AP2313GN RoHS-compliant Product Advanced Power Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET Simple Drive Requirement Small Package Outline D Surface Mount Device BVDSS -20V RDS(ON) 160m ID -2.5A S SOT-23 Description G D Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, low on-resistance and cost-effectiveness. G S The SOT-23 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Absolute Maximum Ratings Parameter Symbol VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25 ID@TA=70 Rating Units -20 V 12 V 3 -2.5 A 3 -1.97 A Continuous Drain Current Continuous Drain Current 1 IDM Pulsed Drain Current -10 A PD@TA=25 Total Power Dissipation 0.83 W TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Rthj-a Parameter Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice 3 Value Unit 150 /W 201022073-1/4 AP2313GN Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. -20 - - V - -0.01 - V/ VGS=-10V, ID=-2.8A - - 120 m VGS=-4.5V, ID=-2.5A - - 160 m VGS=-2.5V, ID=-2A - - 300 m VDS=VGS, ID=-250uA - - -1.2 V BVDSS Drain-Source Breakdown Voltage BVDSS/Tj Breakdown Voltage Temperature Coefficient Reference to 25, ID=-1mA RDS(ON) Static Drain-Source On-Resistance VGS(th) Gate Threshold Voltage gfs Forward Transconductance IDSS 2 VDS=-5V, ID=-2A - 4 - S o VDS=-20V, VGS=0V - - -1 uA o Drain-Source Leakage Current (Tj=70 C) VDS=-16V, VGS=0V - - -25 uA Gate-Source Leakage VGS=12V - - 100 nA ID=-2A - 5 8 nC Drain-Source Leakage Current (Tj=25 C) IGSS VGS=0V, ID=-250uA Max. Units 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=-16V - 1 - nC Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 2 - nC VDS=-10V - 6 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=-1A - 17 - ns td(off) Turn-off Delay Time RG=3.3,VGS=-10V - 16 - ns tf Fall Time RD=10 - 5 - ns Ciss Input Capacitance VGS=0V - 270 430 pF Coss Output Capacitance VDS=-20V - 70 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 55 - pF Min. Typ. IS=-1.2A, VGS=0V - - -1.2 V IS=-2A, VGS=0V, - 20 - ns dI/dt=100A/s - 15 - nC Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 trr Reverse Recovery Time Qrr Reverse Recovery Charge Test Conditions Max. Units Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 360 /W when mounted on Min. copper pad. THIS PRODUCT IS AN ELECTROSTATIC SENSITIVE, PLEASE HANDLE WITH CAUTION. THIS PRODUCT HAS BEEN QUALIFIED FOR CONSUMER MARKET. APPLICATIONS OR USES AS CRITERIAL COMPONENT IN LIFE SUPPORT DEVICE OR SYSTEM ARE NOT AUTHORIZED. 2/4 AP2313GN 15 15 -5.0V -4.5V T A =25 o C 12 12 -3. 5 V -ID , Drain Current (A) -ID , Drain Current (A) -5.0V -4.5V T A = 150 o C 9 -2.5V 6 3 -3.5V 9 -2.5V 6 3 V G = - 1. 5 V V G = - 1. 5 V 0 0 0 1 2 3 4 5 0 -V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 2 3 4 5 Fig 2. Typical Output Characteristics 1.6 200 I D =-2A I D = - 2.5 A V G = -4.5V 1.4 Normalized RDS(ON) T A =25 o C RDS(ON) ( ) 1 -V DS , Drain-to-Source Voltage (V) 160 120 1.2 1.0 0.8 80 0.6 2 4 6 8 -50 10 -V GS , Gate-to-Source Voltage (V) 0 50 100 150 o T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.6 Normalized VGS(th) (V) 3 2 -IS(A) T j =150 o C T j =25 o C 1 0 1.2 0.8 0.4 0 0.2 0.4 0.6 0.8 1 -V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 0 50 100 150 o T j , Junction Temperature ( C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3/4 AP2313GN f=1.0MHz 1000 I D =- 2 A V DS =-16V 8 C iss 6 C (pF) -VGS , Gate to Source Voltage (V) 10 100 C oss 4 C rss 2 10 0 0 2 4 6 1 8 5 9 13 17 21 25 -V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 100 1 Normalized Thermal Response (Rthja) Duty factor=0.5 10 -ID (A) 1ms 1 10ms 100ms T A =25 o C Single Pulse 0.1 1s DC 0.2 0.1 0.1 0.05 PDM t T 0.01 0.01 Single Pulse Duty factor = t/T Peak Tj = PDM x Rthja + T a Rthja = 360/W 0.001 0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000 -V DS , Drain-to-Source Voltage (V) t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG -4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4/4 ADVANCED POWER ELECTRONICS CORP. Package Outline : SOT-23 D Millimeters D1 E1 E e SYMBOLS MIN NOM MAX A 1.00 1.15 A1 0.00 -- 0.10 A2 0.10 0.15 0.25 D1 0.30 0.40 0.50 e 1.70 2.00 2.30 D 2.70 2.90 3.10 E 2.40 2.65 3.00 E1 1.40 1.50 1.60 1.30 1.All Dimension Are In Millimeters. A 2.Dimension Does Not Include Mold Protrusions. A2 A1 Part Marking Information & Packing : SOT-23 Part Number NFXX Date Code