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Product group:
Heatsinks and active heatsinks for processors > Pin heatsinks
Pin heatsinks / ICK S R 32,5 x 10
Ø 32,5 x 10 mm, pin heatsinks round
Parameters of article ICK S R 32,5 x 10
Bauform Rund
Rth [K/W] 5.54
dissipation loss [W] 9
mounting method therm. conductive foil / therm. cond.
adhesive
socket universal
suitable for processor type universal
Ø [mm] 32.5
heigth [mm] 10
plate thickness [mm] 3
weight [g] 9.7
Technical
Drawing
Accessories/ related articles
Thermally conductive foil both sides adhesive / WLFT 404 D 32
Thermally conductive foil both sides adhesive / WLFT 405 D 32
Download CAD Drawing
PDF
DXF
IGS
http://www.fischerelektronik.de/index.php?id=114&L=12/27/2010 2:25:35 PM
ICK S R 32,5X10
