Description
The A3983 is a complete microstepping motor driver with
built-in translator for easy operation. It is designed to operate
bipolar stepper motors in full-, half-, quarter-, and eighth-step
modes, with an output drive capacity of up to 35 V and ±2 A.
The A3983 includes a fixed off-time current regulator which
has the ability to operate in Slow or Mixed decay modes.
The translator is the key to the easy implementation of the
A3983. Simply inputting one pulse on the STEP input drives
the motor one microstep. There are no phase sequence tables,
high frequency control lines, or complex interfaces to program.
The A3983 interface is an ideal fit for applications where a
complex microprocessor is unavailable or is overburdened.
The chopping control in the A3983 automatically selects the
current decay mode (Slow or Mixed). When a signal occurs at
the STEP input pin, the A3983 determines if that step results
in a higher or lower current in each of the motor phases. If
the change is to a higher current, then the decay mode is set to
Slow decay. If the change is to a lower current, then the current
decay is set to Mixed (set initially to a fast decay for a period
amounting to 31.25% of the fixed off-time, then to a slow
decay for the remainder of the off-time). This current decay
26184.29D
Features and Benefits
▪ Low RDS(ON) outputs
▪ Automatic current decay mode detection/selection
▪ Mixed and Slow current decay modes
▪ Synchronous rectification for low power dissipation
▪ Internal UVLO and thermal shutdown circuitry
▪ Crossover-current protection
DMOS Microstepping Driver with Translator
Continued on the next page…
Package: 24-pin TSSOP with exposed thermal pad
(suffix LP)
Functional Block Diagram
A3983
Not to scale
SENSE1
SENSE2
VREG
VCP
CP2
Control
Logic
DAC
VDD
PWM Latch
Blanking
Mixed Decay
DAC
STEP
DIR
RESET
MS1
PWM Latch
Blanking
Mixed Decay
Current
Regulator
CP1
Charge
Pump
RS2
RS1
VBB1
OUT1A
OUT1B
VBB2
OUT2A
OUT2B
0.1 μF
VREF
Translator
Gate
Drive DMOS Full Bridge
DMOS Full Bridge
0.1 μF
0.22 μF
OSC
ROSC
MS2
REF
ENABLE
SLEEP
DMOS Microstepping Driver with Translator
A3983
2
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
control scheme results in reduced audible motor noise, increased
step accuracy, and reduced power dissipation.
Internal synchronous rectification control circuitry is provided to
improve power dissipation during PWM operation. Internal circuit
protection includes: thermal shutdown with hysteresis, undervoltage
lockout (UVLO), and crossover-current protection. Special power-
on sequencing is not required.
The A3983 is supplied in a low-profile (1.2 mm maximum height),
24-pin TSSOP with exposed thermal pad (suffix LP). It is lead (Pb)
free, with 100% matte tin leadframe plating.
Description (continued)
Absolute Maximum Ratings
Characteristic Symbol Notes Rating Units
Load Supply Voltage VBB 35 V
Output Current IOUT
Output current rating may be limited by duty cycle, ambient
temperature, and heat sinking. Under any set of conditions,
do not exceed the specified current rating or a junction tem-
perature of 150°C.
±2 A
Logic Input Voltage VIN –0.3 to 7 V
Sense Voltage VSENSE 0.5 V
Reference Voltage VREF 4V
Operating Ambient Temperature TARange S –20 to 85 ºC
Maximum Junction TJ(max) 150 ºC
Storage Temperature Tstg –55 to 150 ºC
Selection Guide
Part Number Package Packing
A3983SLPTR-T 24-pin TSSOP with exposed thermal pad 4000 pieces per 13-in. reel
THERMAL CHARACTERISTICS
Characteristic Symbol Test Conditions* Value Units
Package Thermal Resistance RθJA 4-layer PCB, based on JEDEC standard) 28 ºC/W
*In still air. Additional thermal information available on Allegro Web site.
20 40 60 80 100 120 140 160 180
Temperature (°C)
Power Dissipation, P
D
(W)
0.0
0.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
1.0
1.5
Maximum Power Dissipation, PD(max)
(RθJA = 28 ºC/W)
DMOS Microstepping Driver with Translator
A3983
3
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
ELECTRICAL CHARACTERISTICS1 at TA = 25°C, VBB = 35 V (unless otherwise noted)
1Negative current is defined as coming out of (sourcing from) the specified device pin.
2Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for
individual units, within the specified maximum and minimum limits.
3errI = (ITrip – IProg
) ⁄ IProg
, where IProg = %ITripMAX I TripMAX.
Characteristics Symbol Test Conditions Min. Typ.2Max. Units
Output Drivers
Load Supply Voltage Range VBB
Operating 8 – 35 V
During Sleep Mode 0 – 35 V
Logic Supply Voltage Range VDD Operating 3.0 – 5.5 V
Output On Resistance RDSON
Source Driver, IOUT = –1.5 A – 0.350 0.450
Sink Driver, IOUT = 1.5 A – 0.300 0.370
Body Diode Forward Voltage VF
Source Diode, IF = –1.5 A – – 1.2 V
Sink Diode, IF = 1.5 A – – 1.2 V
Motor Supply Current IBB
fPWM < 50 kHz – – 4 mA
Operating, outputs disabled – – 2 mA
Sleep Mode – – 10 A
Logic Supply Current IDD
fPWM < 50 kHz – – 8 mA
Outputs off – – 5 mA
Sleep Mode – – 10 A
Control Logic
Logic Input Voltage VIN(1) VDD0.7 ––V
VIN(0) ––
VDD0.3 V
Logic Input Current IIN(1) VIN = VDD0.7 –20 <1.0 20 A
IIN(0) VIN = VDD0.3 –20 <1.0 20 A
Microstep Select 2 MS2 – 100 – k
Input Hysteresis VHYS(IN) 150 300 500 mV
Blank Time tBLANK 0.7 1 1.3 s
Fixed Off-Time tOFF
OSC > 3 V 20 30 40 s
ROSC = 25 k23 30 37 s
Reference Input Voltage Range VREF 0–4V
Reference Input Current IREF –3 0 3 A
Current Trip-Level Error3errI
VREF = 2 V, %ITripMAX = 38.27% – – ±15 %
VREF = 2 V, %ITripMAX = 70.71% – – ±5 %
VREF = 2 V, %ITripMAX = 100.00% – – ±5 %
Crossover Dead Time tDT 100 475 800 ns
Protection
Thermal Shutdown Temperature TJ– 165 – °C
Thermal Shutdown Hysteresis TJHYS –15–°C
UVLO Enable Threshold UVLO VDD rising 2.35 2.7 3 V
UVLO Hysteresis UVHYS 0.05 0.10 – V
DMOS Microstepping Driver with Translator
A3983
4
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Figure 1. Logic Interface Timing Diagram
STEP
tA
tD
tC
MS1, MS2,
RESET, or DIR
t
B
Table 1. Microstep Resolution Truth Table
MS1 MS2 Microstep Resolution Excitation Mode
L L Full Step 2 Phase
H L Half Step 1-2 Phase
L H Quarter Step W1-2 Phase
H H Eighth Step 2W1-2 Phase
Time Duration Symbol Typ. Unit
STEP minimum, HIGH pulse width tA1s
STEP minimum, LOW pulse width tB1s
Setup time, input change to STEP tC200 ns
Hold time, input change to STEP tD200 ns
DMOS Microstepping Driver with Translator
A3983
5
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Functional Description
Device Operation. The A3983 is a complete microstep-
ping motor driver with a built-in translator for easy operation
with minimal control lines. It is designed to operate bipolar
stepper motors in full-, half-, quarter-, and sixteenth-step
modes. The currents in each of the two output full-bridges
and all of the N-channel DMOS FETs are regulated with
fixed off-time PMW (pulse width modulated) control cir-
cuitry. At each step, the current for each full-bridge is set by
the value of its external current-sense resistor (RS1 or RS2), a
reference voltage (VREF), and the output voltage of its DAC
(which in turn is controlled by the output of the translator).
At power-on or reset, the translator sets the DACs and the
phase current polarity to the initial Home state (shown in fig-
ures 2 through 5), and the current regulator to Mixed Decay
Mode for both phases. When a step command signal occurs
on the STEP input, the translator automatically sequences the
DACs to the next level and current polarity. (See table 2 for
the current-level sequence.) The microstep resolution is set
by the combined effect of inputs MS1 and MS2, as shown in
table 1.
When stepping, if the new output levels of the DACs are
lower than their previous output levels, then the decay mode
for the active full-bridge is set to Mixed. If the new output
levels of the DACs are higher than or equal to their previous
levels, then the decay mode for the active full-bridge is set
to Slow. This automatic current decay selection improves
microstepping performance by reducing the distortion of
the current waveform that results from the back EMF of the
motor.
RESET Input (RESET). The RESET input sets the
translator to a predefined Home state (shown in figures 2
through 5), and turns off all of the DMOS outputs. All STEP
inputs are ignored until the RESET input is set to high.
Step Input (STEP). A low-to-high transition on the STEP
input sequences the translator and advances the motor one
increment. The translator controls the input to the DACs and
the direction of current flow in each winding. The size of
the increment is determined by the combined state of inputs
MS1 and MS2.
Microstep Select (MS1 and MS2). Selects the micro-
stepping format, as shown in table 1. MS2 has a 100 kΩ pull-
down resistance. Any changes made to these inputs do not take
effect until the next STEP rising edge.
Direction Input (DIR). This determines the direction of
rotation of the motor. When low, the direction will be clock-
wise and when high, counterclockwise. Changes to this input
do not take effect until the next STEP rising edge.
Internal PWM Current Control. Each full-bridge is
controlled by a fixed off-time PWM current control circuit
that limits the load current to a desired value, ITRIP
. Ini-
tially, a diagonal pair of source and sink DMOS outputs are
enabled and current flows through the motor winding and
the current sense resistor, RSx. When the voltage across RSx
equals the DAC output voltage, the current sense compara-
tor resets the PWM latch. The latch then turns off either the
source DMOS FETs (when in Slow Decay Mode) or the sink
and source DMOS FETs (when in Mixed Decay Mode).
The maximum value of current limiting is set by the selec-
tion of RSx and the voltage at the VREF pin. The transcon-
ductance function is approximated by the maximum value of
current limiting, ITripMAX (A), which is set by
ITripMAX = VREF / ( 8 R S)
where RS is the resistance of the sense resistor (Ω) and VREF
is the input voltage on the REF pin (V).
The DAC output reduces the VREF output to the current
sense comparator in precise steps, such that
Itrip = (%ITripMAX / 100) × ITripMAX
(See table 2 for %ITripMAX at each step.)
It is critical that the maximum rating (0.5 V) on the SENSE1
and SENSE2 pins is not exceeded.
Fixed Off-Time. The internal PWM current control cir-
cuitry uses a one-shot circuit to control the duration of time
that the DMOS FETs remain off. The one shot off-time, tOFF,
is determined by the selection of an external resistor con-
nected from the ROSC timing pin to ground. If the ROSC
Functional Description
DMOS Microstepping Driver with Translator
A3983
6
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
pin is tied to an external voltage > 3 V, then tOFF defaults to
30 μs. The ROSC pin can be safely connected to the VDD
pin for this purpose. The value of tOFF (μs) is approximately
tOFF ≈ ROSC ⁄ 825
Blanking. This function blanks the output of the current
sense comparators when the outputs are switched by the
internal current control circuitry. The comparator outputs are
blanked to prevent false overcurrent detection due to reverse
recovery currents of the clamp diodes, and switching tran-
sients related to the capacitance of the load. The blank time,
tBLANK (μs), is approximately
tBLANK ≈ 1 μs
Charge Pump (CP1 and CP2). The charge pump is
used to generate a gate supply greater than that of VBB
for driving the source-side DMOS gates. A 0.1 μF ceramic
capacitor, should be connected between CP1 and CP2. In
addition, a 0.1 μF ceramic capacitor is required between
VCP and VBB, to act as a reservoir for operating the
high-side DMOS gates.
VREG (VREG). This internally-generated voltage is used
to operate the sink-side DMOS outputs. The VREG pin must
be decoupled with a 0.22 μF ceramic capacitor to ground.
VREG is internally monitored. In the case of a fault condi-
tion, the DMOS outputs of the A3983 are disabled.
Enable Input (ENABLE). This input turns on or off all of
the DMOS outputs. When set to a logic high, the outputs are
disabled. When set to a logic low, the internal control enables
the outputs as required. The translator inputs STEP, DIR,
MS1, and MS2, as well as the internal sequencing logic, all
remain active, independent of the ENABLE input state.
Shutdown. In the event of a fault, overtemperature
(excess TJ) or an undervoltage (on VCP), the DMOS out-
puts of the A3983 are disabled until the fault condition is
removed. At power-on, the UVLO (undervoltage lockout)
circuit disables the DMOS outputs and resets the translator to
the Home state.
Sleep Mode (SLEEP). To minimize power consumption
when the motor is not in use, this input disables much of the
internal circuitry including the output DMOS FETs, current
regulator, and charge pump. A logic low on the SLEEP pin
puts the A3983 into Sleep mode. A logic high allows normal
operation, as well as start-up (at which time the A3983 drives
the motor to the Home microstep position). When emerging
from Sleep mode, in order to allow the charge pump to stabi-
lize, provide a delay of 1 ms before issuing a Step command.
Mixed Decay Operation. The bridge can operate in
Mixed Decay mode, depending on the step sequence, as
shown in figures 3 thru 5. As the trip point is reached, the
A3983 initially goes into a fast decay mode for 31.25% of
the off-time. tOFF. After that, it switches to Slow Decay mode
for the remainder of tOFF.
Synchronous Rectification. When a PWM-off cycle
is triggered by an internal fixed–off-time cycle, load current
recirculates according to the decay mode selected by the
control logic. This synchronous rectification feature turns on
the appropriate FETs during current decay, and effectively
shorts out the body diodes with the low DMOS RDS(ON). This
reduces power dissipation significantly, and can eliminate
the need for external Schottky diodes in many applications.
Turning off synchronous rectification prevents the reversal of
the load current when a zero-current level is detected.
DMOS Microstepping Driver with Translator
A3983
7
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Application Layout
Layout. The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3983 must be soldered directly onto the board. On the under-
side of the A3983 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground, located very close to the device.
By making the connection between the pad and the ground plane
directly under the A3983, that area becomes an ideal location for
a star ground point. A low impedance ground will prevent ground
bounce during high current operation and ensure that the supply
voltage remains stable at the input terminal. The star ground can
be created using the exposed thermal pad under the device, to
serve both as a low impedance ground point and thermal path.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
The sense resistors, RSx , should have a very low impedance
path to ground, because they must carry a large current while
supporting very accurate voltage measurements by the current
sense comparators. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparators
to accurately measure the current in the windings. The SENSEx
pins have very short traces to the RSx resistors and very thick,
low impedance traces directly to the star ground underneath the
device. If possible, there should be no other components on the
sense circuits.
V
DD
V
BB
C2
ROSC
PAD
A3983
C5
C6
C3
C4
R4
R5
C1
OUT2B
OUT1B
OUT2A
OUT1A
VBB2
VBB1
DIR
SENSE2
SENSE1
CP1 GND
ENABLE
GND
CP2
VCP
VREG
ROSC
VDD
MS1
MS2
STEP
REF
RESET
SLEEP
GND
GND
GND
GND
GND
GND GND
R4
U1
OUT2B
GND
R5
OUT2A
OUT1A
OUT1B
C3
C4
C5
ROSC
C2
C6
C1
VBB
VDD
CAPACITANCE
BULK
PCB
Thermal Vias
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
Solder
A3983
DMOS Microstepping Driver with Translator
A3983
8
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
0.00
100.00
92.39
70.71
38.27
–38.27
–70.71
–92.39
–100.00
0.00
100.00
92.39
70.71
38.27
–38.27
–70.71
–92.39
–100.00
Phase 2
IOUT2B
Direction = H
(%)
Phase 1
IOUT1A
Direction = H
(%)
Home Microstep Position
Slow Mixed Slow
Slow Mixed
Slow Mixed Slow MixedMixed
STEP
Slow
Figure 4. Decay Modes for Quarter-Step Increments
Figure 3. Decay Modes for Half-Step IncrementsFigure 2. Decay Mode for Full-Step Increments
Phase 2
IOUT2A
Direction = H
(%)
Phase 1
IOUT1A
Direction = H
(%)
STEP
Home Microstep Position
Home Microstep Position
100.00
70.71
–70.71
0.00
–100.00
100.00
70.71
–70.71
0.00
–100.00
Slow
Slow
Home Microstep Position
Home Microstep Position
100.00
70.71
–70.71
0.00
–100.00
100.00
70.71
–70.71
0.00
–100.00
Phase 2
I
OUT2B
Direction = H
(%)
Phase 1
I
OUT1A
Direction = H
(%)
STEP
Slow
Mixed
Slow
Mixed
Slow
Mixed
Mixed
Slow
Mixed
Slow
Mixed
Slow
Slow
DMOS Microstepping Driver with Translator
A3983
9
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Figure 5. Decay Modes for Eighth-Step Increments
Mixed Mixed
Slow Slow
Mixed Slow Mixed Slow
0.00
100.00
92.39
70.71
55.56
–55.56
83.15
–83.15
38.27
19.51
–19.51
–38.27
–70.71
–92.39
–100.00
0.00
100.00
92.39
70.71
55.56
–55.56
83.15
–83.15
38.27
19.51
–19.51
–38.27
–70.71
–92.39
–100.00
Phase 2
I
OUT2B
Direction = H
(%)
Phase 1
I
OUT1A
Direction = H
(%)
Home Microstep Position
STEP
DMOS Microstepping Driver with Translator
A3983
10
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Full
Step
#
Half
Step
#
1/4
Step
#
1/8
Step
#
Phase 1
Current
[% ItripMax]
(%)
Phase 2
Current
[% ItripMax]
(%)
Step
Angle
(º)
1 1 1 100.00 0.00 0.0
2 98.08 19.51 11.3
2 3 92.39 38.27 22.5
4 83.15 55.56 33.8
123570.71 70.71 45.0
6 55.56 83.15 56.3
4 7 38.27 92.39 67.5
8 19.51 98.08 78.8
3 5 9 0.00 100.00 90.0
10 –19.51 98.08 101.3
6 11 –38.27 92.39 112.5
12 –55.56 83.15 123.8
2 4 7 13 –70.71 70.71 135.0
14 –83.15 55.56 146.3
8 15 –92.39 38.27 157.5
16 –98.08 19.51 168.8
5 9 17 –100.00 0.00 180.0
18 –98.08 –19.51 191.3
10 19 –92.39 –38.27 202.5
20 –83.15 –55.56 213.8
3 6 11 21 –70.71 –70.71 225.0
22 –55.56 –83.15 236.3
12 23 –38.27 –92.39 247.5
24 –19.51 –98.08 258.8
7 13 25 0.00 –100.00 270.0
26 19.51 –98.08 281.3
14 27 38.27 –92.39 292.5
28 55.56 –83.15 303.8
4 8 15 29 70.71 –70.71 315.0
30 83.15 –55.56 326.3
16 31 92.39 –38.27 337.5
32 98.08 –19.51 348.8
Table 2. Step Sequencing Settings
Home microstep position at Step Angle 45º; DIR = H
DMOS Microstepping Driver with Translator
A3983
11
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Terminal List Table
Name Number Description
Package LP
CP1 1 Charge pump capacitor terminal
CP2 2 Charge pump capacitor terminal
VCP 3 Reservoir capacitor terminal
VREG 4 Regulator decoupling terminal
MS1 5 Logic input
MS2 6 Logic input
RESET 7 Logic input
ROSC 8 Timing set
SLEEP 9 Logic input
VDD 10 Logic supply
STEP 11 Logic input
REF 12 Gm reference voltage input
GND 13, 24 Ground*
DIR 14 Logic input
OUT1B 15 DMOS Full Bridge 1 Output B
VBB1 16 Load supply
SENSE1 17 Sense resistor terminal for Bridge 1
OUT1A 18 DMOS Full Bridge 1 Output A
OUT2A 19 DMOS Full Bridge 2 Output A
SENSE2 20 Sense resistor terminal for Bridge 2
VBB2 21 Load supply
OUT2B 22 DMOS Full Bridge 2 Output B
ENABLE 23 Logic input
NC – No connection
PAD – Exposed pad for enhanced thermal dissipation*
*The GND pins must be tied together externally by connecting to the PAD ground plane
under the device.
Package LP
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
CP1
CP2
VCP
VREG
MS1
MS2
RESET
ROSC
SLEEP
VDD
STEP
REF
GND
ENABLE
OUT2B
VBB2
SENSE2
GND
OUT2A
OUT1A
SENSE1
VBB1
OUT1B
DIR
PAD
DMOS Microstepping Driver with Translator
A3983
12
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
LP Package, 24-Pin TSSOP with Exposed Thermal Pad
1.20 MAX
C
SEATING
PLANE
0.15 MAX
C0.10
24X
0.65
6.103.00
4.32
1.65
0.45
0.65
0.25
21
24
3.00
4.32
(1.00)
GAUGE PLANE
SEATING PLANE
B
A
ATerminal #1 mark area
B
For reference only
(reference JEDEC MO-153 ADT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Reference land pattern layout (reference IPC7351
TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
PCB Layout Reference View
Exposed thermal pad (bottom surface)
C
C
7.80 ±0.10
4.40 ±0.10 6.40 ±0.20 0.60 ±0.15
4° ±4
0.25 +0.05
–0.06
0.15 +0.05
–0.06
DMOS Microstepping Driver with Translator
A3983
13
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Copyright ©2005-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to
permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, LLC assumes no re spon si bil i ty for its
use; nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
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