EM MICROELECTRONIC-MARIN SA H4006
1
13.56 MHz 64 Data bit Read Only
Contactless Identification Device
Features
Operating frequency range 10 MHz to 15 MHz
RF interface optimized for 13.56 MHz operation
Laser programmed memory array (64 data bit +
16 CRC bit)
Modulator switch designed to preserve supply
voltage
Miller coding
Default data rate is 26484 Baud
Other data rates possible (mask
programmable)
On chip rectifier
On chip resonant capacitor
On chip supply buffer capacitor
Description
The H4006 is a CMOS integrated circuit intended for
use in electronic Read Only transponders.
The exited coil connected to the device generates
the power supply via a Graetz bridge and an
integrated decoupling capacitor. The clock used for
the logic is also extracted from the coil. The logic is
mainly composed by a miller code generator and the
LROM control. The memory is factory programmed
so that each IC is unique.
Applications
Logistics automation
Anticounterfeiting
Access control
Industrial transponder
Typical Operating Configuration
H4006
C1
C2
L
L: typical 1.4 µH for fo = 13.56 MHz
Figure 1
Pad Assignment
H4006
VSS
TESTn
TOUT
VDD
C1 C2
Figure 2
EM MICROELECTRONIC-MARIN SA H4006
2
Absolute Maximum Ratings
Parameter Symbol Conditions
Maximum DC Current forced
on COIL1 and COIL2
Power Supply
Storage Temp. Die form
Storage Temp. PCB form
Electrostatic discharge
maximum to MIL-STD-883C
method 3015
ICMAX
VDD
Tst
Tst
VESD
±30mA
-0.3V to 7.5V
-55 to +200°C
-55 to +125°C
2000V
Table 1
Stresses above these listed maximum ratings may
cause permanent damage to the device.
Exposure beyond specified operating conditions may
affect device reliability or cause malfunction.
Operating Conditions
Parameter Symbol Min. Typ. Max. Units
Operating Temp.
Maximum Coil
Current
AC Voltage on Coil
Supply Frequency
Top
Icoil
Vcoil
fcoil
-40
-10
3
10
14*
13.56
+85
10
15
°C
mA
Vpp
MHz
Table 2
*) The AC Voltage on Coil is limited by the on chip
voltage limitation circuitry. This is according to the
parameter Icoil.
Handling Procedures
This device has built-in protection against high static
voltages or electric fields; however due to the unique
properties of this device, anti-static precautions
should be taken as for any other CMOS component.
System Principle
H4006
C1
C2
Oscillator Antenna
Driver
Demodulator
Filter &
Gain
Data
Decoder
Data received
from transponder
Transceiver Transponder
Signal on
Transponder coil
Signal on
Transceiver coil
DataRF Carrier
Signals on coils
Figure 3
EM MICROELECTRONIC-MARIN SA H4006
3
Electrical Characteristics
VDD = 2V, VSS = 0V, fC1 = 13.56MHz sine wave, VC1 = 1.0Vpp centered at (VDD - VSS)/2, Ta = 25°C
unless otherwise specified
Parameter Symbol Test Conditions Min. Typ. Max. Units
Supply Voltage VDD 1.9 1) V
Supply current IDD 60 150 µA
Rectifier Voltage Drop VREC IC1C2 = 1mA, modulator switch on
VREC = (VC1-VC2) - (VDD - VSS)
1.8 V
Modulator ON DC voltage
drop 2) VON1
VON2
IVDD VSS = 1mA
IVDD VSS = 10mA
1.9
2.4
2.3
2.8
2.8
3.3
V
V
Power on reset 3) VR
VR - VMIN
1.2
0.1
1.4
0.25
1.7
0.5
V
V
Coil1 - Coil2 Capacitance CRES Vcoil=100mVRMS f=10kHz 92.6 94.5 96.4 pF
Series resistance of CRES RS3Ω
Power Supply Capacitor Csup 140 pF
1) Maximum voltage is defined by forcing 10 mA on C1 - C2 Table 3
2) Measured between VDD and VSS
3) According to Figure 7
Block Diagram
Clock extractor Divider Chain Sequencer Miller Code
Generator
Power
on
Reset
LASER
ROM
Modulator
HF Rectifier
Power Management
VDD
VSS
CSUP
+
AC2
AC1
-
CRES
C1
C2
Figure 4
EM MICROELECTRONIC-MARIN SA H4006
4
General description
The transponder will be activated when illuminated
by a RF field of sufficient power and at any frequency
that is compatible with its associated antenna and its
internal power supply circuit input characteristics.
The chip will Power-on-Reset itself when powered by
this incoming energy that exceeds its reset threshold.
After resetting itself the chip will start to transmit its
memory contents as a stream of Miller code. The
memory contents is transmitted by modifying the
antenna matching impedance at its internal clock
rate, thereby causing varying amounts of RF energy
to be reflected from the antenna. This impedance
variation will be achieved by connecting a modulating
device across the antenna terminals. When switched
on the modulating device will present a low
impedance to the antenna. This will cause a change
in the matching of the antenna and therefore in the
amount of RF energy reflected by the transponder to
the reader. This reflected signal combines with the
transmitted signal in the receiver to yield an
amplitude modulated signal representative of the IC
memory contents. The “ON” impedance of the
modulating device needs to be comparable to about
100 Ohms to affect the matching of the antenna and
therefore its reflectivity.
The RF signal received from the transponder
antenna will serve several purposes :
• power the chip
• provide a global reset to the chip through its POR
(Power-On-Reset) function
• provide a carrier for the data transmission
• provide the input of the internal clock generation
circuit (frequency division)
Functional description
Output Sequence
Transmission from the transponder will be
accomplished through variation of the antenna load
impedance by switching the modulating device ON
and OFF.
Output sequence is composed of cycles which are
repeated. Each cycle is composed of 82 bits
Standard Message Structure (STDMS) which is
Miller coded and a pause (LW) during which the
modulating device is OFF (see figure 6 for details of
Miller code).
The pause (LW) is 9bits length.
The 82 bit STDMS consists of 1 start bit, 64 data
bits, 16 CRC bits and 1 stop bit.
Start bit (1) Data(64) CRC (16)
S
top bit (1) LW(9)
Table 4
Memory organisation
As already mentioned above the 82 bits are stored in
laser programmed ROM (LROM). The 82 bits of this
LROM is partioned as
followed (see table 5):
Wafer Number 5 bits
Factory reserved 4 bits
IC name 10 bits
Customer ID 13 bits
Extended lot number 18 bits
IC position 14 bits
Cyclic redundancy check 16 bits
Start and stop bits 2 bits
First bit sent is bit 0.
EM MICROELECTRONIC-MARIN SA H4006
5
Memory Map
012345
start Wafer Number
6789
Factory Reserved
10 11 12 13 14 15 16 17 18 19
IC Name
20 21 22 23 24 25 26 27 28 29 30 31 32
Customer ID
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Extended lot number
51 52 53 54 55 56 57 58 59 60 61 62 63 64
IC position
65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81
Cyclic redundancy check stop
Table 5
Wafer number
Each wafer has a number between 1 and 25. This 5
bit wafer number contains the wafer number where
the IC was.
Factory reserved bits
These 4 bits are reserved. Default value is 0hex.
IC name bits
They contains the 3 first characters device name.
For this device, the value is 006hex.
Customer ID bits
This field contains a code which is defined by EM
Microelectronic-Marin S.A. For standard version, the
code is 0001hex.
Extended lot number
The code on the chips is unique and reflects the
production lot number system of EM Microelectronic.
This numbering allows full traceability of each chip.
IC position
These 14 bits give the precise position on the
processed wafer.
Cyclic redundancy check
The shift register is reset to all zero with each Stop
Bit.
CRC code is calculated on 64 data bits. The CRC
code is calculated according to CCITT / ISO 3309 -
1984 standarts. See figure 5 for principle block
schematic and generating polynomial of the CRC
code.
Start and stop bits
Start bit is set to logic 1 and stop bit is set to logic 0.
EM MICROELECTRONIC-MARIN SA H4006
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CRC Block Diagram
15 14 111213 45678910 0123
data input
BCC REGISTER
SERI
A
LQUOTIENT
X16X12X5
FEEDB
A
CK
BEFORE
SHIFT
CRC-CCI TT GENER
A
TING POLYNOMI
A
L=
X
16 +
X
12 +
X
5+
X
0
=BCC(Block Check Cha
r
acte
r
s) REGISTER ST
A
GE
= E
X
CLUSI
V
E - OR
x
LSBMSB
Figure 5
EM MICROELECTRONIC-MARIN SA H4006
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RF Interface
Resonant capacitor, Rectifier, Limiter and Modulator
Switch form the unit which is interfacing to the
incoming RF signal. These blocks are
interdependent so they are developed as unit. They
interface to the antenna which typical characteristics
are:
Ls ≈ 1400 nH
Rs ≈ 3 Ohms
30 < Q < 40 at 13.56 MHz.
Resonant Capacitor
The capacitor value is adjusted by laser fusing. It
can be trimmed in factory by 1pF steps to achieve
the absolute value of 94.5pF typically. This option,
which is available on request, allows a smaller
capacitor tolerance over the whole production.
Rectifier and Limiter
A full wave rectifier (Graetz Bridge) is used to
provide supply voltage to the IC. The reverse
breakdown of the diodes is also used to protect the
IC from overvoltages.
Modulator Switch
Due to the low impedance of the antenna and
resonant capacitor the Modulator Switch has to
present low RF impedance when switched ON
(about 100 ohms).
The minimum time period with the Modulator Switch
ON is 38 µs. At lower data rates this time is even
much longer. The current consumption of divider
chain running at 13 MHz is near 60 µA. Putting
together this two figures it is clear that it is not
possible to supply the IC during the time the
Modulator Switch is ON from the integrated Supply
Buffer Capacitor which value is approximately 140
pF. The IC has to get power from the RF field also
during the time the Modulator Switch is ON.
This problem is solved by putting the Modulator
Switch on the output of the Rectifier (between VDD
and VSS) and regulating its ON resistance in
function of supply voltage. When the supply voltage
is high the ON impedance is low. When the supply
voltage drops near the region where the operation of
the IC at 13.56 MHz is not guaranteed the ON
impedance is increased in order to prevent further
drop.
NRZ-L
STREAM
DM-M
CODED
1 11111 00000
Bit i-1 Bit i
x 1 no transition at the beginning of Bit i, transition in the middle of Bit i
0 0 transition at the beginning of Bit i, no transition in the middle of Bit i
1 0 no transition at the beginning of Bit i, no transition in the middle of Bit i
Figure 6
EM MICROELECTRONIC-MARIN SA H4006
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Power Supply Management
For a correct operation, the device must be
initialised. When the transponder is put in the RF
field, the supply voltage increases until it achieves Vr
limit (see Figure 7). During this time and for an
additionnal 64 bit period, the modulator switch is on
and the device initialises its internal logic.
At this point, the data transmission starts and runs
while the supply voltage is higher than Vmin. If the
supply voltage decreases under this limit, the device
is again in an initialising state and the modulator is
on.
Vmax (voltage clipping)
Vmin
Vr (Read wake up)
chip ope
r
ating voltage
r
ange : f
r
om Vmin to Vma
x
ε
chip on boa
r
d supply voltage
time
supply voltage
VDD
time
modulato
r
ON/OFF
OFF
ON RE
A
D
64 bits
pe
r
iod
Figure 7
EM MICROELECTRONIC-MARIN SA H4006
9
Miller Encoder
The input to Miller encoder is NRZ data coming from
LROM. The output is coded according to Miller
format and is driving the modulator Switch. See
figure 6 for example of Miller code.
Clock Generation
The clock of the logic is extracted from the RF
signal. The clock extracted from RF signal is driving
the divider chain consisting of toggle flip-flops. The
output of this divider chain is data clock with which
the data from Laser ROM (LROM) is addressed,
encoded and sent to Modulator Switch.
The layout of divider chain is designed in a way that
different data rates can be chosen with metal mask
(options).
The following division factors are possible on
request:
128, 256, 1024, 2048, 4094 and 8192.
The standard is 512.
Others
As mentioned in Output Sequence, during the pause
(LW) the Modulator Switch is OFF. When observing
the pause duration one has to remember that the
time with Modulator Switch OFF effectively observed
can vary due to different terminations of STDMS.
The stop bit at 0 can be represented either by
Modulator Switch ON or OFF depending on the data.
The start bit at 1 adds 1/2 of data period OFF
(transition in the middle of bit period).
Figure below show the four possible terminations of
STDMS and its influence on entire period passed by
Modulator Switch OFF. Level LOW represents
Modulator Switch OFF. LDB stands for last data bit.
LDB
1
1
0
0
Last data
bit
Stop bit
at 0
Pause 8 +1 bit periods Start bit
at 1
This transition is not due to Miller encoding.
Figure 8
Pad Description
Name Description
C2 connection to antenna
C1 connection to antenna
VDD positive supply
Tout test output
TESTn test input with pull up
VSS negative supply
Table 6
EM MICROELECTRONIC-MARIN SA H4006
10
EM MICROELECTRONIC-MARIN SA CH-2074 Marin, Switze rland Tel. +41 32 755 51 11, Fax . +41 32 755 5403
Pad position
137 339 189 259
150 150
1041
317
160 141
1600
VSS TESTn
H4006
VDDTOUT
C1 C2
Dimensions in µm
PCB package
4.0 mm
8.0 mm
1.0 mm ma
x
.
E M
Coil2 Coil1
Dimensions in mm
CID package
FRONT VIEW
4±0.2
6±0.2
8.5±0.3
0.4±0.1
0.5±
0.12
R0.5±0.1
TOP VIEW
1.3±
0.05
1.3±
0.05
0.485±0.015
0.127±0.012
Dimensions in mm
MARKING
AREA
Coil2 Coil1
Ordering Information
The H4006 is available in :
- Chip form * H4006 501 IC
- CIDpack H4006 501 CID
- PCB package H4006 501 COB
*Chip will be delivered in wafer form.
Thickness of the wafer: 180 µm ± 20 µm (7 mils)
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely
embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the
specifications without notice at any time. You are strongly urged to ensure that the information given has not been
superseded by a more up to date version. © 2000 EM Microelectronic-Marin SA, 10/00 Rev. B/306
