5962-0325002VXC - Atmel Corporation

4155I–AERO–06/06

Features

•SRAM based FPGA Dedicated to Space Use

•SEE Hardened Cells (configuration RAM, FreeRAM, DFF, JTAG, I/O buffers) Remove the

need for Triple Modular Redundancy (TMR)

•Produced on Rad Hard 0.35µm CMOS Process

•Functionally and Pin Compatible with the Atmel Commercial and Military AT40K Series

•High Performance

– 46K Available ASIC gates (50% typ. routable)

– 60 MHz Internal Performance

– 20 MHz System Performance

– 30 MHz Array Multipliers

– 18 ns FreeRAM™ access time

– Internal Tri-state Capability in Each Cell

•FreeRAM

– 18432 Bits of Distributed SRAM Independent of Logic Cells

– Flexible, Single/Dual Port, Synchronous/Asynchronous 32x4 RAM blocks

•8 Global Clocks and 4 Additional Dedicated PCI Clocks

– Fast, Low Skew Clock Distribution

– Programmable Rising/Falling Edge Transitions

– Distributed Clock Shutdown Capability for Low Power Management

•Global Reset Option

•384 PCI Compliant I/Os

– Programmable Output Drive

– Fast, Flexible Array Access Facilitates Pin Locking

•Package Options

– MQFPF160

– MQFPF256

•Design Software (System Designer)

– Combination of Atmel internally developed tools, and industry standard design

tools

– Fast and Efficient Synthesis

– Efficient Integration (Libraries, Interface, Full Back-annotation)

– Over 75 Automatic Component Generators Create Thousands

of Speed and Area Optimized Logic and RAM Functions

– Automatic/Interactive Multi-chip Partitioning

•Supply Voltage 3.3V

•AT40KFL040 is a 5V Tolerant Version

•No Single Event Latch-up below a LET Threshold of 70 MeV/mg/cm2

•Tested up to a Total Dose of 300 krads (Si) according to MIL STD 883 Method 1019

•Quality Grades

– QML -Q and -V with SMD 5962-03250

– ESCC with 9304/008

•Design Kit (AT40KEL-DK) Including:

– A Board with the RH FPGA (MQFPF160 or MQFPF256)

– A configuration memory (AT17 Atmel EEPROM)

– Design software and documentation

– ISP cable and software

•Easy Migration to Atmel Gate Arrays for High Volume Production

Note: All features and characteristics described for

AT40KEL040 in this document, also apply to the

AT40KFL040 unless specified otherwise.

Rad Hard

Reprogrammable

FPGAs with

FreeRAM

AT40KEL040

AT40KFL040

2AT40KEL040

4155I–AERO–06/06

***

Description The AT40KEL040 is a fully PCI-compliant, SRAM-based FPGA with distributed 18 ns

programmable synchronous/asynchronous, dual port/single port SRAM, 8 global clocks,

Cache Logic ability (partially or fully reconfigurable without loss of data), automatic com-

ponent generators, and 46,000 ASIC gates. I/O counts range from 129 to 384 in Aero-

space standard packages and support 3.3V.

The AT40KFL040 is a 5V tolerant version.

The AT40KEL040 is designed to quickly implement high performance, large gate count

designs through the use of synthesis and schematic-based tools used Windows® /

Linux® platform. Atmel’s design tools provide easy integration with industry standard

tools such as Synplicity, Modelsim and Leonardo Spectrum/Precision Synthesis. See

the IDS datasheet for other supported tools.

The AT40KEL040 can be used as a co-processor for high-speed (DSP/processor-

based) designs by implementing a variety of compute-intensive, arithmetic functions.

These include adaptive finite impulse response (FIR) filters, Fast Fourier Transforms

(FFT), convolvers, interpolators and discrete-cosine transforms (DCT) that are required

for video compression and decompression, encryption, convolution and other multime-

dia applications.

Fast, Flexible and

Efficient SRAM

The AT40KEL040 FPGA offers a patented distributed 18 ns SRAM capability where the

RAM can be used without losing logic resources. Multiple independent, synchronous or

asynchronous, dual port or single port RAM functions (FIFO, scratch pad, etc.) can be

created using Atmel’s macro generator tool.

Fast, Efficient Array and

Vector Multipliers

The AT40KEL040’s patented 8-sided core cell with direct horizontal, vertical and diago-

nal cell-to-cell connections implements ultra fast array multipliers without using any bus-

ing resources. The AT40KEL040’s Cache Logic capability enables a large number of

design coefficients and variables to be implemented in a very small amount of silicon,

enabling vast improvement in system speed at much lower cost than conventional

FPGAs.

Cache Logic Design The AT40KEL040 is capable of implementing Cache Logic (Dynamic full/partial logic

reconfiguration, without loss of data, on-the-fly) for building adaptive logic and systems.

As new logic functions are required, they can be loaded into the logic cache without los-

ing the data already there or disrupting the operation of the rest of the chip; replacing or

complementing the active logic. The AT40KEL040 can act as a reconfigurable co-pro-

cessor.

Automatic Component

Generators

The AT40KEL040 FPGA family is capable of implementing user-defined, automatically

generated, macros in multiple designs; speed and functionality are unaffected by the

macro orientation or density of the target device. This enables the fastest, most predict-

able and efficient FPGA design approach and minimizes design risk by reusing already

Table 1. AT40KEL040

Device AT40KEL040

Available ASIC Gates (50% typ. routable) 46K

Rows x Columns 48 x 48

Core Cells 2,304

Registers 3,056

RAM Bits 18,432

I/O (max) 384

AT40KEL040

4155I–AERO–06/06

proven functions. The Automatic Component Generators work seamlessly with industry-

standard schematic and synthesis tools to create the fastest, most efficient designs

available.

The patented AT40KEL040 series architecture employs a symmetrical grid of small yet

powerful cells connected to a flexible busing network. Independently controlled clocks

and resets govern every column of cells. The array is surrounded by programmable I/O.

Devices offer 46,000 usable ASIC gates, and have 3,056 registers. AT40K series

FPGAs utilize a reliable 0.35µm single-poly, 4-metal CMOS process and are 100% fac-

tory-tested. Atmel’s PC- and workstation-based integrated development system (IDS) is

used to create AT40KEL040 series designs. Multiple design entry methods are sup-

ported.

The Atmel architecture was developed to provide the highest levels of performance,

functional density and design flexibility in an FPGA. The cells in the Atmel array are

small, efficient and can implement any pair of Boolean functions of (the same) three

inputs or any single Boolean function of four inputs. The cell’s small size leads to arrays

with large numbers of cells, greatly multiplying the functionality in each cell. A simple,

high-speed busing network provides fast, efficient communication over medium and

long distances.

AT40KEL040

Configurator

Statistics extracted from configuration bitstreams show that the maximum needed size

is 1Mbit.

In order to keep the maximum number of pins assigned to signals, it is recommended to

use a serial configuration interface.

This is the reason why Atmel proposes a 1Mbit serial EEPROM for configuring the

AT40KEL040, the AT17LV010-10DP which is also a 3.3V bias chip. It is packaged into a

28-pin DIL Flat Pack 400mils wide.

This memory has been tested for total dose under bias and unbiased conditions, exhib-

iting far better results when unbiased; this is the reason why it is recommended to switch

off the memory when it is not in the configuration mode.

In addition, heavy ions tests have shown that the data stored in the memory cells are not

corrupted eventhough errors may be detected while downloading the bitstream; this is

the result of the data serialization from the parallel memory plan; therefore, it is recom-

mended to use the FPGA CRC while configuring it, and to resume the configuration

when an error is detected.

4AT40KEL040

4155I–AERO–06/06

The Symmetrical

Array

At the heart of the Atmel architecture is a symmetrical array of identical cells (Figure 1).

The array is continuous from one edge to the other, except for bus repeaters spaced

every four cells (Figure 2 on page 5). At the intersection of each repeater row and col-

umn is a 32 x 4 RAM block accessible by adjacent buses. The RAM can be configured

as either a single-ported or dual-ported RAM(1), with either synchronous or asynchro-

nous operation.

Note: 1. The right-most column can only be used as single-port RAM.

Figure 1. Symmetrical Array Surrounded by I/O

Note: AT40K has registered I/Os. Group enable every sector for tri-states on obuf’s.

= I/O Pad

= AT40K Cell

= Repeater Row

= Repeater Column

= FreeRAM

AT40KEL040

4155I–AERO–06/06

Figure 2. Floorplan (Representative Portion)(1)

Note: 1. Repeaters regenerate signals and can connect any bus to any other bus (all path-

ways are legal) on the same plane. Each repeater has connections to two adjacent

local-bus segments and two express-bus segments. This is done automatically using

the integrated development system (IDS) tool.

RV RV RV RV RV RV RV RV RV RV RV RV

= Core Cell

RAM RAM

RAM RAM RAM

RAM RAM

RAM

RAM RAM

RAM

RAM RAM

6AT40KEL040

4155I–AERO–06/06

The Busing Network Figure 3 on page 7 depicts one of five identical busing planes. Each plane has three bus

resources: a local-bus resource (the middle bus) and two express-bus (both sides)

resources. Bus resources are connected via repeaters. Each repeater has connections

to two adjacent local-bus segments and two express-bus segments. Each local-bus

segment spans four cells and connects to consecutive repeaters. Each express-bus

segment spans eight cells and “leapfrogs” or bypasses a repeater. Repeaters regener-

ate signals and can connect any bus to any other bus (all pathways are legal) on the

same plane. Although not shown, a local bus can bypass a repeater via a programma-

ble pass gate allowing long on-chip tri-state buses to be created. Local/Local turns are

implemented through pass gates in the cell-bus interface (see following page).

Express/Express turns are implemented through separate pass gates distributed

throughout the array.

Some of the bus resource on the AT40KEL040 is used as a dual-function resource.

Table 2 shows which buses are used in a dual-function mode and which bus plane is

used. The AT40KEL040 software tools are designed to accommodate dual-function

buses in an efficient manner.

Table 2. Dual-function Buses

Function Type Plane(s) Direction Comments

Cell Output Enable Local 5 Horizontal and

Vertical

RAM Output Enable Express 2 Vertical Bus full length at array edge

Bus in first column to left of RAM block

RAM Write Enable Express 1 Vertical Bus full length at array edge

Bus in first column to left of RAM block

RAM Address Express 1 - 5 Vertical Buses full length at array edge

Buses in second column to left of RAM block

RAM Data In Local 1 Horizontal

RAM Data Out Local 2 Horizontal

Clocking Express 4 Vertical Bus half length at array edge

Set/Reset Express 5 Vertical Bus half length at array edge

AT40KEL040

4155I–AERO–06/06

Figure 3. Busing Plane (One of Five)

= Local/Local or Express/Express Turn Point

= AT40K/40KAL

= Row Repeater

= Column

Express

bus Local

bus

Express

bus

AT40KEL040

8AT40KEL040

4155I–AERO–06/06

Cell Connections Figure 4(a) depicts direct connections between a cell and its eight nearest neighbors.

Figure 4(b) shows the connections between a cell and five horizontal local buses (1 per

busing plane) and five vertical local buses (1 per busing plane).

Figure 4. Cell Connections

CEL CEL

CEL CEL CEL

CEL CEL

CEL

(a) Cell-to-cell Connections (b) Cell-to-bus Connections

WXYZL

Orthogonal

direct connect

Diagonal

direct connect





















Horizontal

busing plane

Vertical

busing plane































plane 5

plane 4

plane 3

plane 2

plane 1































plane 5

plane 4

plane 3

plane 2

plane 1

AT40KEL040

4155I–AERO–06/06

The Cell Figure 5 depicts the AT40KEL040 cell. Configuration bits for separate muxes and pass

gates are independent. All permutations of programmable muxes and pass gates are

legal. Vn (V1-V

5) is connected to the vertical local bus in plane n. Hn (H1-H

5) is con-

nected to the horizontal local bus in plane n. A local/local turn in plane n is achieved by

turning on the two pass gates connected to Vn and Hn. Pass gates are opened to let sig-

nals into the cell from a local bus or to drive a signal out onto a local bus. Signals coming

into the logic cell on one local bus plane can be switched onto another plane by opening

two of the pass gates. This allows bus signals to switch planes to achieve greater

routability. Up to five simultaneous local/local turns are possible.

The AT40KEL040 FPGA core cell is a highly configurable logic block based around two

3-input LUTs (8 x 1 ROM), which can be combined to produce one 4-input LUT. This

means that any core cell can implement two functions of 3 inputs or one function of 4

inputs. There is a Set/Reset D flip-flop in every cell, the output of which may be tri-stated

and fed back internally within the core cell. There is also a 2-to-1 multiplexer in every

cell, and an upstream AND gate in the “front end” of the cell. This AND gate is an impor-

tant feature in the implementation of efficient array multipliers.

Figure 5. The Cell

With this functionality in each core cell, the core cell can be configured in several

“modes”. The core cell flexibility makes the AT40KEL040 architecture well suited to

most digital design application areas (see Figure 6).

OUT OUT

RESET/SET

CLOCK

"1" NW NE SE SW "1"

"1"

"1""0"

XWY

XZWY

"1" N E S W

8X1 LUT 8X1 LUT

NW NE SE SW N E S W

"1" OE

Pass gates

X = Diagonal Direct connect or Bus

Y = Orthogonal Direct Connector Bus

W = Bus Connection

Z = Bus Connection

FB = Internal Feed back

10 AT40KEL040

4155I–AERO–06/06

Figure 6. Some Single Cell Modes

LUTLUTLUTLUT LUT2:1 MUX LUTLUT

Q (Registered)

Synthesis Mode. This mode is particularly important for

the use of VHDL design. VHDL Synthesis tools generally

will produce as their output large amounts of random logic

functions. Having a 4-input LUT structure gives efficient

random logic optimization without the delays associated

with larger LUT structures. The output of any cell may be

registered, tri-stated and/or fed back into a core cell.

Arithmetic Mode is frequently used in many designs.

As can be seen in the figure, the AT40KEL040 core cell

can implement a 1-bit full adder (2-input adder with both

Carry In and Carry Out) in one core cell. Note that the

sum output in this diagram is registered. This output could

then be tri-stated and/or fed back into the cell.

DSP/Multiplier Mode. This mode is used to efficiently

implement array multipliers. An array multiplier is an array

of bitwise multipliers, each implemented as a full adder

with an upstream AND gate. Using this AND gate and the

diagonal interconnects between cells, the array multiplier

structure fits very well into the AT40K architecture.

Counter Mode. Counters are fundamental to almost all

digital designs. They are the basis of state machines,

timing chains and clock dividers. A counter is essentially

an increment by one function (i.e., an adder), with the

input being an output (or a decode of an output) from the

previous stage. A 1-bit counter can be implemented in one

core cell. Again, the output can be registered, tri-stated

and/or fed back.

Tri-state/Mux Mode. This mode is used in many

telecommunications applications, where data needs to be

routed through more than one possible path. The output of

the core cell is very often tri-statable for many inputs to

many outputs data switching.

SUM (Registered)

SUM

and/or

PRODUCT

CARRY

PRODUCT (Registered)

CARRY

CARRY IN

and/or

AT40KEL040

4155I–AERO–06/06

RAM 32 x 4 dual-ported RAM blocks are dispersed throughout the array as shown in Figure 7.

A 4-bit Input Data Bus connects to four horizontal local buses distributed over four sec-

tor rows (plane 1). A 4-bit Output Data Bus connects to four horizontal local buses dis-

tributed over four sector rows (plane 2). A 5-bit Input Address Bus connects to five

vertical express buses in same column. A 5-bit Output Address Bus connects to five ver-

tical express buses in same column. Ain (input address) and Aout (output address)

alternate positions in horizontally aligned RAM blocks. For the left-most RAM blocks,

Aout is on the left and Ain is on the right. For the right-most RAM blocks, Ain is on the

left and Aout is tied off, thus it can only be configured as a single port. For single-ported

RAM, Ain is the READ/WRITE address port and Din is the (bi-directional) data port.

Right-most RAM blocks can be used only for single-ported memories. WEN and OEN

connect to the vertical express buses in the same column.

Figure 7. RAM Connections (One Ram Block)

Reading and writing of the 18 ns 32 x 4 dual-port FreeRAM are independent of each

other. Reading the 32 x 4 dual-port RAM is completely asynchronous. Latches are

transparent; when Load is logic 1, data flows through; when Load is logic 0, data is

latched. These latches are used to synchronize Write Adress, Write Enable Not, and Din

signals for a synchronous RAM. Each bit in the 32 x 4 dual-port RAM is also a transpar-

ent latch. The front-end latch and the memory latch together form an edge-triggered flip

flop. When a nibble (bit = 7) is (Write) addressed and LOAD is logic 1 and WE is logic 0,

32 x 4 RAM

CLK

Din

Ain

WEN

OEN

Dout

Aout

CLK

12 AT40KEL040

4155I–AERO–06/06

data flows through the bit. When a nibble is not (Write) addressed or LOAD is logic 0 or

WE is logic 1, data is latched in the nibble. The two CLOCK muxes are controlled

together; they both select CLOCK (for a synchronous RAM) or they both select “1” (for

an asynchronous RAM). CLOCK is obtained from the clock for the sector-column imme-

diately to the left and immediately above the RAM block. Writing any value to the RAM

clear byte during configuration clears the RAM (see the “AT40K/40KAL Configuration

Series” application note at www.atmel.com).

Figure 8. RAM Logic

Figure 9 on page 13 shows an example of a RAM macro constructed using

AT40KEL040’s FreeRAM cells. The macro shown is a 128 x 8 dual-ported asynchro-

nous RAM. Note the very small amount of external logic required to complete the

address decoding for the macro. Most of the logic cells (core cells) in the sectors occu-

pied by the RAM will be unused: they can be used for other logic in the design. This

logic can be automatically generated using the macro generators.

Write Address

Din Dout

Read Address

“1”“1”

Write Enable NOT

RAM-Clear Byte

Dout

01 01

“1”

CLOCK

Load

Ain

Aout

WEN

Din

Load

Latch

Load

Latch

Load

Latch

Clear

32 x 4

Dual-port

RAM OE

AT40KEL040

4155I–AERO–06/06

Figure 9. RAM Example: 128 x 8 Dual-ported RAM (Asynchronous)

2-to-4

Decoder

Dout(4)

Dout(5)

Dout(6)

Dout(7)

Din Dout

WEN

OEN

Ain Aout Din Dout Din Dout

WEN

OEN

Din Dout

Aout Ain

WEN

OEN

Ain Aout

WEN

OEN

Aout Ain

Din Dout

Aout Ain

WEN

OEN

Din Dout

WEN

OEN

Ain Aout

Din Dout

Aout Ain

WEN

OEN

Din Dout

WEN

OEN

Ain Aout

2-to-4

Decoder

Local Buses

Express Buses

Dedicated Connections

Read

Address

Din(0)

Din(1)

Din(2)

Din(3)

Din(4)

Din(5)

Din(6)

Din(7)

Write

Address

Dout(0)

Dout(1)

Dout(2)

Dout(3)

14 AT40KEL040

4155I–AERO–06/06

Clocking Scheme There are eight Global Clock buses (GCK1 - GCK8) on the AT40KEL040 FPGA. Each

of the eight dedicated Global Clock buses is connected to one of the dual-use Global

Clock pins. Any clocks used in the design should use global clocks where possible: this

can be done by using Assign Pin Locks to lock the clocks to the Global Clock locations.

In addition to the eight Global Clocks, there are four Fast Clocks (FCK1 - FCK4), two per

edge column of the array for PCI specification. Even the derived clocks can be routed

through the Global network. Access points are provided in the corners of the array to

route the derived clocks into the global clock network. The IDS software tools handle

derived clocks to global clock connections automatically if used.

Each column of an array has a “Column Clock mux” and a “Sector Clock mux”. The Col-

umn Clock mux is at the top of every column of an array and the Sector Clock mux is at

every four cells. The Column Clock mux is selected from one of the eight Global Clock

buses. The clock provided to each sector column of four cells is inverted, non-inverted

or tied off to “0”, using the Sector Clock mux to minimize the power consumption in a

sector that has no clocks. The clock can either come from the Column Clock or from the

Plane 4 express bus (see Figure 10 on page 15). The extreme-left Column Clock mux

has two additional inputs, FCK1 and FCK2, to provide fast clocking to left-side I/Os. The

extreme-right Column Clock mux has two additional inputs as well, FCK3 and FCK4, to

provide fast clocking to right-side I/Os.

The register in each cell is triggered on a rising clock edge by default. Before configura-

tion on power-up, constant “0” is provided to each register’s clock pins. After configura-

tion on power-up, the registers either set or reset, depending on the user’s choice.

The clocking scheme is designed to allow efficient use of multiple clocks with low clock

skew, both within a column and across the core cell array.

AT40KEL040

4155I–AERO–06/06

Figure 10. Clocking (for One Column of Cells)

Global Clock Line

(Buried)

Sector Clock Mux

Column Clock Mux

Sector Clock Mux

Express Bus

(Plane 4; Half length at edge)

GCK1 - GCK8

Repeater

FCK (2 per Edge Column of the Array)

“1”

}







16 AT40KEL040

4155I–AERO–06/06

Set/Reset Scheme The AT40KEL040 family reset scheme is essentially the same as the clock scheme

except that there is only one Global Reset. A dedicated Global Set/Reset bus can be

driven by any User I/O, except those used for clocking (Global Clocks or Fast Clocks).

The automatic placement tool will choose the reset net with the most connections to use

the global resources. You can change this by using an RSBUF component in your

design to indicate the global reset. Additional resets will use the express bus network.

The Global Set/Reset is distributed to each column of the array. Like Sector Clock mux,

there is Sector Set/Reset mux at every four cells. Each sector column of four cells is

set/reset by a Plane 5 express bus or Global Set/Reset using the Sector Set/Reset mux

(Figure 11 on page 17). The set/reset provided to each sector column of four cells is

either inverted or non-inverted using the Sector Reset mux.

The function of the Set/Reset input of a register is determined by a configuration bit in

each cell. The Set/Reset input of a register is active low (logic 0) by default. Setting or

Resetting of a register is asynchronous. Before configuration on power-up, a logic 1 (a

high) is provided by each register (i.e., all registers are set at power-up).

AT40KEL040

4155I–AERO–06/06

Figure 11. Set/Reset (for One Column of Cells)

Each Cell has a programmable Set or Reset

Global Set/Reset Line (Buried)

Repeater

Express Bus

(Plane 5; Half length at edge)

Sector Set/Reset Mux

Any User I/O can drive Global Set/Reset line

“1”

18 AT40KEL040

4155I–AERO–06/06

I/O Structure AT40K has registered I/Os and group enable every sector for tri-states on obuf’s.

Pad The I/O pad is the one that connects the I/O to the outside world. Note that not all I/Os

have pads: the ones without pads are called Unbonded I/Os. The number of unbonded

I/Os varies with the device size and package. These unbonded I/Os are used to perform

a variety of bus turns at the edge of the array.

Pull-up/Pull-down Each pad has a programmable pull-up and pull-down attached to it. This supplies a

weak “1” or “0” level to the pad pin. When all other drivers are off, this control will dictate

the signal level of the pad pin.

The input stage of each I/O cell has a number of parameters that can be programmed

either as properties in schematic entry or in the I/O Pad Attributes editor in IDS.

CMOS The threshold level is a CMOS-compatible level.

Schmitt A Schmitt trigger circuit can be enabled on the inputs. The Schmitt trigger is a regenera-

tive comparator circuit that adds 1V hysteresis to the input. This effectively improves the

rise and fall times (leading and trailing edges) of the incoming signal and can be useful

for filtering out noise.

Delays The input buffer can be programmed to include four different intrinsic delays as specified

in the AC timing characteristics. This feature is useful for meeting data hold require-

ments for the input signal.

Drive The output drive capabilities of each I/O are programmable. They can be set to FAST,

MEDIUM or SLOW (using IDS tool). The FAST setting has the highest drive capability

(16 mA at 3.3V) buffer and the fastest slew rate. MEDIUM produces a medium drive

(12 mA at 3.3V) buffer, while SLOW yields a standard (4 mA at 3.3V) buffer.

Tri-State The output of each I/O can be made tri-state (0, 1 or Z), open source (1 or Z) or open

drain (0 or Z) by programming an I/O’s Source Selection mux. Of course, the output can

be normal (0 or 1), as well.

Source Selection Mux The Source Selection mux selects the source for the output signal of an I/O. See

Figure 12 on page 21.

Primary, Secondary and

Corner I/Os

The AT40KEL040 has three kinds of I/Os: Primary I/O, Secondary I/O and a Corner I/O.

Every edge cell except corner cells on the AT40KEL040 has access to one Primary I/O

and two Secondary I/Os.

Primary I/O Every logic cell at the edge of the FPGA array has a direct orthogonal connection to and

from a Primary I/O cell. The Primary I/O interfaces directly to its adjacent core cell. It

also connects into the repeaters on the row immediately above and below the adjacent

core cell. In addition, each Primary I/O also connects into the busing network of the

three nearest edge cells. This is an extremely powerful feature, as it provides logic cells

toward the center of the array with fast access to I/Os via local and express buses. It can

be seen from the diagram that a given Primary I/O can be accessed from any logic cell

on three separate rows or columns of the FPGA. See Figures 12a and 13a.

Secondary I/O Every logic cell at the edge of the FPGA array has two direct diagonal connections to a

Secondary I/O cell. The Secondary I/O is located between core cell locations. This I/O

AT40KEL040

4155I–AERO–06/06

connects on the diagonal inputs to the cell above and the cell below. It also connects to

the repeater of the cell above and below. In addition, each Secondary I/O also connects

into the busing network of the two nearest edge cells. This is an extremely powerful fea-

ture, as it provides logic cells toward the center of the array with fast access to I/Os via

local and express buses. It can be seen from the diagram that a given Secondary I/O

can be accessed from any logic cell on two rows or columns of the FPGA. See Figure

12a and Figure 13b.

Corner I/O Logic cells at the corner of the FPGA array have direct-connect access to five separate

I/Os: 2 Primary, 2 Secondary and 1 Corner I/O. Corner I/Os are like an extra Secondary

I/O at each corner of the array. With the inclusion of Corner I/Os, an AT40KEL040

FPGA with n x n core cells always has 8n I/Os. As the diagram shows, Corner I/Os can

be accessed both from the corner logic cell and the horizontal and vertical busing net-

works running along the edges of the array. This means that many different edge logic

cells can access the Corner I/Os. See Figure 14.

20 AT40KEL040

4155I–AERO–06/06

Figure 12. South I/O (Mirrored for North I/O)

VCC

TTL/CMOS

GND

PULL-UP

PAD

DRIVE TRI-STATE

PULL-DOWN

DELAY

SCHMITT

“0”

“1”

“0”

“1”

CELL

PAD

GND

PULL-UP

PULL-DOWN

TTL/CMOS DRIVE

VCC

TRI-STATE

DELAY

SCHMITT

“0”

“1”

“0”

CELL

(a) Primary I/O

SOURCE SELECT MUX

(b) Secondary I/O

(a) Primary I/O

AT40KEL040

4155I–AERO–06/06

Figure 13. West I/O (Mirrored for East I/O)

a. Primary I/0

CELL

"0"

"1"

DRIV E

TRI-STATE

"0"

"1"

TTL /CM O S

SCHMITT

DELA Y

PULL-DOWN

PULL-UP

GND VCC

PAD

CELL

ICLK

RST

OCLK

b. Secondary I/O

22 AT40KEL040

4155I–AERO–06/06

Figure 14. Northwest Corner I/O (Similar NE/SE/SW Corners)

"0"

"1"

DRIV E

TRI-STATE

"0"

"1"

TTL/CMOS

SCHMITT

DELAY

PULL-DOWN

PULL-UP

GNDVCC

PAD

"0"

"1"

DRIVE

TRI-STATE

"0"

"1"

TTL/ CMO S

SCHMITT

DELAY

PULL-DOWN

PULL-UP

GND VCC

PAD

"0"

"1"

DRIV E

TRI-STATE

"0"

"1"

TTL/CMOS

SCHMITT

DELAY

PULL-DOWN

PULL-UP

GNDVCC

PAD

CELL

ICLK

RST

ICLK

RST

ICLK

RST

OCLK

RST

OCLK

AT40KEL040

4155I–AERO–06/06

Electrical Characteristics

Absolute Maximum Ratings*

Operating Temperature.................................. -55°C to +125°C*Note: Stresses beyond those listed under Absolute

Maximum Ratings may cause permanent dam-

age to the device. This is a stress rating only and

functional operation of the device at these or any

other conditions beyond those listed under oper-

ating conditions is not implied. Exposure to Abso-

lute Maximum Rating conditions for extended

periods of time may affect device reliability.

Storage Temperature ..................................... -65°C to +150°C

Junction Temperature .................................................. +150°C

Voltage on Any Input Pin

with Respect to Ground (1) ......-0.5V to 5.5V DC (KEL version)

................................................ -0.5V to 7.0V DC (KFL version)

Voltage on Any Output Pin

with Respect to Ground .................................-0.5V to 5.5V DC

1. For DC Input Voltage (VI) Minimum voltage of -0.5V DC, which may undershoot to -2.0V for pulses of less than 20 ns.

Supply Voltage (VCC) ...........................................-0.5V to 5.5V

ESD (RZAP = 1.5K, CZAP = 100 pF)................................. 4000V

DC and AC Operating Range

Operating Temperature -55°C to +125°C

VCC Power Supply 3.3V ± 0.3V

Input Voltage Level (CMOS)

High (VIHC) 70% VCC to VCC + 0.3V DC (KEL version)

70% VCC to 5.5V DC (KFL version)

Low (VILC) -0.3V to 30% VCC DC

24 AT40KEL040

4155I–AERO–06/06

Note: 1. Parameter based on characterization and simulation; it is not tested in production.

Power-On Supply

Requirements

Atmel FPGAs require a minimum rated power supply current capacity to ensure proper

initialization, and the power supply ramp-up time does not affect the current required. A

fast ramp-up time requires more current than a slow ramp-up time.

Table 3. Power-on Supply Requirements

Note: 1. Devices are guaranteed to initialize properly at 50% of the minimum current listed

above. A larger capacity power supply may result in a larger initiallization current.

2. Ramp-up time is measured from 0V DC to 3.6V DC. Peak current required lasts less

than 2 ms, and occurs near the internal power on reset threshold voltage.

DC Characteristics

Symbol Parameter Conditions Min Typ Max Unit

VIH High-level Input Voltage CMOS 70% VCC V

TTL 2.0 V

VIL Low-level Input Voltage CMOS -0.3 30% VCC V

TTL -0.3 0.8 V

VOH High-level Output Voltage

IOH = -4 mA

VCC = 3.3V

2.4 V

IOH = -12 mA

VCC = 3.3V

2.4 V

IOH = -16 mA

VCC = 3.3V

2.4 V

VOL Low-level Output Voltage

IOL = +4 mA

VCC = 3.3V

0.4 V

IOL = +12 mA

VCC = 3.3V

0.4 V

IOL = +16 mA

VCC = 3.3V

0.4 V

IIH High-level Input Current VIN = VCC max -5 5 µA

With pull-down, VIN = VCC 20 75 300 µA

IIL Low-level Input Current VIN = VSS -5 5 µA

With pull-up, VIN = VSS -300.0 -50 -20 µA

IOZH

High-level Tri-state Output

Leakage Current

Without pull-down, VOUT =

VCC max

-5 5 µA

With pull-down, VOUT = VCC

max

20 300 µA

IOZL

Low-level Tri-state Output

Leakage Current

Without pull-up, VOUT = VSS -5 mA

With pull-up, VOUT = VSS

for CON

-500 -150.0 -110 µA

ICC Standby Current

Consumption

Standby, unprogrammed 1 5 mA

CIN Input Capacitance(1) All pins 10 pF

Description Maximum Current(1)(2)

Maximum Current Supply 1.2 A

AT40KEL040

4155I–AERO–06/06

AC Timing

Characteristics

Delays are based on fixed loads which are described in the notes.

Maximum timing based on worst case: Vcc = 3.0V, temperature = 125°C.

Minimum timing based on best case: Vcc = 3.6V, temperature = -55°C.

Maximum delays are the average of tPDLH and tPDHL.

AC Timing

Characteristics

All input I/O characteristics measured from VIH of 50% of VDD at the pad (CMOS threshold) to the internal VIH of 50% of VDD.

All output I/O characteristics are measured as the average of tPDLH and tPDHL to the pad VIH of 50% of VDD.

Cell Function Parameter Path Value Unit Notes

Core

2-input gate tPD (max) x/y -> x/y 2.9 ns 1 unit load

3-input gate tPD (max) x/y/z -> x/y 3.1 ns 1 unit load

3-input gate tPD (max) x/y/w -> x/y 3.5 ns 1 unit load

4-input gate tPD (max) x/y/w/z -> x/y 3.5 ns 1 unit load

Fast carry tPD (max) y -> y 2.8 ns 1 unit load

Fast carry tPD (max) x -> y 2.6 ns 1 unit load

Fast crry tPD (max) y -> x 2.8 ns 1 unit load

Fast carry tPD (max) x -> x 2.9 ns 1 unit load

Fast carry tPD (max) w -> y 3.5 ns 1 unit load

Fast carry tPD (max) w -> x 3.5 ns 1 unit load

Fast carry tPD (max) z -> y 3.1 ns 1 unit load

Fast carry tPD (max) z -> x 3.0 ns 1 unit load

DFF tPD (max) Clk -> x/y 4.3 ns 1 unit load

DFF tPD (max) R -> x/y 4.1 ns 1 unit load

DFF tPD (max) S -> x/y 2.8 ns 1 unit load

DFF tPD (max) q -> w 4.3 ns

Incremental -> L tPD (max) x/y -> L 2.5 ns 1 unit load

Local output enable tPZX (max) oe -> L 2.9 ns 1 unit load

Local output enable tPXZ (max) oe -> L 0.9 ns

Cell Function Parameter Path Value Unit Notes

Repeaters

Repeater tPD (max) L -> E 1.3 ns 1 unit load

Repeater tPD (max) E -> E 1.3 ns 1 unit load

Repeater tPD (max) L -> L 1.3 ns 1 unit load

Repeater tPD (max) E -> L 1.3 ns 1 unit load

Repeater tPD (max) E -> IO 0.7 ns 1 unit load

Repeater tPD (max) L -> IO 0.7 ns 1 unit load

26 AT40KEL040

4155I–AERO–06/06

Cell Function Parameter Path Value Unit Notes

I/O

Input tPD (max) pad -> x/y 5.4 ns no extra delay

Input tPD (max) pad -> x/y 7.6 ns 1 extra delay

Input tPD (max) pad -> x/y 11.4 ns 2 extra delays

Input tPD (max) pad -> x/y 14.9 ns 3 extra delays

Output, slow tPD (max) x/y/E/L -> pad 16.0 ns 50 pf load

Output, medium tPD (max) x/y/E/L -> pad 14.8 ns 50 pf load

Output, fast tPD (max) x/y/E/L -> pad 11.2 ns 50 pf load

Output, slow tPZX (max) oe -> pad 16.4 ns 50 pf load

Output, slow tPXZ (max) oe -> pad 5.1 ns 50 pf load

Output, medium tPZX (max) oe -> pad 14.1 ns 50 pf load

Output, medium tPXZ (max) oe -> pad 9.1 ns 50 pf load

Output, fast tPZX (max) oe -> pad 11.4 ns 50 pf load

Output, fast tPXZ (max) oe -> pad 9.5 ns 50 pf load

AT40KEL040

4155I–AERO–06/06

AC Timing

Characteristics

Clocks and Reset Input buffers are measured from a VIH of 1.5V at the input pad to the internal VIH of 50% of VCC.

Maximum timings for clock input buffers and internal drivers are measured for rising edge delays only.

Notes: 1. CMOS buffer delays are measured from a VIH of 1/2 VCC at the pad to the internal VIH at A. The input buffer load is constant.

2. Buffer delay is to a pad voltage of 1.5V with one output switching.

3. Parameter based on characterization and simulation; not tested in production.

4. Exact power calculation is available in Atmel FPGA Designer software.

Cell Function Parameter Path Value Unit Notes

Global Clocks and Set/Reset

GCK Input buffer tPD (max) pad -> clock 3.3 ns rising edge clock

FCK Input buffer tPD (max) pad -> clock 1.9 ns rising edge clock

Clock column driver tPD (max) clock -> colclk 1.7 ns rising edge clock

Clock sector driver tPD (max) colclk -> secclk 0.8 ns rising edge clock

GSRN Input buffer tPD (max) colclk -> secclk 10.3 ns

Global clock to output tPD (max) clock pad -> out 21.3 ns rising edge clock

fully loaded clock tree

rising edge DFF

20 mA output buffer

50 pf pin load

Fast clock to output tPD (max) clock pad -> out 19.9 ns rising edge clock

fully loaded clock tree

rising edge DFF

20 mA output buffer

50 pf pin load

28 AT40KEL040

4155I–AERO–06/06

AC Timing

Characteristics

Cell Function Parameter Path Value Unit Notes

Asynchronous RAM

Write tWECYC (min) cycle time 28 ns

Write tWEL (min) we 6.5 ns pulse width low

Write tWEH (min) we 6.5 ns pulse width high

Write tsetup (min) wr addr setup -> we 7.0 ns

Write thold (min) wr addr hold -> we 0.0 ns

Write tsetup (min) din setup -> we 6.5 ns

Write thold (min) din hold -> we 0.0 ns

Write thold (min) oe hold -> we 0.0 ns

Write/Read tPD (max) din -> dout 14.1 ns rd addr = wr addr

Read tPD (max) rd addr -> dout 13.1 ns

Read tPZX (max) oe -> dout 4.5 ns

Read tPXZ (max) oe -> dout 4.5 ns

Synchronous RAM

Write tCYC (min) cycle time 28 ns

Write tCLKL (min) clk 6.5 ns pulse width low

Write tCLKH (min) clk 6.5 ns pulse width high

Write tsetup (min) we setup -> clk 5.0 ns

Write thold (min) we hold -> clk 0.0 ns

Write tsetup (min) wr addr setup -> clk 6.5 ns

Write thold (min) wr addr hold -> clk 0.0 ns

Write tsetup (min) wr data setup -> clk 5.1 ns

Write thold (min) wr data hold -> clk 0.0 ns

Write/Read tPD (max) din -> dout 14.1 ns rd addr = wr addr

Write/Read tPD (max) clk -> dout 7.9 ns rd addr = wr addr

Read tPD (max) rd addr -> dout 13.1 ns

Read tPZX (max) oe -> dout 4.5 ns

Read tPXZ (max) oe -> dout 4.5 ns

AT40KEL040

4155I–AERO–06/06

FreeRAM Asynchronous

Timing Characteristics

Single Port Write/Read

Dual Port Write with Read

Dual Port Read

30 AT40KEL040

4155I–AERO–06/06

FreeRAM Synchronous

Timing Characteristics

Single Port Write/Read

Dual Port Write with Read

ADDR

DATA

tCLKH

tWCS

tACS

tDCH

tWCH

tACH

012

CLK

tOXZ tDCS

tOZX tAD

WR ADDR

WR DATA

RD DATA

tCLKH

tWCS

tACS

tCYC

tWCH

tCD

tACH

= WR ADDR 1RD ADDR

01 2

CLK

tCLKL

tDCS tDCH

AT40KEL040

4155I–AERO–06/06

Dual Port Read

RD ADDR

DATA

tOZX

tOXZ

tAD

AT40KEL040

4155E–AERO–06/04

Table 4. MQFP F-160

Number Signal

1VCC

2 I/O384_GCK8_A15

3 I/O383_A14

4 I/O382

5 I/O381

6 I/O372_A13

7 I/O371_A12

8 I/O370

9 I/O369

10 GND

11 I/O360

12 I/O359

13 I/O348_A11

14 I/O347_A10

15 I/O344

16 I/O343

17 I/O338_A9

18 I/O337_A8

19 VCC

20 GND

21 I/O336_A7

22 I/O335_A6

23 I/O330

24 I/O329

25 I/O328

26 I/O326_A5

27 I/O325_A4

28 I/O314

29 I/O313

30 GND

31 I/O304

32 I/O303

33 I/O298_A3

34 I/O297_CS1_A2

35 I/O292

36 I/O291

37 I/O290_GCK7_A1

38 I/O289_A0

39 GND

40 TESTCLOCK

41 VCC

42 CCLK

43 I/O288_GCK6

44 I/O287_D0

45 I/O286

46 I/O285

47 I/O278

48 I/O277_D1

49 I/O274

50 I/O273

51 GND

52 I/O262_FCK4

53 I/O261

54 I/O260

55 I/O259_D2

56 I/O246

57 I/O245

58 I/O242_CHECK

59 I/O241_D3

60 GND

61 VCC

62 I/O240

63 I/O239_D4

64 I/O236

65 I/O235

66 I/O222_CS0

67 I/O221_D5

Number Signal

68 I/O220

69 I/O219_FCK3

70 GND

71 I/O208

72 I/O207

73 I/O206

74 I/O205_D6

75 I/O196

76 I/O195

77 I/O194_GCK5

78 I/O193_D7

79 RESETN

80 VCC

81 CON

82 GND

83 I/O192_GCK4

84 I/O191_D8

85 I/O190

86 I/O189

87 I/O184_D9

88 I/O183_D10

89 I/O180

90 I/O179

91 GND

92 I/O168

93 I/O167

94 I/O166_D11

95 I/O165_D12

96 I/O152

97 I/O151

98 I/O146_D13

99 I/O145_D14

100 GND

101 VCC

Number Signal

AT40KEL040

4155E–AERO–06/04

102 I/O144_INIT

103 I/O143_D15

104 I/O138

105 I/O137

106 I/O124

107 I/O123

108 I/O122

109 I/O121

110 GND

111 I/O110

112 I/O109

113 I/O102_LDC

114 I/O101

115 I/O100

116 I/O99

117 I/O98_HDC

118 I/O97_GCK3

119 M2

120 VCC

121 M0

122 GND

123 M1

124 I/O96_GCK2

125 I/O95_OTS

126 I/O94

127 I/O93

128 I/O90

129 I/O89

130 I/O84

131 I/O83

132 GND

133 I/O72_FCK2

134 I/O71

135 I/O70

Number Signal

136 I/O69

137 I/O54

138 I/O53

139 I/O50

140 I/O49

141 VCC

142 GND

143 I/O48_A23

144 I/O47_A22

145 I/O44

146 I/O43

147 I/O28_A21

148 I/O27_A20

149 I/O26

150 I/O25_FCK1

151 GND

152 I/O16

153 I/O15

154 I/O6_A19

155 I/O5_A18

156 I/O4

157 I/O3

158 I/O2_A17

159 I/O1_GCLK1_A16

160 GND

Number Signal

AT40KEL040

4155E–AERO–06/04

Table 5. MQFP - F256

Number Signal

1 IO384_GCK8_A15

2 IO383_A14

3 IO382

4 IO381

5 IO378

6 IO377

7GND

8VCC

9 IO375

10 IO374

11 IO372_A13

12 IO371_A12

13 IO370

14 IO369

15 IO366

16 IO365

17 IO362

18 IO360

19 IO359

20 IO358

21 IO356

22 IO355

23 IO353

24 IO352

25 IO349

26 IO348_A11

27 IO347_A10

28 IO346

29 IO344

30 IO343

31 IO338_A9

32 IO337_A8

33 IO336_A7

34 IO335_A6

35 IO334

36 IO330

37 IO329

38 IO328

39 IO326_A5

40 IO325_A4

41 IO324

42 IO323

43 IO321

44 IO320

45 IO318

46 IO317

47 IO314

48 IO313

49 IO312

50 IO311

51 IO308

52 IO307

53 IO304

54 IO303

55 IO301

56 IO298_A3

57 GND

58 VCC

59 IO297_CS1_A2

60 IO291

61 IO292

62 IO290_GCK7_A1

63 IO289_A0

64 TESTCLOCK

65 CCLK

66 IO288_GCK6

67 IO287_D0

Number Signal

68 IO286

69 IO285

70 IO282

71 GND

72 VCC

73 IO278

74 IO277_D1

75 IO276

76 IO274

77 IO273

78 IO272

79 IO270

80 IO269

81 IO267

82 IO266

83 IO262_FCK4

84 IO261

85 IO260

86 IO259_D2

87 IO258

88 IO257

89 IO254

90 IO253

91 IO252

92 IO251

93 IO248

94 IO246

95 IO245

96 IO242_CHECK

97 IO241_D3

98 IO240

99 IO239_D4

100 IO236

101 IO235

Number Signal

AT40KEL040

4155E–AERO–06/04

102 IO234

103 IO232

104 IO230

105 IO228

106 IO227

107 IO225

108 IO224

109 IO222_CS0

110 IO221_D5

111 IO220

112 IO219_FCK3

113 IO216

114 IO215

115 IO212

116 IO208

117 IO207

118 IO206

119 IO205_D6

120 IO204

121 GND

122 VCC

123 IO203

124 IO196

125 IO195

126 IO194_GCK5

127 IO193_D7

128 RESETN

129 CON

130 IO192_GCK4

131 IO191_D8

132 IO190

133 IO189

134 IO186

135 GND

Number Signal

136 VCC

137 IO184_D9

138 IO183_D10

139 IO181

140 IO180

141 IO179

142 IO177

143 IO174

144 IO173

145 IO171

146 IO168

147 IO167

148 IO166_D11

149 IO165_D12

150 IO163

151 IO162

152 IO161

153 IO158

154 IO157

155 IO156

156 IO152

157 IO151

158 IO150

159 IO149

160 IO146_D13

161 IO145_D14

162 IO144_INIT

163 IO143_D15

164 IO141

165 IO138

166 IO137

167 IO136

168 IO134

169 IO132

Number Signal

170 IO131

171 IO129

172 IO128

173 IO124

174 IO123

175 IO122

176 IO121

177 IO120

178 IO119

179 IO116

180 IO115

181 IO113

182 IO110

183 IO109

184 IO101

185 GND

186 VCC

187 IO102_LDC

188 IO99

189 IO100

190 IO98_HDC

191 IO97_GCK3

192 M2

193 M0

194 M1

195 IO96_GCK2

196 IO95_OTS

197 IO94

198 IO93

199 GND

200 VCC

201 IO90

202 IO89

203 IO86

Number Signal

AT40KEL040

4155E–AERO–06/04

204 IO85

205 IO84

206 IO83

207 IO80

208 IO79

209 IO77

210 IO76

211 IO72_FCK2

212 IO71

213 IO70

214 IO69

215 IO67

216 IO66

217 IO63

218 IO62

219 IO60

220 IO59

221 IO57

222 IO56

223 IO54

224 IO53

225 IO50

226 IO49

227 IO48_A23

228 IO47_A22

229 IO44

230 IO43

231 IO41

232 IO39

233 IO36

234 IO35

235 IO34

236 IO33

237 IO30

Number Signal

238 IO29

239 IO28_A21

240 IO27_A20

241 IO26

242 IO25_FCK1

243 IO21

244 IO20

245 IO18

246 IO16

247 IO15

248 IO13

249 GND

250 VCC

251 IO6_A19

252 IO5_A18

253 IO4

254 IO3

255 IO2_A17

256 IO1_GCLK1_A16

Number Signal

AT40KEL040

4155I–AERO–06/06

Part/Package

Availability and User

I/O Counts (Including

Dual-function Pins)

Package AT40KEL040

MQFPF 160 129

MQFPF 256 233

38 AT40KEL040

4155I–AERO–06/06

Ordering Information

Part Number Package Version Temperature Range Quality Flow

AT40KEL040KW1-E MQFPF160 3.3V 25°C Engineering Samples

5962-0325001QXC MQFPF160 3.3V -55° to +125°CQML Q

5962-0325001VXC MQFPF160 3.3V -55° to +125°CQML V

930400801 MQFPF160 3.3V -55° to +125°C ESCC

AT40KEL040KZ1-E MQFPF256 3.3V 25°C Engineering Samples

5962-0325001QYC MQFPF256 3.3V -55° to +125°CQML Q

5962-0325001VYC MQFPF256 3.3V -55° to +125°CQML V

930400802 MQFPF256 3.3V -55° to +125°C ESCC

AT40KFL040KW1-E MQFPF160 3.3V, 5V Tolerant 25°C Engineering Samples

5962-0325002QXC MQFPF160 3.3V, 5V Tolerant -55° to +125°CQML Q

5962-0325002VXC MQFPF160 3.3V, 5V Tolerant -55° to +125°CQML V

AT40KFL040KW1-SCC MQFPF160 3.3V, 5V Tolerant -55° to +125°C ESCC

AT40KFL040KZ1-E MQFPF256 3.3V, 5V Tolerant 25°C Engineering Samples

5962-0325002QYC MQFPF256 3.3V, 5V Tolerant -55° to +125°CQML Q

5962-0325002VYC MQFPF256 3.3V, 5V Tolerant -55° to +125°CQML V

AT40KFL040KZ1-SCC MQFPF256 3.3V, 5V Tolerant -55° to +125°C ESCC

AT40KEL040

4155I–AERO–06/06

Package Drawing

Multilayer Quad Flat Pack (MQFP) 160-pin - Front View

40 AT40KEL040

4155I–AERO–06/06

Multilayer Quad Flat Pack (MQFP) 256-pin - Front View

AT40KEL040

4155I–AERO–06/06

Datasheet Change Log

Changes from 4155B -

06/03 to 4155C 04/04

1. Addition of MQFP F256 package information

2. Pad/ Pin assignment updated. Table 4 on page 31.

3. Ordering information updated

4. Reference to design tools

Changes from 4155C -

06/03 to 4155D 04/04

1. Update of radiation hardness performance, page 1.

Changes from 4155D

04/04 - to 4155E 06/04

1. Updated FreeRAM timing characteristics, Section “FreeRAM Asynchronous Tim-

ing Characteristics”, page 29.

Changes from 4155E

06/04 to 4155F 06/04

1. Minor changes throughout the document.

Changes from 4155F

06/04 to 4155G 05/05

1. Minor changes.

Changes from 4155G

05/05 to 4155H 02/06

1. Added MQFP256 package.

Changes from 4155H

02/06 to 4155I 06/06

1. Adding AT40KFL040 5V tolerant version.

2. Corrections on matrix decription.

Printed on recycled paper.

Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard

warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any

errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and

does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are

granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use

as critical components in life support devices or systems.

Atmel Corporation Atmel Operations

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Tel: 1(408) 441-0311

Fax: 1(408) 487-2600

Regional Headquarters

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Case Postale 80

CH-1705 Fribourg

Switzerland

Tel: (41) 26-426-5555

Fax: (41) 26-426-5500

Asia

Room 1219

Chinachem Golden Plaza

77 Mody Road Tsimshatsui

East Kowloon

Hong Kong

Tel: (852) 2721-9778

Fax: (852) 2722-1369

Japan

9F, Tonetsu Shinkawa Bldg.

1-24-8 Shinkawa

Chuo-ku, Tokyo 104-0033

Japan

Tel: (81) 3-3523-3551

Fax: (81) 3-3523-7581

Memory

2325 Orchard Parkway

San Jose, CA 95131, USA

Tel: 1(408) 441-0311

Fax: 1(408) 436-4314

Microcontrollers

2325 Orchard Parkway

San Jose, CA 95131, USA

Tel: 1(408) 441-0311

Fax: 1(408) 436-4314

La Chantrerie

BP 70602

44306 Nantes Cedex 3, France

Tel: (33) 2-40-18-18-18

Fax: (33) 2-40-18-19-60

ASIC/ASSP/Smart Cards

Zone Industrielle

13106 Rousset Cedex, France

Tel: (33) 4-42-53-60-00

Fax: (33) 4-42-53-60-01

1150 East Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906, USA

Tel: 1(719) 576-3300

Fax: 1(719) 540-1759

Scottish Enterprise Technology Park

Maxwell Building

East Kilbride G75 0QR, Scotland

Tel: (44) 1355-803-000

Fax: (44) 1355-242-743

RF/Automotive

Theresienstrasse 2

Postfach 3535

74025 Heilbronn, Germany

Tel: (49) 71-31-67-0

Fax: (49) 71-31-67-2340

1150 East Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906, USA

Tel: 1(719) 576-3300

Fax: 1(719) 540-1759

Biometrics/Imaging/Hi-Rel MPU/

High Speed Converters/RF Datacom

Avenue de Rochepleine

BP 123

38521 Saint-Egreve Cedex, France

Tel: (33) 4-76-58-30-00

Fax: (33) 4-76-58-34-80

Literature Requests

www.atmel.com/literature

4155I–AERO–06/06

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