TK633STL - TOKO, Inc. - Datasheet.Live

February 1999 TOKO, Inc. Page 1

ADVANCED INFORMATION

FEATURES

■Low Dropout Voltage

■Very Low Quiescent Current (50 µA maximum)

■Internal Bandgap Reference

■Regulates down to 1.8 V

■Short Circuit Protection

■Very Low Standby Current (1 µA maximum)

■Miniature Package (SOT-23-5)

BLOCK DIAGRAM

TKxxxxx

GND

VIN

VOUT

CONTROL

TK6xxxx S

ORDERING INFORMATION

TAPE/REEL CODE

TL: Tape Left

PACKAGE CODE

S: SOT-23-5

Tape/Reel Code

Package Code

VOLTAGE CODE

18 = 1.8 V 33 = 3.3 V 55 = 5.5 V

20 = 2.0 V 35 = 3.5 V 60 = 6.0 V

25 = 2.5 V 40 = 4.0 V

28 = 2.8 V 45 = 4.5 V

30 = 3.0 V 50 = 5.0 V

Voltage Code

DESCRIPTION

The device is a low dropout linear regulation housed in a

small SOT-23-5 package, rated at 500 mW.

An internal P Channel pass transistor is used in order to

achieve low dropout voltage. The device has extremely

low quiescent current (max 50 µA). The device offers high

precision output voltage of 2% at over temperature. The

low quiescent current and dropout voltage make this part

ideal for battery powered applications. In the standby

mode when the device is disabled, the linear regulator only

draws 1 µA (max).

APPLICATIONS

■Battery Powered Systems

■Cellular Telephones

■Pagers

■Toys

■Radio Control Systems

■Low Voltage Systems

■Personal Communications Systems

■Portable Instrumentation

■Portable Consumer Equipment

CMOS LDO REGULAT OR WITH HIGH ACTIVE CONTROL

ADVANCED

INFORMATION

CONTROL

GND

VIN VOUT

BANDGAP

REFERENCE

CONTROL

CIRCUIT

CURRENT

LIMIT

Page 2 February 1999 TOKO, Inc.

ADVANCED INFORMATION

ABSOLUTE MAXIMUM RATINGS

All pins except GND ................................................... 9 V

Power Dissipation (Note 1) ................................ 500 mW

Storage Temperature Range ................... -55 to +150 °C

Operating Temp. Range..............................-30 to +80 °C

Junction Temperature ...........................................150 °C

ELECTRICAL CHARACTERISTICS

Test conditions: VIN = VOUT(TYP) + 1 V, TA = 25 °C, unless otherwise specified.

Note 1: Power dissapation is 500 mW when mounted as recommended (150 mW in Free Air). Derate at 1.8 mW/°C for operation above 25 °C.

Note 2: VOUT = 1.8 V to 6 V, 0.1 V step.

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February 1999 TOKO, Inc. Page 3

ADVANCED INFORMATION

DEFINITION AND EXPLANATION OF TECHNICAL TERMS

OUTPUT VOLTAGE (VOUT)

The output voltage is specified with VIN = (VOUT(TYP) + 1 V)

and IOUT = 1 mA.

DROPOUT VOLTAGE (VDROP)

The dropout voltage is the difference between the input

voltage and the output voltage at which point the regulator

starts to fall out of regulation. Below this value, the output

voltage will fall as the input voltage is reduced. It is

dependent upon the load current and the junction

temperature.

OUTPUT CURRENT (IOUT)

Normal operating output current. This is limited by package

power dissipation.

LINE REGULATION (Line Reg)

Line regulation is the ability of the regulator to maintain a

constant output voltage as the input voltage changes. The

line regulation is specified as the input voltage is changed

from VIN = VOUT + 0.5 V to VIN = 8 V.

LOAD REGULATION (Load Reg)

Load regulation is the ability of the regulator to maintain a

constant output voltage as the load current changes. It is

a pulsed measurement to minimize temperature effects

with the input voltage set to VIN = VOUT +1 V. The load

regulation is specified under output current step conditions

of 1 mA to 50 mA.

QUIESCENT CURRENT (IQ)

The quiescent current is the current which flows through

the ground terminal under no load conditions (IOUT = 0 mA).

STANDBY CURRENT (ISTBY)

Standby current is the current which flows into the regulator

when the output is turned off by the control function

(VCONT = 0 V). It is measured with VIN = 8 V.

SENSOR CIRCUITS

Overcurrent Sensor

The overcurrent sensor protects the device if the output is

shorted to ground.

PACKAGE POWER DISSIPATION (PD)

This is the power dissipation level at which the thermal

sensor is activated. The IC contains an internal thermal

sensor which monitors the junction temperature. When the

junction temperature exceeds the monitor threshold of

150 °C, the IC is shut down. The junction temperature

rises as the difference between the input power (VIN x IIN)

and the output power (VOUT x IOUT) increases. The rate of

temperature rise is greatly affected by the mounting pad

configuration on the PCB, the board material, and the

ambient temperature. When the IC mounting has good

thermal conductivity, the junction temperature will be low

even if the power dissipation is great. When mounted on

the recommended mounting pad, the power dissipation of

the SOT-23-5 is increased to 500 mW. For operation at

ambient temperatures over 25 °C, the power dissipation of

the SOT-23-5 device should be derated at 4.0 mW/ °C. To

determine the power dissipation for shutdown when

mounted, attach the device on the actual PCB and

deliberately increase the output current (or raise the input

voltage) until the thermal protection circuit is activated.

Calculate the power dissipation of the device by subtracting

the output power from the input power. These

measurements should allow for the ambient temperature

of the PCB. The value obtained from PD /(150 °C - TA) is the

derating factor. The PCB mounting pad should provide

maximum thermal conductivity in order to maintain low

device temperatures. As a general rule, the lower the

temperature, the better the reliability of the device. The

thermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA

For Toko ICs, the internal limit for junction temperature is

150 °C. If the ambient temperature (TA) is 25 °C, then:

150 °C = 0jA x PD + 25 °C

0jA = 125 °C / PD

Page 4 February 1999 TOKO, Inc.

ADVANCED INFORMATION

DEFINITION AND EXPLANATION OF TECHNICAL TERMS (CONT.)

PD is the value when the thermal protection circuit is

activated. A simple way to determine PD is to calculate VIN

x IIN when the output side is shorted. Input current gradually

falls as temperature rises. You should use the value when

thermal equilibrium is reached.

The range of usable currents can also be found from the

graph below.

Procedure:

1) Find PD

2) PD1 is taken to be PD x (~0.8 - 0.9)

3) Plot PD1 against 25 °C

4) Connect PD1 to the point corresponding to the 150 °C

with a straight line.

5) In design, take a vertical line from the maximum

operating temperature (e.g., 75 °C) to the derating

curve.

6) Read off the value of PD against the point at which the

vertical line intersects the derating curve. This is taken

as the maximum power dissipation, DPD.

The maximum operating current is:

IOUT = (DPD / (VIN(MAX) - VOUT)

SOT-23-5 POWER DISSIPATION CURVE

DPD

25 50 75 150

(mW)

TA (°C)

0 50 100 150

TA (°C)

(

100

500 MOUNTED AS

SHOWN

FREE AIR

200

300

400

February 1999 TOKO, Inc. Page 5

ADVANCED INFORMATION

APPLICATION INFORMATION

CONTROL

VIN VOUT

GND

BOARD LAYOUT

SOT-23-5 BOARD LAYOUTBAOR-5

Page 6 February 1999 TOKO, Inc.

ADVANCED INFORMATION

0.95 0.95

0.950.95

0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

Recommended Mount Pad

123

1.0

0.7

(0.8)

0 - 0.1 (0.6)

(0.6)

1.4 max

e e

0.1

0 - 15 max

Marking

±0.3

+0.15

- 0.05

Dimensions are shown in millimeters

Tolerance: x.x = ± 0.2 mm (unless otherwise specified)

+0.15

-0.05

Marking Information

Part Number Marking

SOT-23-5

PACKAGE OUTLINE

Printed in the USA

TOKO AMERICA REGIONAL OFFICES

Toko America, Inc. Headquarters

1250 Feehanville Drive, Mount Prospect, Illinois 60056

Tel: (847) 297-0070 Fax: (847) 699-7864

IC-216-TKxxxxx

0798O0.0K

Visit our Internet site at http://www.tokoam.com

The information furnished by TOKO, Inc. is believed to be accurate and reliable. However, TOKO reserves the right to make changes or improvements in the design, specification or manufacture of its

products without further notice. TOKO does not assume any liability arising from the application or use of any product or circuit described herein, nor for any infringements of patents or other rights of

third parties which may result from the use of its products. No license is granted by implication or otherwise under any patent or patent rights of TOKO, Inc.

Western Regional Office

Toko America, Inc.

2480 North First Street , Suite 260

San Jose, CA 95131

Tel: (408) 432-8281

Fax: (408) 943-9790

Midwest Regional Office

Toko America, Inc.

1250 Feehanville Drive

Mount Prospect, IL 60056

Tel: (847) 297-0070

Fax: (847) 699-7864

Eastern Regional Office

Toko America, Inc.

107 Mill Plain Road

Danbury, CT 06811

Tel: (203) 748-6871

Fax: (203) 797-1223

Semiconductor Technical Support

Toko Design Center

4755 Forge Road

Colorado Springs, CO 80907

Tel: (719) 528-2200

Fax: (719) 528-2375