INTEGRATED CIRCUITS DATA SHEET 74LVC04A Hex inverter Product specification Supersedes data of 2002 Mar 08 2003 Feb 24 Philips Semiconductors Product specification Hex inverter 74LVC04A FEATURES DESCRIPTION * 5 V tolerant inputs for interfacing with 5 V logic The 74LVC04A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. * Wide supply voltage range from 1.2 to 3.6 V * CMOS low power consumption Inputs can be driven from either 3.3 or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 and 5 V environment. * Direct interface with TTL levels * Inputs accept voltages up to 5.5 V * Complies with JEDEC standard no. 8-1A The 74LVC04A provides six inverting buffers. * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. * Specified from -40 to +85 C and -40 to +125 C. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL PARAMETER tPHL/tPLH propagation delay nA to nY CI input capacitance CPD power dissipation capacitance per gate CONDITIONS TYPICAL UNIT CL = 50 pF; VCC = 3.3 V 2.1 ns 4.0 pF VCC = 3.3 V; notes 1 and 2 15 pF Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; (CL x VCC2 x fo) = sum of the outputs. 2. The condition is VI = GND to VCC. ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS 74LVC04AD -40 to +125 C 14 SO14 plastic SOT108-1 74LVC04ADB -40 to +125 C 14 SSOP14 plastic SOT337-1 74LVC04APW -40 to +125 C 14 TSSOP14 plastic SOT402-1 74LVC04ABQ -40 to +125 C 14 DHVQFN14 plastic SOT762-1 2003 Feb 24 2 PACKAGE MATERIAL CODE Philips Semiconductors Product specification Hex inverter 74LVC04A FUNCTION TABLE See note 1. INPUT OUTPUT nA nY L H H L Note 1. H = HIGH voltage level; L = LOW voltage level. PINNING PIN 2003 Feb 24 SYMBOL DESCRIPTION 1 1A data input 2 1Y data output 3 2A data input 4 2Y data output 5 3A data input 6 3Y data output 7 GND ground (0 V) 8 4Y data output 9 4A data input 10 5Y data output 11 5A data input 12 6Y data output 13 6A data input 14 VCC supply voltage 3 Philips Semiconductors Product specification Hex inverter 74LVC04A handbook, halfpage handbook, halfpage 1A 1 14 VCC 1Y 2 13 6A 2A 3 2Y 4 3A 5 10 5Y 3Y 6 9 GND 7 8 4Y 04 1A VCC 1 14 1Y 2 13 6A 12 6Y 2A 3 12 6Y 11 5A 2Y 4 11 5A 3A 5 10 5Y 3Y 6 9 4A GND(1) 4A MNA340 Top view 7 8 GND 4Y MBL760 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig.1 Pin configuration SO14 and (T)SSOP14. Fig.2 Pin configuration DHVQFN14. handbook, halfpage 1 handbook, halfpage 1 1A 1Y 2 3 2A 2Y 4 5 3A 3Y 6 9 4A 4Y 8 3 5 9 11 5A 5Y 10 13 6A 6Y 12 11 13 MNA342 1 2 1 4 1 6 1 8 1 10 1 12 MNA343 Fig.3 Logic symbol. 2003 Feb 24 Fig.4 Logic symbol (IEEE/IEC). 4 Philips Semiconductors Product specification Hex inverter 74LVC04A handbook, halfpage Y A MNA341 Fig.5 Logic diagram (one gate). RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage 1.2 3.6 V VI input voltage 0 5.5 V VO output voltage 0 VCC V Tamb operating ambient temperature tr, tf input rise and fall times for maximum speed performance for low-voltage applications 2.7 3.6 V -40 +125 C VCC = 1.2 to 2.7 V 0 20 ns/V VCC = 2.7 to 3.6 V 0 10 ns/V LIMITING VALUES In accordance with the absolute maximum rating system (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT -0.5 +6.5 V - -50 mA VCC supply voltage IIK input diode current VI < 0 VI input voltage note 1 -0.5 +6.5 V IOK output diode current VO > VCC or VO < 0 - 50 mA VO output voltage note 1 -0.5 VCC + 0.5 V IO output source or sink current VO = 0 to VCC - 50 mA ICC, IGND VCC or GND current - 100 mA Tstg storage temperature -65 +150 C Ptot power dissipation per package - 500 mW Tamb = -40 to +125 C; note 2 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO14 packages: above 70 C derate linearly with 8 mW/K. For SSOP14 and TSSOP14 packages: above 60 C derate linearly with 5.5 mW/K. For DHVQFN14 packages: above 60 C derate linearly with 4.5 mW/K. 2003 Feb 24 5 Philips Semiconductors Product specification Hex inverter 74LVC04A DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER MIN. OTHER TYP.(1) MAX. UNIT VCC (V) Tamb = -40 to +85 C VIH VIL LOW-level input voltage VOH HIGH-level output voltage VOL 1.2 VCC - - V 2.7 to 3.6 2.0 - - V 1.2 - - GND V 2.7 to 3.6 - - 0.8 V IO = -100 A 2.7 to 3.6 VCC - 0.2 - - V IO = -12 mA 2.7 VCC - 0.5 - - V IO = -18 mA 3.0 VCC - 0.6 - - V IO = -24 mA 3.0 VCC - 0.8 - - V IO = 100 A 2.7 to 3.6 - - 0.2 V IO = 12 mA 2.7 - - 0.4 V IO = 24 mA 3.0 - - 0.55 V HIGH-level input voltage LOW-level output voltage VI = VIH or VIL VI = VIH or VIL ILI input leakage current VI = 5.5 V or GND 3.6 - 0.1 5 A ICC quiescent supply current VI = VCC or GND; IO = 0 3.6 - 0.1 10 A ICC additional quiescent supply VI =VCC - 0.6 V; current per input pin IO = 0 2.7 to 3.6 - 5 500 A 2003 Feb 24 6 Philips Semiconductors Product specification Hex inverter 74LVC04A TEST CONDITIONS SYMBOL PARAMETER MIN. OTHER TYP.(1) MAX. UNIT VCC (V) Tamb = -40 to +125 C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage 1.2 VCC - - V 2.7 to 3.6 2.0 - - V 1.2 - - GND V 2.7 to 3.6 - - 0.8 V VI = VIH or VIL IO = -100 A 2.7 to 3.6 VCC - 0.3 - - V IO = -12 mA 2.7 VCC - 0.65 - - V IO = -18 mA 3.0 VCC - 0.75 - - V IO = -24 mA 3.0 VCC - 1 - - V IO = 100 A 2.7 to 3.6 - - 0.3 V IO = 12 mA 2.7 - - 0.6 V IO = 24 mA 3.0 - - 0.8 V VI = VIH or VIL ILI input leakage current VI = 5.5 V or GND 3.6 - - 20 A ICC quiescent supply current VI = VCC or GND; IO = 0 3.6 - - 40 A ICC additional quiescent supply VI =VCC - 0.6 V; current per input pin IO = 0 2.7 to 3.6 - - 5000 A Note 1. All typical values are measured at VCC = 3.3 V and Tamb = 25 C. 2003 Feb 24 7 Philips Semiconductors Product specification Hex inverter 74LVC04A AC CHARACTERISTICS GND = 0 V; tr = tf 2.5 ns. TEST CONDITIONS SYMBOL PARAMETER MIN. WAVEFORMS TYP.(1) MAX. UNIT VCC (V) Tamb = -40 to +85 C tPHL/tPLH tsk(0) propagation delay nA to nY see Figs 6 and 7 skew note 2 1.2 - 14 - ns 2.7 1.5 2.2 5.5 ns 3.0 to 3.6 1.0 1.9 4.5 ns 3.0 to 3.6 - - 1.0 ps 1.2 - - - ns 2.7 1.5 - 7.0 ns Tamb = -40 to +125 C tPHL/tPLH tsk(0) propagation delay nA to nY see Figs 6 and 7 skew note 2 3.0 to 3.6 1.0 - 6.0 ns 3.0 to 3.6 - - 1.5 ps Notes 1. All typical values are measured at VCC = 3.3 V. 2. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design. AC WAVEFORMS handbook, halfpage VI VM nA input GND t PHL t PLH VOH VM nY output VOL MNA344 VM = 1.5 V at VCC 2.7 V; VM = 0.5VCC at VCC < 2.7 V; VOL and VOH are typical output voltage drop that occur with the output load. Fig.6 The input nA to output nY propagation delays. 2003 Feb 24 8 Philips Semiconductors Product specification Hex inverter 74LVC04A S1 handbook, full pagewidth VCC PULSE GENERATOR VI RL 500 VO 2 x VCC open GND D.U.T. CL 50 pF RT RL 500 MNA368 VCC VI tPLH/tPHL 1.2 V VCC open 2.7 V 2.7 V open 3.0 to 3.6 V 2.7 V open Definitions for test circuits: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.7 Load circuitry for switching times. 2003 Feb 24 9 Philips Semiconductors Product specification Hex inverter 74LVC04A PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.05 0.028 0.024 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.244 0.039 0.041 0.228 0.016 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 2003 Feb 24 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 10 o 8 0o Philips Semiconductors Product specification Hex inverter 74LVC04A SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp L 7 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.4 0.9 8 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT337-1 2003 Feb 24 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 11 o Philips Semiconductors Product specification Hex inverter 74LVC04A TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index Lp L 1 7 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 2003 Feb 24 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 12 o Philips Semiconductors Product specification Hex inverter 74LVC04A DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 6 y y1 C v M C A B w M C b L 1 7 Eh e 14 8 13 9 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 1.65 1.35 2.6 2.4 1.15 0.85 0.5 2 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT762-1 --- MO-241 --- 2003 Feb 24 13 EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Philips Semiconductors Product specification Hex inverter 74LVC04A If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferably be kept: Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. * below 220 C for all the BGA packages and packages with a thickness 2.5mm and packages with a thickness <2.5 mm and a volume 350 mm3 so called thick/large packages Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. * below 235 C for packages with a thickness <2.5 mm and a volume <350 mm3 so called small/thin packages. Wave soldering When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. 2003 Feb 24 14 Philips Semiconductors Product specification Hex inverter 74LVC04A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable(3) DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(4), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP REFLOW(2) suitable suitable suitable not recommended(4)(5) suitable not recommended(6) suitable Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2003 Feb 24 15 Philips Semiconductors Product specification Hex inverter 74LVC04A DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Feb 24 16 Philips Semiconductors Product specification Hex inverter 74LVC04A NOTES 2003 Feb 24 17 Philips Semiconductors Product specification Hex inverter 74LVC04A NOTES 2003 Feb 24 18 Philips Semiconductors Product specification Hex inverter 74LVC04A NOTES 2003 Feb 24 19 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA75 (c) Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613508/05/pp20 Date of release: 2003 Feb 24 Document order number: 9397 750 10528 Philips Semiconductors - PIP - 74LVC04A; Hex inverter Submit Query Philips Semiconductors Home ProductBuy MySemiconductors ContactProduct Information catalogonline 74LVC04A; Hex inverter Products MultiMarket Semiconductors * Product Selector Catalog by * Function Catalog by * System * Cross-reference * Packages End of Life * information Distributors Go * Here! * Models * SoC solutions * General description Block diagram Products & packages Features Buy online Parametrics Information as of 2003-04-22 My.Semiconductors.COM. Your personal service from Use right mouse button to Philips Semiconductors. download datasheet Please register now ! Download datasheet Stay informed Datasheet Email/translate Applications Support & tools Similar products General description top The 74LVC04A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 and 5 V environment. The 74LVC04A provides six inverting buffers. Features top 5 V tolerant inputs for interfacing with 5 V logic Wide supply voltage range from 1.2 to 3.6 V CMOS low power consumption Direct interface with TTL levels Inputs accept voltages up to 5.5 V Complies with JEDEC standard no. 8-1A ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. Specified from -40 to +85 Cel and -40 to +125 Cel. Datasheet top Type number Title 74LVC04A Publication release date Hex inverter 2/24/2003 Datasheet status Page count Product specification 20 File size Datasheet (kB) 97 Download Download PDF File file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74LVC04AD.html (1 of 3) [May-12-2003 12:25:41 PM] Philips Semiconductors - PIP - 74LVC04A; Hex inverter Parametrics top Type number Package Description Propagation Voltage No. Power Logic Output Delay(ns) of Dissipation Switching Drive Pins Considerations Levels Capability 74LVC04AD SOT108-1 (SO14) Hex Inverter 4~6 Low 14 Low Power or Battery Applications TTL Medium 74LVC04ADB SOT337-1 (SSOP14) Hex Inverter 4~6 Low 14 Low Power or Battery Applications TTL Medium 74LVC04APW SOT402-1 Hex Inverter 4~6 (TSSOP14) Low 14 Low Power or Battery Applications TTL Medium Products, packages, availability and ordering top Type number North Ordering code Marking/Packing Package Device Buy online IC packing info American type (12NC) status Download number PDF File Standard Marking SOT108-1 Full production 74LVC04AD 74LVC04AD 9352 424 00112 order this (SO14) * Tube product Standard Marking SOT108-1 74LVC04ADFull production online 9352 424 00118 * Reel Pack, order this (SO14) T SMD, 13" product Standard Marking SOT337-1 Full production online 74LVC04ADB 74LVC04ADB 9352 424 10112 order this (SSOP14) * Tube product Standard Marking SOT337-1 74LVC04ADBFull production online 9352 424 10118 * Reel Pack, order this (SSOP14) T SMD, 13" product SOT402-1 online Standard Marking 74LVC04APW 74LVC04APW 9352 424 20112 (TSSOP14) Full production order this * Tube product Standard Marking SOT402-1 online 74LVC04APW9352 424 20118 * Reel Pack, (TSSOP14) Full production order this T SMD, 13" product online - - - Similar products top 74LVC04A links to the similar products page containing an overview of products that are similar in function Products or related similar to the type number(s) as listed on this page. The similar products page includes products from the same catalog tree(s), relevant selection guides and products from the same functional category. to 74LVC04A Support & tools top Innovative Low Voltage Logic Solutions(date 01-Aug-00) Download PDF File file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74LVC04AD.html (2 of 3) [May-12-2003 12:25:41 PM] Philips Semiconductors - PIP - 74LVC04A; Hex inverter Email/translate this product information top Email this product information. Translate this product information page from English to: French Translate The English language is the official language used at the semiconductors.philips.com website and webpages. All translations on this website are created through the use of Google Language Tools and are provided for convenience purposes only. No rights can be derived from any translation on this website. About this Web Site | Copyright (c) 2003 Koninklijke Philips N.V. All rights reserved. | Privacy Policy | | Koninklijke Philips N.V. | Access to and use of this Web Site is subject to the following Terms of Use. | file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74LVC04AD.html (3 of 3) [May-12-2003 12:25:41 PM]