TEST AND MEASUREMENT PRODUCTS
1www.semtech.com
Edge819
Octal, 18V Pin
Electronics Driver
Description Features
Functional Block Diagram
Applications
Revision 2 / August 16, 2004
The Edge819 is an octal pin electronics driver fabricated
in a wide voltage CMOS process. It is designed specifically
for Test During Burn In (TDBI) applications, where cost,
functional density, and power are all at a premium.
The Edge819 incorporates eight channels of programmable
drivers into one 14 mm X 20 mm 100 pin MQFP package.
Each channel has per pin driver levels, data, and high
impedance control.
The Edge819 uses "Flex In" digital inputs and, therefore,
can mate directly with any digital technology.
The Edge819 is pin and functionally compatible with the
Edge818, except the Edge819 does not have any
comparators.
The 18V driver output range allows the Edge819 to
interface directly with TTL, ECL, CMOS (3.3V and 5V),
LVCMOS, and custom level circuitry, as well as the high
voltage (Super Voltage) level required for many special
test modes for Flash Devices.
• 18V I/O Range
• 50 MHz Operation
• Per Pin Flexibility
• Flex In Digital Inputs
• Small footprint (100 pin MQFP)
• Burn In ATE
• Low Cost ATE
• Instrumentation
8
8
8
DATA
EN*
VH VL
DOUT
2 2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
PIN Description
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3
2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
PIN Description (continued)
181
51
31
N/C
N/C
EN*0
DATA1
N/C
N/C
EN*1
DATA2
N/C
N/C
EN*2
DATA3
N/C
N/C
EN*3
EN*4
N/C
N/C
DATA4
EN*5
N/C
N/C
DATA5
EN*6
N/C
N/C
DATA6
EN*7
N/C
N/C
VH0
DOUT0
VL0
N/C
VH1
DOUT1
VL1
N/C
VH2
DOUT2
VL2
N/C
VH3
DOUT3
VL3
VL4
DOUT4
VH4
N/C
VL5
DOUT5
VH5
N/C
VL6
DOUT6
VH6
N/C
VL7
DOUT7
VH7
DATA0
N/C
N/C
N/C
N/C
N/C
N/C
VEE
VEE
VCC
VCC
N/C
N/C
N/C
N/C
VBB
VCC
VEE
VCC
N/C
DATA7
N/C
N/C
N/C
N/C
N/C
N/C
VEE
VEE
VCC
VCC
N/C
N/C
N/C
N/C
VBB
VCC
VEE
VCC
N/C
100 Lead – 14 X 20 MQFP
4 2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
Circuit Description
Driver Description
The Edge819 supports programmable high and low levels
and tristate per channel. There are no shared lines
between any drivers. The EN* and DA TA signals are wide
voltage high impedance analog inputs capable of receiving
digital signals over a wide common mode range. VBB is
the high impedance analog input which sets the threshold
for EN* and DATA.
EN*, DATA Status
> VBB "1"
< VBB "0"
With EN* high, the driver goes into a high impedance state.
With EN* low , DATA high forces the driver into a high state,
and DATA low forces the driver into a low state.
EN* DATA DOUT
1X HiZ
01 VH
00 VL
Driver High and Low
VH and VL define the logical "1" and "0" levels of the driver,
and can be adjusted anywhere over the range determined
by VCC and VEE. There are no restrictions between VH
and VL, other than they must remain within the power
supply levels.
VEE ≤ VH ≤ VCC
VEE ≤ VL ≤ VCC
Driver Output Protection
In a functional testing environment, where a resistor is
added in series with the driver output to create a 50Ω
driver, the Edge819 can withstand a short to any legal
voltage for an indefinite amount of time.
In a low impedance application, with no additional output
resistance, the system should be designed to check for a
short circuit prior to connecting the driver, and tristate the
driver if a short is detected.
5
2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
Application Information
Power Supply Decoupling
VCC and VEE should be decoupled to GND with a .1 µF
chip capacitor in parallel with a .001 µF chip capacitor. A
VCC and VEE plane, or at least a solid power bus, is
recommended for optimal performance.
VH and VL Decoupling
As the VH and VL inputs are unbuffered and supply the
driver output current, which can be quite large during edge
transitions, decoupling capacitors for these inputs are
recommended in proportion to the amount of output
current requirements.
For applications where VH and VL are shared over multiple
channels, a solid power plane to distribute these levels is
preferred.
VBB
The two VBB pins are connected together on-chip.
Therefore, only one VBB needs to be connected to for
proper 819 operation.
The two pins may be used to daisy chain a VBB signal
across a PC Board without having to route the actual signal
underneath the 819.
Power Supplies
The Edge819 has several power supply requirements to
protect the part in power supply fault situations, as well
as during power up and power down sequences.
The following power supply requirements must be satisifed
at all times:
VEE ≤ All I/O Pins ≤ VCC at all times
The power sequence below can be used as a guideline
when operating the Edge819:
Power-On Sequencing Power-Off Sequencing
1. VCC (Substrate) 1. I/O Pins
2. VEE 2. VEE
3. I/O Pins 3. VCC
Figure 1.
Power Supply Protection Scheme
W arning: It is extremely important that the voltage on any
device pin does not exceed the range of VEE –0.5V to VCC
+0.5V at any time, either during power up, normal
operation, or during power down. Failure to adhere to this
requirement could result in latchup of the device, which
could be destructive if the system power supplies are
capable of supplying large amounts of current. Even if the
device is not immediately destroyed, the cumulative
damage caused by the stress of repeated latchup may
affect device reliability.
The three diode configuration shown in Figure 1 should
be used on a once-per-board basis.
VCC
VDD
VEE
1N5820 or
Equivalent
External
Logic
Supply
External
System
Ground
6 2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
Package Information
PIN Descriptions
D2
E2
D
ZD
ZE
4
3
3
–D–
3
–B– 4
–E–
–A–
e
SEE DETAIL "A"
TOP VIEW
0.25 CD4X A – B
0.20
4X CDA – B
D1
257
5 7
5 7
E1
C
O
O
BOTTOM VIEW
100-Pin MQFP
14 mm x 20 mm
7
2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
Package Information (continued)
–A, B, D–
3
e / 2
DETAIL "A"
–
0.40 MIN.
0 – 7˚
˚
0.13 / 0.30 R. TYP.
GAGE
PLANE
BASE
PLANE SEATING
PLANE
0.25
1.60 REF.
L
C
C
A2 0.10 S
0.13
R. MIN.
DETAIL "B"
0 MIN.
A1
–H–
0.076
–C–
2
8
12
B
12 – 16˚
12 – 16˚
D
CS
MS
ccc A – B
A
SEE DETAIL "B"
B1
BASE METAL
0.13 / 0.17
0.13 / 0.23
1.28 REF. WITH LEAD FINISH
SECTION C–C
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5-1982.
2. Datum plane -H- located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting
line.
3. Datums A-B and -D- to be determined where centerline between
leads exits plastic body at datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable mold protrusion is 0.254 mm per side. Dimensions
D1 and E1 do include mold mismatch and are determined at
datum plane -H-.
6. “N” is the total # of terminals.
7. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
8. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 mm total in excess of the
dimension at maximum material condition. Dambar cannot
be located on the lowerradius or the foot.
9. All dimensions are in millimeters.
10. Maximum allowable die thickness to be assembled in this
package family is 0.635 millimeters.
11. This drawing conforms to JEDEC registered outlines MS-108
and MS-022.
12. These dimensions apply to the flat section of the lead between
0.10 mm and 0.25 mm from the lead tip.
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Variations
(all dimensions in millimeters)
8 2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
Recommended Operating Conditions
Absolute Maximum Ratings
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Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these, or any other conditions beyond
those listed, is not implied. Exposure to absolute maximum conditions for extended periods may affect device
reliability.
9
2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
DC Characteristics
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Test conditions (unless otherwise specified): "Recommended Operating Conditions". VCC = +15V,
VEE = –3V.
Note 1: DC output current is specified per individual driver.
Note 2: Surge current capability for durations of < 2 seconds.
Note 3: VCC = +15V, VEE = –3V.
10 2004 Semtech Corp. / Rev. 2, 8/16/04 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge819
AC Characteristics
Ordering Information
Contact Information
Semtech Corporation
Test and Measurement Division
10021 Willow Creek Rd., San Diego, CA 92131
Phone: (858)695-1808 FAX (858)695-2633
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Test conditions (unless otherwise specified): "Recommended Operating Conditions". VCC = +15V,
VEE = –3V.
Note 1: Load = 10 mA and measured when a 1V change at the output is detected. (VH = 3V,
VL = 0V, VFLOAT = 1.5V, tested at 1V and 2V.)
Note 2: Into 18 cm of 50 Ω transmission line terminate with 1 KΩ and 5 pF, with proper series termination
resistor. Guaranteed by characterization. This parameter is not tested in production.
Note 3: This parameter is production tested at 40 MHz.
Note 4: From VBB threshold of DATA to 50% level of DOUT.
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