OLED-020O002A-LPP5N00000 - VISHAY

OLED-020O002A-LPP5N00000

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20 x 2 Character OLED

FEATURES

• Type: character

• Display format: 20 x 2 characters

• Built-in controller: SSD1311

• Duty cycle: 1/16

• +5 V power supply

• Interface: 6800

• With polarizer

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Notes

• All the above voltages are on the basis of “VSS = 0 V”

• When this module is used beyond the above absolute maximum

ratings, permanent breakage of the module may occur. Also,

for normal operations, it is desirable to use this module under

the conditions according to “Electrical Characteristics”. If this

module is used beyond these conditions, malfunctioning of the

module can occur and the reliability of the module may

deteriorate

Note

• When you use 5 V for VDD please do not use 3 V or 3.3 V for logic I/O this will cause module does not work

MECHANICAL DATA

ITEM STANDARD VALUE UNIT

Module dimension 84.5 x 19.28 x 2.17

Viewing area 75.52 x 13.52

Active area 73.52 x 11.52

Dot size 0.62 x 0.67

Dot pitch 0.65 x 0.70

Mounting hole n/a

Character size 3.22 x 5.57

Character pitch 3.70 x 5.95

ABSOLUTE MAXIMUM RATINGS

ITEM SYMBOL STANDARD VALUE UNIT

MIN. MAX.

Supply voltage

for logic VDD to VSS -0.3 6.0 V

Input voltage VI-0.3 VDD V

Operating

temperature TOP -40 +80

°C

Storage

temperature TSTG -40 +80

ELECTRICAL CHARACTERISTICS

ITEM SYMBOL CONDITION STANDARD VALUE UNIT

MIN. TYP. MAX.

Supply voltage for logic VDD to VSS - 4.8 5.0 5.3

Supply voltage for display VCC -8910

Input high voltage VIH - 0.8 VDD --

Input low voltage VIL - - - 0.2 VDD

Output high voltage VOH IOH = -0.5 mA 0.9 VDD --

Output low voltage VOL IOL = 0.5 mA - - 0.1 VDD

50 % check board operating current ICC VCC = 9 V 141518mA

OPTIONS

EMITTING COLOR

YELLOW GREEN RED BLUE WHITE

Yes----

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INTERFACE PIN FUNCTION

PIN NO. SYMBOL PIN TYPE DESCRIPTION

1 NC - No connection

SL P

This is segment voltage (output low level) reference pin.

When external VSL is not used, this pin should be left open. When external VSL is used, connect with

resistor and diode to ground (details depend on application).

SS P Ground pin. It must be connected to external ground.

4REG V

DD I

Internal VDD regulator selection pin in 5 V I/O application mode. When this pin is pulled “high”,

internal VDD regulator is enabled (5 V I/O application).

When this pin is pulled “low”, internal VDD regulator is disabled (low voltage I/O application).

5SHLCI

This pin is used to determine the common output scanning direction.

COM scan direction

SHLC COM scan direction

0 COM0 to COM31 (normal)

1 COM31 to COM0 (reverse)

Notes

• 0 is connected to VSS

• 1 is connected to VDDI/O

6SHLSI

This pin is used to change the mapping between the display data column address and the segment

driver. SEG scan direction

SHLS SEG direction

1 SEG0 to SEG99 (normal)

0 SEG99 to SEG0 (reverse)

Notes

• 0 is connected to VSS

• 1 is connected to VDDI/O

DD P

Power supply for core logic operation. VDD can be supplied externally or regulated internally.

In LV I/O application (internal VDD is disabled), this is a power input pin.

In 5 V I/O application (internal VDD is enabled), VDD is regulated internally from VDDI/O.

A capacitor should be connected between VDD and VSS under all circumstances.

DDI/O P

Low voltage power supply and power supply for interface logic level in both low voltage I/O and

5 V I/O application. It should match with the MCU interface voltage level and must be connected to

external source.

9BS0

MCU bus interface selection pins. Select appropriate logic setting as described in the following

table. BS2, BS1 and BS0 are pin select. Bus Interface selection.

10 BS1

11 BS2

BS [2:0] Interface

000 Serial interface

001 Invalid

010 I2C

011 Invalid

100 8-bit 6800 parallel

101 4-bit 6800 parallel

110 8-bit 8080 parallel

111 4-bit 8080 parallel

Notes

• 0 is connected to VSS

• 1 is connected to VDDI/O

12 GPIO I/O It is a GPIO pin. Details refer to OLED command DCh.

13 CS# I

This pin is the chip select input connecting to the MCU. The chip is enabled for MCU communication

only when CS# is pulled “low” (active “low”).

In I2C mode, this pin must be connected to VSS.

14 RES# I

This pin is reset signal input.

When the pin is pulled “low”, initialization of the chip is executed. Keep this pin pull “high” during

normal operation.

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15 D / C# I

This pin is data / command control pin connecting to the MCU. When the pin is pulled “high”, the

data at D [7:0] will be interpreted as data.

When the pin is pulled “low”, the data at D [7:0] will be transferred to a command register.

In I2C mode, this pin acts as SA0 for slave address selection. When serial interface is selected, this

pin must be connected to VSS.

16 R / W#

(WR#) I

This pin is read / write control input pin connecting to the MCU interface.

When 6800 interface mode is selected, this pin will be used as read / write (R / W#) selection input.

Read mode will be carried out when this pin is pulled “high” and write mode when “low”.

When 8080 interface mode is selected, this pin will be the write (WR#) input. Data write operation is

initiated when this pin is pulled “low” and the chip is selected.

When serial or I2C interface is selected, this pin must be connected to VSS.

17 E (RD#) I

This pin is MCU interface input.

When 6800 interface mode is selected, this pin will be used as the enable (E) signal. Read / write

operation is initiated when this pin is pulled “high” and the chip is selected.

When 8080 interface mode is selected, this pin receives the read (RD#) signal. Read operation is

initiated when this pin is pulled “low” and the chip is selected.

When serial or I2C interface is selected, this pin must be connected to VSS.

18 D0

I/O

These pins are bi-directional data bus connecting to the MCU data bus.

Unused pins are recommended to tie “low”.

When serial interface mode is selected, D0 will be the serial clock input: SCLK; D1 will be the serial

data input: SID and D2 will be the serial data output: SOD.

When I2C mode is selected, D2, D1 should be tied together and serve as SDAout, SDAin in

application and D0 is the serial clock input, SCL.

19 D1

20 D2

21 D3

22 D4

23 D5

24 D6

25 D7

26 IREF IThis pin is the segment output current reference pin. IREF is supplied externally. A resistor should be

connected between this pin and VSS to maintain current of around 15 μA.

27 ROM0

These pins are used to select character ROM; select appropriate logic setting as described in the

following table. ROM1 and ROM0 are pin select as shown in below table.

Character ROM selection

ROM1 ROM0 ROM

00A

01B

28 ROM1

10C

1 1 S / W selectable

Notes

• 0 is connected to VSS

• 1 is connected to VDDI/O

29 OPR0

This pin is used to select the character number of character generator.

Character RAM selection

OPR1 OPR0 CGROM CGRAM

112560

012488

30 OPR1

102506

002408

Notes

• 0 is connected to VSS

• 1 is connected to VDDI/O

31 VCOMH PCOM signal deselected voltage level. A capacitor should be connected between this pin and VSS.

No external power supply is allowed to connect to this pin.

32 VCC PPower supply for panel driving voltage. This is also the most positive power voltage supply pin. It is

supplied by external high voltage source.

33 NC - No connection

INTERFACE PIN FUNCTION

PIN NO. SYMBOL PIN TYPE DESCRIPTION

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DIMENSIONS in millimeters

The non-specied tolerance of dimension is ± 0.3 mm

73.52 (AA)

75.52 (VA)

79.50 ± 0.2 (Polarizer)

80.50 ± 0.2

84.50 ± 0.2

11.52 (AA)

13.52 (VA)

19.28 ± 0.2

3.88

2.88

0.50

3.70

3.20

0.50

10.00 23.80 ± 0.2

P0.7 x 32 = 22.40 ± 0.05

0.40

22.00

(Alignment mark)

10.00 ± 0.3

2 x R 0.50

118.30

13.75±0.3

3.60 ± 0.2

1.80 ± 0.3

0.10 ± 0.03

0.90

133

2 x Ø 0.80 ± 0.1

0.62

0.65

3.22

3.70

0.67

0.70

5.57

5.95

SCALE: 3/1

Segment 10

(Column 80)

Segment 50

(Column 79)

Common 15

(Row 16) Common 0

(Row 1)

Segment 99

(Column 1)

Segment 49

(Column 2)

0.10±0.03

2.17 ± 0.1

Contact side

Protective tape

11 x 8 x 0.05 mm

Remove tape

t = 0.15 mm max.

Polarizer

t = 0.21 mm

Contact side

31.13

2.20

1.89

(Reference mechnical design)

0.48

0.38

Shade chip t = 0.16 mm

18.28 ± 0.2 (Polarizer)

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MODULE CLASSIFICATION INFORMATION

OLED - 020 O 002 A - L P P 5 N 0 0 000

1 2345 678910111213

1 Brand Vishay Intertechnology, Inc.

2 Horizontal format 20 characters

3 Display type

H: graphic type

N: character type

O: COG type

Y: tab type

4 Vertical format 2 lines

5 Serials code A

6Emitting color

A: amber

B: blue

C: full color

G: green

L: yellow

R: red

W: white

Y: yellow green

7Polarizer N: without polarizer

P: with polarizer

8 Display mode A: active matrix

P: passive matrix

9 Driver voltage 3: 3.0 V to 3.3 V

5: 5.0 V

10 Touch panel N: without touch panel

T: with touch panel

11 Products type

0: standard

1: sunlight readable

2: transparent OLED (TOLED)

3: flexible OLED

4: OLED for lighting

12 Product grades

0: standard (A level)

2: B level

3: C level

4: high class (AA level)

5: customer offerings

13 Serial number Application serial number (000 to ZZZ)

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FUNCTION BLOCK DIAGRAM

GENERAL SPECIFICATIONS

ITEM DIMENSION UNIT

Number of characters 20 characters x 2 lines

Module dimension 84.5 x 19.28 x 2.17 mm

View area 75.52 x 13.52 mm

Active area 73.52 x 11.52 mm

Dot size 0.62 x 0.67 mm

Dot pitch 0.65 x 0.70 mm

Character size 3.22 x 5.57 mm

Character pitch 3.70 x 5.95 mm

Panel type OLED, yellow

Duty 1/16

IC SSD1311

Display position 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

DD RAM address 000102030405060708090A0B0C0D0E0F10111213

DD RAM address 404142434445464748494A4B4C4D4E4F50515253

COM1 to COM20

MPU

68 series

SSD1311

controller IC

20 x 2 OLED

SEG1 to SEG80

DB0 to DB7

R / W

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Notes

• Life time is defined the amount of time when the luminance has decayed to < 50 % of the initial value

• This analysis method uses life data obtained under accelerated conditions to extrapolate an estimated probability density function (PDF) for

the product under normal use conditions

• Screen saving mode will extend OLED lifetime

OPTICAL CHARACTERISTICS

ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT

View angle (V)θ160 - - deg

(H)ϕ160 - -

Contrast ratio CR Dark 2000 : 1 - - -

Response time trise -10-μs

tfall -10-μs

Display with 50 % check board brightness 120 130 - cd/m2

CIEx (yellow) (CIE1931) 0.45 0.47 0.49

CIEy (yellow) (CIE1931) 0.48 0.50 0.52

OLED LIFETIME

ITEM CONDITIONS MIN. TYP.

Operating life time TA = 25 °C, initial 50 % check board brightness typical value 50 000 h -

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Note

• Supply voltage for OLED system = operating voltage at 25 °C

TEST AND MEASUREMENT CONDITIONS

1. All measurements shall not be started until the specimens attain to temperature stability. After the completion of the

described reliability test, the samples were left at room temperature for 2 hours prior to conducting the failure test at

23 °C ± 5 °C, 55 % ± 15 % RH

2. All-pixels-on is used as operation test pattern

3. The degradation of polarizer are ignored for high temperature storage, high temperature / humidity storage, temperature

cycle

EVALUATION CRITERIA

4. The function test is OK

5. No observable defects

6. Luminance: > 50 % of initial value

7. Current consumption: within ± 50 % of initial value

APPENDIX: RESIDUE IMAGE

Because the pixels are lighted in different time, the luminance of active pixels may reduce or differ from inactive pixels.

Therefore, the residue image will occur. To avoid the residue image, every pixel needs to be lighted up uniformly.

RELABILITY

ENVIRONMENTAL TEST

TEST ITEM CONTENT OF TEST TEST CONDITION

High temperature storage Endurance test applying the high storage temperature for a

long time 80 °C, 240 h

Low temperature storage Endurance test applying the low storage temperature for a

long time -40 °C, 240 h

High temperature operation Endurance test applying the electric stress (voltage and

current) and the thermal stress to the element for a long time 80 °C, 240 h

Low temperature operation Endurance test applying the electric stress under low

temperature for a long time -40 °C, 240 h

High temperature /

humidity storage

Endurance test applying the high temperature and high

humidity storage for a long time 60 °C, 90 % RH, 240 h

Temperature cycle

Endurance test applying the low and high temperature cycle

-40 °C / 80 °C, 100 cycles

-40 °C 25 °C 80 °C

30 min 5 min 30 min

1 cycle

MECHANICAL TEST

Vibration test Endurance test applying the vibration during transportation

and using

10 Hz to 22 Hz for 1.5 mm peak-to-peak,

22 Hz to 500 Hz for 1.5 g,

total 0.5 h

Shock test Constructional and mechanical endurance test applying the

shock during transportation

50 g half sin wave 11 ms,

3 times of each direction

Atmospheric pressure test Endurance test applying the atmospheric pressure during

transportation by air 115 mbar, 40 h

OTHERS

Static electricity test Endurance test applying the electric stress to the terminal VS = ± 600 V (contact), ± 800 V (air),

RS = 330 Ω, CS = 150 pF, 10 times

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INSPECTION SPECIFICATION

NO. ITEM CRITERION AQL

01 Electrical testing

1.1 Missing vertical, horizontal segment, segment contrast defect

0.65

1.2 Missing character, dot or icon

1.3 Display malfunction

1.4 No function or no display

1.5 Current consumption exceeds product specifications

1.6 OLED viewing angle defect

1.7 Mixed product types

1.8 Contrast defect

Black or white

spots on OLED

(display only)

2.1 White and black spots on display ≤ 0.25 mm, no more than three white or black spots present

2.5

2.2 Densely spaced: no more than two spots or lines within 3 mm

OLED black spots,

white spots,

contamination

(non-display)

3.1 Round type: as following drawing

Φ = (x + y) / 2

2.5

SIZE ACCEPTABLE QTY

Φ ≤ 0.10 Accept no dense

0.10 < Φ ≤ 0.20 2

0.20 < Φ ≤ 0.25 1

0.25 < Φ0

3.2 Line type

(as following drawing)

2.5

LENGTH WIDTH ACCEPTABLE QTY

-W ≤ 0.02 Accept no dense

L ≤ 3.0 0.02 < W ≤ 0.03 2

L ≤ 2.5 0.03 < W ≤ 0.05

- 0.05 < W As round type

04 Polarizer bubbles

If bubbles are visible, judge using black spot

specifications, not easy to find, must check in

specify direction.

2.5

SIZE ΦACCEPTABLE QTY

Φ ≤ 0.20 Accept no dense

0.20 < Φ ≤ 0.50 3

0.50 < Φ ≤ 1.00 2

1.00 < Φ0

Total QTY 3

05 Scratches Follow no. 3 OLED black spots, white spots, contamination

06 Chipped glass

Symbols:

2.5

x: chip length y: chip width z: chip thickness

k: seal width t: glass thickness a: OLED side length

l: electrode pad length

6.1 General glass chip:

6.1.1 Chip on panel surface and crack between panels:

z: chip thickness y: chip width x: chip length

z ≤ 1/2 t Not over viewing area x ≤ 1/8 a

1/2 t < z ≤ 2 t Not exceed 1/3 k x ≤ 1/8 a

Note

• If there are 2 or more chips, x is total length of each chip

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06 Chipped glass

6.1.2 Corner crack:

2.5

z: chip thickness y: chip width x: chip length

z ≤ 1/2 t Not over viewing area x ≤ 1/8 a

1/2 t < z ≤ 2 t Not exceed 1/3 k x ≤ 1/8 a

Note

• If there are 2 or more chips, x is total length of each chip

06 Glass crack

Symbols:

2.5

x: chip length y: chip width z: chip thickness

k: seal width t: glass thickness a: OLED side length

l: electrode pad length

6.2 Protrusion over terminal:

6.2.1 Chip on electrode pad:

y: chip width x: chip length z: chip thickness

y ≤ 0.5 mm x ≤ 1/8 a 0 < z ≤ t

6.2.2 Non-conductive portion:

y: chip width x: chip length z: chip thickness

y ≤ lx ≤ 1/8 a 0 < z ≤ t

Notes

• If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected

according to electrode terminal specifications

• If the product will be heat sealed by the customer, the alignment mark not be damaged

6.2.3 Substrate protuberance and internal crack:

y: width x: length

y ≤ 1/3 l x ≤ a

07 Cracked glass The OLED with extensive crack is not acceptable 2.5

INSPECTION SPECIFICATION

NO. ITEM CRITERION AQL

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08 Backlight elements

8.1 Illumination source flickers when lit 0.65

8.2 Spots or scratched that appear when lit must be judged. Using OLED spot, lines and

contamination standards 2.5

8.3 Backlight does not light or color wrong 0.65

09 Bezel 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination 2.5

9.2 Bezel must comply with job specifications 0.65

10 PCB, COB

10.1 COB seal may not have pinholes larger than 0.2 mm or contamination 2.5

10.2 COB seal surface may not have pinholes through to the IC 2.5

10.3 The height of the COB should not exceed the height indicated in the assembly diagram 0.65

10.4 There may not be more than 2 mm of sealant outside the seal area on the PCB. And there

should be no more than three places 2.5

10.5 No oxidation or contamination PCB terminals 2.5

10.6 Parts on PCB must be the same as on the production characteristic chart. There should be

no wrong parts, missing parts or excess parts 0.65

10.7 The jumper on the PCB should conform to the product characteristic chart 0.65

10.8 If solder gets on bezel tab pads, OLED pad, zebra pad or screw hold pad, make sure it is

smoothed down 2.5

11 Soldering

11.1 No un-melted solder paste may be present on the PCB 2.5

11.2 No cold solder joints, missing solder connections, oxidation or icicle 2.5

11.3 No residue or solder balls on PCB 2.5

11.4 No short circuits in components on PCB 0.65

12 General appearance

12.1 No oxidation, contamination, curves or, bends on interface pin (OLB) of TCP 2.5

12.2 No cracks on interface pin (OLB) of TCP 0.65

12.3 No contamination, solder residue or solder balls on product 2.5

12.4 The IC on the TCP may not be damaged, circuits 2.5

12.5 The uppermost edge of the protective strip on the interface pin must be present or look as

if it cause the interface pin to sever 2.5

12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into

brown or black color 2.5

12.7 Sealant on top of the ITO circuit has not hardened 2.5

12.8 Pin type must match type in specification sheet 0.65

12.9 OLED pin loose or missing pins 0.65

12.10 Product packaging must the same as specified on packaging specification sheet 0.65

12.11 Product dimension and structure must conform to product specification sheet 0.65

INSPECTION SPECIFICATION

NO. ITEM CRITERION AQL

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CHECK ITEM CLASSIFICATION CRITERIA

No display Major

Missing line Major

Pixel short Major

Darker short Major

Wrong display Major

Un-uniform

B/A x 100 % < 70 %

A/C x 100 % < 70 %

Major

Light pixel

Dark pixel

Normal

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PRECAUTIONS IN USE OF OLED MODULES

MODULES

1. Avoid applying excessive shocks to module or making any alterations or modifications to it

2. Do not make extra holes on the printed circuit board, modify its shape or change the components of OLED display module

3. Do not disassemble the OLED display module

4. Do not operate it above the absolute maximum rating

5. Do not drop, bend or twist OLED display module

6. Soldering: only to the I/O terminals

7. Storage: please storage in anti-static electricity container and clean environment

8. It is pretty common to use “screen saver” to extend the lifetime and do not use fix information for long time in real application

9. Do not use fixed information in OLED panel for long time, that will extend “screen burn” effect time

10. Vishay has the right to change the passive components, including R2 and R3 adjust resistors. (Resistors, capacitors, and

other passive components will have different appearance and color caused by the different supplier)

11. Vishay have the right to change the PCB Rev. (In order to satisfy the supplying stability, management optimization, and the

best product performance... etc, under the premise of not affecting the electrical characteristics and external dimensions,

Vishay have the right to modify the version)

HANDLING PRECAUTIONS

1. Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position

2. If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick

the organic substance

3. If pressure is applied to the display surface or its neighborhood of the OLED display module, the cell structure may be

damaged and be careful not to apply pressure to these sections

4. The polarizer covering the surface of the OLED display module is soft and easily scratched. Please be careful when handling

the OLED display module

5. When the surface of the polarizer of the OLED display module has soil, clean the surface. It takes advantage of by using

following adhesion tape

• Scotch mending tape no. 810 or an equivalent

Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since

the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the

polarizer:

•Water

•Ketone

• Aromatic solvents

6. Hold OLED display module very carefully when placing OLED display module into the system housing. Do not apply

excessive stress or pressure to OLED display module. And, do not over bend the film with electrode pattern layouts. These

stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases

7. Do not apply stress to the LSI chips and the surrounding molded sections

8. Do not disassemble nor modify the OLED display module

9. Do not apply input signals while the logic power is off

OLED-020O002A-LPP5N00000

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Revision: 10-Aug-17 14 Document Number: 37818

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10. Pay sufficient attention to the working environments when handing OLED display modules to prevent occurrence of element

breakage accidents by static electricity

• Be sure to make human body grounding when handling OLED display modules

• Be sure to ground tools to use or assembly such as soldering irons

• To suppress generation of static electricity, avoid carrying out assembly work under dry environments

• Protective film is being applied to the surface of the display panel of the OLED display module. Be careful since static

electricity may be generated when exfoliating the protective film

11. Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At

this time, if the OLED display module has been stored for a long period of time, residue adhesive material of the protection

film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by

the method introduced in the above no. 5

12. If electric current is applied when the OLED display module is being dewed or when it is placed under high humidity

environments, the electrodes may be corroded and be careful to avoid the above

STORAGE PRECAUTIONS

1. When storing OLED display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor

to lights of fluorescent lamps and, also, avoiding high temperature and high humidity environment or low temperature (less

than 0 °C) environments. We recommend you to store these modules in the packaged state when they were shipped from

Vishay. At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them

2. If electric current is applied when water drops are adhering to the surface of the OLED display module, when the OLED

display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and

be careful about the above

DESIGNING PRECAUTIONS

1. The absolute maximum ratings are the ratings which cannot be exceeded for OLED display module, and if these values are

exceeded, panel damage may be happen

2. To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same

time, to make the signal line cable as short as possible

3. We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD) (recommend value: 0.5 A)

4. Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices

5. As for EMI, take necessary measures on the equipment side basically

6. When fastening the OLED display module, fasten the external plastic housing section

7. If power supply to the OLED display module is forcibly shut down by such errors as taking out the main battery while the

OLED display panel is in operation, we cannot guarantee the quality of this OLED display module

• Connection (contact) to any other potential than the above may lead to rupture of the IC

PRECAUTIONS WHEN DISPOSING OF THE OLED DISPLAY MODULES

1. Request the qualified companies to handle industrial wastes when disposing of the OLED display modules. Or, when burning

them, be sure to observe the environmental and hygienic laws and regulations

OTHER PRECAUTIONS

1. When an OLED display module is operated for a long of time with fixed pattern may remain as an after image or slight

contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be

restored. Also, there will be no problem in the reliability of the module

2. To protect OLED display modules from performance drops by static electricity rapture, etc., do not touch the following

sections whenever possible while handling the OLED display modules

• Pins and electrodes

• Pattern layouts such as the TCP and FPC

3. With this OLED display module, the OLED driver is being exposed. Generally speaking, semiconductor elements change

their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OLED driver

is exposed to light, malfunctioning may occur

• Design the product and installation method so that the OLED driver may be shielded from light in actual usage

• Design the product and installation method so that the OLED driver may be shielded from light during the inspection

processes

OLED-020O002A-LPP5N00000

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Revision: 10-Aug-17 15 Document Number: 37818

For technical questions, contact: displays@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

4. Although this OLED display module stores the operation state data by the commands and the indication data, when

excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take

appropriate measures to suppress noise generation or to protect from influences of noise on the system design

5. We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the

commands and re-transference of the display data) to cope with catastrophic noise

6. Resistors, capacitors, and other passive components will have different appearance and color caused by the different

supplier

7. Our company will has the right to upgrade and modify the product function

8. The limitation of FPC bending

Display area

min. 2 mm

R = 1.5 mm

Legal Disclaimer Notice

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Revision: 01-Jan-2021 1Document Number: 91000

Disclaimer

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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over

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including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

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