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Silicon ESD Protection Devices
8
Silicon ESD (SESD) devices help protect electronic
circuits against damage from electrostatic discharge
(ESD) events. The 0201-sized SESD device’s miniature
footprint – measuring 0.6mm x 0.3mm x 0.3mm - is
approximately 70 percent smaller than prior-generation
devices, offering designers flexibility in space-
constrained applications.
The SESD0201C-006-058 device is a bi-directional and
ultra-low capacitance 0.6 picofarad (pF) device that is
suitable for helping to protect very-high-speed data
lines, such as USB and HDMI, or low-voltage antenna
ports. The device’s ultra-low capacitance, low insertion
loss (<0.5dB up to 3GHz), and high linearity of
capacitance versus frequency helps minimize signal
degradation.
The SESD0201C-120-058 (12pF) device and
SESD0201P1BN-0400-090 (4pF) device are higher-
capacitance bi-directional devices that can be used for
low-speed generic interfaces such as keypads, power
buttons, speakers, and microphone ports in portable electronics. Both SESD0201C-006-058 and SESD0201C-120-
058 devices offer 8kV contact and 15kV air discharge protection per the IEC61000-4-2, level 4 standard, while the
SESD0201P1BN-0400-090 device offers 10kV contact and 16kV air discharge protection per the IEC61000-4-2, level
4 standard.
The SESD0402S-005-054 device is an ultra-low-capacitance SOD-923 (0402-size package) uni-directional device
with 0.5pF typical capacitance. This device offers a 10kV contact discharge rating per IEC61000-4-2, level 4 and
can be used with digital applications such as USB and HDMI.
Also included in the product line is the SESD0402P1BN-0450-090 device. This device is a higher-capacitance
(4.5pF), SMD bi-directional device that offers 10kV contact and 16kV air discharge protection per the IEC61000-4-
2, level 4 standard.
• Small size SESD protection diodes for high
speed signals
• ESD protection in space-constrained portable
electronics and mobile handsets
• Helps protect electronic circuits against damage
from ESD
• Assist equipment to pass IEC61000-4-2,
level 4 testing
• RoHS compliant
• Halogen free
(refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm)
• Low-leakage current – 1.0µA (max)
• Capable of withstanding numerous ESD strikes
• Low capacitance and insertion loss
• SOD-923 case epoxy material meets UL 94 V-0
• SESD0402S devices meet MSL-1 requirements
• Mobile phones and portable electronics
• High-speed data lines (low capacitance 0201 and 0402)
• Low-voltage antenna ports (bi-directional 0201)
Silicon ESD Protection Devices
Benefits Features
Applications
• USB 2.0/3.0, HDMI 1.3/1.4, and DisplayPort
• Applications requiring high ESD performance in a
small package
NEW
NE
NE
NE
NE
NE
NE
NE
NE
NE
NE
NE
NE
W
W
W
W
W
W
W
W
W
W
W
W
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50 RoHS Compliant, ELV Compliant HF Halogen Free
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SESD0201C-006-058 ±8 ±15 -40 to +125 -40 to +125 250
SESD0201C-120-058 ±8 ±15 -40 to +125 -40 to +125 250
SESD0402S-005-054 ±10 ±15 -55 to +125 -55 to +150 150
SESD0201P1BN-0400-090 ±10* ±16 -40 to +125 -40 to +125 –
SESD0402P1BN-0450-090 ±10* ±16 -40 to +125 -40 to +125 –
IEC61000-4-2, level 4 (ESD Withstand)
Contact Air
(kV) (kV)
Total Power Dissipation
on FR-4 board†
(mW)
* 10kV @ 50 ± pulses under IEC61000-4-2; 8kV @ 1,000 pulses under IEC61000-4-2
† FR-4 board = 30mm x 30mm x 2mm
Figure SE1
SESD0402S-005-054
Capacitance vs Frequency to 3GHz
Frequency (MHz)
Capacitance (pF)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10 100 1000 10000
Figure SE2
Figure SE1-SE2 Capacitance vs Frequency for SESD Devices
Table SE1 Maximum Ratings for SESD Devices
Temperature
Operating Storage
(°C) (°C)Part Number
SESD0201C-006-058 0.6†0.9 1.0 ±5.8 5.0
SESD0201C-120-058 12.0 13.5 1.0 ±5.8 5.0
SESD0402S-005-054 0.5‡0.9 1.0 +5.4 / -1.0 5.0
SESD0201P1BN-0400-090 4.0 5.0 1.0** 9.0 6.0
SESD0402P1BN-0450-090 4.5 5.5 1.0** 9.0 6.0
Input Capacitance*
Typical Maximum
(pF) (pF)
Leakage Current (max)
IL@ VRWM = 5.0V (µA)Part Number
Table SE2 Electrical Characteristics @T=25°C for SESD Devices
Breakdown Voltage (min)
Vbr @ IT†† = 1mA (V)
Working Reverse Voltage
VRWM @ peak (V)
* @ Vr=0V, f=1MHz
† 0.19pF@f=3GHz
‡ 0.17pF@f=3GHz
** IL@ VRWM = 6.0V (µA)
†† Vbr is measured at test current IT
SESD0201C-006-058
Insertion Loss to 6GHz
Frequency (GHz)
Insertion Loss (dB)
0
-1
-2
-3
-4
-5
Applications Insertion Loss @Frequency (GHz)
HDMI 1.3 (1080p) -0.205 2.25
HDMI 1.3 (max spec) -0.354 3.40
DisplayPort -0.235 2.70
USB 3.0 -0.791 5.00
1 23456
Figure SE3
Figure SE3-SE4 Insertion Loss Diagram for SESD Devices
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B1
1
2
2
12
D
C
E
Bottom View
Top View
SOD-923
Side View
A
F
G
SESD0402S SOD-923 Package
A
A
D E D
B
C
F
G
Bottom View
Side View
Pad 1 Pad 2
Pad 1 Pad 2
SESD0201C CSP Package
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Silicon ESD Protection Devices
RoHS Compliant, ELV Compliant HF Halogen Free
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Part Number ABCDE FGFigure
SESD0201C 0.60 ± 0.03 0.30 ± 0.03 0.27 ± 0.03 0.15 ± 0.03 0.25 ± 0.03 0.25 ± 0.03 0.005 (max) SE5
(23.62 ± 1.20) (11.81 ± 1.20) (10.63 ± 1.20) (5.91 ± 1.20) (9.84 ± 1.20) (9.84 ± 1.20) (0.197) (max)
SESD0402S 1.00 ± 0.05 0.60 ± 0.05 0.37 ± 0.03 0.20 ± 0.05 0.10 ± 0.05 0.80 ± 0.05 0.12 ± 0.05 SE6
(39.37 ± 0.40) (23.62 ± 0.40) (14.57 ± 1.20) (7.87 ± 2.00) (3.94 ± 2.00) (31.50 ± 2.00) (4.72 ± 2.00)
SESD0201P 0.60 ± 0.05 0.30 ± 0.05 0.30 ± 0.05 0.21 ± 0.07 –––SE7
(23.62 ± 2.00) (11.81 ± 2.00) (11.81 ± 2.00) (8.27 ± 2.80) –––
SESD0402P 1.10 ± 0.10 0.50 ± 0.10 0.50 ± 0.10 0.25 ± 0.15 –––SE7
(43.31 ± 0.40) (19.69 ± 4.00) (19.69 ± 4.00) (9.84 ± 6.00) –––
Figure SE5 Figure SE6
Figure SE5-SE7 Dimension Figures for SESD Devices
Table SE3 Dimensions for SESD Devices in Millimeters (Mils)*
Applications Insertion Loss @Frequency (GHz)
HDMI 1.3 (1080p) -0.300 2.25
HDMI 1.3 (max spec) -0.735 3.40
DisplayPort -0.335 2.70
USB 3.0 -1.450 5.00
SESD0402S-005-054
Insertion Loss to 6GHz
Frequency (GHz)
Insertion Loss (dB)
0
-1
-2
-3
-4
-5
123456
Figure SE4
Figure SE3-SE4 Insertion Loss Diagram for SESD Devices
Cont’d
* Round off approximation
A
D
C
B
D
Figure SE7
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52 RoHS Compliant, ELV Compliant HF Halogen Free
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Table SE5 Tape and Reel Specifications for SESD Devices
A00.37 ± 0.03 0.37 ± 0.03 0.66 ± 0.05
B00.67 ± 0.03 0.67 ± 0.03 1.06 ± 0.05
D01.60 (max) 1.60 (max) 1.60 (max)
D11.00 (min) 1.00 (min) 1.00 (min)
E11.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10
E25.85 (min) 5.85 (min) 5.85 (min)
F 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05
P04.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10
P12.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05
P22.00 ± 0.10 2.00 ± 0.10 2.00 ± 0.10
W 8.00 ± 0.30 8.00 ± 0.30 8.00 ± 0.30
Tape Thickness
EIA Mark Dimension (mm) Dimension (mm) Dimension (mm)
B10.67 ± 0.03 0.67 ± 0.03 1.06 ± 0.05
K00.35 ± 0.03 0.35 ± 0.03 0.48 ± 0.05
T 0.60 (max) 0.60 (max) 0.60 (max)
T10.10 (min) 0.10 (min) 0.10 (min)
T21.05 ± 0.03 1.05 ± 0.03 1.05 ± 0.03
Reel Dimension
EIA Mark Dimension (mm) Dimension (mm) Dimension (mm)
A 178 (max) 178 (max) 178 (max)
B 1.60 (min) 1.60 (min) 1.60 (min)
C 13.00 ± 0.20 13.00 ± 0.20 13.00 ± 0.20
D 20.20 (min) 20.20 (min) 20.20 (min)
N 50.00 (min) 50.00 (min) 50.00 (min)
W19.15 ± 0.75 9.15 ± 0.75 9.15 ± 0.75
W214.40 (max) 14.40 (max) 14.40 (max)
W310.90 (max) 10.90 (max) 10.90 (max)
SESD0201C-120-058
Dimension (mm)
SESD0201C-006-058
Dimension (mm)
SESD0402S-005-054
Dimension (mm)
Tape Dimension
EIA Mark
Table SE4 PCB Pad Layout for SESD Devices in Millimeters (Mils)*
Part Number LSW Figure
SESD0201C 0.28 ± 0.01 0.19 ± 0.01 0.30 ± 0.01 SE8
(11.0 ± 0.40) (7.50 ± 0.40) (11.80 ± 0.40)
SESD0402S 0.30 ± 0.01 0.60 ± 0.01 0.40 ± 0.01 SE8
(11.80 ± 0.40) (23.60 ± 0.40) (15.70 ± 0.40)
SESD0201P 0.28 ± 0.01 0.19 ± 0.01 0.30 ± 0.01 SE8
(11.00 ± 0.40) (7.50 ± 0.40) (11.80 ± 0.40)
SESD0402P 0.61 ± 0.05 0.52 ± 0.05 0.50 ± 0.05 SE8
(24.00 ± 2.00) (21.00 ± 2.00) (20.00 ± 2.00)
Pad1
PC Board
Recommended Landing Pattern
SESD0201C can be oriented either direction
W
LSL
Pad2
Figure SE8
* Round off approximation
Pin1
Typical SESD
Protected Signal
Figure SE9
Pin1
cathode anode
Pin2
SESD0402S-005-054
uni-directional board placement
Orient Pin1 to Pad1
Figure SE10
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Silicon ESD Protection Devices
RoHS Compliant, ELV Compliant HF Halogen Free
8
P0
P2
FW
E2
E1
øD1
øD0
Embossment
User Direction of Unreeling
[10 pitches cumulative tolerance
on tape ±0.2mm]
B1is for tape feeder reference only,
including draft concentric about B0
Center Lines of Cavity
Cover Tape
A0
P1
B0
B1
K0
T2
T1
T
Figure SE11 EIA Referenced Taped Component Dimensions for SESD Devices
Table SE6 Tape and Reel Specifications for ChipSESD Devices
A 0.37 ± 0.03 0.58 ± 0.03
B 0.69 ± 0.03 1.20 ± 0.03
D 1.55 ± 0.05 1.55 ± 0.05
E 1.75 ± 0.05 1.75 ± 0.05
F 3.50 ± 0.05 3.50 ± 0.05
W 8.00 ± 0.10 8.00 ± 0.10
P04.00 ± 0.10 4.00 ± 0.10
P12.00 ± 0.05 2.00 ± 0.05
P22.00 ± 0.05 2.00 ± 0.05
T 0.37 ± 0.03 0.57 ± 0.03
0.40 ± 0.03 0.60 ± 0.03
Reel Dimension
EIA Mark Dimension (mm) Dimension (mm)
A 178.0 ± 2.0 178.0 ± 2.0
B 2.0 ± 0.5 2.0 ± 0.5
C 13.0 ± 0.5 13.0 ± 0.5
D 21.0 ± 0.8 21.0 ± 0.8
E 62.0 ± 1.5 62.0 ± 1.5
F 9.0 ± 0.5 9.0 ± 0.5
G 13.0 ± 1.0 13.0 ± 1.0
SESD0402P1BN-0450-090
Dimension (mm)
SESD0201P1BN-0400-090
Dimension (mm)
Tape Dimension
EIA Mark
N
C
A
Full Radius
Access Hole at
Slot Location
(ø40mm min.)
If present,
tape slot in core
for tape start:
4.5 ± 0.05 width x 10.0mm (min) depth
W
2
(Measured at hub)
W
3
(Includes flange distortion at outer edge)
B
W
1
(Measured at hub)
D(Hub diameter,
maximum weight of reel and contents = 13.6kg)
(Arbor hole diameter)
Figure SE12 EIA Referenced Reel Dimensions for SESD Devices
54 RoHS Compliant, ELV Compliant HF Halogen Free
8
Part Numbering System for SESD Devices
SESD 0402 S - 005 - 054
Breakdown Voltage (min)
054 = 5.4V
058 = 5.8V
Input Capacitance (typ)
005 = 0.5pF
006 = 0.6pF
120 = 12.0pF
Package
C = Chip Scale
S = SOD-923
EIA Size
0201
0402
Series
Silicon ESD
Definitions of Terms for SESD Devices
ILReverse Leakage Current @ VRWM
VRWM Working Peak Reverse Voltage
Vbr Breakdown Voltage @ IT
ITTest Current
P0P2
P1
B
FW
T
A
D
E
Figure SE13 EIA Referenced Taped Component Dimensions for ChipSESD Devices
B
D
Label
A
E
C
F
G
Figure SE14 EIA Referenced Reel Dimensions for ChipSESD Devices
55
Silicon ESD Protection Devices
RoHS Compliant, ELV Compliant HF Halogen Free
8
Warning :
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of
and test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of
companies (“TE”) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.TE’s
only obligations are those in the TE Standard Terms and Conditions of Sale and in no case will TE be liable for any incidental, indirect, or
consequential damages arising from the sale, resale, use, or misuse of its products. Specifications are subject to change without notice. In
addition, TE Connectivity reserves the right to make changes to materials or processing that do not affect compliance with any applicable
specification without notification to Buyer. Without expressed or written consent by an officer of TE, TE does not authorize the use of any of its
products as components in nuclear facility applications, aerospace, or in critical life support devices or systems.
Part Numbering System for ChipSESD Devices
SESD 0201 P1BN - 0400 - 090
Breakdown Voltage (min)
090 = 9.0V
Input Capacitance (typ)
0400 = 4.0pF
0450 = 4.5pF
N - No Common pin
B - Bidirectional
1 - one channel
Package
P - Packaged SMD
EIA Size
0201
0402
Series
Silicon ESD
56
8