f.cool Products Service New search New Company Last search result Contact Enquiry Help Search Sitemap Home Back to product overview Keywords: Article number: ICK S R 32,5X10 Search for products Back to list of products Product groups: Product group: Heatsinks and active heatsinks for processors > Pin heatsinks Profile heatsinks and fluid coolers Heatsinks and active heatsinks for processors Pin heatsinks / ICK S R 32,5 x 10 Finger-shaped heatsinks Cooling aggregates Accessories for electronic components O 32,5 x 10 mm, pin heatsinks round Parameters of article ICK S R 32,5 x 10 Bauform Rund Rth [K/W] 5.54 dissipation loss [W] 9 mounting method therm. conductive foil / therm. cond. adhesive socket universal suitable for processor type universal O [mm] 32.5 heigth [mm] 10 plate thickness [mm] 3 weight [g] 9.7 Technical Drawing Accessories/ related articles Thermally conductive foil both sides adhesive / WLFT 404 D 32 Thermally conductive foil both sides adhesive / WLFT 405 D 32 Download CAD Drawing PDF DXF IGS http://www.fischerelektronik.de/index.php?id=114&L=12/27/2010 2:25:35 PM