J H G F E D C B A
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
BOTTOM VIEW
S/N
D/C
TOP VIEW
ESD and Pin 1 Identifier
Notes:
1) For BU-65843B8/BU-65863B8, balls D3, D4, D5, E3, E4, E5, F1, F2, F3, F4, F5,
G3, G4, G5, L3, L4, L5, M3, M4, M5, N1, N2, N3, N4, N5, P3, P4, P5 must be
connected to a thermal plane to maintain recommended operating temperature.
2) For BU-65843B3/BU-65863B3, D3, D4, D5, E2, E3, E4, E5, F3, F4, F5, G2, G3,
G4, G5, H3, H4, H5, P11, P12, P13, P14, P15, R11, R12, R13, R14, R15, T11,
T12, T13, T14, T15, U12, U14 must be connected to a thermal plane to maintain
recommended operating temperature
54
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3.3V_XCVR TRANSCEIVER POWER
TABLE 68. POWER AND GROUND, BGA WITH 3.3V TRANSCEIVERS
SIGNAL NAME DESCRIPTION
A4, A5, B4, B5, J1, J2, J3, J4, J5, K1, K2,
K3, K4, K5 , U4, U5, V4, V5
BU-65843B8
BU-65863B8
BALL
3.3V_LOGIC LOGIC POWER
A8, A9, B8, B9, L16, L17, M16, M17, N12,
N13, P12, P13, R6, R7, T6, T7, U6, U7, V6,
V7
GND_XCVR TRANSCEIVER GROUND (THERMAL BALLS)
D3, D4, D5, E3, E4, E5, F1, F2, F3, F4, F5,
G3, G4, G5, L3, L4, L5, M3, M4, M5, N1,
N2, N3, N4, N5, P3, P4, P5
GND_LOGIC LOGIC GROUND
E10, E11, E12, F10, F11, F12, G10, G11,
G12, H10, H11, H12, R11, R12, R13, T11,
T12, T13, U11, U12, U13
5V_VCC_CHA TRANSCEIVER “A” POWER
TABLE 69. POWER AND GROUND, BGA WITH 5V TRANSCEIVERS
SIGNAL NAME DESCRIPTION
F1, F2
BU-65843B3
BU-65864B3
BALL
5V_VCC_CHB TRANSCEIVER “B” POWERU13, V13
5V_RAM 5V RAM (BU-65864B3 ONLY)
P4, R4
3.3V_LOGIC LOGIC POWERA7, L1, L2, L15, L16, M3, P7, P9, R9, V8
GND_XCVR TRANSCEIVER GROUND (THERMAL BALLS)
D3, D4, D5, E2, E3, E4, E5,F3, F4, F5, G2,
G3, G4, G5, H3, H4, H5, P11, P12, P13,
P14, P15, R11, R12, R13, R14, R15, T11,
T12, T13, T14, T15, U12, U14
GND_LOGIC LOGIC GROUND
E12, E13, E14, F12, F13, F14, G12, G13,
G14, H12, H13, H14
NOTE: Logic ground and transceiver ground are NOT tied together inside the package.
NOTE: Logic ground and transceiver ground ARE tied together inside the package.
+ 5.0V_Xcvr 10
+ 3.3V_Logic 30,51,69
Gnd_Xcvr 22, 79
Gnd_Logic 31, 50, 70
TABLE 67. POWER AND GROUND, CQFP
SIGNAL NAME
BU-65743X3/X4
BU-65843X3/X4
BU-65863X3/X4
PIN
-
10, 30, 51, 69
-
22, 79, 31, 50, 70
BU-65743X0
BU-65843X0
BU-65863X0
PIN
BU-65743X8/X9
BU-65843X8/X9
BU-65863X8/X9
PIN
+ 5.0 Volt Transceiver Power
+ 3.3V_Xcvr -
-
30, 51, 69
22, 79
31, 50, 70
10 -+3.3 Volt Transceiver Power
Logic Power
Transceiver Ground
Logic Ground
DESCRIPTION
NOTE: Logic ground and transceiver ground are NOT tied together inside the package.
55
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TX/RX-A (I/O) D1, D2, E1
Analog Transmit/Receive Input/Outputs. Connect directly to 1553 isolation
transformers. For BGA versions, connect all balls of the signal together.
TX/RX-A (I/O) G1, H1, H2
TX/RX-B (I/O) U11, V11, V12
TX/RX-B (I/O) U15, V14, V15
TABLE 70. 1553 ISOLATION TRANSFORMER INTERFACE
(BU-65XXXX8/X9/X3/X4 VERSIONS)
SIGNAL NAME DESCRIPTION
5V
BALL
D1, D2, E1, E2
G1, G2, H1, H2
L1, L2, M1, M2
P1, P2, R1, R2
3V
BALL
3
5
15
17
PIN
TXDATA_A (O) 3DIGITAL MANCHESTER BIPHASE TRANSMIT OUTPUTS, A BUS
TXDATA_A (O) 5
RXDATA_A (I) 8
RXDATA_A (I) 4
TABLE 71. INTERFACE TO EXTERNAL TRANSCEIVER
(BU-65XXXF(G)0 VERSIONS)
SIGNAL NAME DESCRIPTION
PIN
DIGITAL MANCHESTER BIPHASE RECEIVE INPUTS, A BUS
TX_INH_A_OUT (O) 11 DIGITAL OUTPUT TO INHIBIT EXTERNAL TRANSMITTER, A BUS
TXDATA_B (O) 15
TXDATA_B (O) 17
RXDATA_B (I) 21
DIGITAL MANCHESTER BIPHASE TRANSMIT OUTPUTS, B BUS
DIGITAL MANCHESTER BIPHASE RECEIVE INPUTS, B BUS
RXDATA_B (I) 16
TX_INH_B_OUT (O) 9DIGITAL OUTPUT TO INHIBIT EXTERNAL TRANSMITTER, B BUS
SNGL_END (I) No Connect "NC"
If SNGL_END is connected to logic "0" the Manchester decoder inputs
(RX_DATA_IN_X) will be configured to accept single-ended input sig-
nals (e.g.,MIL-STD-1773 fiber optic receiver outputs). If SNGL_END is
connected to logic "1," the decoder inputs will be configured to accept
standard double-ended Manchester bi-phase input signals (i.e., MIL-
STD-1553 receiver outputs).
Do NOT connect these two signals together.
Connect TXINH_OUT (Digital transmit inhibit output) to the TX INH
input of external MIL-STD-1553 transceivers. Asserted high to inhibit
when not transmitting on the respective bus.
TXINH_IN_A (I)
These two signals
MUST be directly
connected for nor-
mal "Built-In" trans-
ceiver operation.
TXINH_OUT_A
(O)
TABLE 72. MANDATORY ADDITIONAL CONNECTIONS & INTERFACE TO EXTERNAL TRANSCEIVER
(BGA’S ONLY)
SIGNAL NAME FOR USE WITH EXTERNAL TRANSCEIVERS
"TRANSCEIVERLESS"
DESIGN USES
INTERNAL
TRANSCEIVERS
A15
A4
A5
D14
E7
E8
BU-65843B3
BU-65864B3
BU-65843B8
BU-65863B8
BALL BALL
NOTE: The BGA versions can be operated with either their internal transceivers or with external transceivers. When the devices are operated with
their internal transceivers the customer must supply PCB traces that connect the device's "inputs to outputs" (within the correct column) as described
in this table. For example, to operate the BU-65843B8/BU-65863B8 with their internal transceivers, PCB traces must connect E7 to E8, C7 to C8, D7
to D8, etc..
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TABLE 72. MANDATORY ADDITIONAL CONNECTIONS & INTERFACE TO EXTERNAL TRANSCEIVER
(BGA’S ONLY) (CONT)
SIGNAL NAME FOR USE WITH EXTERNAL TRANSCEIVERS
"TRANSCEIVERLESS"
DESIGN USES
INTERNAL
TRANSCEIVERS
BU-65843B3
BU-65864B3
BU-65843B8
BU-65863B8
BALL BALL
NOTE: The BGA versions can be operated with either their internal transceivers or with external transceivers. When the devices are operated with
their internal transceivers the customer must supply PCB traces that connect the device's "inputs to outputs" (within the correct column) as described
in this table. For example, to operate the BU-65843B8/BU-65863B8 with their internal transceivers, PCB traces must connect E7 to E8, C7 to C8, D7
to D8, etc..
Do NOT connect these two signals together. Connect TXDATA_OUT
(Digital manchester biphase transmit data output) directly to the corre-
sponding input of a MIL-STD-1553 or MIL-STD-1773 (fiber optic)
transceiver.
TXDATA_IN_A (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
C8 C7
TXDATA_OUT_A
(O) B8 C8
Do NOT connect these two signals. Connect TXDATA_OUT (Digital
manchester biphase transmit data output) directly to the corresponding
input of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver.
TXDATA_IN_A (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
C4 D7
TXDATA_OUT_A
(O) C5 D8
Do NOT connect these two signals together. Connect RXDATA_IN
(Digital manchester biphase receive data input) directly to the corre-
sponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic)
transceiver.
RXDATA_IN_A (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
D10 G8
RXDATA_OUT_A
(O) E10 G7
Do NOT connect these two signals together. Connect RXDATA_IN
(Digital manchester biphase receive data input) directly to the corre-
sponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic)
transceiver.
RXDATA_IN_A (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
E9 H8
RXDATA_OUT_A
(O) F9 H7
Do NOT connect these two signals together. Connect TXINH_OUT
(Digital transmit inhibit output) to the corresponding input of external
MIL-STD-1553 transceiver. Asserted high to inhibit when not transmit-
ting on the respective bus.
TXINH_IN_B (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
T8 N7
TXINH_OUT_B
(O) R8 N8
Do NOT connect these two signals together. Connect TXDATA_OUT
(Digital manchester biphase transmit data output) to the corresponding
input of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver.
TXDATA_IN_B (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
R10 L7
TXDATA_OUT_B
(O) P10 L8
Do NOT connect these two signals together. Connect TXDATA_OUT
(Digital manchester biphase transmit data output) directly to corre-
sponding inputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic)
transceiver.
TXDATA_IN_B (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
N12 M7
TXDATA_OUT_B
(O) M12 M8
Do NOT connect these two signals together. Connect RXDATA_IN
(Digital manchester biphase receive data input) directly to the corre-
sponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic)
transceiver
RXDATA_IN_B (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
M13 P10
RXDATA_OUT_B
(O) M14 P9
Do NOT connect these two signals together. Connect RXDATA_IN
(Digital manchester biphase receive data input) directly to the corre-
sponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic)
transceiver.
RXDATA_IN_B (I) These two signals
MUST be directly
connected for normal
"Built-In" transceiver
operation.
N13 R10
RXDATA_OUT_B
(O) N14 R9
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SSFLAG (I)/
EXT_TRIG (I)
20 U10 Subsystem Flag (RT) or External Trigger (BC/Word Monitor) input. In RT mode with standard status word,
if this input is asserted low, the Subsystem Flag bit will be set in the PCI MINI-ACE MARK3/MICRO-ACE
TE's RT Status Word. If the SSFLAG input is logic "0" while bit 8 of Configuration Register #1 has been
programmed to logic "1" (cleared), the Subsystem Flag RT Status Word bit will become logic "1", but bit
8 of Configuration Register #1, SUBSYSTEM FLAG, will return logic "1" when read. That is, the sense
on the SSFLAG input has no effect on the SUBSYSTEM FLAG register bit. This input has no meaning in
RT mode with alternate status word.
In the non-enhanced BC mode, this signal operates as an External Trigger input. In BC mode, if the
external BC Start option is enabled (bit 7 of Configuration Register #1), a low to high transition on this
input will issue a BC Start command, starting execution of the current BC frame.
In the enhanced BC mode, during the execution of a Wait for External Trigger (WTG) instruction, the PCI
Mini-ACE Mark3/Micro-ACE TE BC will wait for a low-to-high transition on EXT_TRIG before proceeding
to the next instruction.
In the Word Monitor mode, if the external trigger is enabled (bit 7 of Configuration Register #1), a low to
high transition on this input will initiate a monitor start. (RT the monitor on low). In all modes this input
operates as an external trigger, this signal should remain asserted for at least 4 1533_CLK ticks after it
goes high. This input has no effect in Message Monitor mode.
TABLE 73. PROCESSOR INTERFACE CONTROL
SIGNAL NAME DESCRIPTION
BALL
PIN
L9
BALL
5V
3V
RTAD4 (MSB) (I) 80 RT Address inputs (5V tolerant). If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is pro-
grammed to logic "0" (default), then the PCI Mini-ACE Mark3/Micro-ACE TE's RT address is provided by
means of these 5 input signals. In addition, if RT ADDRESS SOURCE is logic "0", the source of RT
address parity is RTADP.
There are many methods for using these input signals for designating the PCI Mini-ACE Mark3/Micro-
ACE TE's RT address. For details, refer to the description of RT_AD_LAT.
If RT ADDRESS SOURCE is programmed to logic "1", then the PCI Mini-ACE Mark3/Micro-ACE TE's
source for its RT address and parity is under software control, when the SW writes to config reg #5 inter-
nal address bits 4-0 will be latched from PCI data bus bit AD5-1 and internal RTADP will be latched from
PCI data bus bit AD0. In this case, the RTAD4-RTAD0 and RTADP signals are not used.
RTAD3 (I) 7
RTAD2 (I) 2
RTAD1 (I) 1
RTAD0 (LSB) (I) 6
TABLE 74. RT ADDRESS
A7
D10
C15
E6
A6
A10
C9
A8
B9
C11
Remote Terminal Address Parity. This input signal (5V tolerant) must provide an odd parity sum with
RTAD4-RTAD0 in order for the RT to respond to non-broadcast commands. That is, there must be an
odd number of logic "1"s from among RTAD-4-RTAD0 and RTADP
RTADP (I) 13 E9 D6
RT Address Latch. Input signal (5V tolerant) used to control the PCI Mini-ACE Mark3/Micro-ACE TE's
internal RT address latch. If RT_AD_LAT is connected to logic "0", then the PCI Mini-ACE Mark3/Micro-
ACE TE RT is configured to accept a hardwired (transparent) RT address from RTAD4-RTAD0 and
RTADP.
If RT_AD_LAT is initially logic "0", and then transitions to logic "1", the values presented on RTAD4-RTAD0
and RTADP will be latched internally on the rising edge of RT_AD_LAT.
If RT_AD_LAT is connected to logic "1", then the PCI Mini-ACE Mark3/Micro-ACE TE's RT address is
latchable under host processor control. In this case, there are two possibilities: (1) If bit 5 of Configuration
Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the source of the RT
Address is the RTAD4-RTAD0 and RTADP input signals; (2) If RT ADDRESS SOURCE is programmed to
logic "1", then the source of the RT Address is the lower 6 bits of the PCI data bus, D5-D1 (for RTAD4-0)
and D0 (for RTADP).
In either of these two cases (with RT_AD_LAT = "1"), the processor will cause the RT address to be latched
by: (1) writing bit 15 of Configuration Register #3, ENHANCED MODE, to logic "1"; (2) writing bit 3 of
Configuration Register #4, LATCH RT ADDRESS WITH CONFIGURATION REGISTER #5, to logic "1"; and
(3) writing to Configuration Register #5. In the case of RT ADDRESS SOURCE = "1", then the values of RT
address and RT address parity must be written to the lower 6 bits of Configuration Register #5, via D5-D0.
In the case where RT ADDRESS SOURCE = "0", the bit values presented on D5-D0 become "don't care".
RT_AD_LAT (I) 12 D9 C7
SIGNAL NAME DESCRIPTION
BALL
PIN BALL
5V
3V
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INCMD (O)/
MCRST (O) 19
In-command or Mode Code Reset. The function of this pin is controlled by bit 0 of Configuration
Register #7, MODE CODE RESET / INCMD SELECT.
If this register bit is logic "0" (default), INCMD will be active on this pin. For BC, RT, or Selective
Message Monitor modes, INCMD is asserted low whenever a message is being processed by
the PCI Mini-ACE Mark3/Micro-ACE TE. In Word Monitor mode, INCMD will be asserted low
for as long as the monitor is online.
For RT mode, if MODE CODE RESET/INCMD SELECT is programmed to logic "1", MCRST
will be active. In this case, MCRST will be asserted low for two clock cycles following receipt of
a Reset remote terminal mode command.
In BC or Monitor modes, if MODE CODE RESET/INCMD SELECT is logic "1", this signal is
inoperative; i.e., in this case, it will always output a value of logic "1".
E8
TABLE 75. MISCELLANEOUS SIGNALS
DESCRIPTION
BALL
5V
PIN
C9
BALL
3V
SIGNAL NAME
TAG_CLK (I) 23
Input (5V tolerant) for optional external tag clock. No connection needed if internal tag clock is
used. Maximum TAG_CLK frequency is 1/4th of the 1553_CLK input.
D18
F14
SLEEP_IN (I) 14
Sleep input for both 3.3V transceivers. SLEEP_IN = 1 puts the 3.3V transceivers in sleep mode
(receiver and transmitter disabled).
--
R4
1553_CLK (I) 78
20 MHz, 16 MHz, 12 MHz, or 10 MHz clock input.
D8
B7
TX_INH A/B
(I) 18
Transmitter inhibit input (5V tolerant) for the Channel A and Channel B MIL-STD-1553 transmit-
ters. For normal operation, this input should be connected to logic "0". To force a shutdown of
Channel A and Channel B, a value of logic "1" should be applied to the TX_INH input.
F10
F8
MSTCLR
(RST#) (I) 25
Master Clear. Negative true Reset input, normally asserted low following power turn-on. This
input conforms to PCI RST# convention.
B11
R18
RTBOOT (I) F7
If RTBOOT is connected to Logic "0" the PCI Micro ACE TE will initialize in RT mode with the Busy status
word bit set following power turn on. Received data will not be stored because the “BUSY RECEIVE
TRANSFER DISABLE” bit will also be set following power turn on. In addition, CLK_SEL_0 and CLK_
SEL_1 are enabled and they select the divider for the 1553 clock circuitry:
TABLE 76. MISCELLANEOUS SIGNALS, BGA ONLY
SIGNAL NAME DESCRIPTION
BALL
3V XCVR
C12
BALL
5V XCVR
CLK_SEL1 CLK_SEL0 1553 CLOCK FREQUENCY
0 0 10 MHz
0 1 20 MHz
1 0 12 MHz
1 1 16 MHz
1553 CLOCK SELECT 0, ACTIVE ONLY WHEN RTBOOT = 0CLK_SEL_0 (I) L14 M18
1553 CLOCK SELECT 1, ACTIVE ONLY WHEN RTBOOT = 0CLK_SEL_1 (I) E14 B15
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AD31 (I/O) 27 32-Bit PCI Bus Address / Data lines. Address and Data are multiplexed on the same pins. Each bus oper-
ation consists of an address phase followed by one or more data phases.
Address phases are identified when the control signal FRAME# is asserted. Data transfers occur during
those clock cycles in which the control signals IRDY# and TRDY# are both asserted.
AD30 (I/O) 28
AD29 (I/O) 29
AD28 (I/O) 32
AD27 (I/O) 33
TABLE 77. PCI BUS ADDRESS AND DATA SIGNALS
SIGNAL NAME DESCRIPTION
PIN
V9
T8
R17
P17
U8
BALL
3V
D7
M10
L10
H16
E7
BALL
5V
AD26 (I/O) 34
AD25 (I/O) 35
AD24 (I/O) 36
AD23 (I/O) 39
AD22 (I/O) 40
N17
V8
P18
M18
J15
L11
N9
L18
K17
J16
AD21 (I/O) 41
AD20 (I/O) 42
AD19 (I/O) 43
AD18 (I/O) 44
AD17 (I/O) 45
J18
K16
H18
K18
L18
G18
J17
G17
J18
K18
AD16 (I/O) 46
AD15 (I/O) 59
AD14 (I/O) 60
AD13 (I/O) 61
AD12 (I/O) 62
K17
D16
E18
D17
B15
H17
D15
F16
D16
C15
AD11 (I/O) 63 D18 D17
AD10 (I/O) 64
AD9 (I/O) 65
AD8 (I/O) 67
AD7 (I/O) 68
AD6 (I/O) 71
A15
A14
B14
A12
B11
C14
A14
C13
A12
A11
AD5 (I/O) 72 B6 J7
AD4 (I/O) 73
AD3 (I/O) 74
AD2 (I/O) 75
AD1 (I/O) 76
AD0 (I/O)
(LSB) 77
A11
C12
C10
A10
B10
C10
C6
B7
A9
B10
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Bus Command and Byte Enables. These signals are multiplexed on the same pins. During the address
phase of a bus operation, these pins identify the bus command, as shown in the table below. During the data
phase of a bus operation, these pins are used as Byte Enables, with C/BE[0]# enabling byte 0 (LSB) and C/
BE[3]# enabling byte 3 (MSB). The PCI Mini-ACE Mark3/Micro-ACE TE responds to the following PCI com-
mands
C/BE[3:0]# Description (during address phase)
0 1 1 0 Memory Read
0 1 1 1 Memory Write
1 0 1 0 Configuration Read
1 0 1 1 Configuration Write
1 1 0 0 Memory Read Multiple
1 1 1 0 Memory Read Line
1 1 1 1 Memory Write and Invalidate
Note that the last three memory commands are aliased to the basic memory commands: Memory Read
and Memory Write.
C/BE[0]# (I) 66
TABLE 77. PCI BUS ADDRESS AND DATA SIGNALS (CONT)
SIGNAL NAME DESCRIPTIONPIN
B12
BALL
3V
B12
BALL
5V
C/BE[1]# (I) 58 E17 E15
C/BE[2]# (I) 47 J17 H18
C/BE[3]# (I) 37 R8 J8
PAR (I/O) 57 F16 F15
Parity. This signal is even parity across the entire AD[31:0] field along with the C/BE[3:0]# field. The parity
is stable in the clock following the address phase and is sourced by the Bus Master. During the data phase
for write operations, the Bus Master sources this signal on the clock following IRDY# active. During the data
phase for read operations, this signal is sourced by the Target and is valid on the clock following TRDY#
active. The PAR signal therefore has the same timing as AD[31:0], delayed by one clock.
PCI_CLK (I) 26 T10 M9 Clock input. The rising edge of this signal is the reference upon which all other clock signals are based, with
the exception of RST# and INTA#. The maximum frequency accepted is 33 MHz and the minimum is 0 Hz.
TABLE 78. PCI CONTROL BUS SIGNALS
(NOTE THAT ALL SIGNALS LISTED, EXCEPT INTA#, ARE SAMPLED ON THE RISING EDGE OF PCI_CLK)
SIGNAL NAME DESCRIPTION
PIN BALL
3V
BALL
5V
FRAME#(I) 48 G17 G15
STOP#(O) 54 E16 E16
Stop. The Stop signal is sourced by the selected target and conveys a request to the bus master to
stop the current transaction.
DEVSEL# (O) 53 F17 F17 Device Select. This signal is sourced by an active target upon decoding that its address and bus commands
are valid. For bus masters, it indicates whether any device has decoded the current bus cycle.
Frame. This signal is driven by the current bus master and identifies both the beginning and duration of a
bus operation. When FRAME# is first asserted, it indicates that a bus transaction is beginning and that valid
addresses and a corresponding bus command are present on the AD[31:0] and C/BE[3:0] lines, qualified by
PCI _CLK. When FRAME# is deasserted the transaction is in the final data phase or has been complet-
ed.
IRDY#(I) 49 H17 G16
Initiator Ready. This signal is sourced by the bus master and indicates that the bus master is able to com-
plete the current data phase of a bus transaction. For write operations, it indicates that valid data is on the
AD[31:0] pins. Wait states occur until both TRDY# and IRDY# are asserted together.
TRDY#(O) 52 G18 F18
Target Ready. This signal is sourced by the selected target and indicates that the target is able to complete
the current data phase of a bus transaction. For read operations, it indicates that the target is providing valid
data on the AD[31:0] pins. Wait states occur until both TRDY# and IRDY# are asserted together.
IDSEL#(I) 38 N18 K16 Initialization Device Select. This pin is used as a chip select during configuration read or write operations.
PERR# (O) 55 F18 E18
Parity Error. This pin is used for reporting parity errors during the data portion of the bus transaction for all
cycles except a Special Cycle. It is sourced by the agent receiving data and driven active two clocks follow-
ing the detection of an error. This signal is driven inactive (high) two clocks prior to returning to the tri-state
condition.
SERR# (O) 56 F15 E17 System Error. This pin is used for reporting address parity errors, data parity errors on Special Cycle com-
mands, or any other condition having a catastrophic system impact.
INTA# (O) 24 J16 L17 Interrupt A. This pin is a level sensitive, active low interrupt to the host
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PIN#
TABLE 79. PCI MINI-ACE MARK3 PINOUT
SIGNAL NAME
1RTAD1
2RTAD2
3TX/RX A
4DO NOT CONNECT, FACTORY TP
5TX/RX_A
6RTAD0
7RTAD3
8DO NOT CONNECT, FACTORY TP
9DO NOT CONNECT, FACTORY TP
10
3.3V_XCVR FOR
BU-65XXF(G)8(9)-XXX 5VXCVR
FOR BU-65XXF(G)3(4)-XXX
11 DO NOT CONNECT, FACTORY TP
12 RTAD_LAT
13 RTAD_PAR
14 SLEEP_IN
15 TX/RX_B
16 DO NOT CONNECT, FACTORY TP
17 TX/RX_B
18 TXINH_A/B
19 INCMD / MCRST
20 SSFLAG / EXT_TRIG
21 DO NOT CONNECT, FACTORY TP
22 GND_XCVR
23 TAG_CLK
24 INTA#
25 MSTCLR
26 PCI_CLOCK
27 AD31
28 AD30
29 AD29
30 3.3V_LOGIC
31 GND_LOGIC
32 AD28
33 AD27
34 AD26
35 AD25
36 AD24
37 C/BE[3]#
38 IDSEL
39 AD23
40 AD22
PIN# SIGNAL NAME
41 AD21
42 AD20
43 AD19
44 AD18
45 AD17
46 AD16
47 C/BE[2]#
48 FRAME#
49 IRDY#
50 GND_LOGIC
51 3.3V_LOGIC
52 TRDY#
53 DEVSEL#
54 STOP#
55 PERR#
56 SERR#
57 PA R
58 C/BE[1]#
59 AD15
60 AD14
61 AD13
62 AD12
63 AD11
64 AD10
65 AD9
66 C/BE[0]#
67 AD08
68 AD07
69 3.3V_LOGIC
70 GND_LOGIC
71 AD06
72 AD05
73 AD04
74 AD03
75 AD02
76 AD01
77 AD00
78 1553_CLK
79 GND_XCVR
80 RTAD4
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TABLE 80. PCI MICRO-ACE-TE BU-65843B8/BU-65863B8 (3.3V TRANSCEIVER) PINOUTS
SIGNALBALL
NC
SIGNAL
BALL
A1
NCA2
NCA3
+3.3V_XCVRA4
+3.3V_XCVRA5
RTAD0A6
RTAD4A7
+3.3V LOGICA8
+3.3V LOGICA9
AD01A10
AD04
A11
NCA13
AD09A14
AD10A15
NCA16
NCA17
NCA18
NCB1
NCB3
NCB2
+3.3V_XCVR
B4
+3.3V_XCVRB5
AD05B6
1553_CLKB7
+3.3V LOGICB8
+3.3V LOGIC B9
AD00B10
AD06
B11
C/BE[0]#B12
NCB13
AD08B14
AD12B15
NCB16
NC
B17
NCB18
NCC1
NCC2
NCC3
NCC4
NCC5
NCC6
TXDATA_IN_A /1/C7
TXDATA_OUT_A /1/C8
INCMD / MCRSTC9
AD02C10
NCC11
AD03C12
NCC13
NCC14
RTAD2C15
NCC16
NCC17
NCC18
TX/RX-AD1
GND_XCVR /2/D3
TX/RX-AD2
GND_XCVR /2/D4
GND_XCVR /2/D5
NCD6
TXDATA_IN_A /1/D7
TXDATA_OUT_A /1/D8
RT_AD_LATD9
RTAD3D10
NCD11
NCD12
NCD13
SNGL_END
D14
NCD15
AD15D16
AD13D17
AD11D18
NOTES NOTES
Connect to ball C8
Connect to ball C7
Thermal Ball,
Connects to Thermal
Via
Connect to ball D8
Connect to ball D7
TX/RX_AE1
TX/RX_AE2
GND/XCVR /2/E3
GND/XCVR /2/E4
GND/XCVR /2/E5
RTAD1E6
TXINH_IN_A /1/E7
TXINH_OUT_A /1/E8
RTADPARE9
GND_LOGICE10
GND_LOGICE11
GND_LOGICE12
NCE13
Connect to ball E8
Connect to ball E7
CLK_SEL_1
E14
NCE15
STOP#E16
C/BE[1]#E17
AD14E18
Thermal Ball,
Connects to Thermal
Via
AD07A12
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TABLE 80. PCI MICRO-ACE-TE BU-65843B8/BU-65863B8 (3.3V TRANSCEIVER) PINOUTS (CONT)
SIGNAL
BALL
GND_XCVR /2/
SIGNAL
BALL
F1
GND_XCVR /2/F2
GND_XCVR /2/F3
GND_XCVR /2/F4
GND_XCVR /2/F5
NCF6
RTBOOT
F7
TX_INH A/BF8
NCF9
GND_LOGICF10
GND_LOGICF11
GND_LOGICF12
NCF13
TAG_CLKF14
SERR#LF15
PA RF16
DEVSEL#F17
PERR#F18
TX/RX_AG1
GND_XCVR /2/G3
TX/RX_AG2
GND_XCVR /2/G4
GND_XCVR /2/G5
NCG6
RXDATA_OUT_A /1/G7
RXDATA_IN_A /1/G8
NCG9
GND_LOGICG10
GND_LOGICG11
GND_LOGICG12
NCG13
NCG14
NCG15
NCG16
FRAME#G17
TRDY#G18
TX/RX_AH1
TX/RX_AH2
NCH3
NCH4
NCH5
NCH6
RXDATA_OUT /1/H7
RXDATA_IN_A /1/H8
NCH9
GND_LOGICH10
GND_LOGICH11
GND_LOGICH12
NCH13
NCH14
NCH15
NCH16
IRDY#H17
AD19H18
3.3V_XCVRJ1
3.3V_XCVRJ3
3.3V_XCVRJ2
3.3V_XCVRJ4
3.3V_XCVRJ5
NCJ6
NCJ7
NCJ8
NCJ9
NCJ10
NCJ11
NCJ12
NCJ13
NC
J14
AD22J15
INTA#J16
C/BE[2]#J17
AD21J18
NOTES
Thermal Ball, Connects
to Thermal Via
Thermal Ball, Connects
to Thermal Via
Connect to ball G8
Connect to ball G7
NOTES
Connect to ball H8
Connect to ball H7
3.3V_XCVRK1
3.3V_XCVRK2
3.3V_XCVRK3
3.3V_XCVRK4
3.3V_XCVR
K5
NCK6
NCK7
NCK8
NCK9
NCK10
NCK11
NCK12
NC
K13
NCK14
NCK15
AD20K16
AD16K17
AD18K18
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TABLE 80. PCI MICRO-ACE-TE BU-65843B8/BU-65863B8 (3.3V TRANSCEIVER) PINOUTS (CONT)
SIGNALBALL
TX/RX_B
SIGNAL
BALL
L1
TX/RX_B
L2
GND_XCVR /2/L3
GND_XCVR /2/L4
GND_XCVR /2/L5
NCL6
TXDATA_IN_B /1/L7
TXDATA_OUT_B /1/L8
NCL9
NCL10
NC
L11
NCL12
NCL13
CLK_SEL_0L14
NCL15
3.3V_LOGICL16
3.3V_LOGICL17
AD17L18
TX/RX_BM1
GND_XCVR /2/M3
TX/RX_BM2
GND_XCVR /2/M4
GND_XCVR /2/M5
NCM6
TXDATA_IN_B /1/M7
TXDATA_OUT_B /1/M8
NCM9
NCM10
NCM11
NCM12
NCM13
NCM14
NCM15
3.3V_LOGICM16
3.3V_LOGICM17
AD23M18
GND_XCVR /2/N1
GND_XCVR /2/N2
GND_XCVR /2/N3
GND_XCVR /2/N4
GND_XCVR /2/N5
NCN6
TXINH_IN_B /1/N7
TXINH_OUT_B /1/N8
NCN9
NCN10
NCN11
3.3V_LOGICN12
3.3V_LOGICN13
NCN14
NCN15
NCN16
AD26N17
IDSELN18
TX/RX_BP1
GND_XCVR /2/P3
TX/RX_BP2
GND_XCVR /2/P4
GND_XCVR /2/P5
NCP6
NCP7
NCP8
RXDATA_OUT_B /1/P9
RXDATA_IN_B /1/P10
NC
P11
3.3V_LOGICP12
3.3V_LOGICP13
NCP14
NCP15
NCP16
AD28P17
AD24P18
NOTES
Thermal Ball, Connects
to Thermal Via
Connect to ball L8
Connect to ball L7
Thermal Ball, Connects
to Thermal Via
Connect to ball M8
Connect to ball M7
NOTES
Thermal Ball, Connects
to Thermal Via
Connect to ball N8
Connect to ball N7
Thermal Ball,
Connects to Thermal
Via
Connect to ball P10
Connect to ball P9
TX/RX_BR1
TX/RX_BR2
NCR3
SLEEPINR4
NCR5
3.3V_LOGIC
R6
3.3V_LOGICR7
C/BE[3]#R8
RXDATA_OUT_B /1/R9
RXDATA_IN_B /1/R10
GND_LOGICR11
GND_LOGICR12
GND_LOGICR13
Connect to ball R10
Connect to ball R9
NCR14
NCR15
NC
AD29R17
MSTCLR (RST#)R18
R16
65
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TABLE 80. PCI MICRO-ACE-TE BU-65843B8/BU-65863B8 (3.3V TRANSCEIVER) PINOUTS (CONT)
SIGNAL
BALL
NC
SIGNAL
BALL
T1
NCT2
NCT3
NCT4
NCT5
3.3V_LOGICT6
3.3V_LOGICT7
AD30T8
NCT9
PCI_CLKT10
GND_LOGICT11
GND_LOGICT12
GND_LOGICT13
NCT14
NCT15
NCT16
NCT17
NCT18
NCU1
NCU3
NCU2
3.3V_XCVR
U4
3.3V_XCVRU5
3.3V_LOGICU6
3.3V_LOGICU7
AD27U8
NCU9
SSFLAG/EXTTRIGU10
GND_LOGICU11
GND_LOGICU12
GND_LOGICU13
NCU14
NCU15
NCU16
NCU17
NCU18
NCV1
NCV2
NCV3
3.3V_XCVRV4
3.3V_XCVRV5
3.3V_LOGIC
V6
3.3V_LOGICV7
AD25V8
AD31V9
NC
V10
NCV11
NCV12
NCV13
NCV14
NCV15
NCV16
NCV17
NCV18
NOTES NOTES
NOTES :
/1/ -LOGIC-TRANSCEIVER INTERCONNECT SIGNALS: CONSULT
Table 71
/2/ - THERMAL BALL - MUST BE CONNECTED TO PWB THERMAL
PLANE (28)
NC = DO NOT CONNECT, NO USER CONNECTIONS TO THESE
BALLS ALLOWED
66
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TABLE 81. PCI MICRO-ACE-TE BU-65843B3/BU-65864B3 (5V TRANSCEIVER) PINOUTS
SIGNAL
BALL
NC
SIGNAL
BALL
A1
NCA2
NCA3
TXINH_IN_A /1/A4
TXINH_OUT_A /1/A5
NCA6
+3.3V LOGICA7
RTAD2A8
AD01A9
RTAD4A10
AD06A11
AD07A12
NCA13
AD09A14
SNGL_ENDA15
NCA16
NCA17
NCA18
NCB1
NCB3
NCB2
NCB4
NCB5
NCB6
AD02B7
TXDATA_OUT_A /1/B8
RTAD1B9
AD00B10
MSTCLR (RST#)B11
C/BE[0]#
B12
NCB13
NCB14
CLK_SEL1B15
NCB16
NCB17
NCB18
NC
C1
NCC2
NCC3
TXDATA_IN_A /1/C4
TXDATA_OUT_A /1/
C5
AD03C6
RT_AD_LATC7
TXDATA_IN_A /1/C8
RTAD3C9
AD04C10
RTAD0C11
RT_BOOTC12
AD08C13
AD10C14
AD12C15
NCC16
NCC17
NCC18
TX/RX-AD1
GND_XCVR /2/
D3
TX/RX-AD2
GND_XCVR /2/D4
GND_XCVR /2/D5
RTAD_PARD6
AD31D7
1553_CLKD8
NCD9
RXDATA_IN_A /1/D10
NCD11
NCD12
NCD13
NCD14
AD15D15
AD13
D16
AD11D17
TAG_CLKD18
NOTES NOTES
Thermal Ball,
Connects to Thermal
Via
TX/RX_AE1
GND/XCVR /2/E2
GND/XCVR /2/E3
GND/XCVR /2/E4
GND/XCVR /2/E5
NCE6
AD27E7
INCMD / MCRSTE8
RXDATA_IN_A /1/E9
RXDATA_OUT_A /1/E10
NCE11
GND_LOGICE12
GND_LOGICE13
GND_LOGICE14
C/BE[1]#E15
STOP#E16
SERR#E17
PERR#E18
Thermal Ball,
Connects to Thermal
Via
67
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TABLE 81. PCI MICRO-ACE-TE BU-65843B3/BU-65864B3 (5V TRANSCEIVER) PINOUTS (CONT)
SIGNALBALL
+5V VCC CH A
SIGNAL
BALL
F1
+5V VCC CH AF2
GND_XCVR /2/F3
GND_XCVR /2/F4
GND_XCVR /2/F5
NCF6
NCF7
NCF8
RXDATA_OUT_A /1/F9
TX_INH A/BF10
NCF11
GND_LOGICF12
GND_LOGICF13
GND_LOGICF14
PA RF15
AD14F16
DEVSEL#F17
TRDY#F18
TX/RX_AG1
GND_XCVR /2/G3
GND_XCVR /2/G2
GND_XCVR /2/G4
GND_XCVR /2/
G5
NCG6
NCG7
NCG8
NCG9
NCG10
NCG11
GND_LOGICG12
GND_LOGICG13
GND_LOGICG14
FRAME#G15
IRDY#G16
AD19G17
AD21G18
TX/RX_AH1
TX/RX_AH2
GND_XCVR /2/H3
GND_XCVR /2/H4
GND_XCVR /2/H5
NCH6
NCH7
NCH8
NCH9
NCH10
NCH11
GND_LOGICH12
GND_LOGICH13
GND_LOGICH14
NCH15
AD28H16
AD16H17
C/BE[2]#H18
NCJ1
NCJ2
NCJ4
NCJ5
NCJ6
AD05J7
C/BE[3]#J8
NCJ9
NCJ10
NCJ11
NCJ12
NCJ13
NCJ14
NCJ15
AD22J16
AD20J17
AD18J18
NOTES
Thermal Ball, Connects
to Thermal Via
Thermal Ball, Connects
to Thermal Via
NOTES
Thermal Ball, Connects
to Thermal Via
RFU (JTAG)
RFU (JTAG)
NCK1
NCK2
NCK3
NCK4
NCK5
NCK6
NCK7
NCK8
NCK9
NCK10
NCK11
NCK12
NCK13
NCK14
NCK15
IDSELK16
AD23K17
AD17K18
RFU (JTAG)
RFU (JTAG)
NCJ3
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TABLE 81. PCI MICRO-ACE-TE BU-65843B3/BU-65864B3 (5V TRANSCEIVER) PINOUTS (CONT)
SIGNALBALL
3.3V_LOGIC
SIGNAL
BALL
L1
3.3V_LOGICL2
NCL3
NCL4
NCL5
NCL6
NCL7
NCL8
SSFLAG / EXT_TRIGL9
AD29L10
AD26L11
NCL12
NCL13
NCL14
3.3V_LOGICL15
3.3V_LOGICL16
INTA#L17
AD24L18
NCM1
3.3V_LOGICM3
NCM2
NCM4
NCM5
NCM6
NCM7
NCM8
PCI_CLKM9
AD30M10
NCM11
TXDATA_OUT_B /1/M12
RXDATA_IN_B /1/M13
RXDATA_OUT_B /1/M14
NCM15
NCM16
NCM17
CLK_SEL_0M18
NCN1
NCN2
NCN3
NCN4
NCN5
NCN6
NCN7
NCN8
AD25N9
NCN10
NCN11
TXDATA_IN_B /1/
N12
RXDATA_IN_B /1/N13
RXDATA_OUT_B /1/N14
NCN15
NCN16
NCN17
NCN18
NCP1
NCP3
NCP2
5V_RAMP4
NCP5
NCP6
3.3V_LOGICP7
NC
P8
3.3V_LOGICP9
TXDATA_OUT_B /1/P10
GND_XCVR /2/P11
GND_XCVR /2/P12
GND_XCVR /2/P13
GND_XCVR /2/P14
GND_XCVR /2/P15
NCP16
NCP17
NCP18
NOTES
RFU (JTAG)
NOTES
Thermal Ball,
Connects to
Thermal Via
NCR1
NCR2
NCR3
5V_RAMR4
NCR5
NCR6
NCR7
TXINH_OUT_B /1/R8
3.3V_LOGICR9
TXDATA_IN_B /1/R10
GND_XCVRR11
GND_XCVRR12
GND_XCVRR13
GND_XCVR
R14
GND_XCVRR15
NCR16
NCR17
NC
R18
Thermal Ball,
Connects to
Thermal Via
5V RAM BU-65864B3 ONLY
5V RAM BU-65864B3 ONLY
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TABLE 81. PCI MICRO-ACE-TE BU-65843B3/BU-65864B3 (5V TRANSCEIVER) PINOUTS (CONT)
SIGNALBALL
NC
SIGNAL
BALL
T1
NCT2
NCT3
NCT4
NCT5
NCT6
NCT7
TXINH_IN_B /1/T8
NCT9
NCT10
GND_XCVRT11
GND_XCVRT12
GND_XCVRT13
GND_XCVRT14
GND_XCVRT15
NCT16
NCT17
NCT18
NCU1
NCU3
NCU2
NCU4
NCU5
NCU6
NCU7
NCU8
NCU9
NCU10
TX/RX_BU11
GND_XCVRU12
5V VCC CHBU13
GND_XCVRU14
TX/RX_BU15
NCU16
NCU17
NCU18
NCV1
NCV2
NCV3
NCV4
NCV5
NCV6
NCV7
3.3V_LOGICV8
NCV9
NCV10
TX/RX_BV11
TX/RX_BV12
5V VCC CHBV13
TX/RX_BV14
TX/RX_BV15
NCV16
NCV17
NCV18
NOTES
Thermal Ball, Connects
to Thermal Via
Thermal Ball, Connects
to Thermal Via
NOTES
NOTES:
/1/ -LOGIC-TRANSCEIVER INTERCONNECT SIGNALS: CONSULT
Table 71
/2/ -THERMAL BALL - MUST BE CONNECTED TO PWB THERMAL
PLANE (34)
NC = DO NOT CONNECT, NO USER CONNECTIONS TO THESE
BALLS ALLOWED
Thermal Ball, Connects
to Thermal Via
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FIGURE 22. MECHANICAL OUTLINE DRAWING FOR 80-LEAD FLATPACK
#1
Notes:
1) Dimensions are in inches (mm).
4 X 19 EQUAL SP @
0.040 (1.016) = 0.760 (19.304)
(TOL. NON-CUM.)
TOP VIEW
SIDE VIEW
#20
#21
#41
#60
#61
#80
PIN NUMBERS FOR
REFERENCE ONLY
4 X 0.890 (22.606)
MAX.
0.015 (0.381)
TYP.
#40
2 X 1.88 (47.75)
4 X 0.200 (5.08)
2 X 2.36 (59.94)
REF.
0.500 (12.7)
REF
0.050 (1.27)
0.008 (0.2032)
0.025 (0.635)
0.130 (3.302)
MAX.
±0.02
±0.002
4 X 0.060 (1.524)
0.910 (23.114)
MAX.
PIN #1 DENOTED
BY INDEX MARK
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FIGURE 23. MECHANICAL OUTLINE DRAWING FOR 80-PIN GULL LEAD PACKAGE
#1
Notes:
1) Dimensions are in inches (mm).
4 X 0.880 (22.35)
REF
PIN #1 DENOTED
BY INDEX MARK
#20
#21
#41
#60
#61
#80
PIN #1 DENOTED
BY INDEX MARK
PIN NUMBERS FOR
REFERENCE ONLY
4 X 19 EQUAL SP @
0.040 (1.016) = 0.760 (19.304)
(TOL. NON-CUM.)
0.015 (0.381)
TYP.
#40
0.006 (0.152)
+0.010
- 0.004
(+0.254)
(- 0.102)
1.110 (28.194)
0.010 (0.254)
MAX.
0.130 (3.302)
MAX.
0.060 (1.524)
MAX.
4 X 0.060 (1.524)
0.004 (0.102)
± 0.015
SIDE VIEW
TOP VIEW
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FIGURE 24. MECHANICAL OUTLINE DRAWING FOR 324 BALL BGA PACKAGE
.0394 [1.00]
(TYP)
.815 [20.70]
(MAX)
SQUARE
.670 [17.02]
(TYP)
17 EQ. SP. @
.0394 [1.00] = .670 [17.02]
(TOL NONCUM)
(TYP)
.065 [1.65]
(TYP)
.065 [1.65]
(TYP)
.022 [0.56] DIA
B = Sn/Pb (63/37) BALL
R = Sn/Ag/Cu (96.5/3.0/0.5) BALL
0.120 [3.05]
(MAX)
BOTTOM VIEW
SIDE VIEW
Notes:
1) Dimensions are in inches (mm).
2) Cover material: Diallyl Phthalate (DAP).
3) Base material: FR4 PC board.
4) Solder Ball Cluster to be centralized within ±.010 of outline dimensions.
5) The copper pads (324 places) on the bottom of the BGA package are .025” (0.635 mm)
in diameter prior to processing. Final ball size is .022” (0.56 mm) after processing (typical).
Tr iangle denotes
Ball A1
V U T R P N M L K J H G F E D C B A
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0.015 [0.38]
(REF)
Cover Material
Diallyl Phthalate (DAP)
FR4 P. C. Board
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ORDERING INFORMATION FOR PCI MINI-ACE MARK3
BU-6586 3F3-120X
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = 100% Pull Test
Q = 100% Pull Test and Pre-Cap Source Inspection
K = One Lot Date Code
W = One Lot Date Code and Pre-Cap Source Inspection
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, Pre-Cap Source Inspection and 100% Pull Test
Blank = None of the Above
Test Criteria:
0 = Standard Testing
1 = X-Ray
2 = MIL-STD-1760 Amplitude Compliant (not available with McAir compatible Outputs)
See transceiver 4, 9 & D options
3 = MIL-STD-1760 and X-Ray
Process Requirements:
0 = Standard DDC practices, no Burn-In
1 = MIL-PRF-38534 Compliant (note 2)
2 = B (note 1)
3 = MIL-PRF-38534 Compliant (note 2) with PIND Testing
4 = MIL-PRF-38534 Compliant (note 2) with Solder Dip
5 = MIL-PRF-38534 Compliant (note 2) with PIND Testing and Solder Dip
6 = B (note 1) with PIND Testing
7 = B (note 1) with Solder Dip
8 = B (note 1) with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In (see table on next page)
Temperature Range/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
6 = Custom Part (Reserved)
7 = Custom Part (Reserved)
8 = 0°C to +70°C with Variables Test Data
Voltage/Transceiver Option:
0 = Transceiverless (contact factory for availability)
3 = +5.0 Volts rise/fall times = 100 to 300 ns (-1553B)
4 = +5.0 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible) Note: Not available with
“MIL-STD-1760 Amplitude Compliant Outputs”)
8 = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 4)
9 = +3.3 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible) Note: Not available with
“MIL-STD-1760 Amplitude Compliant Outputs”) (note 4)
C = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 5)
D = +3.3 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible. Note: Not available with
“MIL-STD-1760 Amplitude Compliant Outputs") (note 5)
Package Type:
F = 80-Lead Flat Pack
G = 80-Lead “Gull Wing” (Formed Lead)
Logic / RAM Voltage
3 = 3.3 Volt
PCI-Mini-ACE/Mark3 Product Type: (See Product Matrix on Page 75)
BU-6574 = RT only with 4K X 16 RAM
BU-6584 = BC /RT / MT with 4K x 16 RAM
BU-6586 = BC /RT / MT with 64K x 17 RAM
Notes:
1. Standard DDC processing with burn-in and full temperature test. See table on
next page.
2. MIL-PRF-38534 product grading is designated with the following dash numbers:
Class H is a -11X, 13X, 14X, 15X, 41X, 43X, 44X, 45X
Class G is a -21X, 23X, 24X, 25X, 51X, 53X, 54X, 55X
Class D is a -31X, 33X, 34X, 35X, 81X, 83X, 84X, 85X
3. The above products contain tin-lead solder finish as applicable to solder dip
requirements.
4. Transformer center-tap connected to +3.3V_XCVR, see FIGURE 18 (Obsolete)
5. Transformer center-tap connected to GND, see FIGURE 19
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ORDERING INFORMATION FOR PCI MICRO-ACE-TE*
BU-6XXX3BX-E0X
Test Criteria:
0 = 18V Amplitude. Only available with “Voltage transceiver option = 4”
2 = MIL-STD-1760 Amplitude Compliant, Standard
Process Requirements:
0 = Standard DDC practices, no Burn-In
Temperature Range/Data Requirements:
E = -40°C to +100°C
Voltage/Transceiver Option:
3 = +5.0 Volts rise/fall times = 100 to 300 ns (-1553B)
4 = +5.0 Volts 200 to 300 ns rise/fall times, -1553 and McAir compatible
(not available with “Test Criteria option = 2”)
8 = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 3)
C = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 4)
Package Type:
B = 324-ball BGA Package
R = RoHS Compliant 324-ball BGA Package
Logic / RAM Voltage:
3 = 3.3 Volt
4 = 3.3 Volt Logic, 5.0 Volt RAM (for BU-65864, 64K x 17 RAM Voltage is always +5.0V)
Product Type: (See Product Matrix)
BU-6584 = PCI BC/RT/MT with 4K x 16 RAM
BU-6586 = PCI BC/RT/MT with 64K x 17 RAM
Note : Unless otherwise specified, these products contains tin-lead solder.
*See PCI-MICRO-ACE-TE Product Matrix for valid ordering options
ACCESSORIES:
BU-64863B8-600
MICRO-ACE-TE (324 Ball BGA) Mechanical Sample, with "daisy chain" connections of alternating balls,
for use in environmental (mechanical / thermal) integrity testing.
TABLE 11015 (note 1), 1030 (note 2)
BURN-IN
Notes:
1. For Process Requirement "B*" (refer to ordering information), devices may be non-compliant with MIL-STD-883, Test Method 1015,
Paragraph 3.2. Contact factory for details.
2. When applicable.
3. Transformer center-tap connected to +3.3V_XCVR, see FIGURE 18 (Obsolete)
4. Transformer center-tap connected to GND, see FIGURE 19
3000g2001CONSTANT ACCELERATION
C1010TEMPERATURE CYCLE
A and C1014SEAL
2009, 2010, 2017, and 2032INSPECTION
CONDITION(S)METHOD(S)
MIL-STD-883
TEST
STANDARD DDC PROCESSING
FOR HYBRID AND MONOLITHIC HERMETIC PRODUCTS
B1010TEMPERATURE CYCLE
2010, 2017, and 2032INSPECTION
CONDITION(S)METHOD(S)
MIL-STD-883
TEST
STANDARD DDC PROCESSING
FOR BGA PRODUCTS
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BU-65743X3 3.3V
BU-65743X8 3.3V
BU-65743X9 3.3V
PCI-MINI-ACE MARK3 PRODUCT MATRIX
PART NUMBER LOGIC
VOLTAGE
3.3V
3.3V
3.3V
RAM VOLTAGEMEMORY
BU-65743X4 3.3V
4K x 16
4K x 16
4K x 16
4K x 16 3.3V
5.0V
3.3V
3.3V
TRANSCEIVER
VOLTAGE
5.0V
BU-65843B3-E02 3.3V
BU-65864B(R)3-E02 3.3V
BU-65863B8-E02 3.3V
PCI-MICRO-ACE TE PRODUCT MATRIX
PART NUMBER LOGIC
VOLTAGE
3.3V
5.0V
3.3V
RAM
VOLTAGE
MEMORY
BU-65843B8-E02 3.3V
4K x 16
64K x 17
64K x 17
4K x 16 3.3V
5.0V
5.0V
3.3V
TRANSCEIVER
VOLTAGE
3.3V
BU-65843X4 3.3V
BU-65843X8 3.3V
3.3V
3.3V
BU-65843X3 3.3V
4K x 16
4K x 16
4K x 16 3.3V
5.0V
3.3V
5.0V
BU-65843X9 3.3V 3.3V
4K x 16 3.3V
BU-65863X4 3.3V
BU-65863X8 3.3V
3.3V
3.3V
BU-65863X3 3.3V
64K x 17
64K x 17
64K x 17 3.3V
5.0V
3.3V
5.0V
BU-65863X9 3.3V 3.3V
64K x 17 3.3V
SPECIAL ORDER
MIN QTY
MAY APPLY
X
X
BU-65864B(R)4-E00 3.3V 64K x 17 5.0V 5.0V
BU-65743XC 3.3V
BU-65743XD 3.3V
3.3V
3.3V
4K x 16
4K x 16
3.3V
3.3V
BU-65843XC 3.3V 3.3V
4K x 16 3.3V
BU-65843XD 3.3V 3.3V
4K x 16 3.3V
BU-65863XC 3.3V 3.3V
64K x 17 3.3V
BU-65863XD 3.3V 3.3V
64K x 17 3.3V
BU-65843BC-E02 3.3V 4K x 16 3.3V 3.3V
X
BU-65863BC-E02 3.3V 3.3V
64K x 17 3.3V
X
76
AD-2/12-0 PRINTED IN THE U.S.A.
DATA DEVICE CORPORATION
REGISTERED TO ISO 9001:2008
REGISTERED TO AS9100:2004-01
FILE NO. A5976
R
E
G
I
S
T
E
R
E
D
F
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®
U
105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2426
For Technical Support - 1-800-DDC-5757 ext. 7771
Headquarters, N.Y., U.S.A. - Tel: (631) 567-5600, Fax: (631) 567-7358
United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425
Germany - Tel: +49-(0)89-15 00 12-11, Fax: +49-(0)89-15 00 12-22
Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
Asia - Tel: +65-6489-4801
World Wide Web - http://www.ddc-web.com
The information in this data sheet is believed to be accurate; however, no responsibility is
assumed by Data Device Corporation for its use, and no license or rights are
granted by implication or otherwise in connection therewith.
Specifications are subject to change without notice.
Please visit our Web site at www.ddc-web.com for the latest information.
RECORD OF CHANGE
For BU-65743 Data Sheet
Revision
Date
Pages
Description
W 6/2009
30, 32, 33, 35,
50, 51
Removed “old” double-buffered references.
Replaced table 65. Added a new Table (Table 66).
Y
11/2009
62, 65, 67, 72
Changed "Package Type" ordering description
FROM:
R = Lead Free 324-ball BGA Package
TO:
R = RoHS Compliant 324-ball BGA Package
Added not bars to R1 R2 of table 80 and G1, H1,
H2, U15, V14, V15 of table 81
AA
4/2010
5, 48, 50
Edit to Soldering section of table 1. Edit to
table 65 and Figure 18.
AB
AC
6/2011
47, 48, 49, 50,
71, 72
Updated Figures 18 and 20.
Added Figure 19 (BU-64XXXXC/D).
Incremented all following Figure numbers.
Update to Figure 20.
Replaced Table 65.
Added Options “C” and “D”, and notes 4 and
5 to Ordering Information for PCI Mini-ACE
Mark3.
Added Option “C” and notes to Ordering
Information for PCI Micro-ACE-TE
AD
2/2012
2 - 6, 50 - 53
Changed transformer ratio from “1:2.038” to
“1:2.07” in Figure 1, Figure 19, and pages 50
and 52.
Table 1:
Added BU-65X43XC/D-XXX and
BU-65863XC/D-XXX to Power Supply
Requirements (3.3V Transceiver).
Added BU-65X43XC/D-XXX and
BU-65863XC/D-XXX to Power Dissipation
(3.3V Transceiver).
Added BU-65XX3XC/D-XXX to Power
Dissipation (Hottest Die 3.3V Transceiver).