SMD INDUCTORS MODEL NO. : SMI-60 SERIES FEATURES: * SUPERIOR QUALITY FROM AN AUTOMATED PRODUCTION LINE. * PICK AND PLACE COMPATIBLE. * TAPE AND REEL PACKING. APPLICATION : * NOTEBOOK COMPUTERS, *DC-DC CONVERTORS. DC-AC INVERTERS. * SIGNAL CONDITIONING * CELLULAR TELEPHONES *FILTERING. "HYBRIDS PAGERS. PDA. ELECTRICAL SPECIFICATION: PHYSICAL DIMENSION : (UNIT: mm) L DCR RATED OG arena MAX CURRENT (uH) (OHMS) ima) SMi-80-3R3 3.3 0.065 1000 SM-BIHIRT 47 QOS 1000 es re: SM-60-6R8 G8 oz 750 : I SMI-60-100 10 0.16 a00 ys J SMI-60-120 2 0.21 500 i SMI-60-150 15 0.23 500 I, SMI-60-180 18 G.30 450 SMI-80-220 22 0.35 400 SMI-60-270 27 0.50 g00 SMI-60-330 33 0.60 260 ie SMI-60-390 39 0.63 250 pa SM4-60-470 47 0.74 250 4 SMI-60-560 56 0.95 200 |- i | SMi-60-680 68 4.0 200 SNi-f0-A20 82 15 200 _ SMI-60-104 100 1.5 1a0 4 , 4 SMI-60-121 420 1.8 180 of ise gue SMI-60-451 150_ 22 450 a os: SMI-60-184 80 23 450 | ~b gas . ~~ Ee SMI-G0-224 220 33 130 = SMI-GO-27 1 270 3.8 120 29. 4H-1600uH 3.3uH-18uH SMI-80-331 330 4.8 100 SM-S0-471 70 B.3 50) TOLERSNCE t/- 0.3 SNM 1-80-681 640 10,5 60 SNMI-50-821 B20 115 AO SMi-80-102 1000 15 50 NOTE({: TEST FREQUENCY: 100KHz.1 VRMS. NOTE(2)-3.9UH-6.8uH +20%, 10uH1000uH 210%.PACKING Tape and Ree! Orientation os D \\ \ COVER TAPE Nad => oa CARRIER TAPE } | oS ii} i EMBOSSED CAVITY USER DIRECTION OF FEED / LABEL AREA NOTE : Top view shown with cover tape removed. TAPE WIDTH REEL WIBTH COMPONENT PITCH UNITS PER REEL 16mm 224mm 8mm 2500 TAPE SPECIFICATIONS: Carrier Tape Type : Gonductive, Cover Tape Type > Antistater: Gover Tape Adhesion to Cariar : 10 - 70 grams, REEL SPECIFICATIONS: Diameter (Hange! : 13 (330.2mm) STANDARDS | Al embossed carrier tape packaging wil be accomplished In compkance with latest revision of EL4-481 Taping of surface Mount Camponerts for Automatic Placement. ENVIRONMENTAL PERFORMANCE ITEM TEST CONDITION }One cycle shall consist of: 1 |Tharmal Shock |(1) 30minutes at termperenure -30C (2) 15 seconds maximum al roon ambient. (3) 30 minutes et temperature +85C (4) 15 seconds maximum at room amblant. Subject samples to 10 cycles, Test per applicable devices specification afier a 4 hours stabilization al room ambient. |Vibration Inductance deviation within 3.0% alter vibration far 1 Pour. in each of thrae orentations st sweap vibration (10-50-10Hz) wth 1.5mm P-P amplitude. 3. |Solderability Solder pot at 230C45C, with Kester 1544 solder flux. Dip parts into salder pot containing 63/37 moken alloy for Sgecond+1 second. Wetting must ocour on a minimum of 90% of the terminations. 4 |Oparating -26C = #80C ( cof contain heat) Temperature 5 |Rumidity Inductance deviation withints.0% Aftar 96 hour in 30-95% relative humidity at 4022Cand 1 hour drying under normal canditien, 6& |Mechanical One-half sine pulse (8700 g's for 0.3 milliseconds) in each direction slong 3 mutually perpendicular axes in each direction (total of shocks). |Shock