© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 5 1Publication Order Number:
MMBT2369LT1/D
MMBT2369LT1,
MMBT2369ALT1
MMBT2369ALT1 is a Preferred Device
Switching Transistors
NPN Silicon
Features
Pb−Free Packages are Available
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage VCEO 15 Vdc
CollectorEmitter Voltage VCES 40 Vdc
CollectorBase Voltage VCBO 40 Vdc
EmitterBase Voltage VEBO 4.5 Vdc
Collector Current − Continuous IC200 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board
(Note 1) TA = 25°C
Derate above 25°C
PD225
1.8 mW
mW/°C
Thermal Res istance, Junction−to−Ambient RqJA 556 °C/W
Total Device Dissipation Alumina
Substrate, (Note 2) TA = 25°C
Derate above 25°C
PD300
2.4 mW
mW/°C
Thermal Res istance, Junction−to−Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg 55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
Device Package Shipping
ORDERING INFORMATION
MMBT2369LT1 SOT−23 3000/Tape & Ree
l
Preferred devices are recommended choices for future use
and best overall value.
MARKING DIAGRAMS
COLLECTOR
3
1
BASE
2
EMITTER
MMBT2369ALT1 SOT−23 3000/Tape & Ree
l
http://onsemi.com
xxx = M1J or 1JA
M = Date Code*
G= Pb−Free Package
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
(Note: Microdot may be in either location)
MMBT2369ALT1G SOT−23
(Pb−Free) 3000/Tape & Ree
l
MMBT2369LT1G SOT−23
(Pb−Free) 3000/Tape & Ree
l
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
SOT−23
CASE 318
STYLE 6
1
2
1
3
xxx M G
G
MMBT2369LT1, MMBT2369ALT1
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (Note 3)
(IC = 10 mAdc, IB = 0) V(BR)CEO 15 Vdc
CollectorEmitter Breakdown Voltage
(IC = 10 mAdc, VBE = 0) V(BR)CES 40 Vdc
CollectorBase Breakdown Voltage
(IC = 10 mAdc, IE = 0) V(BR)CBO 40 Vdc
EmitterBase Breakdown Voltage
(IE = 10 mAdc, IC = 0) V(BR)EBO 4.5 Vdc
Collector Cutoff Current
(VCB = 20 Vdc, IE = 0)
(VCB = 20 Vdc, IE = 0, TA = 150°C)
ICBO
0.4
30
mAdc
Collector Cutoff Current
(VCE = 20 Vdc, VBE = 0) MMBT2369A ICES 0.4 mAdc
ON CHARACTERISTICS
DC Current Gain (Note 3)
(IC = 10 mAdc, VCE = 1.0 Vdc) MMBT2369
(IC = 10 mAdc, VCE = 1.0 Vdc) MMBT2369A
(IC = 10 mAdc, VCE = 0.35 Vdc) MMBT2369A
(IC = 10 mAdc, VCE = 0.35 Vdc, TA = −55°C) MMBT2369A
(IC = 30 mAdc, VCE = 0.4 Vdc) MMBT2369A
(IC = 100 mAdc, VCE = 2.0 Vdc) MMBT2369
(IC = 100 mAdc, VCE = 1.0 Vdc) MMBT2369A
hFE 40
40
20
30
20
20
120
120
CollectorEmitter Saturation Voltage (Note 3)
(IC = 10 mAdc, IB = 1.0 mAdc) MMBT2369
(IC = 10 mAdc, IB = 1.0 mAdc) MMBT2369A
(IC = 10 mAdc, IB = 1.0 mAdc, TA = +125°C) MMBT2369A
(IC = 30 mAdc, IB = 3.0 mAdc) MMBT2369A
(IC = 100 mAdc, IB = 10 mAdc) MMBT2369A
VCE(sat)
0.25
0.20
0.30
0.25
0.50
Vdc
BaseEmitter Saturation Voltage (Note 3)
(IC = 10 mAdc, IB = 1.0 mAdc) MMBT2369A
(IC = 10 mAdc, IB = 1.0 mAdc, TA = −55°C) MMBT2369A
(IC = 30 mAdc, IB = 3.0 mAdc) MMBT2369A
(IC = 100 mAdc, IB = 10 mAdc) MMBT2369A
VBE(sat) 0.7
0.85
1.02
1.15
1.60
Vdc
SMALL−SIGNAL CHARACTERISTICS
Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz) Cobo 4.0 pF
Small Signal CurrentGain
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz) hfe 5.0
SWITCHING CHARACTERISTICS
Storage Time
(IB1 = IB2 = IC = 10 mAdc) ts 5.0 13 ns
Turn−On Time
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc) ton 8.0 12 ns
Turn−Off Time
(VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = 3.0 mAdc, IB2 = 1.5 mAdc) toff 10 18 ns
3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
MMBT2369LT1, MMBT2369ALT1
http://onsemi.com
3
Figure 1. ton Circuit − 10 mA Figure 2. toff Circuit − 10 mA
+10.6 V
−1.5 V
0
t1
< 1 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2%
3 V 270 W
3.3 k Cs* < 4 pF
+10.75 V
0
−9.15 V
t1
< 1 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2%
270 W
3.3 k Cs* < 4 pF
*Total shunt capacitance of test jig and connectors.
Figure 3. ton Circuit − 100 mA Figure 4. toff Circuit − 100 mA
10 V 95 W
1 k Cs* < 12 pF
+10.8 V
−2 V 0
t1
< 1 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2%
< 1 ns
−8.6 V
+11.4 V t1
0
PULSE WIDTH (t1) BETWEEN
10 AND 500 ms
DUTY CYCLE = 2%
95 W
1 k Cs* < 12 pF
10 V
1N916
*Total shunt capacitance of test jig and connectors.
Figure 5. Turn−On and Turn−Off Time Test Circuit
Vout 90%
10%
Vin
0
ton
Vin
3.3 kW
50 W
220 W
50 W
0.1 mF
Vout
3.3 k
0.0023 mF 0.0023 mF
0.005 mF 0.005 mF
0.1 mF 0.1 mF
VBB +
+
VCC = 3 V
Vin
0
90%
10%
toff
Vout
VBB = +12 V
Vin = −15 V
TO OSCILLOSCOPE
INPUT IMPEDANCE = 50 W
RISE TIME = 1 ns
TURN−OFF WAVEFORMS
PULSE GENERATOR
Vin RISE TIME < 1 ns
SOURCE IMPEDANCE = 50 W
PW 300 ns
DUTY CYCLE < 2%
TURN−ON WAVEFORMS
MMBT2369LT1, MMBT2369ALT1
http://onsemi.com
4
6
5
4
3
2
1
100.1 0.2 0.5 1.0 2.0 5.0
REVERSE BIAS (VOLTS)
CAPACITANCE (pF)
SWITCHING TIMES (nsec)
LIMIT
TYPICAL
Cob
Cib
TJ = 25°C
Figure 6. Junction Capacitance Variations
100
2
5
10
20
50
1 2 5 10 20 50 100
IC, COLLECTOR CURRENT (mA)
Figure 7. Typical Switching Times
βF = 10
VCC = 10 V
VOB = 2 V
tr (VCC = 3 V)
VCC = 10 V
td
ts
tr
tf
+6 V
−4 V
0
t1
< 1 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2%
10 V 980
500 Cs* < 3 pF
C COPT
TIME
C < COPT C = 0
Figure 8. Turn−Off Waveform Figure 9. Storage Time Equivalent Test Circuit
MMBT2369LT1, MMBT2369ALT1
http://onsemi.com
5
VCE, MAXIMUM COLLECTOR−EMITTER VOLTAGE (VOLTS
)
1.0
0.8
0.6
0.4
0.2
0.02 0.05 0.1 0.2 0.5 1 2 5 10 20
IC = 3 mA IC = 10 mA IC = 30 mA IC = 50 mA IC = 100 mA
TJ = 25°C
IB, BASE CURRENT (mA)
Figure 10. Maximum Collector Saturation Voltage Characteristics
hFE, MINIMUM DC CURRENT GAIN
V(sat), SATURATION VOLTAGE (VOLTS)
200
100
20
50
12 51020 50100
IC, COLLECTOR CURRENT (mA)
Figure 11. Minimum Current Gain Characteristics
VCE = 1 V
TJ = 125°C
75°C
25°C
−15°C
−55°C
TJ = 25°C and 75°C
1.4
1.2
1.0
0.8
0.6
0.4
0.2 12 51020 50100
IC, COLLECTOR CURRENT (mA)
Figure 12. Saturation Voltage Limits
βF = 10
TJ = 25°C
MAX VBE(sat)
MIN VBE(sat)
MAX VCE(sat)
MMBT2369LT1, MMBT2369ALT1
http://onsemi.com
6
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
ǒmm
inchesǓ
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
SOLDERING FOOTPRINT*
VIEW C
L
0.25
L1
q
e
EE
b
A
SEE VIEW C
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.37 0.44 0.50 0.015
c0.09 0.13 0.18 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
H
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
2.10 2.40 2.64 0.083 0.094 0.104
HE0.35 0.54 0.69 0.014 0.021 0.029
c
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MMBT2369LT1/D
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