REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Add test requirements to the PIN, new table,
visual inspect ion , manufac turing el ig ib ilit y
paragraph and alternat iv e s older ab il it y test
method. Expanded ohmic resistance range and
coding. Change vendor part number. Editorial
changes throughout.
12 JAN 2017
Prepared in accor d anc e wit h ASM E Y14. 100 Selected item drawing
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PMIC N/A PREPARED BY
Andrew R. Ernst DESIGN ACTIVITY :
DEFENSE SUPPLY CENTER, COLUMBUS
Original date of
drawing
15 August 2006
CHECKED BY
Andrew R. Ernst
TITLE
RESISTOR, CHIP, FIXED, POWER METAL STRIP,
SURFACE MOUNT, LOW VALUE (.1 WATT),
STYLE 0603
APPROVED BY
Michael A. Radecki
SIZE
A CODE IDENT. NO.
037Z3 DWG NO.
REV
A
1 OF 7
AMSC N/A 5905-2016-E03
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
CURRENT DESIGN ACTIVITY CAGE CODE 037Z3
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
RADECKI.
MICHAEL
.A.12301
52051
Digitally signed
by
RADECKI.MICHAE
L.A.1230152051
Date: 2017.01.11
08:51:47 -05'00'
DEFENSE SUPPLY CENTER, COLUMBUS
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037Z3
DWG NO:
06007
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1. SCOPE
1.1 Scope. This drawing describes the requirements for a .060 X .030, .1 watt, fixed, power metal strip, surface mounted, chip
resistor.
* 1.2 Part or Identifying Number (PIN). The complete PIN is as follows:
06007
-
*****
*
*
I
I
I
I
I
I
I
I
Drawing
Resistance value
Tolerance
Testing
number
(see 3.3.1, 3.3.2)
(see 3.3.3)
requirements
(see 3.3.6)
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not
include docum ent s cited in oth er secti ons of this speci fic at ion or recommended for additional information or as examples. While every
effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified
requireme nts of docu men ts in sect ion s 3 and 4 of this specification, whether or not they are listed.
2.2 Govern ment document s.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this
document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation
or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-55342 - Resistor, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General
Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-690 - Failure Rate Sampling Plans and Procedures.
MIL-STD-790 - Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical,
Electronic, and Fiber Optic Parts Specifications.
* (Copies of these documents are available online at http://quicksearch.dla.mil).
* 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless
otherwise spe cif ied, the is sue s of the document s cited in the solicit ation or contract.
AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)
J-STD-002 - Component Leads, Termination, Lugs, Terminals and Wires, Solderability Tests for.
(Application s for copies of these documents are online at http://www.icp.org).
* 2.4 Order of prece den ce. Unless otherwise noted herein or in the contract, or in the event of a conflict between the text of this
document and the references cited herein (except for related specification sheets), the text of this document takes precedence.
Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specified herein.
3.2 Interfa ce and phy si cal dim ensi ons . Resistors shall meet the interface and physical dimensions as specified herein (see
figure 1).
DEFENSE SUPPLY CENTER, COLUMBUS
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Dimensions
L H T W
0.060 ±0.010
(1.52 ±0.254) 0.013 ±0.005
(0.330 ±0.127) 0.015 ±0.010
(0.381 ±0.254) 0.030 ±0.010
(0.76 ±0.254)
NOTES:
1. Dimensions are in inches, millimeters are shown in parentheses.
2. Millimeter equivalents are given for general information only.
FIGURE 1. Resistor, fixed, power metal strip, surface mount.
3.3 Electrical characteristics.
* 3.3.1 Resistance. The nominal resistance is expressed in ohms and is identified by five digits, consisting of four digits and a letter.
The letter is used simultaneously as a decimal point and as a multiplier. For resistance values:
a. Greater than or equal to 0.001 ohm but less than 0.010 ohms, the letter “L” is used to represent a power of 10-3.
(i.e.; 1L500 = 0.0015 or 5L000 = 0.005)
b. Greater than or equal to 0.010 ohm but less than or equal to 0.500 ohms, the letter “R” is used to represent a decimal point.
* All digits preceding and following the letters “L” and “R” of the group represent significant figures. Minimum and maximum resistance
values shall be as specified herein (see 3.3.2). Standard resistance decade values shall be in accordance with table I. It is preferred
that resistan ce values be selected as specif ied in table I. However, if it is necessary to do so, then any values (within specification
limits) may be specified and these values can be considered as conforming to this specification.
* 3.3.2 Resistance range. The resistance range shall be 0.010 ohms to 0.1 ohm (see 6.5).
3.3.3 Resistance tolerance. Resistance tolerances are available in (D) ±0.5 percent and (F) ±1 percent (see 6.5).
DEFENSE SUPPLY CENTER, COLUMBUS
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3.3.4 Power rating. The power rating shall be .1 watt at +70°C. For operation at temperatures greater than +70°C, derate in
accordance with figure 2.
TABLE I. Standard resistance decade values.
Standard resistance decade values
10
20
30
40
50
60
70
80
90
11
21
31
41
51
61
71
81
91
12
22
32
42
52
62
72
82
92
13
23
33
43
53
63
73
83
93
14
24
34
44
54
64
74
84
94
15
25
35
45
55
65
75
85
95
16
26
36
46
56
66
76
86
96
17
27
37
47
57
67
77
87
97
18
28
38
48
58
68
78
88
98
19
29
39
49
59
69
79
89
99
3.3.5 Resistance temperature coefficient. The resistance temperature coefficient shall be ±75 ppm/°C.
* 3.3.6 Testing requirements. The requirement for testing shall be identified by a single letter in accordance with table II.
TABLE II. Testing.
Symbol Testing requirements
(blank) Group A
A
Group A and Group B
B Group A and Power moisture
C Group A, Group B and Power moisture
NOTE: Any testing requirements that are not specified in the PIN
shall have a certificate of compliance issued (see 4.4.2).
3.4 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor
components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see
6.3).
DEFENSE SUPPLY CENTER, COLUMBUS
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FIGURE 2. Derating curves for high ambient temperatures.
3.5 Short time ov erload. When resistors are tested as specified in 4.5, there sha ll be no evi denc e of arcing, burning, or charr ing;
the change in resistance between the initial and final measurements shall not exceed ± (0.5 perc ent+ 0. 00 05 ohm).
* 3.6 Power moisture resistance. When resist ors a re tested as specified in 4.6, there shall be no evidence of mechanical damage;
the change in resistance between the initial and final measurements shall not exceed ± (0.5 percent+ 0.0005 ohm).
* 3.7 Visual inspection. Resistors shall be inspected as specified in 4.8, to verify that the interface, physical dimensions, marking,
and workmanship are in accordance with the applicable requirements (see 3.1, 3.2, 3.9 and 3.12).
3.8 Manufacturers performance data. The manufacturer’s technical specifications and performance data shall be made available to
the customer for a period of two years.
3.9 Marking. Marking is not required on the resistor; however, each unit package shall be marked with the PIN assigned herein
(see 1.2), vendor CAGE code, and date and lot codes.
3.9.1 Ind ividual chip marking. Marking of individual chip resistors is not required but is permitted. Chip resistors may be marked in
accordance with MIL-PRF-55342. The marking requirement and code system used shall be specified on the order. If no code system
is s pecified, the manufacturer may select the code. Abbreviated markings are due to limited space takes precedence over PIN format.
* 3.10 Recycled, recovered, environmentally preferable, or biobased materials. Recycled, recovered, environmentally preferable, or
biobased materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and
maintenance requirements, and promotes economically advantageous life cycle costs.
* 3.11 Manufacturer eligibility. To be eligible for be ing adde d as an approved source of supply, a manufacturer shall be listed on the
MIL-PRF-55342 Qualified Products List for at least one part, or perform the group A and group B inspections specified herein on a
sample agreed upon by the manufacturer and DLA Land and Maritime-VAT.
* 3.11.1 Certificat e of com plia n ce. A certificate of compliance shall be required from manufacturers requesting to be listed as an
approved sour ce of supply .
3.12 Workmanship. The resistor shall be uniform in quality and free from any defects that will affect life, serviceability, or
appearance.
4. VERIFICATION
4.1 Qualification inspection. Qualification in spe ctio n is not appl ica ble to this doc um ent.
4.2 Reliab ili ty assuran ce program. The reliability assurance program specified in MIL-PRF-55342 and maintained in accordance
with MIL-STD-790 is not applicable to this document.
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4.3 Failure rate qualification. Failure rate qualification specified in MIL-PRF-55342 and MIL-STD-690 is not applicable to this
document.
4.4 Conformance inspection.
* 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A inspection (E R level onl y ,
subgroup 2 - dc resistance only, subgroup 3 – shall be in accordance with 4.8, and subgroup 5; the following ex ception shall apply:
Resistors (if mar ked) shall be examined for legibility under normal production room lighting by an inspector at 10X magnification, and
ppm reporting is not appl ic able ) and group B inspection (Su bgroup 1 shall be perfor me d on separate sa mple s - 20 samples each and
solder mounting integrity is not applicable) of MIL-PRF-55342. Additionally; a power moisture resistance test as specified in 4.6 shall
be performed when specified in the PIN.
* 4.4.2 Certification. The manufacture shall submit a certificate of compliance in lieu of the group B inspection and/or the power
moisture resistance test, if not specified in the P IN.
4.5 Short time ov erload. Resistors shall be tested in accordance with MIL-PRF-55342. The following details and ex cepti ons shall
apply:
* a. An overload dc test potential which will result in 5 times the rated wattage and sha ll be appl ied for 5 second s.
b. Test board may have copper lamination in excess of the 70 micrometers copper (2 oz.) thickness as described in
MIL-PRF-55342.
c. Separate resistors shall be used for short time overload and resistance temperature characteristic tests.
* 4.6 Power moisture resistance. Resistors shall be tested in accordance with MIL-PRF-55342. The following details and exceptions
shall apply:
a. The test is to be performed on an annual basis.
b. A 30 piece sample shall be used with 0 defects allowed.
c. Step 7a sha ll not be applica ble.
* 4.7 Solderability. Solderability shall be testes in accordance with MIL-PRF-55342 or as an alternated meth od J-STD-002 test
method S with category 3 preconditioning may be used.
* 4.8 Visual inspection. Resistor shall be examined as listed below:
a. Marking. Marking shall remain legible after all tests.
b. Top coating. The top coating of the resistor body on top shall cover 90 percent of the element.
c. Bottom coating. The bottom coating shall cover 80 percent of the element, and the thickness shall not exceed the terminal
standoff heig ht.
d. Bowing. The resistor body shall not be bowed beyond 0.003”.
e. Cracks. Flexing due to the calibrati on meth od of the resist or can indu ce cra cks along the c alibration cuts and are con sid ered
acceptable.
f. Height. A maximum height per internal specification is 0.030”.
g. Plating on the side. Plating on the side of the element is acceptable when it does not exceed 25 percent of the total element
length. Side plating is defined as the plating covering the entire side of the element and shall have a thickness of 0.007”.
h. Edge plating. Edge plating shall not exceed 50% of the element length. Edge plating is define as plating on the corners of the
elements.
DEFENSE SUPPLY CENTER, COLUMBUS
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5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2).
When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the
responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control
Point's packaging activity within the Military Department or Defense Agency, or within the military service’s system commands.
Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-
ROM products, or by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Inten ded use. Surface mount resistors are used in electronic circuits where space is a major concern.
6.2 Order ing data . The contract or purchase order should specify the following:
a. Complete PIN (see 1.2).
b. Requirements for delivery: One copy of the conformance inspection data or certification of compliance that parts have passed
conformance inspection with each shipment of parts by the manufacturer.
c. Requirements for packaging and packing.
d. If marking is required (see 3.8.1).
6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth
problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical
operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not
prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For
additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin).
* 6.4 User of record. Coordination of this document for future revisions is coordinated only with the approved source of supply and
the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at
resistor@dla.mil or in writing to: DLA Land and Maritime, Attn: VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by
telephone (614) 692-0552 or DSN 850-0552.
* 6.5 Approved source of supply. Approved source of supply is listed herein. Additional sources will be added as they become
available. Assistance in the use of this drawing may be obtained online at resistor@dla.mil or contact DLA Land and Maritime,
Attn: VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552.
DLA Land and
Maritime
drawing PIN
Vendors similar
designation or type
number 1/
Vendor
CAGE Vendor's name
and address
06007-*******
06007-*******A
06007-*******B
06007-*******C
WSL0603-97
WSL0603-98
WSL0603-99
WSL0603-37
91637
Vishay Dale Electronics, Inc.
PO Box 609
Columbus, NE 68602-0609
2799A
Vishay Dale Electronics, Inc.
PO Box 2317
EMEK-Sara “B” Industrial Park
Be’er Sheva, Israel 84874
1/ Parts must be purcha sed to the DLA Land and Maritime P IN to assure that all performance requirements
and tests are met.