TD62930P/F TOSHIBA BIPOLAR DIGITAL IC SILICON MONOLITHIC TD62930P,TD62930F THREE-CHANNEL SMALL-SIGNAL IGBT GATE DRIVER The TD62930P and TD62930F are drivers using 5 V-signal input to output the signals required to drive IGBT gates. TD62930P / F is the most suitable for low-side drive of a miniature IGBT to use for inverter for the household electric appliances mainly. The outputs are separated into high-side and low-side outputs. This separation simplifies the IGBT gate on / off timing control. Two output signals are assigned for one input signal. The high-side output is high-level for high-level input, and high impedance for low-level input. The low-side output is high impedance for high-level input, and low-level for low-level input. FEATURES Power supply voltage (maximum rating) High-voltage block power supply voltage VCC = 30 V Low-voltage block power supply voltage VDD = 7 V Output current (maximum rating) High-side peak current IOUT = -0.4 A (max) Low-side peak current IOUT = 0.4 A (max) Input-output response speed tpHL, tpLH 1 s (max) Package : DIP16 / SSOP16 (1.00 mm pitch) Weight DIP16-P-300-2.54A : 1.11 g (Typ.) SSOP16-P-225-1.00A : 0.14 g (Typ.) 1 2001-07-05 TD62930P/F PIN ASSIGNMENT (TOP VIEW) INTERNAL EQUIVALENT CIRCUIT PIN DESCRIPTION PIN No. PIN NAME FUNCTION 1, 8 VCC 30 V supply pins 2 VDD 5 V supply pin 3, 7 L-GND 4, 5, 6 IN1~3 11, 14 P-GND 9, 12, 15 OUT-L1~3 Low-side output pins 10, 13, 16 OUT-H1~3 High-side output pins Ground pins for 5 V supply Input pins for 5 V output control signals Ground pins for 30 V supply 2 2001-07-05 TD62930P/F MAXIMUM RATINGS (Ta = 25C) CHARACTERISTIC PIN / PACKAGE SYMBOL RATING UNIT Power Supply Voltage VCC VCC 30 V Power Supply Voltage VDD VDD 7 V IN1~3 VIN -0.5~VDD + 0.5 V OUT-H1~3 VOUT (H) OUT-L1~3 VOUT (L) High-level Output Peak Current OUT-H1~3 IOPH (Note 1) -0.4 A / ch Low-level Output Peak Current OUT-L1~3 IOPL (Note 1) +0.4 A / ch IN1~3 f 25 kHz DIP16 PD1 (Note 2) 1.47 (FREE AIR) W SSOP16 PD2 (Note 2) 0.78 (ON PCB) W Operating Ambient Temperature Topr -20~85 C Storage Temperature Tstg -55~150 C Input Voltage Output Voltage Operating Frequency Power Dissipation 0~20 (Ta = -20~85C) V 0~30 (Ta = -20~70C) -0.5~20 (Ta = -20~85C) V -0.5~30 (Ta = -20~70C) Note 1: Output pin current The pulse width of the output pin current at peak is 1 s, 300 pps. Note 2: When ambient temperature exceeds 25C Derate the power dissipation of DIP-type devices at 11.76 mW / 1C (device only) and Derate the power dissipation of SMD-type devices at 6.24 mW / 1C (mounted on the board). RECOMMENDED OPERATING CONDITIONS (Unless otherwise specified, Ta = -20 to 70C) CHARACTERISTIC Input Voltage Input Current High level Low level High level Low level Input Power Supply Voltage PIN IN1~3 IN1~3 VIH VIL IIH IIL TEST CONDITION MIN TYP. MAX VCC = 15 V, VDD = 4.5~5.5 V 3.5 1.0 VCC = 15 V, VDD = 4.5~5.5 V 5 -5 VCC VCC 10 15 25 VDD VDD 4.5 5.0 5.5 -0.1 -0.35 0.1 0.35 VCC = 30 V, VDD = 5.5 V -20 25 70 VCC = 20 V, VDD = 5.5 V -20 25 85 OUT-H1~3 Output Current OUT-L1~3 Operating Temperature SYMBOL IOH (DC) IOH (Peak) IOL (DC) IOL (Peak) Topr 3 VCC = 20 V, VDD = 4.5 V VCC = 20 V, VDD = 4.5 V UNIT V mA V A C 2001-07-05 TD62930P/F ELECTRICAL CHARACTERISTICS (Unless otherwise specified, Ta = -20 to 70C) CHARACTERISTIC Input Current Output Voltage High level Low level PIN IN1~3 SYMBOL TEST CONDITION MIN TYP. MAX IIH VCC = 15 V, VIN = 5 V 0.1 0.2 0.4 IIL VCC = 15 V, VIN = 0 V 0 UNIT mA High level OUT-H1~3 VOH VCC = 15 V, VIH = 5 V, RLH = 100 VCC -4.0 VCC -1.9 VCC -1.0 Low level OUT-L1~3 VOL VCC = 15 V, VIL = 0 V, RLL = 100 0.3 0.5 2.5 VDD = 5.5 V, VIH = 0 V, Ta = 25C 1.5 3.0 VDD = 5.5 V, VIH = 0 V, Ta = -20~85C 3.5 VDD = 5.5 V, VIH = 5 V, Ta = 25C 1.8 3.5 VDD = 5.5 V, VIH = 5 V, Ta = -20~85C 4.0 VCC = 30 V, VDD = 5.5 V, VIH = 0 V, Ta = 25C 10.2 15.0 VCC = 30 V, VDD = 5.5 V, VIH = 0 V 18.0 VCC = 30 V, VDD = 5.5 V, VIH = 5 V, Ta = 25C 7.5 11.0 VCC = 30 V, VDD = 5.5 V, VIH = 5 V 14.0 10 30 V UNIT IDDL Dissipation Current 1 VDD IDDH ICCL Dissipation Current 2 VCC ICCH Operating Power Supply Voltage VCC VCCopr V mA mA SWITCHING CHARACTERISTICS (Unless otherwise specified, Ta = -20~70C) CHARACTERISTIC Output Propagation Delay Time High level Low level PIN SYMBOL TEST CONDITION MIN TYP. MAX OUT-H1~3 tPLH VDD = 5.0 V, VCC = 15 V RLH = RLL = 100 , VIN = 0.7 to 4 V 0.25 1.00 tPHL VDD = 5.0 V, VCC = 15 V RLH = RLL = 100 , VIN = 4 to 0.7 V OUT-L1~3 4 s 0.25 1.00 2001-07-05 TD62930P/F SWITCHING WAVEFORM PROPAGATION DELAY TIME TEST CIRCUIT Toshiba recommends connecting load resistors as in the above diagram, utilizing the independence of the high-level and low-level sides of this IC. 5 2001-07-05 TD62930P/F TEST CIRCUIT (1) IIH (2) IIL (3) (4) VIH, VOH (5) IDDL, IDDH VIL, VOL (6) ICCL, ICCH 6 2001-07-05 TD62930P/F APPLICATION CIRCUIT PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND (L-GND, P-GND) line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 7 2001-07-05 TD62930P/F PACKAGE DIMENSIONS DIP16-P-300-2.54A Unit: mm Weight: 1.11 g (Typ.) 8 2001-07-05 TD62930P/F PACKAGE DIMENSIONS SSOP16-P-225-1.00A Unit: mm Weight: 0.14 g (Typ.) 9 2001-07-05 TD62930P/F RESTRICTIONS ON PRODUCT USE 000707EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 10 2001-07-05