12.86 RRB: $H040.20umUst 1. Contact plating POS. #1 9.9 POS. #10 SMT#: #6980. OS nmBt Contact area: Gold (0.2um min.) FRboe: Xo TWHIe Termination area: Gold (0.03um) } 0.25 a Underplating: Nickel I ate nnn 2. H8I299: QZAC-AZOMY+ 2. Mating connector P/N: QZAC-A20MY+ 3.8R8TH: 24.7mm eleclic PH | erorcioercre | ; 3. Stack height: 24.7mn A.375t0F4-: O. 1mm max. = RA Fy 4, Coplanarity of SMT terminal Is 0.1mm max. | 0.8 POS. #11 4 7.2 IN POS. #20 11.1 16 17. 140.1 Pos. #1 1 Sto. Pos. #10 | | 1 1. 440.05 HFESRE (1, 10, 11, 20) iT Pos. # , At +e Po 4 SRR ZIZ\ZIZIZIZ 1 7 Cavity No. YY y ~ ) ~7 | iaaae m7 J | | YY hos) 2) 3 / i | V. l 4 - r B Z lo o a y ri] 2 oJ | |A IRI THED anannr WY Kot ed | Connector ! Gi AAU yy L outline A ---1 - AIA AAA... 4K ---- | N ABABABAK : \ -|~ | 1.34005 dia. 0. 520.08 \ 0.940.085 dia. | | 0. 840.05 TT Pos. #11 Pos. #20 fa MN [ |__t.2se \_fes: $20 7< HESRTER (IRA75RRAN) Z-Zha Recommended P.C.B layout _ (Connector side) Z-Z Section e-l.e dia. 2-0.8 dia. MtESRR (1, 10, 11, 20) Pos. # 7 ? | K-WEFOY af TTHVK st 0 3 2 / <t To Hold down Brass Tin plating 4 AyYADs Hae #18 | UDTUUEOUE ie cO0 A Contact Copper alloy See note #1 UL9AV-0 11.4 A 1 ken PAST (GF) | i A Insulator Black #Y-7 am | Gia | eRe z ellas|s8 8a & | # x lal ep 2 s Trade mark LTR.| DATE] BY REV. DESCRIPT No. PART NAME MATERIAL |QTY FINISH NOTE * A B DATE |R SCALE| # & UNIT!) 3 & & KeBET_L##ER 2 Sk 08.31 (2010) 3/1 mm (INCH) |3RD. A. P HONDA TSUSHIN KOGYO CO., LTD. ARB s ale t/t ale a/x eg Be | ean ae ET ee shen) DR. DE. CHK. CHK. APP. NAME .omm pltch stacking receptacle connector S A & a 9 we 5 z (SMT _type) Stack height: 24.7mm RoHS) gee A RoHS comp Li ant ]} yo] wr] (a | oe PART No. | QZAC-A2OFY-247+ #1. 3157 }eOE Note ID= Q@ZAC-A20FY-247+ BO