Silicon ESD Protection Devices Silicon ESD Protection Devices NEW Silicon ESD (SESD) devices help protect electronic circuits against damage from electrostatic discharge (ESD) events. The 0201-sized SESD device's miniature footprint - measuring 0.6mm x 0.3mm x 0.3mm - is approximately 70 percent smaller than prior-generation devices, offering designers flexibility in spaceconstrained applications. The SESD0201C-006-058 device is a bi-directional and ultra-low capacitance 0.6 picofarad (pF) device that is suitable for helping to protect very-high-speed data lines, such as USB and HDMI, or low-voltage antenna ports. The device's ultra-low capacitance, low insertion loss (<0.5dB up to 3GHz), and high linearity of capacitance versus frequency helps minimize signal degradation. The SESD0201C-120-058 (12pF) device and SESD0201P1BN-0400-090 (4pF) device are highercapacitance bi-directional devices that can be used for low-speed generic interfaces such as keypads, power buttons, speakers, and microphone ports in portable electronics. Both SESD0201C-006-058 and SESD0201C-120058 devices offer 8kV contact and 15kV air discharge protection per the IEC61000-4-2, level 4 standard, while the SESD0201P1BN-0400-090 device offers 10kV contact and 16kV air discharge protection per the IEC61000-4-2, level 4 standard. 8 The SESD0402S-005-054 device is an ultra-low-capacitance SOD-923 (0402-size package) uni-directional device with 0.5pF typical capacitance. This device offers a 10kV contact discharge rating per IEC61000-4-2, level 4 and can be used with digital applications such as USB and HDMI. Also included in the product line is the SESD0402P1BN-0450-090 device. This device is a higher-capacitance (4.5pF), SMD bi-directional device that offers 10kV contact and 16kV air discharge protection per the IEC61000-42, level 4 standard. Benefits * Small size SESD protection diodes for high speed signals * ESD protection in space-constrained portable electronics and mobile handsets Features * RoHS compliant * Halogen free (refers to: Br900ppm, Cl900ppm, Br+Cl1500ppm) * Low-leakage current - 1.0A (max) * Helps protect electronic circuits against damage from ESD * Capable of withstanding numerous ESD strikes * Assist equipment to pass IEC61000-4-2, level 4 testing * SOD-923 case epoxy material meets UL 94 V-0 * Low capacitance and insertion loss * SESD0402S devices meet MSL-1 requirements Applications * Mobile phones and portable electronics * USB 2.0/3.0, HDMI 1.3/1.4, and DisplayPort * High-speed data lines (low capacitance 0201 and 0402) * Applications requiring high ESD performance in a small package * Low-voltage antenna ports (bi-directional 0201) 49 Table SE1 Maximum Ratings for SESD Devices IEC61000-4-2, level 4 (ESD Withstand) Contact Air (kV) (kV) Part Number Temperature Operating (C) Storage (C) Total Power Dissipation on FR-4 board (mW) SESD0201C-006-058 8 15 -40 to +125 -40 to +125 250 SESD0201C-120-058 8 15 -40 to +125 -40 to +125 250 SESD0402S-005-054 10 15 -55 to +125 -55 to +150 150 NEW SESD0201P1BN-0400-090 10* 16 -40 to +125 -40 to +125 - NEW SESD0402P1BN-0450-090 10* 16 -40 to +125 -40 to +125 - Breakdown Voltage (min) Vbr @ IT = 1mA (V) Working Reverse Voltage VRWM @ peak (V) * 10kV @ 50 pulses under IEC61000-4-2; 8kV @ 1,000 pulses under IEC61000-4-2 FR-4 board = 30mm x 30mm x 2mm Table SE2 Electrical Characteristics @T=25C for SESD Devices Input Capacitance* Typical Maximum (pF) (pF) Part Number 0.6 SESD0201C-006-058 SESD0201C-120-058 12.0 Leakage Current (max) IL @ VRWM = 5.0V (A) 0.9 1.0 5.8 5.0 13.5 1.0 5.8 5.0 SESD0402S-005-054 0.5 0.9 1.0 +5.4 / -1.0 5.0 NEW SESD0201P1BN-0400-090 4.0 5.0 1.0** 9.0 6.0 NEW SESD0402P1BN-0450-090 4.5 5.5 1.0** 9.0 6.0 * ** @ Vr=0V, f=1MHz 0.19pF@f=3GHz 0.17pF@f=3GHz IL @ VRWM = 6.0V (A) Vbr is measured at test current IT Figure SE1-SE2 Capacitance vs Frequency for SESD Devices 8 Figure SE1 Figure SE2 SESD0402S-005-054 Capacitance vs Frequency to 3GHz 1.0 1.0 0.9 0.9 0.8 0.8 Capacitance (pF) Capacitance (pF) SESD0201C-006-058 Capacitance vs Frequency to 3GHz 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 10 100 1000 10000 10 Frequency (MHz) 100 1000 10000 Frequency (MHz) Figure SE3-SE4 Insertion Loss Diagram for SESD Devices Figure SE3 SESD0201C-006-058 Insertion Loss to 6GHz Insertion Loss (dB) 0 -1 -2 Applications -3 -4 -5 1 2 3 4 Frequency (GHz) 50 RoHS Compliant, ELV Compliant HF Halogen Free 5 6 Insertion Loss @Frequency (GHz) HDMI 1.3 (1080p) -0.205 2.25 HDMI 1.3 (max spec) -0.354 3.40 DisplayPort -0.235 2.70 USB 3.0 -0.791 5.00 Silicon ESD Protection Devices Figure SE3-SE4 Insertion Loss Diagram for SESD Devices Cont'd Figure SE4 SESD0402S-005-054 Insertion Loss to 6GHz Insertion Loss (dB) 0 -1 -2 Applications -3 -4 -5 1 2 3 4 5 Insertion Loss @Frequency (GHz) HDMI 1.3 (1080p) -0.300 2.25 HDMI 1.3 (max spec) -0.735 3.40 DisplayPort -0.335 2.70 USB 3.0 -1.450 5.00 6 Frequency (GHz) Table SE3 Dimensions for SESD Devices in Millimeters (Mils)* Part Number A B C D E F G Figure 0.60 0.03 0.30 0.03 0.27 0.03 0.15 0.03 0.25 0.03 0.25 0.03 0.005 (max) SE5 (23.62 1.20) (11.81 1.20) (10.63 1.20) (5.91 1.20) (9.84 1.20) (9.84 1.20) (0.197) (max) SESD0201C SESD0402S NEW NEW 1.00 0.05 0.60 0.05 0.37 0.03 0.20 0.05 0.10 0.05 0.80 0.05 0.12 0.05 (39.37 0.40) (23.62 0.40) (14.57 1.20) (7.87 2.00) (3.94 2.00) (31.50 2.00) (4.72 2.00) SESD0201P 0.60 0.05 0.30 0.05 0.30 0.05 0.21 0.07 - - - (23.62 2.00) (11.81 2.00) (11.81 2.00) (8.27 2.80) - - - SESD0402P 1.10 0.10 0.50 0.10 0.50 0.10 0.25 0.15 - - - (43.31 0.40) (19.69 4.00) (19.69 4.00) (9.84 6.00) - - - SE6 SE7 SE7 8 * Round off approximation Figure SE5-SE7 Dimension Figures for SESD Devices Figure SE5 Figure SE6 SESD0201C CSP Package SESD0402S SOD-923 Package Bottom View A B Side View Bottom View Pad 1 Pad 2 1 D F C 2 G E D E A D Top View Side View A 2 B 1 2 C 1 Pad 1 Pad 2 G F SOD-923 Figure SE7 A B C D RoHS Compliant, ELV Compliant D HF Halogen Free 51 Table SE4 PCB Pad Layout for SESD Devices in Millimeters (Mils)* Part Number SESD0201C SESD0402S SESD0201P NEW SESD0402P NEW L S W Figure 0.28 0.01 0.19 0.01 0.30 0.01 SE8 (11.0 0.40) (7.50 0.40) (11.80 0.40) 0.30 0.01 0.60 0.01 0.40 0.01 (11.80 0.40) (23.60 0.40) (15.70 0.40) 0.28 0.01 0.19 0.01 0.30 0.01 (11.00 0.40) (7.50 0.40) (11.80 0.40) 0.61 0.05 0.52 0.05 0.50 0.05 (24.00 2.00) (21.00 2.00) (20.00 2.00) SE8 SE8 SE8 * Round off approximation Figure SE8 Figure SE9 Figure SE10 Recommended Landing Pattern Typical SESD Protected Signal PC Board Pad2 Pad1 W SESD0402S-005-054 uni-directional board placement cathode anode Pin1 Pin2 Pin1 Orient Pin1 to Pad1 L S L SESD0201C can be oriented either direction Table SE5 Tape and Reel Specifications for SESD Devices 8 Tape Dimension EIA Mark SESD0201C-120-058 Dimension (mm) SESD0402S-005-054 Dimension (mm) A0 0.37 0.03 0.37 0.03 0.66 0.05 B0 0.67 0.03 0.67 0.03 1.06 0.05 D0 1.60 (max) 1.60 (max) 1.60 (max) D1 1.00 (min) 1.00 (min) 1.00 (min) E1 1.75 0.10 1.75 0.10 1.75 0.10 E2 5.85 (min) 5.85 (min) 5.85 (min) F 3.50 0.05 3.50 0.05 3.50 0.05 P0 4.00 0.10 4.00 0.10 4.00 0.10 P1 2.00 0.05 2.00 0.05 2.00 0.05 P2 2.00 0.10 2.00 0.10 2.00 0.10 W 8.00 0.30 8.00 0.30 8.00 0.30 Tape Thickness EIA Mark Dimension (mm) Dimension (mm) Dimension (mm) B1 0.67 0.03 0.67 0.03 1.06 0.05 K0 0.35 0.03 0.35 0.03 0.48 0.05 T 0.60 (max) 0.60 (max) 0.60 (max) T1 0.10 (min) 0.10 (min) 0.10 (min) T2 1.05 0.03 1.05 0.03 1.05 0.03 Dimension (mm) Reel Dimension EIA Mark 52 SESD0201C-006-058 Dimension (mm) Dimension (mm) Dimension (mm) A 178 (max) 178 (max) 178 (max) B 1.60 (min) 1.60 (min) 1.60 (min) C 13.00 0.20 13.00 0.20 13.00 0.20 D 20.20 (min) 20.20 (min) 20.20 (min) N 50.00 (min) 50.00 (min) 50.00 (min) W1 9.15 0.75 9.15 0.75 9.15 0.75 W2 14.40 (max) 14.40 (max) 14.40 (max) W3 10.90 (max) 10.90 (max) 10.90 (max) RoHS Compliant, ELV Compliant HF Halogen Free Silicon ESD Protection Devices Figure SE11 EIA Referenced Taped Component Dimensions for SESD Devices T oD0 P2 T2 P0 [10 pitches cumulative tolerance on tape 0.2mm] E1 A0 F K0 W E2 B0 B1 P1 T1 Center Lines of Cavity Cover Tape B1 is for tape feeder reference only, including draft concentric about B0 oD1 Embossment User Direction of Unreeling Figure SE12 EIA Referenced Reel Dimensions for SESD Devices Full Radius Access Hole at Slot Location (o40mm min.) W3 (Includes flange distortion at outer edge) W2 (Measured at hub) A C D N (Hub diameter, maximum weight of reel and contents = 13.6kg) (Arbor hole diameter) 8 W1 (Measured at hub) B If present, tape slot in core for tape start: 4.5 0.05 width x 10.0mm (min) depth Table SE6 Tape and Reel Specifications for ChipSESD Devices Tape Dimension EIA Mark SESD0201P1BN-0400-090 Dimension (mm) SESD0402P1BN-0450-090 Dimension (mm) A 0.37 0.03 0.58 0.03 B 0.69 0.03 1.20 0.03 D 1.55 0.05 1.55 0.05 E 1.75 0.05 1.75 0.05 F 3.50 0.05 3.50 0.05 W 8.00 0.10 8.00 0.10 P0 4.00 0.10 4.00 0.10 P1 2.00 0.05 2.00 0.05 P2 2.00 0.05 2.00 0.05 T 0.37 0.03 0.57 0.03 0.40 0.03 0.60 0.03 Dimension (mm) Dimension (mm) 178.0 2.0 178.0 2.0 Reel Dimension EIA Mark A B 2.0 0.5 2.0 0.5 C 13.0 0.5 13.0 0.5 D 21.0 0.8 21.0 0.8 E 62.0 1.5 62.0 1.5 F 9.0 0.5 9.0 0.5 G 13.0 1.0 13.0 1.0 RoHS Compliant, ELV Compliant HF Halogen Free 53 Figure SE13 EIA Referenced Taped Component Dimensions for ChipSESD Devices P0 T P2 D E F B A P1 Figure SE14 EIA Referenced Reel Dimensions for ChipSESD Devices G F B C E A D Label 8 Definitions of Terms for SESD Devices IL Reverse Leakage Current @ VRWM VRWM Working Peak Reverse Voltage Vbr Breakdown Voltage @ IT IT Test Current Part Numbering System for SESD Devices SESD 0402 S - 005 - 054 Breakdown Voltage (min) 054 = 5.4V 058 = 5.8V Input Capacitance (typ) 005 = 0.5pF 006 = 0.6pF 120 = 12.0pF Package C = Chip Scale S = SOD-923 EIA Size 0201 0402 Series Silicon ESD 54 RoHS Compliant, ELV Compliant HF Halogen Free W Silicon ESD Protection Devices Part Numbering System for ChipSESD Devices SESD 0201 P1BN - 0400 - 090 Breakdown Voltage (min) 090 = 9.0V Input Capacitance (typ) 0400 = 4.0pF 0450 = 4.5pF N - No Common pin B - Bidirectional 1 - one channel Package P - Packaged SMD EIA Size 0201 0402 Series Silicon ESD 8 Warning : All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies ("TE") makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. TE's only obligations are those in the TE Standard Terms and Conditions of Sale and in no case will TE be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of its products. Specifications are subject to change without notice. In addition, TE Connectivity reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. Without expressed or written consent by an officer of TE, TE does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems. RoHS Compliant, ELV Compliant HF Halogen Free 55 8 56