Document Number: MC33399
Rev. 10.0, 4/2013
Freescale Semiconductor
Technical Data
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2006-2013. All rights reserved.
Local Interconnect Network
(LIN) Physical Interface
Local interconnect network (LIN) is a serial communication
protocol designed to support automotive networks in conjunction with
controller area network (CAN). As the lowest level of a hierarchical
network, LIN enables cost-effective communication with sensors and
actuators when all the features of CAN are not required. This device
is powered by SMARTMOS technology.
The 33399 is a physical layer component dedicated to automotive
sub-bus applications. It offers communication speed from 1.0 kbps to
20 kbps, and up to 60 kbps for programming mode. It has two
operating modes: Normal and Sleep.
The 33399 supports LIN protocol specification 1.3.
Features
• Nominal operation from VSUP 7.0 to 18 V DC, functional up to
27 V DC battery voltage and capable of handling 40 V during load
dump
• Active bus waveshaping to minimize radiated emission
•± 5.0 kV ESD on LIN Bus Pin, ± 4.0 kV ESD on other pins
•30 k internal pull-up resistor
• Ground shift operation and ground disconnection Fail-safe at
module level
• An unpowered node does not disturb the network
•20 µA in Sleep mode
• Wake-up capability from LIN Bus, MCU command and dedicated
high voltage wake-up input (interface to external switch)
• Interface to MCU with CMOS compatible I/O pins
• Control of external voltage regulator
Figure 1. 33399 Simplified Application Diagram
LIN PHYSICAL INTERFACE
33399
ORDERING INFORMATION
Device
(Add R2 Suffix for
Tape and Reel)
Temperature
Range (TA)Package
MC33399PEF - 40 to 125 °C 8 SOICN
EF SUFFIX (PB-FREE)
98ASB42564B
8 PIN SOICN
LIN Bus
5.0 V
Regulator
33399
MCU
VPWR
INH
EN
TXD
RXD
VSUP WAKE
GND
LIN
12 V
Analog Integrated Circuit Device Data
2Freescale Semiconductor
33399
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
Figure 2. 33399 Simplified Internal Block Diagram
VREF
Receiver
INF
EN
RXD
TXD
GND
LIN
30 k
VSUP
Driver
WAKE
Wake-up
VREG
Control
Bias
Protection
Logic
Analog Integrated Circuit Device Data
Freescale Semiconductor 3
33399
PIN CONNECTIONS
PIN CONNECTIONS
Figure 3. 33399 8-SOICN Pin Connections
Table 1. 8-SOICN Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 10.
Pin Pin Name Formal Name Definition
1RXD Data Output MCU interface that reports the state of the LIN bus voltage.
2EN Enable Control Controls the operation mode of the interface.
3WAKE Wake Input High voltage input used to wake up the device from the Sleep mode.
4TXD Data Input MCU interface that controls the state of the LIN output.
5GND Ground Device ground pin.
6LIN LIN Bus Bidirectional pin that represents the single-wire bus transmitter and receiver.
7VSUP Power Supply Device power supply pin.
8 INH Inhibit Output Controls an external switchable voltage regulator having an inhibit input.
1
2
3
45
6
7
8
RXD
EN
WAKE
TXD
INH
VSUP
LIN
GND
Analog Integrated Circuit Device Data
4Freescale Semiconductor
33399
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating Symbol Value Unit
ELECTRICAL RATINGS
Power Supply Voltage
Continuous Supply Voltage
Transient Voltage (Load Dump)
VSUP
27
40
V
WAKE DC and Transient Voltage (Through a 33 k Serial Resistor) VWAKE - 18 to 40 V
Logic Voltage (RXD, TXD, EN Pins) VLOG - 0.3 to 5.5 V
LIN Pin
DC Voltage
Transient (Coupled Through 1.0 nF Capacitor)
VBUS
- 18 to 40
- 150 to 100
V
INH Voltage / Current
DC Voltage VINH - 0.3 to VSUP + 0.3 V
ESD Voltage, Human Body Model (1)
All Pins
LIN Bus Pin with Respect to Ground
V ESD1
± 4000
± 5000
V
ESD Voltage, Machine Model
All Pins
V ESD2
± 200
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
TA
TJ
- 40 to 125
- 40 to 150
C
Storage Temperature TSTG - 55 to 150 C
Thermal Resistance, Junction to Ambient RJA 150 C/W
Peak Package Reflow Temperature During Reflow (2), (3) TPPRT Note 3. °C
Thermal Shutdown TSHUT 150 to 200 C
Thermal Shutdown Hysteresis THYST 8.0 to 20 C
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 220 pF, RZAP = 0 ).
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor 5
33399
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 7.0 V VSUP 18 V, -40C TA 125C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
VSUP PIN (DEVICE POWER SUPPLY)
Supply Voltage Range VSUP 7.0 13.5 18 V
Supply Current in Sleep Mode
VLIN > VSUP - 0.5 V, VSUP < 14 V
14 V VSUP < 18 V
IS1
IS2
—
—
20
—
50
150
A
Supply Current in Normal Mode
Recessive State
Dominant State, Total Bus Load > 500
IS(REC)
IS(DOM)
—
—
—
—
2.0
3.0
mA
Supply Undervoltage Threshold VSUP_UV 5.5 6.4 6.8 V
RXD OUTPUT PIN (LOGIC)
Low-Level Output Voltage
IIN 1.5 mA
VOL
0.0 —0.9
V
High-Level Output Voltage
IOUT 
VOH
3.75 —5.25
V
TXD INPUT PIN (LOGIC)
Low-Level Input Voltage VIL — — 1.5 V
High-Level Input Voltage VIH 3.5 — — V
Input Voltage Threshold Hysteresis VINHYST 100 550 800 mV
Pullup Current Source
1.0 V < VTXD < 4.0 V, VEN = 5.0 V
IPU
- 50 — - 25
A
EN INPUT PIN (LOGIC)
Low-Level Input Voltage VIL — — 1.5 V
High-Level Input Voltage VIH 3.5 — — V
Input Voltage Threshold Hysteresis VINHYST 100 480 800 mV
EN Low-Level Input Current
VIN = 1.0 V
IIL
5.0 20 30
A
High-Level Input Current
VIN = 4.0 V
IIH
—20 40
A
Pulldown Current
1.0 V < EN < 4.0 V
IPD
—20 —
A
Analog Integrated Circuit Device Data
6Freescale Semiconductor
33399
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
LIN PIN (VOLTAGE EXPRESSED VERSUS VSUP VOLTAGE)
Low Level Bus Voltage (Dominant State)
TXD LOW, VLIN = 40 mA
VDOM
0.0 —1.4
V
High Level Voltage (Recessive State)
TXD HIGH, IOUT = 1.0 A
VREC
0.85 VSUP — —
V
Internal Pullup Resistor to VSUP (4)
- 40 °C TA 70 °C
70 °C < TA 125 °C
RPU
20
35
30
49
47
60
k
Current Limitation
TXD LOW, VLIN = VSUP
I LIM
50 150 200
mA
Leakage Current to GND
Recessive State, VSUP - 0.3 V VLIN VSUP (4)
VSUP Disconnected, -18 V VLIN 18 V (Excluding Internal Pull-up
Source)
VSUP Disconnected, VLIN = -18 V (Including Internal Pull-up Source)
VSUP Disconnected, VLIN = +18 V (Including Internal Pull-up Source)
I LEAK
0.0
- 40
—
—
—
—
- 600
15
10
40
—
—
A
LIN Receiver, Low Level Input Voltage
TXD HIGH, RXD LOW
V LINL
0 VSUP —0.4 VSUP
V
LIN Receiver, High Level Input Voltage
TXD HIGH, RXD HIGH
V LINH
0.6 VSUP — VSUP
V
LIN Receiver Threshold Center
(VLINH - VLINL) / 2
V LINTH
— VSUP/2 —
V
LIN Receiver Input Voltage Hysteresis
VLINH - VLINL
V LINHYS
0.05 VSUP —0.15 VSUP
V
LIN Wake-up Threshold Voltage V LINWU 3.5 4.5 6.0 V
INH OUTPUT PIN
High Level Voltage (Normal Mode) VWUH VSUP - 0.8 — VSUP V
Leakage Current (Sleep Mode)
0 < VINH < VSUP
I LEAK
0.0 —5.0
A
WAKE INPUT PIN
Typical Wake-Up Threshold (EN = 0 V, 7.0 V VSUP 18 V) (5)
HIGH-to-LOW Transition
LOW-to-HIGH Transition
VWUTH
0.3 VSUP
0.4 VSUP
0.43 VSUP
0.55 VSUP
0.55 VSUP
0.65 VSUP
V
Wake-up Threshold Hysteresis VWUHYS 0.1 VSUP 0.16 VSUP 0.2 VSUP V
WAKE Input Current
VWAKE 14 V
VWAKE > 14 V
I WU
—
—
1.0
—
5.0
100
A
Notes
4. A diode structure is inserted with the pullup resistor to avoid parasitic current path from LIN to VSUP.
5. When VSUP is greater than 18 V, the wake-up voltage thresholds remain identical to the wake-up thresholds at 18 V.
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP 18 V, -40C TA 125C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
Freescale Semiconductor 7
33399
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 7.0 V VSUP 18 V, -40C TA 125C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
DIGITAL INTERFACE TIMING
LIN Slew Rate (6)
, (7)
Falling Edge
Rising Edge
t
FALL
t RISE
0.75
0.75
2.0
2.0
3.0
3.0
V/s
LIN Rise/Fall Symmetry (t
RISE
- t
FALL)t SYM - 2.0 —2.0 s
Driver Propagation Delay (8)
, (9)
TXD LOW-to-LIN LOW
TXD HIGH-to-LIN HIGH
t
TXDLINL
t
TXDLINH
0.0
0.0
—
—
4.0
4.0
s
Receiver Propagation Delay (9)
, (10)
LIN LOW to RXD LOW
LIN HIGH to RXD HIGH
t
RXDLINL
t
RXDLINH
2.0
2.0
4.0
4.0
6.0
6.0
s
Receiver Propagation Delay Symmetry t RECSYM - 2.0 —2.0 s
Transmitter Propagation Delay Symmetry t TRSYM - 2.0 —2.0 s
Propagation Delay (11)
LIN Bus Wake-up to INH HIGH
t PROPWL
45 70 130
s
Notess
6. Measured between 20 and 80 percent of bus signal for 10 V <VSUP < 18 V. Between 30 and 70 percent of signal for
7.0 V < VSUP < 10 V.
7. See Figure 5, page 8.
8. t TXDLINL is measured from TXD (HIGH-to-LOW) and LIN (VREC - 0.2 V). t TXDLINH is measured from TXD (LOW-to-HIGH) and LIN
(VDOM + 0.2 V).
9. See Figure 4, page 8.
10. Measured between LIN receiver thresholds and RXD pin.
11. See Figure 6, page 8.
Analog Integrated Circuit Device Data
8Freescale Semiconductor
33399
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
Figure 4. Normal Mode Bus Timing Characteristics
Figure 5. LIN Rise and Fall Time Figure 6. LIN Bus Wake-up
TXD
RXD
LIN
VREC
Dominant State
tTXDLINL
tTXDLINH
Recessive State
Recessive State
0.4 VSUP
0.6 VSUP
tRXDLINH tRXDLINL
VDOM + 0.2 V
VREC - 0.2 V
VDOM
tFALL
tRISE
0.2 VSUP
0.8 VSUP
0.8 VSUP
0.2 VSUP
INH
LIN
VSUP
Dominant State
Recessive State
0.4 VSUP
tPROPWL
Analog Integrated Circuit Device Data
Freescale Semiconductor 9
33399
ELECTRICAL CHARACTERISTICS
FUNCTIONAL DIAGRAMS
FUNCTIONAL DIAGRAMS
Figure 7. LIN Wake-up with INH Option Figure 8. LIN Wake-Up from Wake-up Switch
Figure 9. LIN Wake-up with MCU in Stop Mode
LIN Bus
INH
Bus Wake-up Filtering Time (
t
PROG
WL)
Voltage
Off State
On State
Node in Sleep State
Node in
Regulator Wake-up Time Delay
Low or Floating
High
MCU Startup Time Delay
EN
EN High
Operation
Regulator
WAKE
INH
Voltage
Off State
On State
Node in Sleep State
Node in
Regulator Wake-up Time Delay
High
MCU Startup Time Delay
EN
EN High
Operation
State Change
Regulator
Low or Floating
WAKE Filtering Time
Analog Integrated Circuit Device Data
10 Freescale Semiconductor
33399
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33399 is a Physical Layer component dedicated to
automotive LIN sub-bus applications.
The 33399 features include speed communication from
1.0 kbps to 20 kbps, up to 60 kbps for Programming mode,
and active bus waveshaping to minimize radiated emission.
The device offers three different wake-up capabilities:
wake-up from LIN bus, wake-up from the MCU command,
and dedicated high voltage wake-up input.
The INH output may be used to control an external voltage
regulator.
FUNCTIONAL PIN DESCRIPTION
POWER SUPPLY PIN (VSUP)
The VSUP power supply pin is connected to a battery
through a serial diode for reverse battery protection. The DC
operating voltage is from 7.0 to 27 V. This pin sustains
standard automotive voltage conditions such as 27 V DC
during jump-start conditions and 40 V during load dump. To
avoid a false bus message, an undervoltage reset circuitry
disables the transmission path (from TXD to LIN) when VSUP
falls below 7.0 V. Supply current in the Sleep mode is
typically 20 A.
GROUND PIN (GND)
In case of a ground disconnection at the module level, the
33399 does not have significant current consumption on the
LIN bus pin when in the recessive state. (Less than 100 µA is
sourced from LIN bus pin, which creates 100 mV drop
voltage from the 1.0 k LIN bus pull-up resistor.) For the
dominant state, the pull-up resistor should always be active.
The 33399 handles a ground shift up to 3.0 V when
VSUP > 9.0 V. Below 9.0 V VSUP, a ground shift can reduce
VSUP value below the minimum VSUP operation of 7.0 V.
LIN BUS PIN (LIN)
The LIN bus pin represents the single-wire bus transmitter
and receiver.
Transmitter Characteristics
The LIN driver is a low side MOSFET with internal current
limitation and thermal shutdown. An internal pull-up resistor
with a serial diode structure is integrated so no external pull-
up components are required for the application in a slave
node. An additional pull-up resistor of 1.0 k must be added
when the device is used in the master node.
Voltage can go from - 18 to 40 V without current other than
the pull-up resistance. The LIN pin exhibits no reverse current
from the LIN bus line to VSUP, even in the event of GND shift
or VPWR disconnection. LIN thresholds are compatible with
the LIN protocol specification.
The fall time from recessive to dominant and the rise time
from dominant to recessive are controlled to typically
2.0 V/µs. The symmetry between rise and fall time is also
guaranteed.
When going from dominant to recessive, the bus
impedance parasitic capacitor must be charged up to VSUP.
This charge-up is achieved by the total system pull-up current
resistors. In order to guarantee that the rise time is within
specification, maximum bus capacitance should not exceed
10 nF with bus total pull-up resistance less than 1.0 k.
Receiver Characteristics
The receiver thresholds are ratiometric with the device
supply pin. Typical threshold is 50%, with a hysteresis
between 5% and 10% of VSUP.
DATA INPUT PIN (TXD)
The TXD input pin is the MCU interface that controls the
state of the LIN output. When TXD is LOW, LIN output is
LOW; when TXD is HIGH, the LIN output transistor is turned
OFF.
This pin has an internal 5.0 V internal pull-up current
source to set the bus in a recessive state in case the MCU is
not able to control it; for instance, during system power-up/
power-down. During the Sleep mode, the pull-up current
source is turned OFF.
DATA OUTPUT PIN (RXD)
The RXD output pin is the MCU interface that reports the
state of the LIN bus voltage. LIN HIGH (recessive) is reported
by a high level on RXD; LIN LOW (dominant) is reported by a
low voltage on RXD. RXD output structure is a CMOS-type
push-pull output stage.
ENABLE INPUT PIN (EN)
The EN pin controls the operation mode of the interface. If
EN = logic [1], the interface is in normal mode, with the
transmission path from TXD to LIN and from LIN to RXD both
active. If EN = logic [0], the device is in Sleep mode or low
power mode, and no transmission is possible.
In Sleep mode, the LIN bus pin is held at VSUP through the
bus pull-up resistors and pull-up current sources. The device
can transmit only after being awakened. Refer to the INHIBIT
OUTPUT PIN (INH) description on page 11.
During Sleep mode, the device is still supplied from the
battery voltage (through VSUP pin). Supply current is 20 µA
typical. Setting the EN pin to LOW will turn the INH to high-
impedance. The EN pin has an internal 20 µA pull-down
current source to ensure the device is in Sleep mode if EN
floats.
Analog Integrated Circuit Device Data
Freescale Semiconductor 11
33399
FUNCTIONAL DESCRIPTION
INTRODUCTION
INHIBIT OUTPUT PIN (INH)
The INH pin controls an external switchable voltage
regulator having an inhibit input. This pin is a high side switch
structure to VSUP. When the device is in the Normal mode,
the inhibit high side switch is turned ON and the external
voltage regulator is activated. When the device is in Sleep
mode, the inhibit switch is turned OFF and disables the
voltage regulator (if this feature is used).
A wake-up event on the LIN bus line will switch the INH pin
to VSUP level. Wake-up output current capability is limited to
280 µA. INH can also drive an external MOSFET connected
to an MCU IRQ or XIRQ input to generate an interrupt. See
the typical application illustrated in Figure 13, page 15.
WAKE INPUT PIN (WAKE)
The WAKE pin is a high voltage input used to wake up the
device from Sleep mode. WAKE is usually connected to an
external switch in the application. The typical WAKE
thresholds are VSUP
/ 2.
The WAKE pin has a special design structure and allows
wake-up from both HIGH-to-LOW or LOW-to-HIGH
transitions. When entering the Sleep mode, the LIN monitors
the state of the WAKE pin and stores it as a reference state.
The opposite state of this reference state will be the wake-up
event used by the device to re-enter Normal mode.
An internal filter is implemented (50 s typical filtering time
delay). The WAKE pin input structure exhibits a high
impedance with extremely low input current when voltage at
this pin is below 14 V. When voltage at the WAKE pin
exceeds 14 V, input current starts to sink into the device. A
series resistor should be inserted in order to limit the input
current, mainly during transient pulses. Recommended
resistor value is 33 k.
Important The WAKE pin should not be left open. If the
wake-up function is not used, WAKE should be connected to
GND to avoid false wake-up.
Analog Integrated Circuit Device Data
12 Freescale Semiconductor
33399
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
As described below and depicted in Figure 10 and Table 5
on page 13, the 33399 has two operational modes, normal
and sleep, and one transitional mode, Awake.
NORMAL MODE
This is the normal transmitting and receiving mode. All
features are available.
SLEEP MODE
In this mode the transmission path is disabled and the
device is in low power mode. Supply current from VSUP is
20 µA typical. Wake-up can occur from LIN bus activity, as
well as from node internal wake-up through the EN pin and
the WAKE input pin.
DEVICE POWER-UP (AWAKE TRANSITIONAL
MODE)
At system power-up (VSUP rises from zero), the 33399
automatically switches into the “Awake” mode (refer to
Figure 10 below and Table 5 on page 13. It switches the INH
pin in HIGH state to VSUP level. The microcontroller of the
application then confirms the Normal mode by setting the EN
pin HIGH.
DEVICE WAKE-UP EVENTS
The device can be awakened from Sleep mode by three
wake-up events:
• LIN bus activity
• Internal node wake-up (EN pin)
• Wake-up from WAKE pin
Figures 7, 8, and 9 on page 9 show device application
circuit and detail of wake-up operations.
Wake-up from LIN Bus (Awake Transitional Mode)
A wake-up from the LIN pin switching from recessive to
dominant state (switch from VSUP to GND) can occur. This
is achieved by a node sending a wake-up frame on the bus.
This condition internally wakes up the interface, which
switches the INH pin to a HIGH level to enable the voltage
regulator. The device switches into the Awake mode. The
microcontroller and the complete application power up. The
microcontroller must switch the EN pin to a HIGH level to
allow the device to leave the Awake mode and turn it into
Normal mode in order to allow communication on the bus.
Wake-up from Internal Node Activity (Normal Mode)
The application can internally wake-up. In this case, the
microcontroller of the application sets the EN pin in the HIGH
state. The device switches into Normal mode.
Wake-up from WAKE Pin (Awake Transitional Mode)
The application can wake up with the activation of an
external switch. Refer to Table 1, 8-SOICN Pin Definitions on
page 3.
Figure 10. Operational and Transitional Modes State Diagram
Power-Up/
Sleep Awake
Normal
EN LOW
LIN Bus or WAKE Pin
EN HIGH
Wake-up
EN HIGH (Local Wake-up Event)
1.0 to 20
kbps
VPWR > 7.0 V
Note Refer to Table 5 for explanation.
VPWR < 7.0 V
VPWR < 7.0 V VPWR < 7.0 V
Down
Analog Integrated Circuit Device Data
Freescale Semiconductor 13
33399
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSIS FEATURES
PROTECTION AND DIAGNOSIS FEATURES
ELECTROSTATIC DISCHARGE (ESD)
The 33399 has two Human Body Model ESD values. All
pins can handle ± 4.0 kV. The LIN bus pin, with respect to
ground, can handle ± 5.0 kV.
ELECTROMAGNETIC COMPATIBILITY
RADIATED EMISSION ON LIN BUS OUTPUT LINE
Radiated emission level on the LIN bus output line is
internally limited and reduced by active slew rate control of
the output bus driver. Figure 11 shows the results in the
frequency range 100 kHz to 2.0 MHz.
ELECTROMAGNETIC IMMUNITY (EMI)
On the LIN bus pin, the 33399 offers high EMI level from
external disturbance occurring at the LIN bus pin in order to
guarantee communication during external disturbance.
On the WAKE input pin, an internal filter is implemented to
reduce false wake-up during external disturbance.
NOISE FILTERING
Noise filtering is used to protect the electronic module
against illegal wake-up spikes on the bus. Integrated receiver
filters suppress any high-frequency (HF) noise induced into
the bus wires. The cut-off frequency of these filters is a
compromise between propagation delay and HF
suppression.
Figure 11. Radiated Emission in Normal Mode
Table 5. Explanation of Operational and Transitional Modes State Diagram
Operational/
Transitional LIN INH EN TXD RXD
Sleep Mode Recessive state, driver off.
20 A pull-up current source.
LOW LOW XHigh-impedance.
Awake Recessive state, driver off. HIGH LOW XLOW.
Normal Mode Driver active. 30 k pullup active. HIGH HIGH LOW to drive LIN bus in
dominant.
HIGH to drive LIN bus in
recessive.
Report LIN bus level:
• LOW LIN bus dominant
• HIGH LIN bus recessive
X = Don’t care.
Analog Integrated Circuit Device Data
14 Freescale Semiconductor
33399
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
The 33399 can be configured in several applications. Figures 12 and 13 show slave and master node applications. An
additional pull-up resistor of 1.0 k in series with a diode must be added when the device is used in the master node.
Figure 12. Slave Node Typical Application with WAKE Input Switch and INH
(Switchable 5.0 V Regulator)
Actuator
SCI
MCU
Driver
M
12 V
5.0 V
INH
5.0 V
LIN Bus
V
REG
I/O
V
DD
External Switch
RXD
TXD
EN
LIN
VSUP
V
REF
Logic
GND
Driver
Receiver
Bias
INH
Protection
Wake-up
WAKE
30
k
33399
V
PWR
Regulator
Regulator
Control
Analog Integrated Circuit Device Data
Freescale Semiconductor 15
33399
TYPICAL APPLICATIONS
Figure 13. Master Node Typical Device Application with MCU Wake-Up from Stop Mode
(Non-Switchable 5.0 V Regulator, MCU Stop Mode)
Actuator
SCI
MCU
Driver
M
5.0 V
LIN Bus
Master Node
Pullup
IRQ
5.0 V
I/O
V
DD
I/O(2)
RXD
TXD
EN
LIN
VSUP
V
REF
Logic
GND
Driver
Receiver
Bias
INH
Protection
WAKE
30
k
1.0
k
33399
V
PWR
External Switch
12 V
5.0 V
Regulator
Wake-up
Regulator
Control
Analog Integrated Circuit Device Data
16 Freescale Semiconductor
33399
REFERENCE DOCUMENTS
REFERENCE DOCUMENTS
Table 6. Reference Documents
Title LIterature Order Number
Local Interconnect Network (LIN) Physical Interface: Difference Between MC33399 and MC33661 EB215
Analog Integrated Circuit Device Data
Freescale Semiconductor 17
33399
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Important For the most current revision of the package, visit www.freescale.com and do a keyword search on the
98ASB42564B drawing number below. Dimensions shown are provided for reference ONLY.
EF SUFFIX (Pb-FREE)
8-PIN SOIC NARROW BODY
98ASB42564B
ISSUE U
Analog Integrated Circuit Device Data
18 Freescale Semiconductor
33399
REVISION HISTORY
REVISION HISTORY
REVISION DATE DESCRIPTION OF CHANGES
7.0 7/2006 • Implemented Revision History page
• Added Pb-Free suffix code EF
• Added EPP ordering part number MCZ33399EF/R2
• Adjusted to the Freescale prevailing form and style
8.0 10/2006 • Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
MAXIMUM RATINGS on page 4. Added note with instructions to obtain this information from
www.freescale.com.
9.0 6/2012 • Removed MC33399D from the ordering information.
• Removed D Suffix
• Updated orderable part number from MCZ33399EF to MC33399PEF.
• Updated Freescale form and style
10.0 4/2013 • Change TSTG to -55 to 150
• No other technical changes. Revised back page. Updated document properties. Added
SMARTMOS sentence to first paragraph.
Document Number: MC33399
Rev. 10.0
4/2013
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