2001 May 28 Rev.4 5 www.phycomp-components.com
Phycomp Product specification
Surge chip resistors
size 1206 SRC01
5%
TESTS AND REQUIREM ENTS
Essent iall y all tes ts are ca rri ed out in acc orda nce with the
schedule of “IEC publication 60115-8”, category
55/155/56 (rated temperatur e range −55 to +155 °C;
damp heat, long term, 56 days). The testing also covers
the requirements specified by EIA and EIAJ.
The tests are carried out in accordance with
IEC publication 60068, “Recommended basic climatic and
mechanical robustness testing procedure for electronic
components” and under standard atmospheric conditions
according to “IEC 60068-1”, subclause 5.3.
Unless otherwise specified the following values apply:
Temperatur e: 15 °Cto35°C
Relative humidity: 45% to 75%
Air pressure: 86 kPa to 106 kPa.
In Table 4 the tests and requirements are listed with
reference to the relevant clauses of “IEC publications
60115-8 and 60068”; a short description of the test
procedure is also given. In some instances deviations from
the IEC re commendatio ns were nece ssary for our m ethod
of speci fy i n g.
All solder ing tes ts are per formed with mil dly acti vated fl ux.
Table 4 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1 visual examination no holes; clean surface;
no visible dam age
4.5 resistance applied voltage (+0/−10%): 0.1 V R −Rnom:max. ±5%
4.18 20 (Tb) resistance to
soldering heat unmounted chips; 10 ±1 s; 260 ±5°C no visible damage
∆R/R max.: ±(1% +0.05 Ω)
4.29 45 (Xa) component solvent
resistance isopropyl alcohol; H2O no visible damage
4.17 20 (Ta) solderability unmounted chips completely immersed
for 2 ±0.5 s in a s older bath at 23 5 ±2°Cgood tinning (≥95% covered) ;
no damage
4.17 20 (Ta) solderability
(after ageing) 8 hours steam or 16 hours at 155 °C;
unmounted chips completely immersed
for 2 ±0.5 s in a s older bath at 23 5 ±2°C
good tinning (≥95% covere d) ;
no damage
4.7 voltage proof on
insulation 200 V (RMS) during 1 minute no breakdown or flashover
4.13 short time ov erload room temper ature;
dissipation 6.25 ×Pn;
5 s (voltage not more than 2 ×Vmax)
∆R/R max.: ±(2% +0.1 Ω)
4.33 (JIS)
C 5200 bending resistors mounted on a 90 mm glass
epoxy resin printed-circuit board;
bending: 5 mm
no visible dam age
∆R/R max.: ±(0.5% +0.05 Ω)
4.19 14 (Na) rapid change of
temperature 30 minutes at LCT and
30 minutes at UCT; 5 cycle s no visible dam age
∆R/R max.: ±(1.5% +0.05 Ω)
4.6.1.1 insulation
resistance 100 V (DC) af ter 1 minute Rins min.: 1000 MΩ
4.24.2 3 (Ca) damp heat (steady
state) 56 days; 40 ±2°C; 93 +2/−3% RH;
loaded with 0.01 Pn Rins min.: 1000 MΩ
∆R/R max.: ±(1.5% +0.05 Ω)