1 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
SMD B
EAST1005RA1
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS compliant version.
․Compliance with EU REACH.
․Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm).
Description
․The SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density,
reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
DATASHEET
SMD B
EAST1005RA1
2 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Device Selection Guide
Chip
Materials Emitted Color Resin Color
AlGaInP Deep-Red Water Clear
Absolute Maximum Ratings (Ta=25 )℃
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
Forward Current IF 25 mA
Peak Forward Current
(Duty 1/10 @1KHz) IFP 60 mA
Power Dissipation Pd 60 mW
Electrostatic Discharge ESDHBM 2000 V
Operating Temperature Topr -40 ~ +85 ℃
Storage Temperature Tstg -40 ~ +90 ℃
Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
DATASHEET
SMD B
EAST1005RA1
3 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Electro-Optical Characteristics (Ta=25 )℃
Parameter Symbol Min. Typ. Max. Unit Condition
Luminous
Intensity Iv 57.0 ----- 112 mcd
IF=20mA
Viewing Angle 2θ1/2 ----- 120 ----- deg
Peak
Wavelength
λp ----- 650 ----- nm
Dominant
Wavelength λd 633.5 ----- 645.5 nm
Spectrum
Radiation
Bandwidth
△λ ----- 20 ----- nm
Forward
Voltage VF 1.75 ----- 2.35 V
Reverse
Current IR ----- ----- 10 μA VR=5V
Note:
1.Tolerance of Luminous Intensity: ±11%
2.Tolerance of Dominant Wavelength ±1nm
3. Tolerance of Forward Voltage: ±0.05V
DATASHEET
SMD B
EAST1005RA1
4 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Bin Range of Luminous Intensity
Bin Code Min. Max. Unit Condition
P2 57.0 72.0
mcd IF =20mA
Q1 72.0 90.0
Q2 90.0 112.0
Bin Range Of Dom. Wavelength
Bin Code Min. Max. Unit Condition
E8 633.5 637.5
nm IF =20mA
E9 637.5 641.5
E10 641.5 645.5
Bin Range Of Forward Voltage
Bin Code Min. Max. Unit Condition
0 1.75 1.95
V IF =20mA
1 1.95 2.15
2 2.15 2.35
Note:
1.Tolerance of Luminous Intensity: ±11%
2.Tolerance of Dominant Wavelength ±1nm
3. Tolerance of Forward Voltage: ±0.1V
DATASHEET
SMD B
EAST1005RA1
5 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Typical Electro-Optical Characteristics Curves
Ta=25°C
Forward Voltage V (V)
Relative luminous intensity (%)
-60
Forward Current Derating Curve
Ambient Temperature Ta (°C)
Forward Current F
I (mA)
1
10
-20-40 0 20 60
40 10080
Relative luminous intensity (%)
100
1000
Forward Current
Wavelength λ (nm)
Rel. Luminous Intensity vs.
Ambient Temperature
I (mA)
F
Spectrum Distribution Forward Voltage
F
Ta=25°C
Forward Current vs.
10
Relative luminous intensity (%)
1
10
100
1000
Forward Current I (mA)
010110 2
F
Ta=25°C
Rel. Luminous Intensity vs.
Forward Current
Ambient Temperature Ta (°C)
500
25
0
50
75
100
550 600 650 700 1.2
0
10
20
25
30
40
50
2.82.01.6 2.4 3.0
0
10
0
20
30
25
40
50
40
20 60 10085
0°
Radiation Diagram
0.7
0.5 0.3 0.1
0.8
1.0
0.9
40°
80°
0.60.2 0.4
90°
60°
70°
50°
Ta=25°C
10° 20°
30°
DATASHEET
SMD B
EAST1005RA1
6 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Package Dimension
Suggested pad dimension is just for reference only.
Please modify the pad dimension based on individual need.
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
DATASHEET
SMD B
EAST1005RA1
7 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Label Explanation
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Chromaticity Coordinates & Dom. Wavelength Rank
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
DATASHEET
SMD B
EAST1005RA1
8 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label Desiccant Label
Aluminum moisture-proof bag
DATASHEET
SMD B
EAST1005RA1
9 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
Pre-heating
150~200°C
60~120sec.
A bove 217°C
60~150sec.
260°C Max.
10sec. M ax .
6°C/sec.Max.
Above255°C
30sec.Max.
3°C/sec.Max.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less
than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful
because the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head
soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
DATASHEET
SMD B
EAST1005RA1
10 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 19-Sep-2012. Issue No: 1 Rev.1 www.everlightamericas.com
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems,
and medical equipment may require different product. If you have any concerns, please contact
Everlight Americas before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
