Dual Channel Low Input
Current, High Gain
Optocouplers
Technical Data
Features
• High Current Transfer Ratio
– 1800% Typical
• Low Input Current
Requirements – 0.5 mA
• Low Output Saturation
Voltage – 0.1 V
• High Density Packaging
• Performance Guaranteed
over Temperature
0°Cto70°C
• LSTTL Compatible
• High Output Current –
60 mA
• Safety Approval
UL Recognized - 3750 V rms
for 1 Minute and
5000 V rms* for 1 minute
CSA Approved
• Available in 8 Pin DIP and
SO-8 Footprint
• MIL-PRF-38534 Hermetic
Version Available (HCPL-
5730/5731)
• Surface Mount Gull Wing
Option Available for 8-Pin
DIP (Option 300)
Applications
• Digital Logic Ground
Isolation
• Telephone Ring Detector
• Level Shifting
• EIA RS-232C Line Receiver
• Polarity Sensing
• Low Input Current Line
Receiver - Long Line or Party
Line
• Microprocessor Bus
Isolation
• Current Loop Receiver
• Line Voltage Status Indicator
-Low Input Power
Dissipation
HCPL-2730 HCPL-0730
HCPL-2731 HCPL-0731
Description
These dual channel optocouplers
contain a separated pair of GaAsP
light emitting diodes optically
coupled to a pair of integrated
high gain photo detectors. They
provide extremely high current
transfer ratio and excellent input-
output common mode transient
immunity. A separate pin for the
photodiodes and first gain stages
(VCC) permits lower output satura-
tion voltage and higher speed
operation than possible with
conventional photodarlington
type optocouplers. In addition,
VCC may be as low as 1.6 V
Functional Diagram
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
*5000 V rms/1 minute withstand voltage rating is for Option 020 (HCPL-2730, HCLP-2731) products only.
A 0.1 µF bypass capacitor connected between pins 5 and 8 is recommended.
V
O2
V
O1
V
CC
GND
ANODE
1
CATHODE
1
CATHODE
2
ANODE
2
7
5
6
8
2
3
4
1
TRUTH TABLE
LED
ON
OFF
V
O
LOW
HIGH
2
without adversely affecting the
parametric performance.
These dual channel optocouplers
are available in an 8-Pin DIP and
in an industry standard SO-8
package. The following is a cross
reference table listing the 8-Pin
DIP part number and the
electrically equivalent SOIC-8 part
number.
8-Pin DIP SO-8
HCPL-2730 HCPL-0730
HCPL-2731 HCPL-0731
The SO-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Guaranteed operation at low input
currents and the high current
transfer ratio (CTR) reduce the
magnitude and effects of CTR
degradation.
The outstanding high temperature
performance of this split
Darlington type output amplifier
results from the inclusion of an
integrated emitter-base bypass
resistor which shunts photodiode
and first stage leakage currents to
ground.
The HCPL-2731/0731 have a
400% minimum CTR at an input
current of only 0.5 mA making it
ideal for use in low input current
applications such as MOS, CMOS,
and low power logic interfacing or
RS232C data transmission
systems. In addition, the high
CTR and high output current
capability make this device
extremely useful in applications
where a high fanout is required.
Compatibility with high voltage
CMOS logic systems is guaranteed
by the 18 V VCC and VO specifica-
tions and by testing output high
leakage (IOH) at 18 V.
The HCPL-2730/0730 are speci-
fied at an input current of 1.6 mA
and have a 7 V VCC and VO rating.
The 300% minimum CTR allows
TTL to TTL interfacing at this
input current.
Important specifications such as
CTR, leakage current, and output
saturation voltage are guaranteed
over the 0°C to 70°C temperature
range to allow trouble-free system
operation. Selection for lower
input currents down to 250 µA is
available upon request.
Selection Guide
Widebody
8-Pin DIP Package Hermetic
(300 Mil) Small Outline SO-8 (400 mil) Single and
Dual Single Dual Minimum Absolute Dual
Single Channel Channel Channel Single Input ON Maxi- Channel
Channel Package Package Package Channel Current Minimum mum Packages
Package HCPL- HCPL- HCPL- Package (IF) CTR V
CC HCPL-
6N139[1] 2731 0701[1] 0731 HCNW139[1] 0.5 mA 400% 18 V
6N138[1] 2730 0700[1] 0730 HCNW138[1] 1.6 mA 300% 7 V
HCPL-4701[1] 4731[1] 070A[1] 073A[1] 40 µA 800% 18 V
0.5 mA 300% 20 V 5701[1]
5700[1]
5731[1]
5730[1]
Note:
1. Technical data are on separate Agilent publications.
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2731#XXXX
020 = 5000 V rms/1 Minute UL Rating Option.*
300 = Gull Wing Surface Mount Option, 50 per tube.**
500 = Tape and Reel Packaging Option, 1000 per reel.
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for
information.
*For HCPL-2731 and HCPL-2730 only.
**Gull wing surface mount option applies to through hole parts only.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use “–”
Schematic
I
F2
6
5GND
3
4
V
O2
V
F2
I
O2
+
I
F1
8
7V
CC
1
2
V
O1
I
CC
V
F1
I
O1
+
HCPL-2731/0731 SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 8)
4
Package Outline Drawings
8-Pin DIP Package (HCPL-2731/HCPL-2730)
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2731/HCPL-2730)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
5° TYP.
OPTION CODE*
UL
RECOGNITION
UR
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010) 12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
5
Small Outline SO-8 Package (HCPL-0731/HCPL-0730)
XXX
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003) 1.270
(0.050)BSC
* 5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005) 1.524
(0.060)
45° X 0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)MIN.
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7°
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
PIN ONE
6
Regulatory Information
The HCPL-2731/2730 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Solder Reflow Thermal Profile
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°CPEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
Recommended Pb-Free IR Profile
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of ACTU AL
PEAK TEMPERA TURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
7
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage (HCPL-2731/HCPL-0731) VCC 4.5 18 V
Power Supply Voltage (HCPL-2730/HCPL-0730) VCC 4.5 7 V
Forward Input Current (ON) IF(ON) 0.5 12 mA
Forward Input Voltage (OFF) VF(OFF) 0 0.8 V
Operating Temperature TA070°C
Absolute Maximum Ratings (No Derating Required up to 85°C)
Parameter Symbol Min. Max. Units
Storage Temperature TS-55 125 °C
Operating Temperature T
A-40 85 °C
Average Forward Input Current IF(AVG) 20 mA
Peak Forward Input Current IFPK 40 mA
(50% Duty Cycle, 1 ms Pulse Width)
Reverse Input Voltage (Each Channel) VR5V
Input Power Dissipation (Each Channel) PI35 mW
Output Current (Each Channel) IO60 mA
Supply Voltage and Output Voltage VCC -0.5 18 V
(HCPL-2731, HCPL-0731)
(VCC - Pin 8-5, VO - Pin 7,6-5) -Note 1
Supply Voltage and Output Voltage VCC -0.5 7 V
(HCPL-2730, HCPL-0730)
(VCC - Pin 8-5, VO - Pin 7,6-5) -Note 1
Output Power Dissipation (Each Channel) -Note 12 PO100 mW
Total Power Dissipation (Each Channel) PT135 mW
Lead Solder Temperature (for Through Hole Devices) 260°C for 10 sec., 1.6 mm below seating plane
Reflow Temperature Profile See Package Outline Drawings section
(for SOIC-8 and Option #300)
Insulation Related Specifications (HCPL-2731/2730/0731/0730)
8-Pin DIP
(300 Mil) SO-8
Parameter Symbol Value Value Units Conditions
Minimum External Air L(101) 7.1 4.9 mm Measured from input terminals to
Gap (External output terminals, shortest distance
Clearance) through air.
Minimum External L(102) 7.4 4.8 mm Measured from input terminals to
Tracking (External output terminals, shortest distance
Creepage) path along body.
Minimum Internal Plastic 0.08 0.08 mm Through insulation distance, conductor
Gap (Internal Clearance) to conductor, usually the direct
distance between the photoemitter and
photodetector inside the optocoupler
cavity.
Tracking Resistance CTI 200 200 Volts DIN IEC 112/ VDE 0303 Part 1
(Comparative Tracking
Index)
Isolation Group IIIa IIIa Material Group DIN VDE 0110
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
8
Electrical Specifications
0°C TA 70°C, 4.5 V VCC 18 V, 0.5 mA IF(ON) 12 mA, 0 V VF(OFF) 0.8 V, unless otherwise
specified. All Typicals at TA = 25°C. (See note 8.)
Device
Parameter Sym. HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note
Current CTR 2731 400 1800 5000 % IF = 0.5 mA VCC = 4.5 2, 3 2
Transfer 0731 VO = 0.4 V
500 1600 2600 IF = 1.6 mA
2730/0730 300 1600 2600 IF = 1.6 mA
Logic Low VOL 2731 0.1 0.4 V IF = 1.6 mA, V
CC = 4.5 V 1
Output 0731 IO = 8 mA
Voltage 0.1 0.4 IF = 5.0 mA,
IO = 15 mA
0.2 0.4 IF = 12 mA,
IO = 24 mA
2730/0730 0.1 0.4 IF = 1.6 mA,
IO = 4.8 mA
Logic High IOH 2731/0731 0.05 100 µAV
O = VCC = 18 V IF = 0 mA 2
Output
Current 2730/0731 0.1 250 VO = VCC = 7 V
Logic Low ICCL 2731/0731 1.2 3 mA VCC = 18 V IF1 = IF2 = 1.6 mA 5
Supply V01 = V02 = Open
Current 2730/0730 0.9 VCC = 7 V
Logic High ICCH 2731/0731 0.005 20 µAV
CC = 18 V IF1 = IF2 = 0 mA, 5
Supply V01 = V02 = Open
Current 2730/0730 0.004 VCC = 7 V
Input VF1.4 1.7 V TA = 25°C4
Forward
Voltage 1.75 IF = 1.6 mA
Input BVR5.0 V IR = 10 µA, TA = 25°C2
Reverse
Breakdown
Voltage
Temperature VF-1.8 mV/°CI
F = 1.6 mA
Coefficient TA
of Forward
Voltage
Input CIN 60 pF f = 1 MHz, VF = 0 2
Capacitance
*All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
Ratio
9
Device
Parameter Sym. HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note
Propagation Delay tPHL 2731 25 100 µsT
A = 25°C 6, 7, 2
Time to Logic 0731 8, 9
Low at Output 120 IF = 0.5 mA
Rl = 4.7 k
2730 5 20 TA = 25°C
2731
0730
0731
25 IF = 1.6 mA, Rl = 2.2 k
0.5 2 TA = 25°C
3I
F = 12 mA, Rl = 270
Propagation Delay tPLH 2731 10 60 µsT
A = 25°C 7, 8, 2
Time to Logic 0731 9
High at Output 90 IF = 0.5 mA, Rl = 4.7 k
2730 10 35 TA = 25°C
2731
0730
0731
50 IF = 1.6 mA, Rl = 2.2 k
110 T
A = 25°C
15 IF = 12 mA, Rl = 270
Common Mode |CMH| 1000 10000 V/µsI
F = 0 mA, TA = 25°C, 10 2, 6,
Transient Immunity Rl = 2.2 k7
at Logic High |VCM| = 10 Vp-p
Output
Common Mode |CML1000 10000 V/µsI
F = 1.6 mA, TA = 25°C,
Transient Immunity Rl = 2.2 k
at Logic Low Level |VCM| = 10 Vp-p
Output
*All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
Switching Specifications (AC)
Over recommended operating conditions (TA = 0°C to 70°C), VCC = 5 V, unless otherwise specified.
(See note 8.)
10
Package Characteristics
Device
Parameter Symbol HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note
Input-Output Momentary VISO 3750 V rms RH 50%, 4, 9
Withstand Voltage** t = 1 min.,
Option 020 2730 5000 4, 10
2731
Resistance RI-O 1012 VI-O = 500 VDC 4
(Input-Output) RH 45%
Capacitance CI-O 0.6 pF f = 1 MHz 11
(Input-Output)
Input-Input Insulation II-I 0.005 µA RH 45% 5
Leakage Current VI-I = 500 VDC
Input-Input Insulation RI-I 1011 5
Leakage Current
Capacitance CI-I 2730 0.03 pF 5
(Input-Input) 2731
0730 0.25
0731
*All Typical values at T
A = 25°C unless otherwise noted.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics
Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-
Output Endurance Voltage.”
Notes:
1. Pin 5 should be the most negative
voltage at the detector side.
2. Each channel.
3. DC CURRENT TRANSFER RATIO
(CTR) is defined as the ratio of output
collector current, IO, to the forward
LED input current, IF, times 100%.
4. Device considered a two-terminal
device: pins 1, 2, 3, and 4 shorted
together, and pins 5, 6, 7, and 8
shorted together.
5. Measured between pins 1 and 2
shorted together, and pins 3 and 4
shorted together.
6. Common mode transient immunity in a
Logic High level is the maximum
tolerable (positive) dV
CM/dt of the
T
A = 25°C
common mode pulse, VCM, to assure
that the output will remain in a Logic
High state (i.e., VO > 2.0 V). Common
mode transient immunity in a Logic
Low level is the maximum tolerable
(negative) dVCM/dt of the common
mode pulse, VCM, to assure that the
output will remain in a Logic Low state
(i.e., VO < 0.8 V).
7. In applications where dV/dt may
exceed 50,000 V/µs (such as static
discharge) a series resistor, RCC,
should be included to protect the
detector IC from destructively high
surge currents. The recommended
value is RCC = 110 .
8. Use of a 0.1 µF bypass capacitor
connected between pins 5 and 8
adjacent to the device is
recommended.
9. In accordance with UL 1577, each
optocoupler is proof tested by
applying an insulation test voltage
> 4500 V rms for 1 second (leakage
detection current limit, II-O < 5 µA).
10. In accordance with UL 1577, each
optocoupler is proof tested by
applying an insulation test voltage
> 6000 V rms for 1 second (leakage
detection current limit, II-O < 5 µA).
11. Measured between the LED anode and
cathode shorted together and pins 5
through 8 shorted together.
12. Derate linearly above 65°C free-air
temperature at a rate of 2.3 mW/°C for
the SO-8 package.
11
Figure 7. Propagation Delay vs.
Temperature.
Figure 8. Propagation Delay vs. Input
Diode Forward Current.
Figure 6. Propagation Delay to Logic
Low vs. Pulse Period.
Figure 4. Input Diode Forward
Current vs. Forward Voltage.
Figure 5. Supply Current per
Channel vs. Input Diode Forward
Current.
Figure 1. DC Transfer Characteristics. Figure 2. Current Transfer Ratio vs.
Forward Current.
Figure 3. Output Current vs. Input
Diode Forward Current.
012
V
O
OUTPUT VOLTAGE V
I
O
OUTPUT CURRENT mA
60
30
0
I
F
= 5.0 mA
I
F
= 4.5 mA
I
F
= 4.0 mA
I
F
= 3.5 mA
I
F
= 1.0 mA
T
A
= 25° C
V
CC
= 5.0 V
I
F
= 0.5 mA
I
F
= 1.5 mA
I
F
= 2.0 mA
I
F
= 2.5 mA
I
F
= 3.0 mA
I
F
FORWARD CURRENT mA
2500
2000
1000
500
0.1 1.0
CTR CURRENT TRANSFER RATIO %
10
1500
0
V
CC
= 5.0 V
V
O
= 0.4 V
T
A
= 25° C
T
A
= 0° C
T
A
= 70° C
T
A
= 85° C
T
A
= -40° C
I
F
INPUT DIODE FORWARD CURRENT mA
100
10
0.1
0.1 1 10
I
O
OUTPUT CURRENT mA
1.0
T
A
= 85° C
T
A
= 25° C
T
A
= -40° C
V
CC
= 5.0 V
V
O
= 0.4 V
I
F
INPUT DIODE FORWARD CURRENT mA
50
40
20
10
02 4 6
t
P
PROPAGATION DELAY µs
108
30
0
60
V
CC
= 5 V
T
A
= 25° C
70
t
PHL
R
L
= 2.2 k OR 4.7 k
t
PLH
R
L
= 4.7 k
t
PLH
R
L
= 2.2 k
050
T
A
TEMPERATURE °C
t
P
PROPAGATION DELAY µs
18
010 20 30 40 60 70 80 90
6
9
12
15
21
24
27
30
33
36
HCPL-2731/0731
(I
F
= 0.5 mA, R
L
= 4.7 k
)
HCPL-2730/0730
(I
F
= 1.6 mA, R
L
= 2.2 k
)
t
PHL
3
t
PLH
t
PLH
t
PHL
VF FORWARD VOLTAGE V
100
10
0.1
0.01
1.1 1.2 1.3 1.4
IF FORWARD CURRENT mA
1.61.5
1.0
0.001
1000
IFT = 25°C
A
VF
+
I
F
INPUT DIODE FORWARD CURRENT mA
100
10
0.1 1.0
I
CC
(PER CHANNEL) SUPPLY CURRENT mA
10
1.0
T
A
= 25° C
100
0.1
HCPL-2731
V
CC
= 18 V
HCPL-2730
HCPL-2731
V
CC
= 7 V
T INPUT PULSE PERIOD ms
100
10
0.01 0.1
t
PHL
PROPAGATION DELAY
TO LOGIC LOW µs
1.0
1.0
T
A
= 25° C
10
0.1
HCPL-2731/0731
I
F
= 0.5 mA
R
L
= 4.7 k
HCPL-2730/0730
HCPL-2731/0731
I
F
= 1.6 mA
R
L
= 2.2 k
0
V
O
I
F
V
OL
t
PHL
T
50 µs
1.5 V 5 V
Figure 10. Test Circuit for Transient Immunity and Typical Waveforms.
Figure 9. Switching Test Circuit.
VO
PULSE GEN.
Z = 50
t = 5 ns
O
r
I MONITOR
F
IF
0.1µF
L
R+5 V
C = 15 pF
L
RM
7
5
6
8
2
3
4
1
1.5 V
5 V
tPHL
O
V
IF
OL
V
05 V
tPLH
1.5 V
OL
V
O
V
IF
V
O
I
F
0.1 µF
L
R
+5 V
A
B
PULSE GEN.
V
CM
+
V
FF
CC
R (SEE NOTE 7)
110
O
V5 V
OL
V
O
V
10 V
0 V
10% 90% 90% 10%
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 1.6 mA
F
CM
V
t
r
t
f
t , t = 16 ns
rf
7
5
6
8
2
3
4
1
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Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/Interna-
tional), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0781EN
December 20, 2004
5989-2105EN