5749030-1 - Tyco Electronics

Product

Specification 108-1092

21Feb07 Rev E

AMPLIMITE* HD-22 Front Metal Shell, PCB Mounted

Connector

Harrisburg, PA

All International Rights Reserved.

* Trademark

| Indi cates ch ange For latest revision, visit ou r website at www.tyco elect ronics.com\documents.

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LOC B

1. SCOPE

1.1. Content

This specification covers perf ormance, tests and quality requirements for AMPLIMI TE* HD-22 right

angl e and vertical printed circuit board mounted connect ors.

1.2. Qualification

When test s are per formed on the subject product line, procedur es specifi ed in Figure 1 shall be used.

Al l inspections shall be performed using applicable inspect ion plan and pr oduct dr awing.

1.3. Qual ification Test Results

Successful qualification testing on the subject product line was compl eted on 14Dec89. The

Qual ification Test Repor t number for t his testing is 501-104. Additional t esting was complet ed on

09Jan02, t he Engineeri ng Report number for this t esting 502- 1125. T his documentation is on file at and

available from Engineering Practices and Standards (EPS).

2. APPLICABLE DOCUMENTS

The followi ng Tyco Electronics documents form a part of this specif ication to the extent specified herein.

Unl ess other wise specified, the latest edition of the document applies. In the event of conflict between

the r equirements of this specification and the product drawing, the product dr awing shall t ake

precedence. In the event of conflict betw een the requirements of t his specif icati on and the refer enced

documents, this specification shall take precedence.

109-1: Test Specification (General Requir ements for Test Specifications)|

109 Series: Test Specifications as indicated in Figure 1

114-40021: Applicat ion Specification (AMP LIMITE* HD-22 Right Angle Front Metal Shell|Connectors)|

114-40022: Applicat ion Specification (AMP LIMITE* HD-22 St raight Front Metal Shell PC Board|Connector)|

501-104: Qualif icati on Test Report (AMPLIMITE* HD-22 Front Metal Shell, PCB Mounted|Connector)|

502-1125: Engineeri ng Report (AMPLIMITE* HD-22 Front Metal Shell, PCB Mounted Connector)|

3. REQUIREMENTS

3.1. Desi gn and Constr uction

Product shall be of design, constr uction and physical dimensions specified on applicable pr oduct

drawing.

3.2. Materials

Materials used in the construction of this pr oduct shall be as specified on the appl icable product draw ing.|

108-1092

Rev E 2 of 8

3.3. Ratings

Voltage:

• UL: 250 vol ts Ac

• CSA: 125 volts AC

Current:

• Right angle: 2 amperes maximum per contact

• Str aight posted: 1.5 amperes maximum per contact

Temperature:

• Regular housing: -55 t o 105

• High temperature housing: -55 t o 130

3.4. Perf ormance and Test Description

Product is designed t o meet electrical, mechanical and envi ronmental per formance requirements

speci fied in Figure 1. All tests are performed at ambi ent environmental conditions per AM P Specification

109-1 unless otherw ise specif ied.

3.5. Test Requirements and Procedur es Summary

Test Descripti on Requi rement Procedur e

Examination of product. Meets requirements of pr oduct

drawing and AMP Spec 114- 40021

and 114-40022.

Vi sual, dimensional and functional

per applicable quality inspect ion

plan.

ELECTRICAL

Termination resistance, dry circuit. 25 milliohms maximum final for 30

i n gold.

30 milliohms maximum final for 15

i n and gold flash.

)

R 10 milliohms.

AMP Spec 109-6-1.

Subject mated contacts assembled

i n housing to 50 mv open circuit at

100 ma maximum.

See Fi gure 3.

Di electric withstanding voltage. 1000 volts AC at sea level. AMP Spec 109-29- 1.

Test between adjacent contacts

and between contacts and metal

shel l of unmated connector

assemblies.

Insulation resist ance. 5000 megohms minimum initi al.

1000 megohms minimum final. AMP Spec 109-28-4.

Test between adjacent contacts of

unmated connector assemblies.

Temperature rise vs current. 30

C maximum temperature rise at

speci fied current. AMP Spec 109-45-1.

Measure temperatur e rise vs

current.

MECHANICAL

Vi brat ion, random. No discontinuit ies greater than 1

microsecond.

See Note.

AMP Spec 109-21-5,

Test level G,

Durat ion 20 minutes.

Subject mated connectors to 23 G's

rms with 100 ma current applied.

See Fi gure 4.

Fi gure 1 ( continued)

108-1092

Test Descripti on Requi rement Procedur e

Rev E 3 of 8

Physical shock. No di scontinuities greater than 1

microsecond.

See Note.

AMP Spec 109-26-1.

Subject mated connectors to 50 G's

hal f- sine shock pulses of 11

milliseconds durat ion. 3 shocks in

each di rect ion applied along 3

mutual ly perpendicular planes, 18

tot al shocks.

See Fi gure 4.

Mating f orce. Force in pounds maximum.

Grounding

Indent s

Size Positions W/O With

1 15 5.6 33

2 26 9.8 38

3 44 16.5 46

4 62 23.3 52

5 78 29.3 58

AMP Spec 109-42,

Condi tion A.

Measure force necessar y t o mate

connector assemblies at rate of 1

i nch per mi nute.

Unmati ng for ce. Force in pounds maximum.

Grounding

Indent s

Size Positions W/O With

1 15 5.6 33

2 26 9.8 38

3 44 16.5 46

4 62 23.3 52

5 78 29.3 58

AMP Spec 109-42,

Condi tion A.

Measure force necessar y t o

unmate connector assemblies at

rat e of 1 inch per minut e.

Durability. See Note. AMP Spec 109-27.

Mate and unmate connector

assemblies for 100 cycles for gold

flash and 500 cycles for 30

i n gold

pl ating at maximum rate of 200

cycles per hour.

Solderability. Solderable area shall have

minimum of 95% solder coverage. AMP Spec 109-11-1.

Subject contacts to solderability for|connector s with tin-lead plated|solder tails.|

AMP Spec 109-11- 11.|Subject contacts to solderability for|connector s with lead-free tin plated|soldertails.|

ENVIRONMENTAL

Thermal shock. See Note. AMP Spec 109-22.

Subject mated connectors to 100

cycles between - 55 and 105

C for

regular housings and -55 and

130

C for high temperatur e

housings.

Fi gure 1 ( continued)

108-1092

Test Descripti on Requi rement Procedur e

Rev E 4 of 8

Humidity-temperature cy cling. See Note. AMP Spec 109-23-3,

Condi tion B.

Subject mated connectors to 10

humidity-temperature cy cles

between 25 and 65

C at 95% RH.

Mixed flowing gas. See Note. AMP Spec 109-85-3.

Subject mated connectors to

environmental class III for 20 days.

Temperature lif e. See Note. AMP Spec 109-43.

Subject mated connectors to

temperat ure life at 105

C for 500

hours.

Shall meet visual requirements, show no physical damage and shall meet requirements of

NOTE

additional tests as specified in Test Sequence in Figure 2.

Fi gure 1 ( end)

3.6. Product Qualif ication and Requalif icati on Test Sequence

Test or Exami nation

Test Group (a)

12345678

Test Sequence (b)

Examination of product 1,9 1,6 1,6 1,4 1,5 1,8 1,3 1,5

Termination resistance 3,7 2,5 2,5 2 2,4

Di electric withstanding voltage 3,7

Insulati on resistance 2,6

Temperature rise vs current 3

Vibration 5

Physical shock 6

Mating force 2 2

Unmating force 8 4

Durability 4 3 3 3

Solderability 2

Thermal shock 4

Humidity-temperature cy cling 4 5

Mixed flowing gas 3(c)

Temperature lif e 4

(a)

See paragr aph 4.1.A.

NOTE

(b) Numbers indicat e sequence in which tests ar e performed.

Fi gure 2

108-1092

Rev E 5 of 8

4. QUALITY ASSURANCE PROVISIONS

4.1. Qual ification Testing

A. Sample Selection

Connector housings and contacts shall be prepared in accor dance with applicable Instruct ion

Sheets and shall be selected at r andom from current production.

Test groups 1 and 3 shall consist of 5 samples each of 30

i n gold plating and gold flash of a right

angl e recept acle connector. Mating crimp snap pl ug connector s without grounding indent s shall be

l oaded with 30

i n gold plating and gold flash pin contacts as required per Not e (a). Cr imp snap

contact s shall be double crimped w ith 2, 12 inch 105

C rated PVC 26 AWG wires per Note (b).

Cabl e clamps shall be used on crimp snap connectors. Hardware shall be used t o hold mating

connector s together and to secure posted connector s onto printed ci rcuit boards.

Test group 2 shall consist of 5 samples each of 30

i n gold plated right angl e receptacle connector

and gol d flash straight posted receptacle connect or. Mating crimp snap pl ug connectors shall be

l oaded with 30

i n gold plating and gold flash pin contacts as required per Not e (a). Cr imp snap

contact s shall be double crimped w ith 12 inch 105

C rated PVC 26 AWG wires per Note (b).

Hardware shall be used to hold mating connect ors together and to secure posted connectors onto

printed circuit boards.

Test group 4 shall consist of 5 samples each of right angl e receptacle connector and st raight

posted r eceptacle connect or with gold flash contacts. Mat ing crimp snap plug connectors shall be

l oaded with gold flash pin contacts. Crimp snap contact s shall be double crimped w ith 2, 12 inch

105

C rat ed PVC 26 AWG wires per Note (b). Cable clamps shal l be used on cri mp snap

connector s. Hardware shall be used to hol d mating connectors t ogether and to secure posted

connector s onto printed ci rcuit boards.

Test group 5 shall consist of 5 samples each of gold flash right angle receptacle connector and

str aight posted r eceptacle connect or. Mating crimp snap pl ug connectors shall be loaded with gold

flash pin contacts. Crimp snap contacts shall be double cri mped w ith 2, 12 inch 105

C rated PVC

26 AWG wires per Note (b). Cable clamps shall be used on crimp snap connectors. Hardware shall

be used to hold mating connect ors together and to secur e posted connectors onto print ed circui t

boards.

Test groups 6 and 7 shall each consist of 5 samples of right angl e receptacle connector with gold

flash contacts.

Test group 8 shall consist of 5 samples each of siz e 1 (15 position), size 2 (26 position), size 3 (44

posi tion), size 4 (62 position), and size 5 (78 position) r eceptacle connect ors w ith gold flash

contact s. Mating cri mp snap plug connectors with grounding indents shall be loaded wi th cr imped

contact s with no wires required.

(a) Gold f lash socket contact s shall be mated with gold fl ash pin contacts. 30 µin gold

NOTE

socket cont acts shall be mated to 30

in gold pin contacts.

(b) Str ip wires to .250 inch beyond insulation barrel for double crimp to prevent broken

wires. Second wir e shall be used to provide voltage dr op readings.

B. Test Sequence

Qual ification inspect ion shall be verif ied by test ing samples as specified in Figur e 2.

108-1092

Rev E 6 of 8

4.2. Requal ification Testing

If changes signif icantly affecting f orm, fit or f unction ar e made to the product or manufacturing process,

product assurance shall coordinate requalification testing, consisting of all or part of the original testing

sequence as deter mined by development/product, quality and reliab ility engineering.

4.3. Acceptance

Acceptance is based on verificati on that the product meets the requir ements of Figur e 1. Failures

att ribut ed to equipment, test setup or operator def iciencies shall not disqualify t he product. When

product failure occurs, corrective action shall be taken and samples resubmit ted for qualification. Testing

to conf irm correct ive action is required befor e resubmi ttal.

4.4. Qual ity Conformance Inspection

The applicable quality inspection plan will specify sampling acceptable quality level to be used.

Di mensional and functional r equirements shall be in accor dance with applicable product drawing and

this specificati on.

4.5. Certification

Product has been recognized under the Component Recognition Program of Under writers' Laborat ories

Inc. , Elect rical File Number E- 28476 and certifi ed by Canadian Standards Association Number LR-

16455.

108-1092

Rev E 7 of 8

Fi gure 3

Termination Resistance Measurement Points

108-1092

Rev E 8 of 8

Fi gure 4

Vi brat ion & Physical Shock Mounting Fixture