BAT750
350mW
Schottky Diodes
40 Volts
Features
x Very Low Forward Voltage Drop.
x High Conductance
x For Use in DC-DC Converter PCMCIA, and Moblie
Telecommunication Applications.
Mechanical Data
x Marking: K77/K79
x Weight: 0.008 grams (approx.)
Maximum Ratings
Symbol Rating Rating Unit
VRContinuous Reverse Voltage 40 V
VR(RMS) RMS Reverse Voltage 28 V
IOAverage Rectified Current(1) 0.75 A
IFSM
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed
on rated load(JEDEC Method) 5.5 A
PDPower Dissipation (1) 350 mW
RJA Thermal Resistance Junction to Ambient
Air(1) 286 OC/W
TJJunction Temperature 125 OC
TSTG Storage Temperature -55 to +150 OC
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol Parameter Min Typ Max Units
V(BR)R Reverse Breakdown Voltage
(IR=300uAdc) (2) 40 45 --- V
VF
Forward Voltage (2)
IF=50mAdc
IF=100mAdc
IF=250mAdc
IF=500mAdc
IF=750mAdc
IF=1000mAdc
IF=1500mAdc
---
---
---
---
---
---
---
0.225
0.235
0.290
0.340
0.390
0.420
0.475
0.280
0.310
0.350
0.420
0.490
0.540
0.650
V
IRReverse Current (2)
(VR=30Vdc) --- 50 100 uA
CT
Capacitance
(VR=0, f=1.0MHz)
(VR=25Vdc, f=1.0MHz)
---
--- 175
25 ---
--- pF
*(1) Part mounted on FR-4 PC board with recommended pad layout
(2) Short duration test pulse used to minimize self-heating effect.
omponents
20736 Marilla Street Chatsworth
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MCC
www.mccsemi.com
Revision: 3 2008/01/01
SOT-23
Suggested Solder
Pad Layout
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .110 .120 2.80 3.04
B .083 .098 2.10 2.64
C .047 .055 1.20 1.40
D .035 .041 .89 1.03
E .070 .081 1.78 2.05
F .018 .024 .45 .60
G .0005 .0039 .013 .100
H .035 .044 .89 1.12
J .003 .007 .085 .180
K .015 .020 .37 .51
A
B
C
D
E
F
GH
.079
2.000
mm
.800
.035
.900
.950
.037
.950
TM
Micro Commercial Components
x Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
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