NCP2811BMTTXGEVB - ON Semiconductor

November, 2010 − Rev. 3

1Publication Order Number:

NCP2811/D

NCP2811

NOCAPt Advanced Stereo

Headphone Amplifier

NCP2811 is a dual audio power amplifier designed for portable

communication device applications such as mobile phones. This part

is capable of delivering 27 mW of continuous average power into a

16 Ω load from a 2.7 V power supply with a THD+N of 1%.

Based on the power supply delivered to the device, an internal

power management block generates a symmetrical positive and

negative voltage. Thus, the internal amplifiers provide outputs

referenced to Ground. In this True Ground configuration, the two

external heavy coupling capacitors can be removed. It offers

significant space and cost savings compared to a typical stereo

application.

NCP2811 is available with an external adjustable gain (version A),

or with an internal gain of −1.5 V/V (version B). It reaches a superior

−100 dB PSRR and noise floor. Thus, it offers high fidelity audio

sound, as well as a direct connection to the battery. It contains circuitry

to prevent from “Pop & Click” noise that would otherwise occur

during turn−on and turn−off transitions. The device is available in 12

bump CSP package (2 x 1.5 mm) which help to save space on the

board. It is also available in WQFN12 and TSSOP−14 packages.

Features

•True Ground Configuration Output Eliminates DC−Blocking

Capacitors:

− Save Board Area

− Save Component Cost

− No Low−Frequency Response Attenuation

•High PSRR (−100 dB): Direct Connection to the Battery

•“Pop and Click” Noise Protection Circuitry

•Internal Gain (−1.5 V/V) or External Adjustable Gain

•Ultra Low Current Shutdown Mode

•2.7 V – 5.0 V Operation

•Thermal Overload Protection Circuitry

•CSP 2 x 1.5 mm

•WQFN12 3 x 3 mm

•TSSOP−14

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

•Headset Audio Amplifier for

− Cellular Phones

− MP3 Player

− Personal Digital Assistant and Portable Media Player

− Portable Devices

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See detailed ordering and shipping information on page 12 of

this data sheet.

ORDERING INFORMATION

WQFN12

MT SUFFIX

CASE 510AH

2811x

ALYWG

(Note: Microdot may be in either location)

2811xz

AYWW

x = A for NCP2811A

= B for NCP2811B

z = C for backside laminate

A = Assembly Location

Y = Year

WW = Work Week

G= Pb−Free Package

TSSOP−14

DTB SUFFIX

CASE 948G

12 PIN CSP

FC SUFFIX

CASE 499AZ

MARKING

DIAGRAMS

2811

ALYWG

x = A for NCP2811A

= B for NCP2811B

A = Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

G= Pb−Free Package

(Note: Microdot may be in either location)

x = A for NCP2811A

= B for NCP2811B

A = Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

G= Pb−Free Package

NCP2811

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AGND

OUTR A3

OUTL A4

INR

INL

B3 SPVM B4

CPP

PGND C2

CPM

PVM C4

CPP

CPM

1 mF

OUTL

PVM

OUTR

Audio Left

Audio Right

AGND

OUTR A3

OUTL A4

INR

INL

B3 SPVM B4

CPP

PGND C2

CPM

PVM C4

CPP

CPM

OUTL

PVM

OUTR

Audio Left

Audio Right

B version

A version

Figure 1. Application Schematics

1 mF

SD SD

1 mF

AGND

A1 A2 A3 A4

B1 B2 B3 B4

C1 C2 C3 C4

SD OUTR OUTL

VP INL SPVMINR

CPP CPM PVMPGND

(Top View) (Top View)

INR

AGND

CPP

PGND

CPM

OUTL

OUTR

PVM

INL

(Top View)

Figure 2. Pin Configurations

OUTL

OUTR

INR

AGND

INL

CPP

PGND

CPM

PVM

12 PIN CSP TSSOP14

WQFN12

NCP2811

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Figure 3. Typical Application Schematic version A

−

AGND

OUTL

OUTR

CLICK/POP

SUPPRESSION

BIASING

PGND

PVM

CPP CPM

VRM

VRP

VRM

Left

Audio

Right

Audio

SPVM

INL

INR

POWER MANAGEMENT

1 mF

Use 10 ohm

resistor for

capacitive drive

capability

NCP2811

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Figure 4. Typical Application Schematic version B

−

AGND

OUTL

OUTR

CLICK/POP

SUPPRESSION

BIASING

PGND

PVM

CPP CPM

VRM

VRP

VRM

Left

Audio

Right

Audio

INL

INR

POWER MANAGEMENT

1 mF

Use 10 ohm resistor

for capacitive

drive capability

Table 1. PIN FUNCTION DESCRIPTION

CSP

TQFN

PIN TS-

SOP

NAME TYPE DESCRIPTION

A1 7 10 AGND GROUND Analog ground. Connect to ground reference

A2 5 7 SD INPUT Enable activation

A3 10 13 OUTR OUTPUT Right audio channel output signal

A4 11 14 OUTL OUTPUT Left audio channel output signal

B1 12 2 VP POWER Positive supply voltage. It can be connected for example to a Lithium/Ion

battery

B2 8 11 INR INPUT Right input of the first audio source

B3 6 9 INL INPUT Left input of the first audio source

B4 − − SPVM POWER Amplifier negative power supply voltage. Connect to PVM

C1 1 3 CPP INPUT/

OUTPUT

Charge pump flying capacitor positive terminal. A 1 mF ceramic filtering

capacitor to CPM is needed

C2 2 4 PGND GROUND Power ground, connect to ground reference

C3 3 5 CPM INPUT Charge pump flying capacitor negative terminal. A 1 mF ceramic filtering

capacitor to CPP is needed

C4 4 6 PVM OUTPUT Charge pump output. A 1 mF ceramic filtering capacitor to ground is

needed

NCP2811

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Table 2. MAXIMUM RATINGS

Rating Symbol Value Unit

AVIN, PVIN Pins: Power Supply Voltage (Note 2) VP− 0.3 to + 6.0 V

INL, INR Pins: Input (Note 2)

A version

B version

VIN

−VP – 0.3 to VP + 0.3

−2 to +2

SD Pin: Input (Note 2) VYY −0.3 to VP + 0.3 V

Human Body Model (HBM) ESD Rating are (Note 3) ESD HBM 2000 V

Machine Model (MM) ESD Rating are (Note 3) ESD MM 200 V

CSP 1.5 x 2.0 mm package (Notes 6 and 7)

Thermal Resistance Junction to Case

RqJC (Note 7) °C/W

Operating Ambient Temperature Range TA−40 to + 85 °C

Operating Junction Temperature Range TJ−40 to + 125 °C

Maximum Junction Temperature (Note 6) TJMAX + 150 °C

Storage Temperature Range TSTG −65 to + 150 °C

Moisture Sensitivity (Note 5) MSL Level 1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Notes:

1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.

2. According to JEDEC standard JESD22−A108B.

3. This device series contains ESD protection and passes the following tests:

Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.

Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.

4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.

5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.

6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation.

7. The RJA is highly dependent of the PCB Heatsink area. For example, RJA can equal 195°C/W with 50 mm2 total area and also 135°C/W with

50 mm2. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation.

RqCA +

125 *TA

*RqJC

NCP2811

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Table 3. ELECTRICAL CHARACTERISTICS Min & Max Limits apply for TA between −40°C to +85°C and TJ up to + 125°C for VIN

between 2.7 V to 5.0 V (Unless otherwise noted). Typical values are referenced to TA = + 25°C and VIN = 3.6 V.

Symbol Parameter Conditions Min Typ Max Unit

VPOperational Power Supply 2.7 5.0 V

IDD Supply quiescent current Both channels enabled 6.0 mA

ISD Shutdown current VP = 2.7 V to 5.0 V 1mA

VOS Output offset voltage VP = 2.7 V to 5.0 V ±1 mV

VIH High−Level input voltage SD pin 1.2 V

VIL Low−Level input voltage SD pin 0.4 V

RSD SD pin pull−down impedance 190 KW

TWU Turning on time 1 ms

TSD Thermal shutdown temperature 160 °C

VLP Max output swing (peak value) VP = 2.9 V to 5.0 V

Headset ≥ 16 W

THD+N = 1%

1 VRMS

POMax output power (output in phase) VP = 2.7V, THD+N = 1%

Headset = 16 W

VP = 2.7V, THD+N = 1%

Headset = 32 W

VP = 3.6V, THD+N = 1%

Headset = 16 W

VP = 3.6V, THD+N = 1%

Headset = 32 W

VP = 5.0V, THD+N = 1%

Headset = 16 W

VP = 5.0V, THD+N = 1%

Headset = 32 W

110

Crosstalk (Note 8) Headset ≥ 16 W−80 −60 dB

PSRR Power supply rejection ratio (Note 8) VP = 2.7 V to 5.0 V

Input shorted to ground

F = 217 Hz

F = 1 kHz

−106

−95

THD+N Total harmonic distortion + noise (Note 8) Headset = 16 W

POUT = 25 mW

0.01 %

VNOutput noise voltage (Note 8) A−Weighting filter 7mVRMS

ZIN Input impedance B version only 20 KW

ZSD Output impedance in shutdown mode 10 KW

UVLO UVLO threshold Falling edge 2.3 V

UVLOHYST UVLO hysteresis 100 mV

Av Voltage Gain B version only −1.53 −1.5 −1.48 V/V

8. Guaranteed by design and characterized.

NCP2811

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TYPICAL OPERATING CHARACTERISTICS

Figure 5. THD+N vs. Pout @ Vp = 3.6 V Figure 6. THD+N vs. Pout @ Vp = 3.6 V

Pout (mW)

140120100806040200

0.001

0.01

0.1

100

Figure 7. THD+N vs. Pout LEFT Figure 8. THD+N vs. Pout RIGHT

Pout (mW)

140120100806040200

0.001

0.01

0.1

100

Figure 9. THD+N vs. Pout LEFT Figure 10. THD+N vs. Pout RIGHT

THD+N (%)THD (%)

160

16 W in Phase

THD+N_L (%)

THD+N_R (%)

Pout (mW)

140120100806040200

0.001

0.01

0.1

100

THD+N (%)

180

16 W out of Phase

THD+N_L (%)

THD+N_R (%)

Pout (mW)

140120100806040200

0.001

0.01

0.1

100

THD (%)

180

Pout (mW)

140120100806040200

0.001

0.01

0.1

100

THD (%)

180

16 W in Phase

Pout (mW)

140120100806040200

0.001

0.01

0.1

100

THD (%)

180

16 W out of Phase 16 W out of Phase

Vp = 5 V

4.2 V

3.6 V

3.0 V

2.7 V

Vp = 5 V

4.2 V

3.6 V

3.0 V

2.7 V

Vp = 5 V

4.2 V

3.6 V

3.0 V

2.7 V

Vp = 5 V

4.2 V

3.6 V

3.0 V

2.7 V

10 10

160

160 160

160

16 W out of Phase

NCP2811

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TYPICAL OPERATING CHARACTERISTICS

Figure 11. THD+N vs. Pout @ Vp = 3.6 V Figure 12. THD+N vs. Pout @ Vp = 3.6 V

Pout (mW)

706050403020100

0.001

0.01

0.1

100

Figure 13. THD+N vs. Pout LEFT Figure 14. THD+N vs. Pout RIGHT

Figure 15. THD+N vs. Pout LEFT Figure 16. THD+N vs. Pout RIGHT

THD+N (%)

80 100

Pout (mW)

706050403020100

0.001

0.01

0.1

100

THD+N (%)

80 100

Pout (mW)

706050403020100

0.001

0.01

0.1

100

THD (%)

80 100

Pout (mW)

706050403020100

0.001

0.01

0.1

100

THD (%)

80 100

32 W in Phase 32 W out of Phase

32 W in Phase 32 W in Phase

Pout (mW)

706050403020100

0.001

0.01

0.1

100

THD (%)

80 100

Pout (mW)

706050403020100

0.001

0.01

0.1

100

THD (%)

80 100

32 W out of Phase 32 W out of Phase

THD+N_L (%)

THD+N_R (%)

THD+N_L (%)

THD+N_R (%)

Vp = 5 V

4.2 V

3.6 V

3.0 V

2.7 V

Vp = 5 V

4.2 V

3.6 V

3.0 V

2.7 V

Vp = 5 V

4.2 V

3.6 V

3.0 V

2.7 V

Vp = 5 V

4.2 V

3.6 V

3.0 V

2.7 V

NCP2811

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TYPICAL OPERATING CHARACTERISTICS

Figure 17. THD vs. Frequency LEFT

@ Pout = 32 mW

Figure 18. THD vs. Frequency RIGHT

@ Pout = 32 mW

FREQUENCY (Hz)

100,00010,0001,00010010

0.001

0.01

0.1

Figure 19. THD vs. Frequency LEFT

@ Pout = 32 mW

Figure 20. THD vs. Frequency RIGHT

@ Pout = 32 mW

Figure 21. Maximum Output Power LEFT vs.

VP (THD+N < 1%)

Figure 22. Maximum Output Power LEFT vs.

VP (THD+N < 0.1%)

VP (V) VP (V)

4.74.23.73.22.7

100

120

140

4.74.23.73.22.7

THD+N (%)(mW)

(mW)

16 W out of Phase

VP = 2.7 V

VP = 3.6 V

VP = 5.0 V

FREQUENCY (Hz)

100,00010,0001,00010010

0.001

0.01

0.1

THD+N (%)

16 W out of Phase

FREQUENCY (Hz)

100,00010,0001,00010010

0.001

0.01

0.1

THD+N (%)

32 W out of Phase

FREQUENCY (Hz)

10,0001,00010010

0.001

0.01

0.1

THD+N (%)

32 W out of Phase

100,000

−40°C

25°C

85°C

−40°C

25°C

85°C

VP = 2.7 V

VP = 3.6 V

VP = 5.0 V

VP = 2.7 V

VP = 3.6 V

VP = 5.0 V

VP = 2.7 V

VP = 3.6 V

VP = 5.0 V

NCP2811

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TYPICAL OPERATING CHARACTERISTICS

Figure 23. PSRR at Vp = 3.6 V Figure 24. Crosstalk vs. Frequency

@ Vp = 3.6 V

FREQUENCY (Hz)

10,000100010010

−120

−100

−60

−20

PSRR (dB)

100,000

−40

−80

FREQUENCY (Hz)

10,000100010010

−110

−100

−95

−80

−65

−60

(dB)

100,000

−70

−75

−85

−90

−105

−115

−120

NCP2811B Left

Right to Left

Left to Right

NCP2811B Right

NCP2811

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DETAIL OPERATING DESCRIPTION

Detailed Descriptions

The NCP2811 is a stereo headphone amplifier with a true

ground architecture. This architecture eliminates the need to

use 2 external big capacitors required by conventional

headphone amplifier.

The structure of the NCP2811 is basically composed of 2

true ground amplifiers, an UVLO, a short circuit protection

and also a thermal shutdown. A special circuitry is

embedded to eliminate any pop and click noise that occurs

during turn on and turn off time. The A version has an

external gain selectable by two resistor, B version has a gain

of 1.5 V/V.

NOCAPt

NOCAPt is a patented architecture which requires only

2 small ceramic capacitors. It generates a symmetrical

positive and negative voltage and it allows the output of the

amplifiers to be biased around the ground.

Current Limit Protection Circuit

The NCP2811 embed a protection circuitry against short

to ground. When an output is shorted to GND and when a

signal appears at the input, the current is limited to 300 mA.

Thermal Overload Protection

Internal amplifiers are switched off when the temperature

exceed 160°C, and will be switch on again when the

temperature decrease below 140°C.

Under Voltage Lockout

When the battery voltage decreases below 2.3 V, the

amplifiers are turned off. The hysteresis to turn on it again

is 100 mV.

Pop and Click Suppression Circuitry

The NCP2811 includes a special circuitry to eliminate any

pop and click noise during turn on and turn off time. Basic

amplifier creates an offset during these transitions at the

output which give a parasitic noise called “pop and click

noise”. The NCP2811 eliminates this problem.

Gain Setting Resistor Selection (Rin & Rf, A version

only)

Rin and Rf set the closed loop gain of the amplifier. A low

gain configuration (close to 1) minimizes the THD + noise

values and maximizes the signal to noise ratio.

A closed loop gain in the range of 1 to 10 is recommended

to optimize overall system performance.

The formula to calculate the gain is:

Av +*

Rin

Input Capacitor Selection

The input coupling capacitor blocks the DC voltage at the

amplifier input terminal. This capacitor creates a high−pass

filter with Rin (externally selectable for A version, 20 kW for

B version).

The size of the capacitor must be large enough to couple

in low frequencies without severe attenuation in the audio

bandwith (20 Hz – 20 kHz).

The cut off frequency for the input high−pass filter is:

Fc+1

2pRinCin

A Fc < 20 Hz is recommended.

Charge Pump Capacitor Selection

Use ceramic capacitor with low ESR for better

performances. X5R / X7R capacitor is recommended.

The flying capacitor (C2) serves to transfer charge during

the generation of the negative voltage.

The CPVM capacitor (C3) must be equal at least to the

CFly capacitor to allow maximum transfer charge. The

CPVM value must not exceed 1 mF. Higher capacitor value

can damage the part.

Table 4 suggests typical value and manufacturer:

Table 4.

Value Reference Package Manufacturer

1 mFC1005X5R0J105K 0402 TDK

1 mFGRM155R60J105K19 0402 Murata

Lower value of capacitors can be used but the maximum

output power is reduced and the device may not operate to

specifications.

Power Supply Decoupling Capacitor (C1)

The NCP2811 is a True Ground amplifier which requires

the adequate decoupling capacitor to reduce noise and

THD+N. Use X5R / X7R ceramic capacitor and place it

closed to the CPVDD pin. A value of 1 mF is recommended.

Shutdown Function

The device enters in shutdown mode when shutdown signal

is low. During the shutdown mode, the DC quiescent current

of the circuit does not exceed 500 nA. In this configuration,

the output impedance is 10 kW on each output.

Output Resistor for Capacitive Drive Capability

Under normal operation, NCP2811 maximum direct

capacitive load is in the 80 pF range. If, for any reason, high

value capacitive loads should be connected to NCP2811

outputs, an additional 10 W resistor should be placed

between the NCP2811 output and the capacitive load to

ensure amplifier stability.

Layout Recommendation

Connect C1 as close as possible of the Vp pin.

Connect C2 and C3 as close as possible of the NCP2811.

Route audio signal and AGND far from Vp, CPP, CPM,

PVM and PGND to avoid any perturbation due to the

switching.

NCP2811

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Table 5. ORDERING INFORMATION

Device Package Shipping†

NCP2811ADTBR2G TSSOP−14

(Pb−Free)

2500/Tape & Reel

NCP2811BDTBR2G TSSOP−14

(Pb−Free)

2500/Tape & Reel

NCP2811AFCT1G Flip−Chip 12

(Pb−Free)

3000/Tape & Reel

NCP2811BFCT1G Flip−Chip 12

(Pb−Free)

3000/Tape & Reel

NCP2811BFCCT1G Flip−Chip 12

(Backside Laminate Coating)

(Pb−Free)

3000/Tape & Reel

NCP2811AMTTXG WQFN12

(Pb−Fre)

3000/Tape & Reel

NCP2811BMTTXG WQFN12

(Pb−Free)

3000/Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

PACKAGE DIMENSIONS

12 PIN FLIP−CHIP, 2.0x1.5, 0.5P

CASE 499AZ−01

ISSUE O

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

DIM

MIN MAX

0.54

MILLIMETERS

D2.00 BSC

b0.29 0.34

e0.50 BSC

0.60

PIN A1

REFERENCE

A0.05 BC

0.03 C

0.05 C

12X b

1 234

0.10 C

0.21 0.27

e/2

0.10 C

12X

NOTE 3

TOP VIEW

SIDE VIEW

BOTTOM VIEW

0.33 0.39

E1.50 BSC

SOLDERING FOOTPRINT*

0.5

PACKAGE

12X 0.25

PITCH 0.5

PITCH

OUTLINE

NCP2811

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PACKAGE DIMENSIONS

WQFN12 3x3, 0.5P

CASE 510AH−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

ÇÇÇ

C0.10

PIN ONE

REFERENCE

TOP VIEW

SIDE VIEW

BOTTOM VIEW

C0.10

A1 SEATING

PLANE

12X

NOTE 3

12X

0.10 C

0.05 C

ABB

DIM MIN MAX

MILLIMETERS

A0.65 0.85

A1 0.00 0.05

b0.20 0.30

D3.00 BSC

D2 1.30 1.50

E3.00 BSC

E2 1.30 1.50

e0.50 BSC

K0.20 −−−

L0.30 0.50

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

PITCH

1.50 3.30

DIMENSIONS: MILLIMETERS

0.63

12X

NOTE 4

0.30

12X

DETAIL A

A3 0.22 REF

13X

DETAIL B

DETAIL A

ALTERNATE

CONSTRUCTIONS

ÉÉ

ÇÇ

ÇÇÇ

ÉÉÉ

DETAIL B

MOLD CMPDEXPOSED Cu

ALTERNATE

CONSTRUCTIONS L1 0.00 0.15

OUTLINE

PACKAGE

NCP2811

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PACKAGE DIMENSIONS

TSSOP−14

CASE 948G−01

ISSUE B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.50 0.60 0.020 0.024

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL

IN EXCESS OF THE K DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

U0.15 (0.006) T

2X L/2

0.10 (0.004) V S

L−U−

SEATING

PLANE

0.10 (0.004)

−T−

ÇÇÇ

SECTION N−N

DETAIL E

JJ1

ÉÉÉ

DETAIL E

−W−

0.25 (0.010)

PIN 1

IDENT.

U0.15 (0.006) T

−V−

14X REFK

7.06

14X

0.36 14X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT

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