STB12NM50FD - STB12NM50FD-1 STP12NM50FD/FP - STW14NM50FD N-channel 500V - 0.32 - 12A - TO-220/FP - D2/I2PAK - TO-247 FDmeshTM Power MOSFET (with fast diode) General features Type VDSS RDS(on) ID Pw STB12NM50FD 500V <0.4 12A 160W STB12NM50FD-1 500V <0.4 12A 160W STP12NM50FD 500V <0.4 12A 160W STP12NM50FDFP 500V <0.4 12A 35W STW14NM50FD 500V <0.4 12A 160W 100% avalanche tested High dv/dt and avalanche capabilities Low input capacitance and gate charge Low gate input resistance Tight process control and high manufacturing yields Description 3 1 3 2 1 TO-220 2 TO-220FP 3 1 DPAK DPAK TO-247 r P e t le uc od ) s t( 3 12 IPAK Internal schematic diagram o s b O - The FDmeshTM associates all advantages of reduced on-resistance and fast switching with an intrinsic fast-recovery body diode. It is therefore strongly recommended for bridge topologies, in particular ZVS phase-shift converters. Applications ) s ( ct u d o r P e Switching application t e l Orderocodes s b O Part number Marking Package Packaging STB12NM50FD B12NM50FD DPAK Tape & reel STB12NM50FD-1 B12NM50FD IPAK Tube STP12NM50FD P12NM50FD TO-220 Tube STP12NM50FDFP P12NM50FDFP TO-220FP Tube STW14NM50FD W14NM50FD TO-247 Tube May 2006 Rev 3 1/18 www.st.com 18 Contents STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Electrical characteristics (curves) ............................ 6 3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 c u d e t le ) s ( ct u d o r P e t e l o s b O 2/18 o s b O - o r P ) s t( STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Value Symbol Parameter Unit TO-220/ TO-220FP D/IPAK VDS VDGR VGS TO-247 Drain-source voltage (VGS = 0) 500 V Drain-gate voltage (RGS = 20K) 500 V Gate-source voltage 30 V ID Drain current (continuous) at TC = 25C 12 12(1) 14 A ID Drain current (continuous) at TC=100C 7.5 7.5(1) 8.8 A Drain current (pulsed) 48 48 (1) 56 A Total dissipation at TC = 25C 160 35 160 W Derating factor 1.28 0.28 IDM (2) PTOT dv/dt(3) Peak diode recovery voltage slope VISO Insulation withstand voltage (DC) TJ Tstg 20 -- Operating junction temperature Storage temperature od -- -65 to 150 o s b O - 2. Pulse width limited by safe operating area 1.4 2500 e t le 1. Limited only by maximum temperature allowed Pr uc ) s t( W/C V/ns V C 3. ISD 12A, di/dt 400A/s, VDD =80%V(BR)DSS Table 2. Thermal resistance Symbol c u d (t s) Parameter o r P e TO-220 IPAK Rthj-case Thermal resistance junction-case Max Rthj-a t e l o O bs Tl Table 3. Symbol Thermal resistance junction-ambient Max Value Unit DPAK TO-220FP TO-247 0.78 62.5 Maximum lead temperature for soldering purpose 3.57 100 0.77 62.5 300 C/W C/W C Avalanche data Parameter IAR Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) EAS Single pulse avalanche energy (starting Tj=25C, Id=Iar, Vdd=50V) Value Unit 6 A 400 mJ 3/18 Electrical characteristics 2 STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Electrical characteristics (TCASE=25C unless otherwise specified) Table 4. Symbol V(BR)DSS On/off states Parameter Drain-source breakdown voltage Test condictions ID = 1mA, VGS= 0 Zero gate voltage drain current (VGS = 0) IGSS Gate body leakage current (VDS = 0) VGS = 30V VGS(th) Gate threshold voltage VDS= VGS, ID = 250A RDS(on) Static drain-source on resistance VGS= 10V, ID= 6A Symbol gfs (1) Ciss Coss Crss Qg Test condictions Forward transconductance VDS =15V, ID = 6A Input capacitance Output capacitance Reverse transfer capacitance VDS =25V, f=1 MHz, VGS=0 Qgd RG Gate input resistance d o r P e uc (t s) e t le o s b O - VDD=400V, ID = 3A VGS =10V (see Figure 11) f=1 MHz Gate DC Bias= 0 test signal level = 20mV open drain 1. Pulsed: pulse duration=300s, duty cycle 1.5% t e l o s b O 4/18 3 1 10 A A 100 nA 4 5 V 0.32 0.4 c u d o r P Min. Unit V VDS = Max rating @125C Parameter Max. 500 Dynamic Total gate charge Gate-source charge Gate-drain charge Qgs Typ. VDS = Max rating, IDSS Table 5. Min. Typ. ) s t( Max. Unit 9.8 S 1000 390 20 pF pF pF 12 3 7 nC nC nC 2 STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Table 6. Switching times Symbol td(on) tr tr(Voff) tf tc Table 7. Electrical characteristics Parameter Test Condictions Min. Typ. VDD=250 V, ID= 6A, Turn-on delay time Rise time RG=4.7, VGS=10V (see Figure 17) VDD=400 V, ID= 12A, Off-voltage rise time Fall time Cross-over time RG=4.7, VGS=10V (see Figure 17) Max. Unit 19 10 ns ns 39 18 29 ns ns ns Source drain diode Symbol Max Unit Source-drain current 12 A ISDM(1) Source-drain current (pulsed) 48 A VSD(2) Forward on voltage ISD=12A, VGS=0 Reverse recovery time Reverse recovery charge Reverse recovery current ISD=12A, Tj=25C ISD trr Qrr IRRM trr Qrr IRRM Parameter Test condictions Min di/dt = 100A/s, VDD=30V, (see Figure 22) uc 140 800 11 d o r P e let ISD=12A, Tj=150C ) s t( 1.5 di/dt = 100A/s, VDD=30V, (see Figure 22) Reverse recovery time Reverse recovery charge Reverse recovery current Typ. 252 1890 15 V ns nC A ns nC A o s b O - 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5% ) s ( ct u d o r P e t e l o s b O 5/18 Electrical characteristics STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD 2.1 Electrical characteristics (curves) Figure 1. Safe operating area for TO-220/ DPAK/IPAK Figure 2. Thermal impedance for TO-220/ DPAK/IPAK Figure 3. Safe operating areafor TO-220FP Figure 4. Thermal impedance for TO-220FP c u d e t le Figure 5. ) s ( ct o r P e t e l o s b O 6/18 du Safe operating area for TO-247 ) s t( o r P o s b O Figure 6. Thermal impedance for TO-247 STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Electrical characteristics Figure 7. Output characterisics Figure 8. Transfer characteristics Figure 9. Transconductance Figure 10. Static drain-source on resistance c u d e t le ) s ( ct ) s t( o r P o s b O - Figure 11. Gate charge vs gate-source voltage Figure 12. Capacitance variations u d o r P e t e l o s b O 7/18 Electrical characteristics STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Figure 13. Normalized gate threshold voltage vs temperature Figure 14. Normalized on resistance vs temperature Figure 15. Source-drain diode forward characteristics Figure 16. Normalized BVDSS vs temperature c u d e t le ) s ( ct u d o r P e t e l o s b O 8/18 o s b O - o r P ) s t( STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD 3 Test circuit Test circuit Figure 17. Switching times test circuit for resistive load Figure 18. Gate charge test circuit c u d ) s t( Figure 19. Test circuit for inductive load Figure 20. Unclamped inductive load test switching and diode recovery times circuit e t le ) s ( ct u d o Figure 21. Unclamped inductive waveform r P e o r P o s b O - Figure 22. Switching time waveform t e l o s b O 9/18 Package mechanical data 4 STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at : www.st.com c u d e t le ) s ( ct u d o r P e t e l o s b O 10/18 o s b O - o r P ) s t( STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Package mechanical data TO-220 MECHANICAL DATA mm. DIM. MIN. TYP inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 ) s t( H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 L20 L30 d o r 0.645 28.90 1.137 oP 3.75 3.85 Q 2.65 2.95 ) s ( ct 0.147 P e let 0.104 uc 0.154 16.40 0.151 0.116 o s b O - u d o r P e t e l o s b O 11/18 Package mechanical data STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD TO-247 MECHANICAL DATA mm. DIM. MIN. TYP inch MAX. MIN. 4.85 5.15 0.19 0.20 A1 2.20 2.60 0.086 0.102 b 1.0 1.40 0.039 0.055 b1 2.0 2.40 0.079 0.094 0.134 b2 3.0 3.40 0.118 c 0.40 0.80 0.015 0.03 D 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 5.45 ) s t( L 14.20 14.80 0.560 0.582 3.70 4.30 0.14 0.17 18.50 3.55 3.65 0.140 oR 4.50 5.50 0.177 5.50 u d o r P e 0.143 o r P 0.216 e t le ) s ( ct c u d 0.728 oP S 12/18 0.620 0.214 L1 L2 s b O MAX. A e t e l o TYP. o s b O - 0.216 STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MAX. MIN. A MIN. 4.4 TYP 4.6 0.173 TYP. 0.181 MAX. A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 10.4 0.393 4.88 5.28 0.192 D1 8 E 10 E1 0.315 8.5 G L 15 15.85 0.590 L2 1.27 1.4 0.050 L3 1.4 1.75 M 2.4 3.2 R 0 so 0.208 0.625 0.055 0.068 0.126 0.015 b O 4 ) s ( ct e t le 0.055 o r P 0.094 0.4 V2 c u d 0.334 ) s t( u d o s b O t e l o 3 r P e 1 13/18 Package mechanical data STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD TO-220FP MECHANICAL DATA mm. DIM. MIN. A 4.4 inch TYP MAX. MIN. TYP. 4.6 0.173 0.181 MAX. 0.106 B 2.5 2.7 0.098 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 16 0.630 L3 28.6 30.6 1.126 L4 9.8 10.6 .0385 2.9 3.6 L6 15.9 16.4 L7 9 9.3 O 3 3.2 1.204 0.114 r P e t le 0.626 0.354 od 0.141 0.645 0.366 0.118 o s b O - 0.126 s b O 14/18 G G1 F F2 t e l o L7 H o r P e du L3 L6 F1 B ) s ( ct L2 L5 ) s t( 0.417 D A L5 uc E L2 1 2 3 L4 STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Package mechanical data TO-262 (I2PAK) MECHANICAL DATA mm. inch DIM. MAX. MIN. A 4.40 MIN. TYP 4.60 0.173 TYP. MAX. A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 0.181 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 L2 1.27 1.40 0.050 uc ) s t( 0.154 d o r 0.055 P e let ) s ( ct o s b O - u d o r P e t e l o s b O 15/18 Packaging mechanical data 5 STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT c u d REEL MECHANICAL DATA DIM. mm MIN. A ro MAX. 330 P e let B 1.5 C 12.8 D 20.2 G 24.4 N 100 o s b O - T TAPE MECHANICAL DATA mm DIM. MAX. MIN. 10.5 10.7 0.413 0.421 B0 15.7 15.9 D 1.5 1.6 0.059 0.063 1.59 1.61 0.062 0.063 1.65 1.85 0.065 0.073 11.4 11.6 0.449 0.456 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 K0 MAX. od r P e t e l o F 0.618 0.626 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 * on sales type 16/18 t c u MIN. E O (s) A0 D1 bs inch 0.933 0.956 inch MIN. MAX. 12.992 0.059 13.2 0.504 0.520 26.4 0.960 1.039 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 ) s t( STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD 6 Revision history Revision history Table 8. Revision history Date Revision 03-May-2006 3 Changes New template c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 17/18 STB12NM50FD/-1 - STP12NM50FD/FP - STW14NM50FD Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. c u d All ST products are sold pursuant to ST's terms and conditions of sale. ) s t( Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. o r P No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. e t le o s b O - UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ) s ( ct UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. u d o Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. r P e t e l o s b O ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 18/18