PC7447AVGHY1420NC - E2V Technologies (UK), Ltd.

Features

•3000 Dhrystone 2.1 MIPS at 1.3 GHz

•Selectable Bus Clock (30 CPU Bus Dividers up to 28x)

•Selectable MPx/60x Interface Voltage (1.8V, 2.5V)

•PD Typically 18W at 1.33 GHz at VDD = 1.3V; 8.0W at 1 GHz at VDD = 1.1V

Full Operating Conditions

•Nap, Doze and Sleep Power Saving Modes

•Superscalar (Four Instructions Fetched Per Clock Cycle)

•4 GB Direct Addressing Range

•Virtual Memory: 4 Hexabytes (252)

•64-bit Data and 36-bit Address Bus Interface

•Integrated L1: 32 KB Instruction and 32 KB Data Cache

•Integrated L2: 512 KB

•11 Independent Execution Units and three Register Files

•Write-back and Write-through Operations

•fINT Max = 1.33 GHz (1.42 GHz to be Confirmed)

•fBUS Max = 133 MHz/166 MHz

Description

The PC7447A host processor is a high-performance, low-power, 32-bit implementa-

tions of the PowerPC® Reduced Instruction Set Computer (RISC) architecture

combined with a full 128-bit implementation of Freescale®’s AltiVec™ technology.

This microprocessor is ideal for leading-edge embedded computing and signal pro-

cessing applications. The PC7447A features 512 KB of on-chip L2 cache. The

PC7447A microprocessor has no backside L3 cache, allowing for a smaller package

designed as a pin-for-pin replacement for the PC7447 microprocessor. This device

benefits from a silicon-on-insulator (SOI) CMOS process technology, engineered to

help deliver tremendous power savings without sacrificing speed. A low-power version

of the PC7447A microprocessor is also available.

Figure 1-1 on page 2 shows a block diagram of the PC7447A. The core is a high-per-

formance superscalar design supporting a double-precision floating-point unit and a

SIMD multimedia unit. The memory storage subsystem supports the MPX bus proto-

col and a subset of the 60x bus protocol to the main memory and other system

resources.

Note that the PC7447A is a footprint-compatible, drop-in replacement in a PC7447

application if the core power supply is 1.3V.

Screening

•Full Military Temperature Range (TJ = -55°C, +125°C)

•Industrial Temperature Range (TJ = -40°C, +110°C)

GH suffix

HITCE 360

PowerPC 7447A

RISC

Microprocessor

PC7447A

Preliminary

Rev. 5387C–HIREL–05/06

5387C–HIREL–05/06

PC7447A [Preliminary]

1. Block Diagram

Figure 1-1. PC7447A Microprocessor Block Diagram

Additional Features

• Time Base Counter/Decrementer

Clock Multiplier

JTAG/COP Interface

Thermal/Power Management

Performance Monitor

Dynamic Frequency Switching (DFS)

Temperature Dioder

x ÷

FPSCR

+ x ÷

Instruction Unit Instruction Queue

(12-Word)

96-Bit (3 Instructions)

Reservation

32-Bit

Floating-

Point Unit

64-Bit

Load/Store Unit

(EA Calculation)

Finished

32-Bit

Completion Unit

(16-Entry)

36-bit 64-bit

Stations (2)

FPR File

16 Rename

Buffers

GPR File

16 Rename

Buffers

VR File

16 Rename

Buffers

64-Bit

128-Bit

Completes up

SRs

(Shadow)

128-Entry

ITLB

Stores

Load Miss

CTR

Vector Touch Engine

32-Bit

L1 Castout

Status

L2 Store Queue (L2SQ)

Vector

FPU

Vector

Integer

Unit 1

Vector

Integer

Unit 2

Vector

Permute

Unit

Status

Block 1 (32-Byte)

Memory Subsystem

Snoop Push/

Interventions

L1 Castouts

Bus Accumulator

L1 Push

(4)

to three

per clock

instructions

L1 Load Queue (LLQ)

L1 Load Miss (5)

Instruction Fetch (2)

Cacheable Store Request (1)

L1 Service

Queues

L1 Store Queue

(LSQ)

L2 Prefetch (3)

Address Bus Data Bus

Castout

Queue (9) /

Push

Queue (10)2

Bus Store Queue

Load

Queue (11)

Completion Queue

Reservation

Station

Reservation

Station

Reservation

Station

Reservation

Station

Branch Processing Unit

BTIC (128-Entry)

BHT (2048-Entry)

VR Issue

(4-Entry/2-Issue)

GPR Issue

(6-Entry/3-Issue)

FPR Issue

(2-Entry/1-Issue)

Fetcher

Dispatch

Unit

Instruction MMU

IBAT Array

Data MMU

DBAT Array

128-Bit (4 Instructions)

Tags 32-Kbyte

I Cache

32-Kbyte

D Cache

Tags

Block 0 (32-Byte)

System Bus Interface

Notes: The castout queue and push queue share resources such for a combined total of entries.

The castout queue itself is limited to 9 entries, ensuring 1 entry will be available for a push.

Integer

Unit 2

Reservation

Stations (2)

Reservation

Station

Integer

Unit 1

(3)

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PC7447A [Preliminary]

2. Features

This section summarizes features of the PC7447A implementation of the PowerPC architecture.

Major features of the PC7447A are as follows:

• High-performance, superscalar microprocessor

– Up to four instructions can be fetched from the instruction cache at a time

– Up to 12 instructions can be in the instruction queue (IQ)

– Up to 16 instructions can be at some stage of execution simultaneously

– Single-cycle execution for most instructions

– One instruction per clock cycle throughput for most instructions

– Seven-stage pipeline control

• Eleven independent execution units and three register files

– Branch processing unit (BPU) features static and dynamic branch prediction

128-entry (32-set, four-way set-associative) branch target instruction cache (BTIC),

a cache of branch instructions that have been encountered in branch/loop code

sequences. If a target instruction is in the BTIC, it is fetched into the instruction

queue a cycle sooner than it can be made available from the instruction cache.

Typically, a fetch that hits the BTIC provides the first four instructions in the target

stream.

2048-entry branch history table (BHT) with two bits per entry for four levels of

prediction: not taken, strongly not taken, taken, and strongly taken

Up to three outstanding speculative branches

Branch instructions that do not update the count register (CTR) or link register (LR)

are often removed from the instruction stream

Eight-entry link register stack to predict the target address of Branch Conditional to

Link Register (BCLR) instructions

– Four integer units (IUs) that share 32 GPRs for integer operands

Three identical IUs (IU1a, IU1b, and IU1c) can execute all integer instructions except

multiply, divide, and move to/from special-purpose register instructions.

IU2 executes miscellaneous instructions including the CR logical operations, integer

multiplication and division instructions, and move to/from special-purpose register

instructions.

– Five-stage FPU and a 32-entry FPR file

Fully IEEE® 754-1985-compliant FPU for both single- and double-precision

operations

Supports non-IEEE mode for time-critical operations

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PC7447A [Preliminary]

Hardware support for denormalized number

Thirty-two 64-bit FPRs for single- or double-precision operands

– Four vector units and 32-entry vector register file (VRs)

Vector permute unit (VPU)

Vector integer unit 1 (VIU1) handles short-latency AltiVec™ integer instructions,

such as vector add instructions (for example, vaddsbs, vaddshs, and vaddsws).

Vector integer unit 2 (VIU2) handles longer-latency AltiVec integer instructions, such

as vector multiply add instructions (for example, vmhaddshs, vmhraddshs, and

vmladduhm).

Vector floating-point unit (VFPU)

– Three-stage load/store unit (LSU)

Supports integer, floating-point, and vector instruction load/store traffic

Four-entry vector touch queue (VTQ) supports all four architectures of the AltiVec

data stream operations

Three-cycle GPR and AltiVec load latency (byte, half word, word, vector) with one-

cycle throughput

Four-cycle FPR load latency (single, double) with one-cycle throughput

No additional delay for misaligned access within double-word boundary

Dedicated adder calculates effective addresses (EAs)

Supports store gathering

Performs alignment, normalization, and precision conversion for floating-point data

Executes cache control and TLB instructions

Performs alignment, zero padding, and sign extension for integer data

Supports hits under misses (multiple outstanding misses)

Supports both big- and little-endian modes, including misaligned little-endian

accesses

• Three issue queues, FIQ, VIQ, and GIQ, can accept as many as one, two, and three

instructions, respectively, in a cycle. Instruction dispatch requires the following:

– Instructions can only be dispatched from the three lowest IQ entries: IQ0, IQ1, and

IQ2

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PC7447A [Preliminary]

– A maximum of three instructions can be dispatched to the issue queues per clock

cycle

– Space must be available in the CQ for an instruction to dispatch (this includes

instructions that are assigned a space in the CQ but not in an issue queue)

• Rename buffers

– 16 GPR rename buffers

– 16 FPR rename buffers

– 16 VR rename buffers

• Dispatch unit

– Decode/dispatch stage fully decodes each instruction

• Completion unit

– The completion unit retires an instruction from the 16-entry completion queue (CQ)

when all instructions ahead of it have been completed, the instruction has finished

execution, and no exceptions are pending

– Guarantees sequential programming model (precise exception model)

– Monitors all dispatched instructions and retires them in order

– Tracks unresolved branches and flushes instructions after a mispredicted branch

– Retires as many as three instructions per clock cycle

• Separate on-chip L1 instruction and data caches (Harvard Architecture)

– 32-Kbyte, eight-way set-associative instruction and data caches

– Pseudo least-recently-used (PLRU) replacement algorithm

– 32-byte (eight-word) L1 cache block

– Physically indexed/physical tags

– Cache write-back or write-through operation programmable on a per-page or per-

block basis

– Instruction cache can provide four instructions per clock cycle; data cache can

provide four words per clock cycle

– Caches can be disabled in software

– Caches can be locked in software

– MESI data cache coherency maintained in hardware

– Separate copy of data cache tags for efficient snooping

– Parity support on cache and tags

– No snooping of instruction cache except for icbi instruction

– Data cache supports AltiVec LRU and transient instructions

– Critical double- and/or quad-word forwarding is performed as needed. Critical quad-

word forwarding is used for AltiVec loads and instruction fetches. Other accesses

use critical double-word forwarding.

• Level 2 (L2) cache interface

– On-chip, 512-Kbyte, eight-way set-associative unified instruction and data cache

– Fully pipelined to provide 32 bytes per clock cycle to the L1 caches

– A total nine-cycle load latency for an L1 data cache miss that hits in L2

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PC7447A [Preliminary]

– Cache write-back or write-through operation programmable on a per-page or per-

block basis 64-byte, two-sectored line size

– Parity support on cache

• Separate memory management units (MMUs) for instructions and data

– 52-bit virtual address, 32- or 36-bit physical address

– Address translation for 4-Kbyte pages, variable-sized blocks, and 256-Mbyte

segments

– Memory programmable as write-back/write-through, caching-inhibited/caching-

allowed, and memory coherency enforced/memory coherency not enforced on a

page or block basis

– Separate IBATs and DBATs (eight each) also defined as SPRs

– Separate instruction and data translation look aside buffers (TLBs)

Both TLBs are 128-entry, two-way set-associative, and use a LRU replacement

algorithm

TLBs are hardware- or software-reloadable (that is, a page table search is

performed in hardware or by system software on a TLB miss).

• Efficient data flow

– Although the VR/LSU interface is 128 bits, the L1/L2 bus interface allows up to 256

bits

– The L1 data cache is fully pipelined to provide 128 bits/cycle to or from the VRs

– L2 cache is fully pipelined to provide 256 bits per processor clock cycle to the L1

cache

– As many as eight outstanding, out-of-order, cache misses are allowed between the

L1 data cache and the L2 bus

– As many as 16 out-of-order transactions can be present on the MPX bus

– Store merging for multiple store misses to the same line. Only coherency action

taken (address-only) for store misses merged to all 32 bytes of a cache block (no

data tenure needed)

– Three-entry finished store queue and five-entry completed store queue between the

LSU and the L1 data cache

– Separate additional queues for efficient buffering of outbound data (such as castouts

and write-through stores) from the L1 data cache and L2 cache

• Multiprocessing support features include the following:

– Hardware-enforced, MESI cache coherency protocols for data cache

– Load/store with reservation instruction pair for atomic memory references,

semaphores, and other multiprocessor operations

• Power and thermal management

– A new dynamic frequency switching (DFS) feature allows the processor core

frequency to be halved through software to reduce power consumption

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PC7447A [Preliminary]

– The following three power-saving modes are available to the system:

Nap: Instruction fetching is halted. Only the clocks for the time base, decrementer,

and JTAG logic remain running. The part goes into the doze state to snoop memory

operations on the bus and then back to nap using a QREQ/QACK processor-system

handshake protocol.

Sleep: Power consumption is further reduced by disabling bus snooping, leaving

only the PLL in a locked and running state. All internal functional units are disabled.

Deep sleep: When the part is in the deep Sleep state, the system can disable the

PLL. The system can then disable the SYSCLK source for greater system power

savings. Power-on reset procedures for restarting and relocking the PLL must be

followed upon exiting the deep sleep state.

– Instruction cache throttling provides control of instruction fetching to limit device

temperature

– A new temperature diode that can determine the temperature of the microprocessor

• Performance monitor can be used to help debug system designs and improve software

efficiency

• In-system testability and debugging features through JTAG boundary-scan capability

• Testability

– LSSD scan design

– IEEE 1149.1 JTAG interface

– Array built-in self test (ABIST), factory test only

• Reliability and serviceability

– Parity checking on system bus

– Parity checking on the L1 and L2 caches

3. General Parameters

Table 3-1 provides a summary of the general parameters of the PC7477A.

Table 3-1. Device Parameters

Parameter Description

Technology 0.13 µm CMOS, nine-layer metal

Die size 8.51 mm × 9.86 mm

Transistor count 48.6 million

Logic design Fully-static

Packages Surface mount 360 ceramic ball grid array

(HITCE)

Core power supply 1.3V ± 50 mV and 1.1V ± 50 mV DC nominal

I/O power supply 1.8V ± 5% DC, or 2.5V ±5% DC

5387C–HIREL–05/06

PC7447A [Preliminary]

4. Signal Description

Figure 4-1. PC7447A Microprocessor Signal Groups

Note: For the PC7447A, there are 5 PLL_CFG signals, (PLL_CFG[0:4]

PC7447A

INT

SMI

MCP

SRESET

HRESET

CKSTP_IN

CKSTP_OUT

TBEN

QREQ

QACK

BVSEL

BMODE[0:1]

PMON_IN

PMON_OUT

SYSCLK

PLL_CFG[0:3](2)

PLL_EXT

EXT_QUAL

CLK_OUT

TCK

TDI

TDO

TMS

TRST

A[0:35]

AP[0:4]

TT[0:4]

TBST

TSIZ[0:2]

GBL

AACK

ARTRY

SHD0/SHD1

HIT

DBG

DTI[0:3]

DRDY

D[0:63]

DP[0:7]

TEA

Address

Arbitration

Address

Transfer

Address

Transfer

Attributes

Address

Transfer

Termination

Data

Arbitration

Data

Transfer

Data

Transfer

Termination

Interrupts/Resets

Processor

Status/Control

Clock Control

Test Interface

(JTAG)

AVDD

GND

VDD

OVDD

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PC7447A [Preliminary]

5. Detailed Specification

This specification describes the specific requirements for the microprocessor PC7447A in com-

pliance with Atmel standard screening.

6. Applicable Documents

1. MIL-STD-883: Test methods and procedures for electronics

2. MIL-PRF-38535: Appendix A: General specifications for microcircuits

The microcircuits are in accordance with the applicable documents and as specified herein.

6.1 Design and Construction

6.1.1 Terminal Connections

Depending on the package, the terminal connections are as shown in Table 8-1, Table 6-2 and

Figure 4-1.

6.2 Absolute Maximum Ratings

The tables in this section describe the PC7447A DC electrical characteristics. Table 6-1 pro-

vides the absolute maximum ratings.

Notes: 1. Functional and tested operating conditions are given in Table 6-2 on page 10. Absolute maximum ratings are stress ratings

only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability

or cause permanent damage to the device.

2. Caution: VDD/AVDD must not exceed OVDD by more than 1V during normal operation; this limit may be exceeded for a maxi-

mum of 20 ms during the power-on reset and power-down sequences.

3. Caution: OVDD must not exceed VDD/AVDD by more than 2V during normal operation; this limit may be exceeded for a maxi-

mum of 20 ms during the power-on reset and power-down sequences.

4. BVSEL must be set to 0, such that the bus is in 1.8V mode.

5. BVSEL must be set to HRESET or 1, such that the bus is in 2.5V mode.

6. Caution: VIN must not exceed OVDD by more than 0.3V at any time including during power-on reset.

7. VIN may overshoot/undershoot to a voltage and for a maximum duration shown in Figure 6-1 on page 10.

Table 6-1. Absolute Maximum Ratings(1)

Symbol Characteristic Maximum Value Unit

VDD(2) Core supply voltage -0.3 to 1.60 V

AVDD(2) PLL supply voltage -0.3 to 1.60 V

OVDD(3)(4)

Processor bus supply voltage BVSEL = 0 -0.3 to 1.95 V

OVDD(3)(5) BVSEL = HRESET or OVDD -0.3 to 2.7 V

VIN(6)(7)

Input voltage Processor bus -0.3 to OVDD + 0.3 V

VIN JTAG signals -0.3 to OVDD + 0.3 V

TSTG Storage temperature range -55 to 150 °C

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PC7447A [Preliminary]

6.3 Recommended Operating Conditions

Table 6-2 provides the recommended operating conditions for the PC7447A.

Notes: 1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not

guaranteed.

2. This voltage is the input to the filter discussed in Section ”PLL Power Supply Filtering” on page 40 and not necessarily the

voltage at the AVDD pin, which may be reduced from VDD by the filter.

Figure 6-1. Overshoot/Undershoot Voltage

The PC7447A provides several I/O voltages to support both compatibility with existing systems

and migration to future systems. The PC7447A core voltage must always be provided at a nom-

inal 1.3V (see Table 6-2 on page 10 for the actual recommended core voltage). The input

voltage threshold for each bus is selected by sampling the state of the voltage select pins at the

negation of the signal HRESET. The output voltage will swing from GND to the maximum volt-

age applied to the OVDD power pins. Table 6-3 on page 11 provides the input threshold voltage

settings. Because these settings may change in future products, it is recommended that BVSEL

be configured using resistor options, jumpers, or some other flexible means, with the capability

to reconfigure the termination of this signal in the future if necessary.

Table 6-2. Recommended Operating Conditions(1)

Symbol Characteristic

Recommended Value

UnitMin Max

VDD Core supply voltage 1.3V ± 50 mV or 1.1V ± 50 mV V

AVDD(2) PLL supply voltage 1.3V ± 50 mV or 1.1V ± 50 mV V

OVDD Processor bus supply

voltage

BVSEL = 0 1.8V ± 5%

OVDD

BVSEL = HRESET or

OVDD

2.5V ± 5%

VIN Input voltage Processor bus GND OVDD V

VIN JTAG signals GND OVDD

TJDie-junction temperature -55 125°C°C

GND

GND – 0.3V

GND – 0.7V

Not to exceed 10% of tSYSCLK

OVDD + 20%

OVDD + 5%

OVDD

VIH

VIL

5387C–HIREL–05/06

PC7447A [Preliminary]

Notes: 1. Caution: The input threshold selection must agree with the OVDD voltages supplied. See notes in Table 6-1 on page 9.

2. If used, pull-down resistors should be less than 250Ω.

6.4 Thermal Characteristics

6.4.1 Package Characteristics

Notes: 1. See ”Thermal Management Information” on page 12 for details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-

ture, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.

3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

4. Per JEDEC JESD51-6 with the board horizontal.

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

6. This is the thermal resistance between the die and the case top surface as measured with the cold plate method (MIL

SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

6.4.2 Internal Package Conduction Resistance

For the exposed-die packaging technology described in Table 6-4 on page 11, the intrinsic con-

duction thermal resistance paths are as follows:

• The die junction-to-case thermal resistance (the case is actually the top of the exposed

silicon die)

• The die junction-to-ball thermal resistance

Figure 9-2 depicts the primary heat transfer path for a package with an attached heat sink

mounted to a printed-circuit board.

Table 6-3. Input Threshold Voltage Setting(1)

BVSEL Signal Processor Bus Input Threshold is Relative to: Notes

01.8V(2)

¬HRESET Not available

HRESET 2.5V

12.5V

Table 6-4. Package Thermal Characteristics(1)

Symbol Characteristic Value Unit

RθJA(2)(3) Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board 26 °C/W

RθJMA(2)(4) Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board 19 °C/W

RθJMA(2)(4) Junction-to-ambient thermal resistance, 200 ft./min. airflow, single-layer (1s) board 20 °C/W

RθJMA(2)(4) Junction-to-ambient thermal resistance, 200 ft./min. airflow, four-layer (2s2p) board 16 °C/W

RθJB(5) Junction-to-board thermal resistance 10 °C/W

RθJC(6) Junction-to-case thermal resistance < 0.1 °C/W

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PC7447A [Preliminary]

Figure 6-2. C4 Package with Heat Sink Mounted to a Printed-Circuit Board

Note the internal versus external package resistance.

Heat generated on the active side of the chip is conducted through the silicon, through the heat

sink attach material (or thermal interface material), and finally to the heat sink where it is

removed by forced-air convection.

Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be

neglected for a first-order analysis. Thus, the thermal interface material and the heat sink con-

duction/convective thermal resistances are the dominant terms.

6.4.3 Thermal Management Information

This section provides thermal management information for the high coefficient of the thermal

expansion ceramic ball grid array (HITCE) package for air-cooled applications. Proper thermal

control design is primarily dependent on the system-level design – the heat sink, airflow, and

thermal interface material. The PC7447A implements several features designed to assist with

thermal management, including DFS and the temperature diode. DFS reduces the power con-

sumption of the device by reducing the core frequency; see Table 6-6 on page 19 for specific

information regarding power reduction and DFS. The temperature diode allows an external

device to monitor the die temperature in order to detect excessive temperature conditions and

alert the system; see section ”Temperature Diode” on page 16 for more information.

To reduce the die-junction temperature, heat sinks may be attached to the package by several

methods – spring clips to holes in the printed-circuit board or package, and mounting clips and

screw assembly (see Figure 6-3); however, due to the potentially large mass of the heat sink,

attachment through the printed-circuit board is suggested. If a spring clip is used, the spring

force should not exceed ten pounds.

External Resistance

Internal Resistance

Radiation Convection

Heat Sink

Thermal Interface Material

Die/Package

Die Junction

Package/Leads

Printed-Circuit Board

Radiation Convection

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PC7447A [Preliminary]

Figure 6-3. Package Exploded Cross-sectional View with Several Heat Sink Options

6.4.4 Thermal Interface Materials

A thermal interface material is recommended at the package lid-to-heat sink interface to mini-

mize the thermal contact resistance. For those applications where the heat sink is attached by

spring clip mechanism, Figure 6-4 on page 14 shows the thermal performance of three thin-

sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint

with thermal grease as a function of contact pressure.

As shown, the performance of these thermal interface materials improves with increasing con-

tact pressure.

The use of thermal grease significantly reduces the interface thermal resistance. That is, the

bare joint results in a thermal resistance approximately seven times greater than the thermal

grease joint.

Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-

circuit board (see Figure 6-3 on page 13). Therefore, synthetic grease offers the best thermal

performance, considering the low interface pressure, and is recommended due to the high

power dissipation of the PC7447A. Of course, the selection of any thermal interface material

depends on many factors – thermal performance requirements, manufacturability, service tem-

perature, dielectric properties, cost, and so on.

Printed-Circuit Board

Thermal Interface

Material

Heat Sink

Clip

Heat Sink HCTE Package

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PC7447A [Preliminary]

Figure 6-4. Thermal Performance of Select Thermal Interface Material

6.4.4.1 Heat Sink Selection Example

For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:

TJ = TI + Tr + (RθJC + Rθint + Rθsa) × Pd

where:

TJ is the die-junction temperature

Ti is the inlet cabinet ambient temperature

Tr is the air temperature rise within the computer cabinet

RθJC is the junction-to-case thermal resistance

Rθint is the adhesive or interface material thermal resistance

Rθsa is the heat sink base-to-ambient thermal resistance

Pd is the power dissipated by the device

0.5

1.5

010 20304050607080

Silicone Sheet (0.006 in.)

Bare Joint

Floroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

Specific Thermal Resistance (K-in.2/W)

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PC7447A [Preliminary]

During operation, the die-junction temperatures (TJ) should be maintained less than the value

specified in Table 6-2 on page 10. The temperature of air cooling the component greatly

depends on the ambient inlet air temperature and the air temperature rise within the electronic

cabinet. An electronic cabinet inlet-air temperature (Ti) may range from 30° to 40°C. The air tem-

perature rise within a cabinet (Tr) may be in the range of 5° to 10°C. The thermal resistance of

the thermal interface material (Rθint) is typically about 1.5°C/W. For example, assuming a Ti of

30°C, a Tr of 5°C, an HITCE package RθJC = 0.1, and a typical power consumption (Pd) of

18.7W, the following expression for TJ is obtained:

Die-junction temperature: TJ = 30°C + 5°C + (0.1°C/W + 1.5°C/W + θsa) × 18.7W

For this example, a Rθsa value of 2.1°C/W or less is required to maintain the die junction temper-

ature below the maximum value of Table 6-2 on page 10.

Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a com-

mon figure-of-merit used for comparing the thermal performance of various microelectronic

packaging technologies, one should exercise caution when only using this metric in determining

thermal management because no single parameter can adequately describe three-dimensional

heat flow. The final die-junction operating temperature is not only a function of the component-

level thermal resistance, but the system-level design and its operating conditions. In addition to

the component's power consumption, a number of factors affect the final operating die-junction

temperature – airflow, board population (local heat flux of adjacent components), heat sink effi-

ciency, heat sink attach, heat sink placement, next-level interconnect technology, system air

temperature rise, altitude, and so on.

Due to the complexity and variety of system-level boundary conditions for today's microelec-

tronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,

and conduction) may vary widely. For these reasons, we recommend using conjugate heat

transfer models for the board, as well as system-level designs.

For system thermal modeling, the PC7447A thermal model is shown in Figure 6-5 on page 16.

Four volumes represent this device. Two of the volumes, solder ball-air and substrate, are mod-

eled using the package outline size of the package. The other two, die, and bump-underfill, have

the same size as the die. The silicon die should be modeled 9.5 × 9.5 × 0.7 mm with the heat

source applied as a uniform source at the bottom of the volume. The bump and underfill layer is

modeled as 7.3 × 9.3 × 0.7 mm (or as a collapsed volume) with orthotropic material properties:

0.6 W/(m × K) in the xy-plane and 1.9 W/(m × K) in the direction of the z-axis. The substrate vol-

ume is 25 × 25 × 1.2 mm, and has 8.1 W/(m × K) isotropic conductivity in the xy-plane and 4

W/(m × K) in the direction of the z-axis. The solder ball and air layer are modeled with the same

horizontal dimensions as the substrate and are 0.6 mm thick. They can also be modeled as a

collapsed volume using orthotropic material properties: 0.034 W/(m × K) in the xy-plane direction

and 3.8 W/(m × K) in the direction of the z-axis.

5387C–HIREL–05/06

PC7447A [Preliminary]

Figure 6-5. Recommended Thermal Model of PC7447A

6.4.4.2 Temperature Diode

The PC7447A has a temperature diode on the microprocessor that can be used in conjunction

with other system temperature monitoring devices. These devices use the negative temperature

coefficient of a diode operated at a constant current to determine the temperature of the micro-

processor and its environment. For proper operation, the monitoring device used should auto-

calibrate the device by canceling out the VBE variation of each PC7447A’s internal diode.

The following are the specifications of the PC7447A on-board temperature diode:

Vf > 0.40V

Vf < 0.90V

Operating range 2 - 300 µA

Diode leakage < 10 nA at 125°C

Ideality factor over 5 µA – 150 µA at 60°C: 1 <= n <= TBD

Ideality factor is defined as the deviation from the ideal diode equation:

Another useful equation is:

Bump and Underfill

Die

Substrate

Solder and Air

Die

Substrate

Side View of Model (Not to Scale)

Conductivity Value Unit

Bump and Underfill (7.3 x 9.3 x 0.070 mm)

W/(m x K)

Substrate (25 x 25 x 1.2 mm)

Solder Ball and Air (25 x 25 x 0.6 mm)

kx0.6

ky0.6

kz1.9

kx8.1

ky8.1

kz4.0

0.034

3.8

IfW Ise

qVf

nKT

-----------

1–=

VHVL

–nKT

------- InIH

-----

5387C–HIREL–05/06

PC7447A [Preliminary]

Where:

Ifw = Forward current

Is = Saturation current

Vd = Voltage at diode

Vf = Voltage forward biased

VH = Diode voltage while IH is flowing

VL = Diode voltage while IL is flowing

IH = Larger diode bias current

IL = Smaller diode bias current

q = Charge of electron (1.6 × 10-19 C)

n = Ideality factor (normally 1.0)

K = Boltzman’s constant (1.38 × 10-23 Joules/K)

T = Temperature (Kelvins)

The ratio of IH to IL is usually selected to be 10:1. The above simplifies to the following:

VH - VL = 1.986 × 10-4 × nT

Solving for T, the equation becomes:

6.4.4.3 Dynamic Frequency Switching (DFS)

The new DFS feature in the PC7447A adds the ability to divide the processor-to-system bus

ratio by two during normal functional operation by setting the HID1[DFS1] bit. The frequency

change occurs in 1 clock cycle, and no idle waiting period is required to switch between modes.

Additional information regarding DFS can be found in the MPC7450 RISC Microprocessor Fam-

ily User’s Manual.

6.4.4.4 Power Consumption with DFS Enabled

Power consumption with DFS enabled can be approximated using the following formula:

Where:

PDFS = Power consumption with DFS enabled

fDFS = Core frequency with DFS enabled

f = Core frequency prior to enabling DFS

P = Power consumption prior to enabling DFS (see Table 6-6 on page 19)

PDS = Deep sleep mode power consumption (see Table 6-6 on page 19)

The above is an approximation only. Power consumption with DFS enabled is not tested or

guaranteed.

nT VHV–L

1 986 10 4–

×,

---------------------------------=

PDFS fDFS

-----------PP

–()

PDS

5387C–HIREL–05/06

PC7447A [Preliminary]

6.4.4.5 Bus-to-Core Multiplier Constraints with DFS

DFS is not available for all bus-to-core multipliers as configured by PLL_CFG[0:4] during hard

reset. Specifically, because the PC7447A does not support quarter clock ratios or the 1x multi-

plier, the DFS feature is limited to integer PLL multipliers of 4x and higher. The complete listing

is shown in Table 6-5 on page 18.

Table 6-5. Valid Divide Ratio Configurations

Bus-to-Core Multiplier Configured by

PLL_CFG[0:4] (see Table 12-1 on page 39)

Bus-to-Core Multiplier with

HID1[DFS1] = 1 (÷2)

2x N/A

3x N/A

4x 2x

5x 2.5x

5.5x 2x

6x 3x

6.5x N/A

7x 3.5x

7.5x N/A

8x 4x

8.5x N/A

9x 4.5x

9.5x N/A

10x 5x

10.5x N/A

11x 5.5x

11.5x N/A

12x 6x

12.5x N/A

13x 6.5x

13.5x N/A

14x 7x

15x 7.5x

16x 8x

17x 8.5x

18x 9x

20x 10x

21x 10.5x

24x 12x

28x 14x

5387C–HIREL–05/06

PC7447A [Preliminary]

6.4.4.6 Minimum Core Frequency Requirements with DFS

In many systems, enabling DFS can result in very low processor core frequencies. However,

care must be taken to ensure that the resulting processor core frequency is within the limits

specified in Table 9-2 on page 25. Proper operation of the device is not guaranteed at core fre-

quencies below the specified minimum fcore.

6.4.5 Power Consumption

Table 6-6 provides the power consumption for the PC7447A. For information regarding power

consumption when dynamic frequency switching is enabled, See “Dynamic Frequency Switch-

ing (DFS)” on page 17.

Notes: 1. These values apply for all valid processor buses. The values do not include I/O supply power (OVDD) or PLL supply power

(AVDD). OVDD power is system dependent but is typically < 5% of VDD power. Worst case power consumption for AVDD <

3 mW.

2. Typical power is an average value measured at the nominal recommended VDD (see Table 6-2 on page 10) and 65°C while

running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz

3. Maximum power is the average measured at nominal VDD and maximum operating junction temperature (see Table 6-2 on

page 10) while running an entirely cache-resident, contrived sequence of instructions which keep all the execution units

maximally busy.

4. Doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep mode. As a

result, power consumption for this mode is not tested.

5. Power consumption for these devices is artificially constrained during screening to assure lower power consumption than

other speed grades.

Table 6-6. Power Consumption for PC7447A

Processor (CPU) Frequency

1000 1167 1267 1333(5) 1420 Unit

Full-Power Mode

Core Power Supply 1.1 1.1 1.3 1.3 1.3

Typical(1)(2) 8 9.2 18.3 18 21 W

Maximum(1)(3) 11.5 13 26 25 30 W

Nap Mode

Typical(1)(2) 1.3 1.3 4.1 3.3 4.1 W

Sleep Mode

Typical(1)(2) 1.3 1.3 4.1 3.3 4.1 W

Deep Sleep Mode (PLL Disabled)

Typical(1)(2) 1.2 1.2 4 3.2 4 W

5387C–HIREL–05/06

PC7447A [Preliminary]

7. Pin Assignment

Figure 7-1 shows the pinout of the PC7447A, 360 high coefficient of the thermal expansion

ceramic ball grid array (HITCE) package as viewed from the top surface. Figure 7-2 shows the

side profile of the HITCE package to indicate the direction of the top surface view.

Figure 7-1. Pinout of the PC7447A, 360 HITCE Package as Viewed from the Top Surface

Figure 7-2. Side View of the CBGA Package

321456 1617 18 19

151413121110987

Substrate Assembly

Encapsulant

View

Die

5387C–HIREL–05/06

PC7447A [Preliminary]

8. Pinout Listings

Table 8-1 provides the pinout listing for the PC7447A, 360 HITCE package. The pinouts of the

PC7447A and PC7447 are pin compatible but there have been some changes. A PC7447A may

be populated on a board designed for a PC7447 provided all pins defined as ‘Not Connected’ for

the PC7447 are unterminated as required by the PC7457 RISC Microprocessor Specification.

The PC7447A uses pins previously marked ‘Not Connected’ for the temperature diode pins and

for additional power and ground connections. Because these ‘Not Connected’ pins in the

PC7447 360 pin package are not driven in functional mode, a PC7447 can be populated in a

PC7447A board. See section ”Connection Recommendations” on page 41 for additional

information.

Note: This pinout is not compatible with the PC750, PC7400, or PC7410 360 BGA package.

Table 8-1. Pinout Listing for the PC7447A, 360 HITCE Package

Signal Name Pin Number Active I/O I/F Select(1)

A[0:35](2)

E11, H1, C11, G3, F10, L2, D11, D1, C10, G2, D12, L3, G4, T2, F4, V1,

J4, R2, K5, W2, J2, K4, N4, J3, M5, P5, N3, T1, V2, U1, N5, W1, B12,

C4, G10, B11

High I/O BVSEL

AACK R1 Low Input BVSEL

AP[0:4](2) C1, E3, H6, F5, G7 High I/O BVSEL

ARTRY(3) N2 Low I/O BVSEL

AVDD A8 – Input BVSEL

BG M1 Low Input BVSEL

BMODE0(4) G9 Low Input BVSEL

BMODE1(5) F8 Low Input BVSEL

BR D2 Low Output BVSEL

BVSEL(1)(6) B7 High Input BVSEL

CI(3) J1 Low Output BVSEL

CKSTP_IN A3 Low Input BVSEL

CKSTP_OUT B1 Low Output BVSEL

CLK_OUT H2 High Output BVSEL

D[0:63]

R15, W15, T14, V16, W16, T15, U15, P14, V13, W13, T13, P13, U14,

W14, R12, T12, W12, V12, N11, N10, R11, U11, W11, T11, R10, N9,

P10, U10, R9, W10, U9, V9, W5, U6, T5, U5, W7, R6, P7, V6, P17,

R19, V18, R18, V19, T19, U19, W19, U18, W17, W18, T16, T18, T17,

W3, V17, U4, U8, U7, R7, P6, R8, W8, T8

High I/O BVSEL

DBG M2 Low Input BVSEL

DP[0:7] T3, W4, T4, W9, M6, V3, N8, W6 High I/O BVSEL

DRDY(7) R3 Low Output BVSEL

DTI[0:3](8) G1, K1, P1, N1 High Input BVSEL

EXT_QUAL(9) A11 High Input BVSEL

GBL E2 Low I/O BVSEL

5387C–HIREL–05/06

PC7447A [Preliminary]

GND

B5, C3, D6, D13, E17, F3, G17, H4, H7, H9, H11, H13, J6, J8, J10,

J12, K7, K3, K9, K11, K13, L6, L8, L10, L12, M4, M7, M9, M11, M13,

N7, P3, P9, P12, R5, R14, R17, T7, T10, U3, U13, U17, V5, V8, V11,

V15

–– N/A

GND(15) A17, A19, B13, B16, B18, E12, E19, F13, F16, F18, G19, H18, J14,

L14, M15, M17, M19, N14, N16, P15, P19 –– N/A

GND_SENSE(19) G12, N13 – – N/A

HIT(7) B2 Low Output BVSEL

HRESET D8 Low Input BVSEL

INT D4 Low Input BVSEL

L1_TSTCLK(9) G8 High Input BVSEL

L2_TSTCLK(10) B3 High Input BVSEL

No Connect(11)

A6, A14, A15, B14, B15, C14, C15, C16, C17, C18, C19, D14, D15,

D16, D17, D18, D19, E14, E15, F14, F15, G14, G15, H15, H16, J15,

J16, J17, J18, J19, K15, K16, K17, K18, K19, L15, L16, L17, L18, L19

–– –

LSSD_MODE(6)(12) E8 Low Input BVSEL

MCP C9 Low Input BVSEL

OVDD

B4, C2, C12, D5, F2, H3, J5, K2, L5, M3, N6, P2, P8, P11, R4, R13,

R16, T6, T9, U2, U12, U16, V4, V7, V10, V14 –– N/A

OVDD_SENSE(16) E18, G18 – – N/A

PLL_CFG[0:4] B8, C8, C7, D7, A7 High Input BVSEL

PMON_IN(13) D9 Low Input BVSEL

PMON_OUT A9 Low Output BVSEL

QACK G5 Low Input BVSEL

QREQ P4 Low Output BVSEL

SHD[0:1](3) E4, H5 Low I/O BVSEL

SMI F9 Low Input BVSEL

SRESET A2 Low Input BVSEL

SYSCLK A10 – Input BVSEL

TA K6 Low Input BVSEL

TBEN E1 High Input BVSEL

TBST F11 Low Output BVSEL

TCK C6 High Input BVSEL

TDI(6) B9 High Input BVSEL

TDO A4 High Output BVSEL

TEA L1 Low Input BVSEL

TEMP_ANODE(17) N18

TEMP_CATHODE(17) N19

Table 8-1. Pinout Listing for the PC7447A, 360 HITCE Package (Continued)

Signal Name Pin Number Active I/O I/F Select(1)

5387C–HIREL–05/06

PC7447A [Preliminary]

Notes: 1. OVDD supplies power to the processor bus, JTAG, and all control signals; VDD supplies power to the processor core and the

PLL (after filtering to become AVDD). To program the I/O voltage, connect BVSEL to either GND (selects 1.8V), or to

HRESET or OVDD (selects 2.5V); see Table 6-3 on page 11. If used, the pull-down resistor should be less than 250Ω.

Because these settings may change in future products, it is recommended BVSEL be configured using resistor options,

jumpers, or some other flexible means, with the capability to reconfigure the termination of this signal in the future if neces-

sary. For actual recommended value of VIN or supply voltages see Table 6-2 on page 10 .

2. Unused address pins must be pulled down to GND and corresponding address parity pins pulled up to OVDD.

3. These pins require weak pull-up resistors (for example, 4.7 KΩ) to maintain the control signals in the negated state after they

have been actively negated and released by the PC7447A and other bus masters.

4. This signal selects between MPX bus mode (asserted) and 60x bus mode (negated) and will be sampled at HRESET going

high.

5. This signal must be negated during reset, by pull-up resistor to OVDD or negation by ¬HRESET (inverse of HRESET), to

ensure proper operation.

6. Internal pull up on die.

7. Ignored in 60x bus mode.

8. These signals must be pulled down to GND if unused, or if the PC7447A is in 60x bus mode.

9. These input signals are for factory use only and must be pulled down to GND for normal machine operation.

10. This test signal is recommended to be tied to HRESET; however, other configurations will not adversely affect performance.

11. These signals are for factory use only and must be left unconnected for normal machine operation. Some pins that were

NCs on the PC7447, have now been defined for other purposes.

12. These input signals are for factory use only and must be pulled up to OVDD for normal machine operation.

13. This pin can externally cause a performance monitor event. Counting of the event is enabled through software.

14. This signal must be asserted during reset, by pull down to GND or assertion by HRESET, to ensure proper operation.

15. These pins were NCs on the PC7447. They may be left unconnected for backward compatibility with these devices, but it is

recommended they be connected in new designs to facilitate future products. See section ”Connection Recommendations”

on page 41 for more information.

16. These pins were OVDD pins on the PC7447. These pins are internally connected to OVDD and are intended to allow an exter-

nal device to detect the I/O voltage level present inside the device package. If unused, they must be connected directly to

OVDD or left unconnected.

17. These pins provide connectivity to the on-chip temperature diode that can be used to determine the die junction temperature

of the processor. These pins may be left unterminated if unused.

18. These pins are internally connected to VDD and are intended to allow an external device to detect the processor core voltage

level present inside the device package. If unused, they must be connected directly to VDD or left unconnected.

19. These pins are internally connected to GND and are intended to allow an external device to detect the processor ground

voltage level present inside the device package. If unused, they must be connected directly to GND or left unconnected.

TEST[0:3](12) A12, B6, B10, E10 – Input BVSEL

TEST[4](9) D10 – Input BVSEL

TMS(6) F1 High Input BVSEL

TRST(6)(14) A5 Low Input BVSEL

TS(3) L4 Low I/O BVSEL

TSIZ[0:2] G6, F7, E7 High Output BVSEL

TT[0:4] E5, E6, F6, E9, C5 High I/O BVSEL

WT(3) D3 Low Output BVSEL

VDD

H8, H10, H12, J7, J9, J11, J13, K8, K10, K12, K14, L7, L9, L11, L13,

M8, M10, M12 –– N/A

VDD(15) A13, A16, A18, B17, B19, C13, E13, E16, F12, F17, F19, G11, G16,

H14, H17, H19, M14, M16, M18, N15, N17, P16, P18 –– N/A

VDD_SENSE(18) G13, N12 – – N/A

Table 8-1. Pinout Listing for the PC7447A, 360 HITCE Package (Continued)

Signal Name Pin Number Active I/O I/F Select(1)

5387C–HIREL–05/06

PC7447A [Preliminary]

Note: Caution must be exercised when performing boundary scan test operations on a board designed for a PC7447A but populated

with an PC7447.

This is because in the PC7447 it is possible to drive the latches associated with the former ‘No Connect’ pins in the PC7447,

potentially causing contention on those pins. To prevent this, ensure that these pins are not connected on the board or, if they

are connected, ensure that the states of internal PC7447 latches do not cause these pins to be driven during board testing.

9. Electrical Characteristics

9.1 Static Characteristics

Table 9-1 provides the DC electrical characteristics for the PC7447A.

Notes: 1. Nominal voltages; see Table 6-2 on page 10 for recommended operating conditions.

2. For processor bus signals, the reference is OVDD while GVDD is the reference for the L3 bus signals.

3. Excludes test signals and IEEE 1149.1 boundary scan (JTAG) signals.

Table 9-1. DC Electrical Specifications (see Table 6-2 on page 10 for Recommended Operating Conditions)

Symbol Characteristic

Nominal Bus

Voltage(1) Min Max Unit Notes

VIH Input high voltage (all inputs) 1.8 OVDD × 0.65 OVDD + 0.3 V(2)

2.5 1.7 OVDD + 0.3

VIL Input low voltage (all inputs) 1.8 -0.3 OVDD × 0.35 V(2)(6)

2.5 -0.3 0.7

IIN

Input leakage current,

VIN = GVDD/ODD

VIN = GND

––30

-30

µA (2)(3)

ITSI

High-impedance (off-state) leakage current,

VIN = GVDD/ODD

VIN = GND

––30

-30

µA (2)(3)(4)

VOH Output high voltage at IOH = -5 mA 1.8 OVDD - 0.45 – V

2.5 1.8 –

VOL Output low voltage at IOL = 5 mA 1.8 – 0.45 V

2.5 – 0.6

CIN

Capacitance,

VIN = 0V

f = 1 MHz

All other inputs – 8 pF (5)

VIH Input high voltage (all inputs) 1.8 OVDD × 0.65 OVDD + 0.3 V(2)

2.5 1.7 OVDD + 0.3

VIL Input low voltage (all inputs) 1.8 -0.3 OVDD × 0.35 V(2)(6)

2.5 -0.3 0.7

IIN

Input leakge current,

VIN = GVDD/OVDD

VIN = GND

––30

-30

µA (2)(3)

5387C–HIREL–05/06

PC7447A [Preliminary]

4. The leakage is measured for nominal OVDD/GVDD and VDD, or both OVDD/GVDD and VDD must vary in the same direction (for

example, both OVDD and VDD vary by either +5% or -5%).

5. Capacitance is periodically sampled rather than 100% tested.

6. Excludes signals with internal pull ups: BVSEL, LSSD_MODE, TDI, TMS, and TRST. Characterization of leakage current for

these signals is currently being conducted.

9.2 Dynamic Characteristics

This section provides the AC electrical characteristics for the PC7447A. After fabrication, func-

tional parts are sorted by maximum processor core frequency as shown in Section ”Clock AC

Specifications” on page 25 and tested for conformance to the AC specifications for that fre-

quency. The processor core frequency is determined by the bus (SYSCLK) frequency and the

settings of the PLL_CFG[0:4] signals, and can be dynamically modified using dynamic fre-

quency switching (DFS). Parts are sold by maximum processor core frequency; See “Ordering

Information” on page 46. for information on ordering parts. DFS is described in Section

”Dynamic Frequency Switching (DFS)” on page 17.

9.2.1 Clock AC Specifications

Table 9-2 provides the clock AC timing specifications as defined in Figure 9-1 on page 26 and

represents the tested operating frequencies of the devices. The maximum system bus fre-

quency, fSYSCLK, given in Table 9-2 on page 25 is considered a practical maximum in a typical

single-processor system. The actual maximum SYSCLK frequency for any application of the

PC7447A will be a function of the AC timings of the PC7447A, the AC timings for the system

controller, bus loading, printed-circuit board topology, trace lengths, and so forth, and may be

less than the value given in Table 9-2 on page 25.

Table 9-2. Clock AC Timing Specifications (See Table 6-2 on page 10 for Recommended Operating Conditions)

Symbol Characteristic

Maximum Processor Core Frequency

Unit Notes

1000 MHz 1267 MHz 1333 MHz 1420 MHz

VDD = 1.3V VDD = 1.3V VDD = 1.3 VDD = 1.3

MinMaxMinMaxMinMaxMinMax

fCORE

Processor core

frequency 600 1000 600 1267 600 1333 600 1420 MHz (1)(8)(9)

fVCO VCO frequency 1200 2000 1200 2533 1200 2667 1200 2840 MHz (1)(9)

fSYSCLK SYSCLK frequency 33 167 33 167 33 167 33 167 MHz (1)(2)(8)

tSYSCLK SYSCLK cycle time 6.0 30 6 30 6 30 6 30 ns (2)

tKR, tKF

SYSCLK rise and fall

time –1.0–1–1–1ns

(3)

tKHKL/tSYSCLK

SYSCLK duty cycle

measured at OVDD/2 40 60 40 60 40 60 40 60 % (4)

SYSCLK jitter(5)(6) – 150 – 150 – 150 – 150 ps (5)(6)

Internal PLL relock

time(7) – 100 – 100 – 100 – 100 µs (7)

5387C–HIREL–05/06

PC7447A [Preliminary]

Notes: 1. Caution: The SYSCLK frequency and PLL_CFG[0:4] settings must be chosen such that the resulting SYSCLK (bus) fre-

quency, processor core frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum

operating frequencies. Refer to the PLL_CFG[0:4] signal description in Section ”PLL Configuration” on page 38 for valid

PLL_CFG[0:4] settings.

2. Assumes a lightly-loaded, single-processor system.

3. Rise and fall times for the SYSCLK input measured from 0.4V to 1.4V.

4. Timing is guaranteed by design and characterization.

5. Guaranteed by design.

6. The SYSCLK driver’s closed loop jitter bandwidth should be less than 1.5 MHz at -3 dB.

7. Relock timing is guaranteed by design and characterization. PLL relock time is the maximum amount of time required for

PLL lock after a stable VDD and SYSCLK are reached during the power-on reset sequence. This specification also applies

when the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that HRESET must be held

asserted for a minimum of 255 bus clocks after the PLL relock time during the power-on reset sequence.

8. Caution: If DFS is enabled, the SYSCLK frequency and PLL_CFG[0:4] settings must be chosen such that the resulting pro-

cessor frequency is greater than or equal to the minimum core frequency.

9. Caution: These values specify the maximum processor core and VCO frequencies when the device is operated at the nomi-

nal core voltage. If operating the device at the derated core voltage, the processor core and VCO frequencies must be

reduced.

Figure 9-1 provides the SYSCLK input timing diagram.

Figure 9-1. SYSCLK Input Timing Diagram

VM = Midpoint Voltage (OVDD/2)

Symbol Characteristic

Maximum Processor Core Frequency

Unit Notes

1000 MHz 1167 MHz

VDD = 1.1V VDD = 1.1V

Min Max Min Max

fCORE Processor core frequency 500 1000 500 1167 MHz (1)(8)(9)

fVCO VCO frequency 1000 2000 1000 2233 MHz (1)(9)

fSYSCLK SYSCLK frequency 33 167 33 167 MHz (1)(2)(8)

tSYSCLK SYSCLK cycle time 6 30 6 30 ns (2)

tKR, tKF SYSCLK rise and fall time – 1 – 1 ns (3)

tKHKL/tSYSCLK SYSCLK duty cycle measured at OVDD/2 40 60 40 60 % (4)

SYSCLK jitter(5)(6) –150–150ps

(5)(6)

Internal PLL relock time(7) –100–100µs (7)

SYSCLK VMVMVM

tKHKL

tSYSCLK

CVIL

CVIH

tKR tKF

5387C–HIREL–05/06

PC7447A [Preliminary]

9.2.2 Processor Bus AC Specifications

Table 9-3 provides the processor bus AC timing specifications for the PC7447A as defined in

Figure 7-2 on page 20 and Figure 9-2 on page 28..

Table 9-3. Processor Bus AC Timing Specifications(1) (at Recommended Operating Conditions, see Table 6-2 on page

10.)

Symbol(2) Parameter

All Speed Grades

UnitMin Max

tAVKH

tDVKH

tIVKH

tMVKH(8)

Input setup times:

A[0:35], AP[0:4]

D[0:63], DP[0:7]

AACK, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3], GBL,

TT[0:3], QACK, TA, TBEN, TEA, TS,

EXT_QUAL, PMON_IN, SHD[0:1],

BMODE[0:1], BVSEL

1.8

–

tAXKH

tDXKH

tIXKH

tMXKH(8)

Input hold times:

A[0:35], AP[0:4]

D[0:63], DP[0:7]

AACK, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3], GBL,

TT[0:3], QACK, TA, TBEN, TEA, TS, EXT_QUAL,

PMON_IN, SHD[0:1]

BMODE[0:1], BVSEL

–

tKHAV

tKHDV

tKHOV

Output valid times:

A[0:35], AP[0:4]

D[0:63], DP[0:7]

AACK, ARTRY, BR, CI, CKSTP_IN, DRDY, DTI[0:3],

GBL, HIT, PMON_OUT, QREQ, TBST, TSIZ[0:2], TT[0:3],

TS, SHD[0:1], WT

–

tKHAX

tKHDX

tKHOX

Output hold times:

A[0:35], AP[0:4]

D[0:63], DP[0:7]

AACK, ARTRY, BR, CI, CKSTP_IN, DRDY, DTI[0:3],

GBL, HIT, PMON_OUT, QREQ, TBST, TSIZ[0:2], TT[0:3],

TS, SHD[0:1], WT

0.5

–

tKHOE(5) SYSCLK to output enable 0.5 – ns

tKHOZ(5) SYSCLK to output high impedance (all except TS, ARTRY, SHD0,

SHD1)–3.5ns

tKHTSPZ(3)(4)(5) SYSCLK to TS high impedance after precharge – 1 tSYSCLK

tKHARP(3)(5)(6)(7) Maximum delay to ARTRY/SHD0/SHD1 precharge – 1 tSYSCLK

tKHARPZ(3)(5)(6)(7) SYSCLK to ARTRY/SHD0/SHD1 high impedance after precharge – 2 tSYSCLK

5387C–HIREL–05/06

PC7447A [Preliminary]

Notes: 1. All input specifications are measured from the midpoint of the signal in question to the midpoint of the rising edge of the input

SYSCLK. All output specifications are measured from the midpoint of the rising edge of SYSCLK to the midpoint of the sig-

nal in question. All output timings assume a purely resistive 50Ω load (see Figure 7-2 on page 20). Input and output timings

are measured at the pin; time-of-flight delays must be added for trace lengths, vias, and connectors in the system.

2. The symbology used for timing specifications herein follows the pattern of t(signal)(state)(reference)(state) for inputs and

t(reference)(state)(signal)(state) for outputs. For example, tIVKH symbolizes the time input signals (I) reach the valid state (V) relative to

the SYSCLK reference (K) going to the high (H) state or input setup time. And tKHOV symbolizes the time from SYSCLK (K)

going high (H) until outputs (O) are valid (V) or output valid time. Input hold time can be read as the time that the input signal

(I) went invalid (X) with respect to the rising clock edge (KH) (note the position of the reference and its state for inputs) and

output hold time can be read as the time from the rising edge (KH) until the output went invalid (OX).

3. tSYSCLK is the period of the external clock (SYSCLK) in ns. The numbers given in the table must be multiplied by the period of

SYSCLK to compute the actual time duration (in ns) of the parameter in question.

4. According to the bus protocol, TS is driven only by the currently active bus master. It is asserted low and precharged high

before returning to high impedance, as shown in Figure 9-3 on page 29. The nominal precharge width for TS is 0.5 × tSYSCLK,

that is, less than the minimum tSYSCLK period, to ensure that another master asserting TS on the following clock will not con-

tend with the precharge. Output valid and output hold timing is tested for the signal asserted. Output valid time is tested for

precharge.The high-impedance behavior is guaranteed by design.

5. Guaranteed by design and not tested.

6. According to the bus protocol, ARTRY can be driven by multiple bus masters through the clock period immediately following

AACK. Bus contention is not an issue because any master asserting ARTRY will be driving it low. Any master asserting it low

in the first clock following AACK will then go to high impedance for 1 clock before precharging it high during the second cycle

after the assertion of AACK. The nominal precharge width for ARTRY is 1.0 tSYSCLK; that is, it should be high impedance as

shown in Figure 9-3 on page 29 before the first opportunity for another master to assert ARTRY. Output valid and output hold

timing is tested for the signal asserted.The high-impedance behavior is guaranteed by design.

7. According to the MPX bus protocol, SHD0 and SHD1 can be driven by multiple bus masters beginning the cycle of TS. Tim-

ing is the same as ARTRY, that is, the signal is high impedance for a fraction of a cycle, then negated for up to an entire

cycle (crossing a bus cycle boundary) before being three-stated again. The nominal precharge width for SHD0 and SHD1 is

1.0 tSYSCLK. The edges of the precharge vary depending on the programmed ratio of core to bus (PLL configurations).

8. BMODE[0:1] and BVSEL are mode select inputs and are sampled before and after HRESET negation. These parameters

represent the input setup and hold times for each sample. These values are guaranteed by design and not tested. These

inputs must remain stable after the second sample. See Figure 9-2 on page 28 for sample timing.

Figure 9-2 provides the mode select input timing diagram for the PC7447A. The mode select

inputs are sampled twice, once before and once after HRESET negation.

Figure 9-2. Mode Input Sample Timing Diagram

HRESET

Mode Signals

VMVM

VM = Midpoint Voltage (OVDD/2)

SYSCLK

1st Sample 2nd Sample

5387C–HIREL–05/06

PC7447A [Preliminary]

Figure 9-3 provides the input/output timing diagram for the PC7447A.

Figure 9-3. Input/Output Timing Diagram

Note: VM = Midpoint Voltage (OVDD/2)

SYSCLK

All Inputs

All Outputs

(Except TS,

All Outputs

tKHOE

ARTRY, SHD0, SHD1)

(Except TS,

ARTRY, SHD0, SHD1)

ARTRY,

SHD0,

SHD1

tAVKH

tKHAV

tMVKH

tIVKH

tAXKH

tIXKH

tMXKH

tKHDV

tKHOV

tKHAX

tKHDX

tKHOX

tKHOZ

tKHTSPZ

tKHTSX

tKHTSV

tKHARV tKHARP

tKHARX

tKHARPZ

5387C–HIREL–05/06

PC7447A [Preliminary]

9.2.3 IEEE 1149.1 AC Timing Specifications

Table 9-4 provides the IEEE 1149.1 (JTAG) AC timing specifications as defined in Figure 9-5

through Figure 9-8 on page 32.

Notes: 1. All outputs are measured from the midpoint voltage of the falling/rising edge of TCLK to the midpoint of the signal in ques-

tion. The output timings are measured at the pins. All output timings assume a purely resistive 50Ω load (see Figure 9-4).

Time-of-flight delays must be added for trace lengths, vias and connectors in the system.

2. TRST is an asynchronous level sensitive signal. The time is for test purposes only.

3. Non-JTAG signal input timing with respect to TCK.

4. Non-JTAG signal output timing with respect to TCK.

5. Guaranteed by design and characterization.

Figure 9-4 provides the AC test load for TDO and the boundary-scan outputs of the PC7457.

Figure 9-4. Alternate AC Test Load for the JTAG Interface

Table 9-4. JTAG AC Timing Specifications (Independent of SYSCLK)(1)at Recommended Operating Conditions

(see Table 6-2 on page 10)

Symbol Parameter Min Max Unit

fTCLK TCK frequency of operation 0 33.3 MHz

tTCLK TCK cycle time 30 – ns

tJHJL TCK clock pulse width measured at 1.4V 15 – ns

tJR and tJF TCK rise and fall times – 2 ns

tTRST(2) TRST assert time 25 – ns

tDVJH(3)

tIVJH

Input Setup Times:

Boundary-scan data

TMS, TDI

–

tDXJH(3)

tIXJH

Input Hold Times:

Boundary-scan data

TMS, TDI

–

tJLDV(4)

tJLOV

Valid Times:

Boundary-scan data

TDO

tJLDX(4)

tJLOX

Output hold times:

Boundary-scan data

TDO

–

tJLDZ(4)(5)

tJLOZ

TCK to output high impedance:

Boundary-scan data

TDO

Output Z0 = 50Ω

RL = 50Ω

OVDD/2

5387C–HIREL–05/06

PC7447A [Preliminary]

Figure 9-5. JTAG Clock Input Timing Diagram

Note: VM = Midpoint Voltage (OVDD/2)

Figure 9-6. TRST Timing Diagram

Note: VM = Midpoint Voltage (OVDD/2)

Figure 9-7. Boundary-scan Timing Diagram

Note: VM = Midpoint Voltage (OVDD/2)

VMVMVM

tTCLK

tJR tJF

tJHJL

TCLK

TRST

VMTCK

Boundary

Data Inputs

Boundary

Data Outputs

Boundary

Data Outputs

tDXJH

tDVJH

tJLDV

tJLDZ

Output Data Valid

tJLDX

Input

Data Valid

Output Data Valid

5387C–HIREL–05/06

PC7447A [Preliminary]

Figure 9-8. Test Access Port Timing Diagram

Note: VM = Midpoint Voltage (OVDD/2)

10. Preparation for Delivery

10.1 Handling

MOS devices must be handled with certain precautions to avoid damage due to accumulation of

static charge. Input protection devices have been designed in the chip to minimize the effect of

static buildup. However, the following handling practices are recommended:

• Devices should be handled on benches with conductive and grounded surfaces

• Ground test equipment, tools and operator

• Do not handle devices by the leads

• Store devices in conductive foam or carriers

• Avoid use of plastic, rubber or silk in MOS areas

• Maintain relative humidity above 50% if practical

11. Package Mechanical Data

The following sections provide the package parameters and mechanical dimensions for the

HITCE package.

11.1 Package Parameters for the PC7447A, 360 HITCE

The package parameters are as provided in the following list. The package type is 25 × 25 mm,

360-lead high coefficient of the thermal expansion ceramic ball grid array (HITCE).

Package outline 25 mm × 25 mm

Interconnects 360 (19 × 19 ball array - 1)

Pitch 1.27 mm (50 mil)

Minimum module height 2.72 mm

Maximum module height 3.24 mm

Ball diameter 0.89 mm (35 mil)

tJLOX

Input Data

Valid

tIVJH tIXJH

tJLOV

tJLOZ

Output Data Valid

TCK

TDI, TMS

TDO

5387C–HIREL–05/06

PC7447A [Preliminary]

11.2 Mechanical Dimensions for the PC7447A, 360 HITCE

Figure 11-1 provides the mechanical dimensions and bottom surface nomenclature for the PC7447A, 360 HITCE package.

Figure 11-1. Mechanical Dimensions and Bottom Surface Nomenclature for the PC7447A, 360 CBGA Package

Notes: 1. Dimensioning and tolerance per ASME Y14.5M, 1994

2. Dimensions in millimeters

3. Top side A1 corner index is a metallized feature with various shapes. Bottom side A1 corner is designated with a ball missing

from the array

360X

B0.3

0.15

123456 78910111213141516 1718 19

0.2

A1 CORNER

0.2

D3 D1

Capacitor Region

0.15 A

0.35 A

Millimeters

DIM MIN MAX

A 2.72 3.20

A1 0.80 1

A2 1.10 1.30

A3 – 0.6

b 0.82 0.93

D 25 BSC

D1 – 11.3

D2 8 –

D3 – 6.5

D4 9.76 9.96

e 1.27 BSC

E 25 BSC

E1 – 11.3

E2 8 –

E3 – 6.5

E4 8.41 8.61

5387C–HIREL–05/06

PC7447A [Preliminary]

11.3 Package Parameters for the PC7447A, 360 HITCE RoHS-Compliant BGA

The package parameters are as provided in the following list. The package type is 25 × 25 mm,

360 lead-free high coefficient of thermal expansion ceramic ball grid array (HITCE).

Package outline 25 mm × 25 mm

Interconnects 360 (19 × 19 ball array - 1)

Pitch 1.27 mm (50 mil)

Minimum module height 2.32 mm

Maximum module height 2.80 mm

Ball diameter 0.89 mm (35 mil)

Coefficient of thermal expansion 12.3 ppm/°C

5387C–HIREL–05/06

PC7447A [Preliminary]

11.4 Mechanical Dimensions for the PC7447A, 360 HITCE RoHS-Compliant BGA

Figure 11-1 provides the mechanical dimensions and bottom surface nomenclature for the PC7447A, 360 HITCE BGA

package.

Figure 11-2. Mechanical Dimensions and Bottom Surface Nomenclature for the PC7447A, 360 HITCE RoHS-Compliant

BGA Package

360X

B0.3

0.15

123456 78910111213141516 1718 19

0.2

A1 CORNER

0.2

D3 D1

Capacitor Region

0.15 A

0.35 A

Millimeters

DIM MIN MAX

A 2.32 2.80

A1 0.40 0.60

A2 1.10 1.30

A3 – 0.6

b 0.6 0.9

D 25 BSC

D1 – 11.3

D2 8 –

D3 – 6.5

D4 9.76 9.96

e 1.27 BSC

E 25 BSC

E1 – 11.3

E2 8 –

E3 – 6.5

E4 8.41 8.61

5387C–HIREL–05/06

PC7447A [Preliminary]

11.5 Package Parameters for the PC7447A, 360 HCTE LGA

The package parameters are as provided in the following list. The package type is 25 × 25 mm,

360 high coefficient of thermal expansion ceramic land grid array (HCTE).

Package outline 25 mm × 25 mm

Interconnects 360 (19 × 19 ball array - 1)

Pitch 1.27 mm (50 mil)

Minimum module height 1.92 mm

Maximum module height 2.20 mm

Coefficient of thermal expansion 12.3 ppm/°C

5387C–HIREL–05/06

PC7447A [Preliminary]

11.6 Mechanical Dimensions for the MPC7447A, 360 HCTE LGA

Figure 11-3 provides the mechanical dimensions and bottom surface nomenclature for the

PC7447A, 360 HCTE LGA package.

Figure 11-3. Mechanical Dimensions and Bottom Surface Nomenclature for the PC7447A, 360 HITCE LGA Package

360X

B0.3

0.15

123456 78910111213141516 1718 19

0.2

A1 CORNER

0.2

D3 D1

Capacitor Region

0.15 A

0.35 A

Millimeters

Dim Min Max

A 1.92 2.20

A1 1.10 1.30

A2 – 0.6

b 0.82 0.93

D 25 BSC

D1 – 11.3

D2 8 –

D3 – 6.5

D4 9.76 9.96

e 1.27 BSC

E 25 BSC

E1 – 11.3

E2 8 –

E3 – 6.5

E4 8.41 8.61

5387C–HIREL–05/06

PC7447A [Preliminary]

11.7 Substrate Capacitors for the PC7447A, 360 HITCE

Figure 11-4 shows the connectivity of the substrate capacitor pads for the PC7447A, 360 HITCE. All capacitors are 100 nF.

Figure 11-4. Substrate Bypass Capacitors for the PC7447A, 360 HITCE

12. System Design Information

This section provides system and thermal design recommendations for successful application of

the PC7447A.

12.1 PLL Configuration

The PC7447A PLL is configured by the PLL_CFG[0:4] signals. For a given SYSCLK (bus) fre-

quency, the PLL configuration signals set the internal CPU and VCO frequency of operation.

The PLL configuration for the PC7447A is shown in Table 12-1 on page 39 for a set of example

frequencies. In this example, shaded cells represent settings that, for a given SYSCLK fre-

quency, result in core and/or VCO frequencies that do not comply with the 1400 MHz column in

Table 9-2 on page 25. When enabled, dynamic frequency switching (DFS) also affects the core

frequency by halving the bus-to-core multiplier; see section ”Dynamic Frequency Switching

(DFS)” on page 17 for more information.

C1-2

C1-1 C2-1 C3-1 C4-1 C5-1 C6-1

C6-2C5-2C4-2C3-2C2-2

C18-1

C18-2 C17-2 C16-2 C15-2 C14-2 C13-2

C13-1C14-1C15-1C16-1C17-1

C12-1

C12-2 C11-2 C10-2 C9-2 C8-2 C7-2

C7-1C8-1C9-1

C10-1C11-1

C19-2

C19-1 C20-1 C21-1 C22-1 C23-1 C24-1

C24-2C23-2C22-2C21-2C20-2

A1 CORNER

C1 GND VDD

C2 GND VDD

C3 GND OVDD

C4 GND VDD

C5 GND VDD

C6 GND VDD

C7 GND VDD

C8 GND VDD

C9 GND VDD

C10 GND VDD

C11 GND VDD

C12 GND VDD

C13 GND VDD

C14 GND VDD

C15 GND VDD

C16 GND OVDD

C17 GND VDD

C18 GND OVDD

C19 GND OVDD

C20 GND VDD

C21 GND OVDD

C22 GND VDD

C23 GND OVDD

C24 GND VDD

Capacitor

Pad Number

-1 -2

5387C–HIREL–05/06

PC7447A [Preliminary]

Note that when DFS is enabled the resulting core frequency must meet the minimum core fre-

quency requirements described in Table 9-2 on page 25.

Table 12-1. PC7447A Microprocessor PLL Configuration Example for 1420-MHz Parts

PLL_CFG[0:4]

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus-to-Core

Multiplier

Core-to-VCO

Multiplier

Bus (SYSCLK) Frequency

33.33

MHz

66.66

MHz

100

MHz

133.33

MHz

166.66

MHz

01000 2x 2x

10000 3x 2x

10100 4x 2x 667

(1333)

10110 5x 2x 667

(1333)

835

(1670)

10010 5.5x 2x 733

(1466)

919

(1837)

11010 6x 2x 600

(1200)

800

(1600)

1002

(2004)

01010 6.5x 2x 650

(1300)

866

(1730)

1086

(2171)

00100 7x 2x 700

(1400)

931

(1862)

1169

(2338)

00010 7.5x 2x 623

(1245)

750

(1500)

1000

(2000)

1253

(2505)

11000 8x 2x 600

(1200)

664

(1328)

800

(1600)

1064

(2128)

1336

(2672)

01100 8.5x 2x 638

(1276)

706

(1412)

850

(1700)

1131

(2261)

1417

(2833)

01111 9x 2x 600

(1200)

675

(1350)

747

(1494)

900

(1800)

1197

(2394)

01110 9.5x 2x 633

(1266)

712

(1524)

789

(1578)

950

(1900)

1264

(2528)

10101 10x 2x 667

(1333)

750

(1500)

830

(1660)

1000

(2000)

1333

(2667)

10001 10.5x 2x 700

(1400)

938

(1876)

872

(1744)

1050

(2100)

1397

(2793)

10011 11x 2x 733

(1466)

825

(1650)

913

(1826)

1100

(2200)

00000 11.5x 2x 766

(532)

863

(1726)

955

(1910)

1150

(2300)

10111 12x 2x 600

(1200)

800

(1600)

900

(1800)

996

(1992)

1200

(2400)

11111 12.5x 2x 600

(1200)

833

(1666)

938

(1876)

1038

(2076)

1250

(2500)

5387C–HIREL–05/06

PC7447A [Preliminary]

Notes: 1. PLL_CFG[0:4] settings not listed are reserved.

2. The sample bus-to-core frequencies shown are for reference only. Some PLL configurations may select bus, core, or VCO

frequencies that are not useful, not supported, or not tested for by the PC7455; see Section ”Clock AC Specifications” on

page 25 for valid SYSCLK, core, and VCO frequencies.

3. In PLL-bypass mode, the SYSCLK input signal clocks the internal processor directly and the PLL is disabled. However, the

bus interface unit requires a 2x clock to function. Therefore, an additional signal, EXT_QUAL, must be driven at one-half the

frequency of SYSCLK and offset in phase to meet the required input setup tIVKH and hold time tIXKH (see Table 9-3 on

page 27). The result will be that the processor bus frequency will be one-half SYSCLK while the internal processor is

clocked at SYSCLK frequency. This mode is intended for factory use and emulator tool use only.

Note: The AC timing specifications given in this document do not apply in PLL-bypass mode.

4. In PLL-off mode, no clocking occurs inside the PC7447A regardless of the SYSCLK input.

12.2 PLL Power Supply Filtering

The AVDD power signal is provided on the PC7447A to provide power to the clock generation

PLL. To ensure stability of the internal clock, the power supplied to the AVDD input signal should

be filtered of any noise in the 500 KHz to 10 MHz resonant frequency range of the PLL. A circuit

similar to the one shown in Figure 12-1 using surface mount capacitors with minimum effective

series inductance (ESL) is recommended.

01011 13x 2x 650

(1300)

865

(1730)

975

(1950)

1079

(2158)

1300

(2600)

11100 13.5x 2x 675

(1350)

900

(1800)

1013

(2026)

1121

(2242)

1350

(2700)

11001 14x 2x 700

(1400)

933

(1866)

1050

(2100)

1162

(2324)

1400

(2800)

00011 15x 2x 750

(1500)

1000

(2000)

1125

(2250)

1245

(2490)

11011 16x 2x 800

(1600)

1066

(2132)

1200

(2400)

1328

(2656)

00001 17x 2x 850

(1900)

1132

(2264)

1275

(2550)

1411

(2822)

00101 18x 2x 600

(1200)

900

(1800)

1200

(2400)

1350

(2700)

00111 20x 2x 667

(1334)

1000

(2000)

1332

(2664)

01001 21x 2x 700

(1400)

1050

(2100)

1399

(2797)

01101 24x 2x 800

(1600)

1200

(2400)

11101 28x 2x 933

(1866)

1400

(2800)

00110 PLL bypass PLL off, SYSCLK clocks core circuitry directly

11110 PLL off PLL off, no core clocking occurs

Table 12-1. PC7447A Microprocessor PLL Configuration Example for 1420-MHz Parts (Continued)

PLL_CFG[0:4]

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus-to-Core

Multiplier

Core-to-VCO

Multiplier

Bus (SYSCLK) Frequency

33.33

MHz

66.66

MHz

100

MHz

133.33

MHz

166.66

MHz

5387C–HIREL–05/06

PC7447A [Preliminary]

The circuit should be placed as close as possible to the AVDD pin to minimize noise coupled from

nearby circuits. It is often possible to route directly from the capacitors to the AVDD pin, which is

on the periphery of the 360 HITCE footprint.

Figure 12-1. PLL Power Supply Filter Circuit

12.3 Decoupling Recommendations

Due to the PC7447A dynamic power management feature, large address and data buses, and

high operating frequencies, the PC7447A can generate transient power surges and high fre-

quency noise in its power supply, especially while driving large capacitive loads. This noise must

be prevented from reaching other components in the PC7447A system, and the PC7447A itself

requires a clean, tightly regulated source of power. Therefore, it is recommended that the sys-

tem designer use sufficient decoupling capacitors, typically one capacitor for every 1-2 VDD pins,

and a similar or lesser amount for the OVDD pins, placed as close as possible to the power pins

of the PC7447A. It is also recommended that these decoupling capacitors receive their power

from separate VDD, OVDD, and GND power planes in the PCB, utilizing short traces to minimize

inductance.

These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic surface mount technology

(SMT) capacitors should be used to minimize lead inductance. Orientations where connections

are made along the length of the part, such as 0204, are preferable but not mandatory. Consis-

tent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A

Handbook of Black Magic (Prentice Hall, 1993) and contrary to previous recommendations for

decoupling Freescale microprocessors, multiple small capacitors of equal value are recom-

mended over using multiple values of capacitance.

In addition, it is recommended that there be several bulk storage capacitors distributed around

the PCB, feeding the VDD and OVDD planes, to enable quick recharging of the smaller chip

capacitors. These bulk capacitors should have a low equivalent series resistance (ESR) rating to

ensure the quick response time necessary. They should also be connected to the power and

ground planes through two vias to minimize inductance. Suggested bulk capacitors are: 100-330

µF (AVX TPS tantalum or Sanyo OSCON).

12.4 Connection Recommendations

To ensure reliable operation, it is highly recommended to connect unused inputs to an appropri-

ate signal level. Unless otherwise noted, unused active low inputs should be tied to OVDD, and

unused active high inputs should be connected to GND. All NC (no connect) signals must

remain unconnected.

Power and ground connections must be made to all external VDD, OVDD, and GND pins in the

PC7447A.

VDD

10Ω

2.2 µF2.2 µF

GND

AVDD

Low ESL surface mount capacitors

5387C–HIREL–05/06

PC7447A [Preliminary]

For backward compatibility with the PC7447 to the PC7447A, the new power and ground signals

(formerly NC, see Table 8-1 on page 21) may be left unconnected. There is no performance

degradation associated with leaving these pins unconnected. However, future devices may

require these additional power and ground signals to be connected to achieve maximum perfor-

mance, and it is recommended that new designs include the additional connections to facilitate

future upgrades. See also section ”Pinout Listings” on page 21 for additional information.

12.5 Output Buffer DC Impedance

The PC7447A processor bus drivers are characterized over process, voltage, and temperature.

To measure Z0, an external resistor is connected from the chip pad to OVDD or GND. The value

of each resistor is varied until the pad voltage is OVDD/2. Figure 12-2 on page 42 shows the

driver impedance measurement.

The output impedance is the average of two components–the resistances of the pull-up and pull-

down devices. When data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the

voltage at the pad equals OVDD/2. RN then becomes the resistance of the pull-down devices.

When data is held high, SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the

pad equals OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are

designed to be close to each other in value. Then, Z0 = (RP + RN)/2.

Figure 12-2. Driver Impedance Measurement

Table 12-2 summarizes the signal impedance results. The impedance increases with junction

temperature and is relatively unaffected by bus voltage.

Table 12-2. Impedance Characteristics with VDD = 1.5V, OVDD = 1.8V ±5%, Tj = 5° - 85°C

Impedance Processor bus L3 Bus Unit

Typical 33 – 42 34 – 42 Ω

Maximum 31 – 51 32 – 44 Ω

OVDD

OGND

SW2

SW1

Pad

Data

5387C–HIREL–05/06

PC7447A [Preliminary]

12.6 Pull-up/Pull-down Resistor Requirements

The PC7447A requires high-resistive (weak: 4.7-KΩ) pull-up resistors on several control pins of

the bus interface to maintain the control signals in the negated state after they have been

actively negated and released by the PC7447A or other bus masters. These pins are: TS,

ARTRY, SHDO, and SHD1.

Some pins designated as being factory test pins must be pulled up to OVDD or down to GND to

ensure proper device operation. For the PC7447A, 360 BGA, the pins that must be pulled up to

OVDD are LSSD_MODE and TEST[0:3]; the pins that must be pulled down to GND are:

L1_TSTCLK and TEST[4]. The CKSTP_IN signal should likewise be pulled up through a pull-up

resistor (weak or stronger: 4.7–1 KΩ) to prevent erroneous assertions of this signal.

In addition, the PC7447A has one open-drain style output that requires a pull-up resistor (weak

or stronger: 4.7–1 KΩ) if it is used by the system. This pin is CKSTP_OUT.

If pull-down resistors are used to configure BVSEL, the resistors should be less than 250Ω (see

Table 8-1 on page 21). Because PLL_CFG[0:4] must remain stable during normal operation,

strong pull-up and pull-down resistors (1 KΩ or less) are recommended to configure these sig-

nals in order to protect against erroneous switching due to ground bounce, power supply noise

or noise coupling.

During inactive periods on the bus, the address and transfer attributes may not be driven by any

master and may, therefore, float in the high-impedance state for relatively long periods of time.

Because the PC7447A must continually monitor these signals for snooping, this float condition

may cause excessive power draw by the input receivers on the PC7447A or by other receivers

in the system. These signals can be pulled up through weak (10-KΩ) pull-up resistors by the

system, address bus driven mode enabled (see the MPC7450 RISC Microprocessor Family

Users’ Manual for more information on this mode), or they may be otherwise driven by the sys-

tem during inactive periods of the bus to avoid this additional power draw. Preliminary studies

have shown the additional power draw by the PC7447A input receivers to be negligible and, in

any event, none of these measures are necessary for proper device operation. The snooped

address and transfer attribute inputs are: A[0:35], AP[0:4], TT[0:4], CI, WT, and GBL.

If address or data parity is not used by the system, and respective parity checking is disabled

through HID1, the input receivers for those pins are disabled and do not require pull-up resistors,

and may be left unconnected by the system. If extended addressing is not used (HID0[XAEN] =

0), A[0:3] are unused and must be pulled low to GND through weak pull-down resistors; addi-

tionally, if address parity checking is enabled (HID1[EBA] = 1) and extended addressing is not

used, AP[0] must be pulled up to OVDD through a weak pull-up resistor. If the PC7447A is in 60x

bus mode, DTI[0:3] must be pulled low to GND through weak pull-down resistors. The data bus

input receivers are normally turned off when no read operation is in progress and, therefore, do

not require pull-up resistors on the bus. Other data bus receivers in the system, however, may

require pull-ups, or that those signals be otherwise driven by the system during inactive periods

by the system. The data bus signals are: D[0:63] and DP[0:7].

5387C–HIREL–05/06

PC7447A [Preliminary]

12.7 JTAG Configuration Signals

Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is

optional in the IEEE 1149.1 specification but is provided on all processors that implement the

PowerPC architecture. While it is possible to force the TAP controller to the reset state using

only the TCK and TMS signals, more reliable power-on reset performance will be obtained if the

TRST signal is asserted during power-on reset. Because the JTAG interface is also used for

accessing the common on-chip processor (COP) function, simply tying TRST to HRESET is not

practical.

The COP function of these processors allows a remote computer system (typically a PC with

dedicated hardware and debugging software) to access and control the internal operations of

the processor. The COP interface connects primarily through the JTAG port of the processor,

with some additional status monitoring signals. The COP port requires the ability to indepen-

dently assert HRESET or TRST in order to fully control the processor. If the target system has

independent reset sources, such as voltage monitors, watchdog timers, power supply failures, or

push-button switches, then the COP reset signals must be merged into these signals with logic.

The arrangement shown in Figure 12-3 on page 45 allows the COP port to independently assert

HRESET or TRST, while ensuring that the target can drive HRESET as well. If the JTAG inter-

face and COP header will not be used, TRST should be tied to HRESET through a 0Ω. isolation

resistor so that it is asserted when the system reset signal (HRESET) is asserted, ensuring that

the JTAG scan chain is initialized during power-on. Although Freescale recommends that the

COP header be designed into the system as shown in Figure 12-3 on page 45, if this is not pos-

sible, the isolation resistor will allow future access to TRST in the case where a JTAG interface

may need to be wired onto the system in debug situations.

The COP header shown in Figure 12-3 on page 45 adds many benefits: breakpoints, watch-

points, register and memory examination/modification, and other standard debugger features

are possible through this interface, and can be as inexpensive as an unpopulated footprint for a

header to be added when needed.

The COP interface has a standard header for connection to the target system, based on the

0.025 inch square-post, 0.100 inch centered header assembly (often called a Berg header). The

connector typically has pin 14 removed as a connector key.

There is no standardized way to number the COP header shown in Figure 12-3 on page 45; con-

sequently, many different pin numbers have been observed from emulator vendors. Some are

numbered top-to-bottom then left-to-right, while others use left-to-right then top-to-bottom, while

still others number the pins counter clockwise from pin 1 (as with an IC). Regardless of the num-

bering, the signal placement recommended in Figure 12-3 on page 45 is common to all known

emulators.

The QACK signal shown in Figure 12-3 on page 45 is usually connected to the PCI bridge chip

in a system and is an input to the PC7447A informing it that it can go into the quiescent state.

Under normal operation this occurs during a low-power mode selection. In order for COP to

work, the PC7447A must see this signal asserted (pulled down). While shown on the COP

header, not all emulator products drive this signal. If the product does not, a pull-down resistor

can be populated to assert this signal. Additionally, some emulator products implement open-

drain type outputs and can only drive QACK asserted; for these tools, a pull-up resistor can be

implemented to ensure this signal is negated when it is not being driven by the tool. Note that the

pull-up and pull-down resistors on the QACK signal are mutually exclusive and it is never neces-

sary to populate both in a system. To preserve correct power-down operation, QACK should be

merged through logic so that it also can be driven by the PCI bridge.

5387C–HIREL–05/06

PC7447A [Preliminary]

Figure 12-3. JTAG Interface Connection

Notes: 1. RUN/STOP, normally found on pin 5 of the COP header, is not implemented on the PC7447A.

Connect pin 5 of the COP header to OVDD with a 10 kΩ pull-up resistor.

2. Key location; pin 14 is not physically present on the COP header.

3. Component not populated. Populate only if debug tool does not drive QACK.

4. Populate only if debug tool uses an open-drain type output and does not actively de-assert

QACK.

5. If the JTAG interface is implemented, connect HRESET from the target source to TRST from

the COP header though an AND gate to TRST of the part. If the JTAG interface is not imple-

mented, connect HRESET from the target source to TRST of the part through a 0Ω isolation

resistor.

6. The COP port and target board should be able to independently assert HRESET and TRST to

the processor in order to fully control the processor as shown above.

HRESET HRESET(6)

HRESET

SRESET

VDD_SENSE

5(1)

2 kΩ10 kΩ

10 kΩ

OVDD

CHKSTP_IN CHKSTP_IN

8TMS

TDO

TDI

TCK

TMS

TDO

TDI

TCK

TRST

14(2)

Key

QACK

OVDD

TRST(6)

10 kΩ

OVDD

QACK

CHKSTP_OUT

KEY

No Pin

COP Connector

Physical Pin Out

10 kΩ(4)

OVDD

2 kΩ(3)

0Ω(5)

From Target

Board Sources

(if any)

COP Header

10 kΩ

5387C–HIREL–05/06

PC7447A [Preliminary]

13. Ordering Information

Notes: 1. For availability of the different versions, contact your local Atmel sales office.

2. The letter X in the part number designates a "Prototype" product that has not been qualified by Atmel. Reliability of a PCX

part-number is not guaranteed and such part-number shall not be used in Flight Hardware. Product changes may still occur

while shipping prototypes.

14. Definitions

14.1 Life Support Applications

These products are not designed for use in life support appliances, devices or systems where

malfunction of these products can reasonably be expected to result in personal injury. Atmel

customers using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify Atmel for any damages resulting from such improper use or sale.

xx y xxx nnnn L x7447

Part

Identifier

7447A M: -55˚C, +125˚C

GH: HiTCE

GHY: HiTCE RoHS compliant

LH: LGA

N: 1.1V ± 50 mV1000 MHz (N-Spec)

C: 2.1 ;

PVR = 8004 0201

Product

Code(1)

PC(X)(2)

Package(1) Max Internal

Processor Speed(1)

Revision

Level (1)

Application

Modifier (1)

Temperature

Range Tj (1)

xx y xxx nnnn L x7447

Part

Identifier

7447A V: -40˚C, +110˚C

GH: HiTCE

GHY: HiTCE RoHS compliant

LH: LGA N: 1.1V ± 50 mV

L : 1.3V ± 50 mV

1333 MHz (L-Spec)

1420 MHz (L-Spec)

1167 MHz (N-Spec)

1000 MHz (N-Spec)

C: 2.1 ;

PVR = 8004 0201

Product

Code(1)

PC(X)(2)

Package(1) Max Internal

Processor Speed(1)

Revision

Level (1)

Application

Modifier (1)

Temperature

Range Tj (1)

5387C–HIREL–05/06

PC7447A [Preliminary]

15. Document Revision History

Table 15-1 provides a revision history for this hardware specification.

Table 15-1. Document Revision History

Revision Number Date Substantive Change(s)

C 12/05 Add RoHS package and LGA package.

B 07/05

Changed die size.

Table 9-2 on page 25: Modified jitter specifications to conform to JEDEC standards,

changed jitter specification to cycle-to-cycle jitter (instead of long- and short-term jitter);

changed jitter bandwidth recommendations.

Added tKHTSV

, tKHARV

, tKHTSX, and tKHARX to Table 9-3 on page 27; these were previously

grouped with tKHOV and tKHOX.

Note: Documentation change only; the values for the output valid and output hold AC

timing specifications remain unchanged for TS, ARTRY, and SHD[0:1].

A 04/04 Initial revision.

5387C–HIREL–05/06

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