© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 1
CSPEMI200A
4 Channel Headset EMI Filter with ESD Protection
Features
• Four channels of EMI filtering
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• Includes 1 channel of ESD-only protection
• Greater than 30dB attenuation at 1GHz
•+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
•+15kV ESD protection on each channel (HBM)
• Supports bipolar signals—ideal for
audio applications
• 11-bump, 2.045mm X 1.437mm footprint
Chip Scale Package (CSP)
• Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
• Lead-free version available
Applications
• EMI filtering and ESD protection for audio ports
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
Product Description
The CSPEMI200A is a quad low-pass filter array inte-
grating four pi-style filters (C-R-C) that reduce EMI/RFI
emissions while at the same time providing ESD pro-
tection. This device is custom-designed to interface
with the headset port on a cellular telephone, and con-
tains 3 different filter values. Each high quality filter
provides more than 20dB attenuation in the 800-2700
MHz range. These pi-style filters support bidirectional
filtering, controlling EMI both to and from the micro-
phone and speaker elements. They also support bipo-
lar signals, enabling audio signals to pass through
without distortion.
In addition, the CSPEMI200A provides a very high
level of protection for sensitive electronic components
that may be subject to electrostatic discharge (ESD).
The CSPEMI200A can safely dissipate ESD strikes of
8kV, the maximum requirement of the IEC 61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for contact
discharges to greater than 15kV.
The CSPEMI200A is particularly well suited for porta-
ble electronics (e.g., cellular telephones, PDAs, note-
book computers) because of its small package format
and low weight. The CSPEMI200A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Electrical Schematic
10
Ω
100pF
100pF
100
Ω
47pF
47pF
MIC_IN1
B2
A2
A3
A4
B4
C1
C2
C3
C4
B3 ESD Channel
MIC_IN2
SPKR_OUT1
SPKR_OUT2
GND
GND
SPKR_IN2
SPKR_IN1
MIC_OUT2
MIC_OUT1
B1
68
Ω
47pF
47pF
10
Ω
100pF
100pF
© 2003 California Micro Devices Corp. All rights reserved.
2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI200A
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1 N.B. No Bump – used for orientation / alignment
A2 MIC_IN2 Microphone Input 2 (from microphone)
A3 SPKR_OUT1 Speaker Output 1 (to speaker)
A4 SPKR_OUT2 Speaker Output 2 (to speaker)
B1 MIC_IN1 Microphone Input 1 (from microphone)
B2 ESD1 ESD Protection Input. Provides a channel specifically for ESD protection purposes.
B3 GND Device Ground
B4 GND Device Ground
C1 MIC_OUT1 Microphone Output 1 (to audio circuitry)
C2 MIC_OUT2 Microphone Output 2 (to audio circuitry)
C3 SPKR_IN1 Speaker Input 1 (from audio circuitry)
C4 SPKR_IN2 Speaker Input 2 (from audio circuitry)
MIC_IN2
MIC_IN1
SPKR_OUT1 SPKR_OUT2
ESD1 GND GND
MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2
A3A2
Orientation
Marking A4
B4B3B2B1
C4C3C2C1
A1
200A
4321
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
TOP VIEW
CSPEMI200A
CSP Package
BOTTOM VIEW
(Bumps Down View) (Bumps Up View)
2) Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
1) These drawings are not to scale.
PART NUMBERING INFORMATION
Bumps Package
Standard Finish Lead-free Finish2
Ordering Part
Number1Part Marking
Ordering Part
Number1Part Marking
11 CSP CSPEMI200A 200A CSPEMI200AG 200A
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 3
CSPEMI200A
Specifications
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design and characterization.
Note 6: ZSOURCE=50Ω, ZLOAD=50Ω.
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 400 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
R1Resistance 1 90 100 110 Ω
R2Resistance 2 61 68 75 Ω
R3Resistance 3 9 10 11 Ω
C1 Capacitance 1 38 47 57 pF
C2 Capacitance 2 80 100 120 pF
ILEAK Diode Leakage Current VIN=5.0V 1.0 µA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
5
-5
7
-10
15
-15
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
±15
±8
kV
kV
VCL Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+15
-19
V
V
fC1 Cut-off frequency 1; Note 6 R = 100Ω, C = 47pF 53 MHz
fC2 Cut-off frequency 2; Note 6 R = 68Ω, C = 47pF 61 MHz
fC3 Cut-off frequency 3; Note 6 R = 10Ω, C = 100pF 33 MHz
© 2003 California Micro Devices Corp. All rights reserved.
4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI200A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance
Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 5
CSPEMI200A
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance
Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance
© 2003 California Micro Devices Corp. All rights reserved.
6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI200A
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 7. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.275mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.325mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50µm
Solder Ball Side Coplanarity +20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (°C)
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 7
CSPEMI200A
Mechanical Details
CSP Mechanical Specifications
CSPEMI200A devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
Package Dimensions for CSPEMI200A
Chip Scale Package
CSP Tape and Reel Specifications
Figure 8. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 11
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 2.001 2.046 2.091 0.0788 0.0806 0.0823
A2 1.391 1.436 1.481 0.0548 0.0565 0.0583
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.223 0.273 0.323 0.0088 0.0107 0.0127
C2 0.168 0.218 0.268 0.0066 0.0086 0.0106
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
1234
C1
B1
A1
B2
C2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL P0P1
CSPEMI200A 2.04 X 1.44 X 0.6 2.29 X 1.60 X 0.81 8mm 178mm (7") 3500 4mm 4mm
To p
For Tape Feeder Reference
Cover
Ta pe
P
1
Only including Draft.
Concentric Around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
